CN111584236A - X-capacitor device for suppressing interference and method for manufacturing the same - Google Patents
X-capacitor device for suppressing interference and method for manufacturing the same Download PDFInfo
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- CN111584236A CN111584236A CN202010536782.6A CN202010536782A CN111584236A CN 111584236 A CN111584236 A CN 111584236A CN 202010536782 A CN202010536782 A CN 202010536782A CN 111584236 A CN111584236 A CN 111584236A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 20
- 230000001629 suppression Effects 0.000 claims abstract description 31
- 230000000740 bleeding effect Effects 0.000 claims description 18
- 239000000084 colloidal system Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 16
- 239000004743 Polypropylene Substances 0.000 claims description 14
- -1 polypropylene Polymers 0.000 claims description 14
- 229920001155 polypropylene Polymers 0.000 claims description 14
- 238000005470 impregnation Methods 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 8
- 238000004382 potting Methods 0.000 claims description 4
- 238000009517 secondary packaging Methods 0.000 claims description 4
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- WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to an X capacitor device for interference suppression and a manufacturing method thereof. The invention has the effect of automatically forming self-body electric quantity discharge in the X capacitor device for interference suppression from the X capacitor main body to the self-discharge circuit assembly when the power is on or off.
Description
Technical Field
The invention relates to the technical field of safety capacitors, in particular to an X capacitor device for interference suppression and a manufacturing method thereof.
Background
The current safety capacitor is divided into an X capacitor and a Y capacitor. In use, the X capacitor is connected to two ends of the power input line for eliminating differential mode interference, and the Y capacitor is connected between the power input line and the ground line for eliminating common mode interference. Structurally, the X capacitor is usually a plastic-packaged square high-voltage CBB capacitor (polypropylene capacitor) so that the product has better electrical performance, the X capacitor is connected with the input end of a power supply in parallel so as to effectively reduce the influence of high-frequency pulse on a switching power supply, and the Y capacitor is usually provided with a high-voltage ceramic chip.
When the X capacitor is mounted on a printed circuit board to form an electrical product, a bleeder circuit connected in series with the X capacitor is usually designed in advance in the circuit board, so that the product can be safely used under a lightning stroke test condition, and the bleeder circuit is required to safely bear severe input surge and voltage surge within a withstand voltage range. The suppliers of the printed circuit board and the X capacitor belong to manufacturing factories adopting different process procedures respectively, and when the quality problem of devices occurs, the responsibility is difficult to clear. Even if the quality of both devices is acceptable, there is a risk of system defects that are incompatible between the devices after installation. Specifically, the front-end capacitor manufacturer does not know how to match the applicable bleeding circuit to the back-end application of the capacitor. In addition, the bleeder circuit occupies a certain surface area of the printed circuit board for mounting the X capacitor, the heating of the board body of the printed circuit board is accelerated in the electric quantity bleeding process, and the contact point of the bleeder circuit and the X capacitor is deeply buried in the printed circuit board, so that the main functional device of the electric product is adversely affected by a shorter heat conduction/conduction path through the power input line.
The applicant discloses an X electric capacity bleeder circuit and electrical apparatus at utility model patent publication number CN203788129U, and the bleeder circuit concatenates with X electric capacity CX1, and the bleeder circuit includes: the control circuit comprises a control end, a first switch end and a second switch end, wherein the first switch end is connected with one end of the X capacitor, the second switch end is connected with the other end of the X capacitor, and the control end is connected with an external control signal. When the system works, no extra power consumption is generated, and the discharge speed can meet the requirement of safety certification. In a typical configuration, the bleeder circuit is designed on a printed circuit board of the electrical apparatus.
In an X capacitor discharging method for a switching circuit, the switching circuit includes an X capacitor connected to an input terminal, and the X capacitor discharging circuit includes: the first diode and the second diode are connected with the two ends of the X capacitor respectively, the cathode of the first diode is connected with the cathode of the second diode, the common node of the first diode is a first node, the voltage of the first node is rectified voltage, the first node is pulled down by first current, and the rectified voltage is continuously higher than a first voltage threshold value in the first time, so that the input power failure is represented, and the first node is pulled down by the first pull-down current. The discharge circuit is arranged outside the X capacitor.
The patent application No. CN110445361A discloses a discharging circuit and a discharging method for a safety capacitor, in which the safety capacitor is coupled between input terminals of a switch converter, the discharging circuit for the safety capacitor includes an ac voltage detecting circuit and a discharging module, when the ac voltage detecting circuit detects that the input terminal of the switch converter is not coupled to an ac power supply, the discharging module performs a discharging protection operation on the safety capacitor, and the discharging method includes: the discharging module discharges the safety capacitor in a first time period, stops discharging the safety capacitor in a second time period, samples the voltage between the input ends of the switch converter at the first time to obtain a sampled voltage, and compares the sampled voltage with the voltage between the input ends of the switch converter at the second time to judge whether the input end of the switch converter is connected with a power supply, wherein at least part of the first time period is between the first time and the second time. The discharge module is included within a discharge circuit that is relatively remote from the safety capacitor XCAP.
Utility model patent publication No. CN209447689U discloses an ann rule condenser based on X2Y2 set, including the casing with set up in the inside PCB of casing, insert respectively on the PCB and establish first Y2 electric capacity, second Y2 electric capacity and X2 electric capacity, form X2Y2 set electric capacity, the condenser is still including leading out electrode and filling layer, and first Y2 electric capacity, second Y2 electric capacity and X2 electric capacity set up a leading out electrode respectively, the filling layer sets up in the space between casing and PCB for encapsulate inside the casing with the PCB, be used for realizing the insulation of X2Y2 set electric capacity. The PCB in the capacitor is used for inserting the X2 capacitor and the Y2 capacitor to form an X2Y2 integrated capacitor. The PCB functions to integrate multiple types of capacitors into the capacitor, and the patent prior art does not disclose how to connect the bleeder circuit to the capacitor.
Disclosure of Invention
The invention mainly aims to provide an X capacitor device for interference suppression, which mainly aims to solve the problems of heating and electric conduction of a discharge circuit arranged outside a traditional X capacitor to an external printed circuit board, incompatible system defects between devices after installation and the like, can eliminate the quality problems of poor/unqualified discharge circuits or connection points of the discharge circuits in advance when the X capacitor is shipped, and can more sensitively open and close the series connection relation of the resistors of the discharge circuits to an X capacitor body.
The invention also provides a method for manufacturing the interference suppression X capacitor device, which is used for manufacturing the interference suppression X capacitor device, exerting automatic and self-body electric quantity discharge in the X capacitor and reducing adverse effects on external electrical equipment products.
The main purpose of the invention is realized by the following technical scheme:
an interference suppressing X capacitor device is provided, including:
the X capacitor body is connected with a plurality of extension pins through electrodes of the X capacitor body, and has a capacitor capacity of more than or equal to 0.1 uF;
a self-bleeding circuit assembly shorted to the extended pin;
the encapsulation body that the embedment formed seals X electric capacity main part with from the bleeder circuit subassembly, the encapsulation body still seals from the bleeder circuit subassembly with the short junction of extension pin, the extension pin expose in the encapsulation body.
Through adopting above-mentioned technical scheme, utilize the self-bleeding circuit subassembly of being embedment in the condenser, still produce the short circuit relation with a plurality of extension pins of connecting X electric capacity main part, when X electric capacity main part has the electric capacity that is more than or equal to 0.1uF, X electric capacity device for interference suppression has possessed automatic autologous electric quantity by oneself and has bled. Most of the discharge capacity is intercepted to the self-bleeding circuit assembly in advance, and the external bleeding circuit is not relied on. In addition, the capacitor can meet the next generation safety standard discharge requirement, and the size of the capacitor can still be consistent with or close to that of the traditional standard capacitor.
The invention may in a preferred example be further configured to: the self-bleeder circuit assembly comprises a built-in circuit board, a parallel resistor arranged on the built-in circuit board and a controller chip device arranged on the built-in circuit board and connected with the parallel resistor in series, wherein a bleeder circuit is formed in the built-in circuit board, and short-circuit end points of the bleeder circuit are positioned on two sides of the built-in circuit board and used for short-circuit of the extension pins.
The controller chip device is used for passively and automatically connecting the parallel resistor and the X capacitor main body in series by taking a power supply disconnection state as a driving instruction, and the self-discharge comprises automatic discharge and self-discharge simultaneously. The parallel resistor reduces the concentrated heating of the resistor by the number of resistors and avoids the loss of self-discharge function caused by the disconnection of a single resistor.
The invention may in a preferred example be further configured to: the short-circuit end point is in the shape of an annular welding disc, the part of the extension pin penetrating into the short-circuit end point is welded with the short-circuit end point, and the built-in circuit board is used for installing the parallel resistor and the surface of the controller chip device, and the surface of the built-in circuit board is back to the X capacitor main body.
Through adopting above-mentioned preferred technical characterstic, utilize from bleeder circuit subassembly's short circuit termination point to have annular pad shape, supply the penetrating combination of extension pin carries out the welding. The exposed part of the extension pin is not easy to cause welding fracture by bending and shaking, and the positioning of the built-in circuit board is also facilitated when the sealing colloid is poured. Particularly, the device mounting surface of the built-in circuit board is preferably utilized to be opposite to the X capacitor main body, so that the repair of the bleeder circuit, the parallel resistor connected with the bleeder circuit and the controller chip device is facilitated, and the spatial interference of the parallel resistor and the controller chip device to the X capacitor main body can be avoided.
The invention may in a preferred example be further configured to: the number of the extension pins is only two, and the parallel connection number of the resistors of the parallel resistor is more than or equal to 2.
By adopting the preferable technical characteristics, the number of the extension pins is only two, the same pins can be used for sharing the joint of the traditional X capacitor on the external printed circuit board, and the parallel number of the resistors of the parallel resistor is integral multiple of the number of the pins, so that the discharge charge of the capacitor can be dispersed, and the heat generated by the unit resistor is less.
The invention may in a preferred example be further configured to: the parallel resistors are arranged on two sides of the controller chip device in multiple groups, the bleeder circuit comprises an inner collecting bridge connected between the controller chip device and the parallel resistors, and chip connection points on one side of the controller chip device and inner resistor connection points of the corresponding parallel resistors are positioned on the inner collecting bridge.
By adopting the preferable technical characteristics, the controller chip device is connected in series between the groups of parallel resistors by utilizing the configuration of the groups of parallel resistors, so that the circuit can be automatically switched on and off in the presence of alternating current in a two-way manner. By utilizing the internal convergence bridge of the bleeder circuit, the self-bleeding function is not affected by the fracture of any chip contact or inner side resistance contact.
The invention may in a preferred example be further configured to: the bleeder circuit also comprises an outer collecting bridge used for connecting the parallel resistors and the short-circuit end points, and outer resistor contacts and the short-circuit end points of the corresponding groups of the parallel resistors are positioned on the outer collecting bridge.
By adopting the preferable technical characteristics, the self-discharge function is not influenced by the fracture of any outer resistance joint by utilizing the outer collection bridge of the discharge circuit, and the chip joint of the controller chip device can be packaged and protected by sealing the controller chip device by the secondary packaging structure of the sealing colloid.
The invention may in a preferred example be further configured to: the X capacitor device for interference suppression further comprises a capacitor shell, wherein the X capacitor main body is installed in the capacitor shell, and the sealing colloid is formed in the capacitor shell in a pouring mode;
preferably, a vacuum impregnation layer is formed on the surface of the X capacitor body;
specifically, the X capacitor main body is formed by winding a metallized polypropylene film into a roll.
By adopting the preferable technical characteristics, the capacitor shell is used for filling and forming the sealing colloid, so that the size and the shape of the X capacitor are predetermined before packaging, and the extending pins or the side of the built-in circuit board are prevented from being exposed at the side of the X capacitor. The vacuum impregnation layer is used for protecting the surface of the X capacitor main body after the X capacitor main body is connected with the extension pins, and preventing electrodes of the X capacitor main body from mistakenly touching a built-in circuit board or other conductive structures with metal or conductive surfaces. The X capacitor main body formed by winding the metallized polypropylene film into a roll can effectively increase the capacitor capacity.
The invention may in a preferred example be further configured to: when the X capacitor device for interference suppression is installed on an external printed circuit board and a power supply is cut off, self-electricity discharge in the X capacitor device for interference suppression is automatically formed from the X capacitor main body to the self-discharge circuit assembly.
By adopting the preferable technical characteristics, the self-electricity discharge is automatically formed in the X capacitor device by utilizing the use and installation form of the X capacitor device for interference suppression and taking the cut-off of the alternating current power supply as a discharge starting instruction, so that the interference influence on an external printed circuit board is suppressed to the minimum.
The main purpose of the invention is realized by the following technical scheme:
a method for manufacturing an X capacitor device for interference suppression is provided, which includes:
preparing an X capacitor main body, and connecting a plurality of extension pins by electrodes of the X capacitor main body, wherein the X capacitor main body has a capacitor capacity of more than or equal to 0.1 uF;
mounting a self-bleeding circuit assembly in short circuit with the extension pin;
the encapsulation forms the colloid of sealing, the colloid of sealing seal the X electric capacity main part with from the circuit assembly that discharges, the colloid of sealing still seal from the circuit assembly that discharges with extend the short junction of pin, extend the pin expose in the colloid of sealing.
By adopting the technical scheme, the X capacitor body connected with the plurality of extension pins is prepared, the self-discharging circuit assembly is installed, and the encapsulation body is formed by encapsulation, so that the X capacitor with the self-discharging function is prepared.
The invention may in a preferred example be further configured to: after the X capacitor main body is prepared and before the sealing colloid is formed by encapsulation, the manufacturing method also comprises the steps of installing the X capacitor main body in a capacitor shell for carrying out a pouring process for forming the sealing colloid;
preferably, the manufacturing method further includes forming a vacuum impregnation layer on a surface of the X capacity body after the X capacity body is prepared and before the X capacity body is installed in the capacitor case;
specifically, the X capacitor main body is prepared by the steps of metalizing a polypropylene film, and winding the obtained metalized polypropylene film into a roll to form the X capacitor main body.
By adopting the preferable technical characteristics, the X capacitor main body is arranged in the shell by the capacitor shell in the manufacturing process so as to be convenient for encapsulation and formation of the sealing colloid, the electrode of the X capacitor main body is protected by the vacuum impregnation layer from touching other metal conductive surfaces in the subsequent manufacturing process, and the X capacitor main body formed by rolling the metallized polypropylene film can have larger adjustable capacitor capacity according to the number of rolling turns.
In summary, the present invention includes at least one of the following technical effects that contribute to the prior art:
1. the automatic self-discharging effect of the X capacitor is realized, and the dependence on an external circuit is avoided;
2. the X capacitor type with a novel design can be provided, and sharing can be conveniently implemented on the design of the old capacitor pin, so that the product meets the new energy efficiency and safety standard;
3. the use convenience of the X capacitor is improved;
4. and zero power consumption (less than 5 mW) of the X capacitor on the electric quantity discharge switch is achieved.
Drawings
Fig. 1 is a perspective view of an interference suppressing X-capacitor device according to some preferred embodiments of the invention;
FIG. 2 is a schematic cross-sectional view of an interference suppressing X-capacitor device in a lead extension plane according to some preferred embodiments of the invention;
FIG. 3 is a schematic diagram of a cell circuit of an interference rejection X-capacitor device according to some preferred embodiments of the invention;
FIG. 4 is a schematic diagram of the system circuit connections of the interference rejection X capacitor device according to some preferred embodiments of the invention;
FIG. 5 is a schematic diagram of a bleeder circuit of an internal circuit board included in some preferred embodiments of the present invention;
FIG. 6 is a circuit diagram of a controller chip device included in some preferred embodiments of the invention;
FIG. 7 is a schematic diagram of the controller chip device according to some preferred embodiments of the invention (A is a top view, B is a side view);
FIG. 8 is a block diagram illustrating a process for fabricating an interference rejection X-capacitor device according to some preferred embodiments of the invention.
The capacitor comprises a capacitor body, an extending pin, a capacitor body, an extending pin, a short contact point, a capacitor body, an extending pin, a short contact point, a capacitor body.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of embodiments for understanding the inventive concept of the present invention, and do not represent all embodiments, nor do they explain only embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention under the understanding of the inventive concept of the present invention are within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly. In order to facilitate understanding of the technical solutions of the present invention, the following embodiments will further describe and explain the interference suppression X capacitor device and the manufacturing method thereof in detail, but the invention is not limited to the protection scope. In the description of the embodiments, the short circuit means that the distance from the connection point of the bleeder circuit assembly to the X capacitor body by the extension pin is shorter than the distance from the extension pin to the X capacitor body, that is, the middle section of the extension pin is connected to the bleeder circuit assembly. The X capacitor in the description of the embodiment does not include the Y capacitor. The self-bleeding in the description of the embodiments includes both self-bleeding and automatic bleeding.
The accompanying drawings are only for showing the common parts of the embodiments and the individual embodiments of some of the embodiments, and do not show the differences or differences, and are also described in text. Based on the industrial features and technical essence of the technical field, a person skilled in the art should reasonably understand and judge whether individual technical features or any combination of a plurality of technical features described below can be characterized in the same embodiment or whether a plurality of technical features mutually exclusive can be respectively characterized in different variant embodiments.
Fig. 1 is a perspective view of an interference suppression X capacitor device according to some preferred embodiments of the present invention, fig. 2 is a cross-sectional view of the interference suppression X capacitor device according to some preferred embodiments of the present invention at a pin extending surface, fig. 3 is a schematic unit circuit diagram of the interference suppression X capacitor device according to some preferred embodiments of the present invention, and fig. 1 to 3 are schematic unit circuit diagrams of an interference suppression X capacitor device according to some preferred embodiments of the present invention, including:
the capacitor comprises an X capacitor body 10, a plurality of extension pins 11 and 12 are connected with an electrode of the X capacitor body 10, and the X capacitor body 10 has a capacitor capacity of more than or equal to 0.1uF, wherein the capacitor capacity is specifically 0.1-6.8 uF;
a self-bleeding circuit assembly 20 shorted to the extension pins 11,12 for forming a series circulation loop for capacitive bleeding in the capacitor space;
the encapsulation body 30 formed by encapsulation seals the X capacitor body 10 and the self-discharging circuit assembly 20, the encapsulation body 30 further seals the self-discharging circuit assembly 20 and the short-circuit point 13 of the extension pins 11 and 12, and the extension pins 11 and 12 are exposed out of the encapsulation body 30.
The implementation principle of the embodiment is as follows: by using the self-bleeding circuit assembly 20 encapsulated in the capacitor and also generating a short-circuit relationship with the plurality of extension pins 11 and 12 connected to the X capacitor body 10, when the X capacitor body 10 has a capacitance capacity of 0.1uF or more, the interference suppression X capacitor device has self-automatic self-electricity bleeding. Most of the leakage is trapped in the self-bleeding circuit assembly 20 in advance, and the conventional pin of the X capacitor is not relied on to conduct the external bleeding circuit to the external printed circuit board. In addition, the capacitor can meet the next generation safety standard discharge requirement, and the size of the capacitor can still be consistent with or close to that of the traditional standard capacitor.
With respect to the illustration of the X capacitor body 10, in a preferred example, the surface of the X capacitor body 10 is formed with a vacuum impregnation layer 14 (as shown in fig. 2), and specifically, the X capacitor body 10 is formed by rolling a metallized polypropylene film. Therefore, the vacuum impregnation layer protects the surface of the X capacitor body 10 after the extending pins 11,12 are connected to the X capacitor body 10, and prevents the electrodes of the X capacitor body 10 from mistakenly touching the built-in circuit board 21 or other conductive structures with metal or conductive surfaces. The X capacitor body 10 formed by winding a metallized polypropylene film into a roll can effectively increase the capacitor capacity. The X capacitor body 10 is specifically cylindrical in shape, lying against the inner surface of the built-in circuit board 21 of the self bleeding circuit assembly 20 remote from the device mounting. In fig. 4, the X capacitance body 10 is denoted CX 1.
With regard to the illustration of the extension pins 11 and 12, in a preferred example, the number of the extension pins 11 and 12 may be only two, and the parallel number of the resistors of the parallel resistor 22 is greater than or equal to 2. Therefore, the number of the extension pins 11,12 is only two, the same pin can be used for sharing the joint of the traditional X capacitor on the external printed circuit board, and the parallel resistor 22 has the resistor parallel number which is integral multiple of the pin number, so that the capacitor discharge charge can be dispersed, and the heat generated by the unit resistor is less. As shown in fig. 1, the shank of the extension pins 11,12 may have a plurality of notches for positioning in the self-bleeding circuit assembly 20 (shown as the central hole of the annular shorting end 25 in fig. 5). Each of the extension pins 11,12 may be a single piece or a series of multiple pieces.
With respect to the exemplary illustration of the encapsulant 30, in the preferred embodiment, the encapsulant 30 is a thermosetting, electrically insulating filler gel, and the drawings show the cells within the capacitor housing 40 as being potted, but may be potted in an array in alternative embodiments. In some preferred examples, the interference suppression X capacitor device further includes a capacitor housing 40, the X capacitor body 10 is mounted in the capacitor housing 40, and the sealant 30 is poured into the capacitor housing 40. The capacitor housing 40 is formed by pouring the molding compound 30 to predetermine the size and shape of the X capacitor before packaging and to prevent the extending leads 11,12 or the side of the internal circuit board 21 from being exposed to the side of the X capacitor.
Referring to fig. 4, a system circuit connection relationship of the interference suppression X capacitor device is exemplified. In the preferred embodiment, when the said X capacitor device for interference suppression is mounted on the external printed circuit board of an electrical apparatus, two input lines of the ac power supply (ACINPUT in the figure) are connected to the extension pins 11,12 of the X capacitor device for interference suppression, and further connected to the switching power supply (SMPS in the figure) having the function of voltage transformation and stabilization, and a fuse (position F1 in the figure) can be disposed in the connection path, so that the switching power supply provides the voltage required by the apparatus. When the power supply is cut off, the self-electricity leakage in the interference suppression X capacitor device is automatically formed from the X capacitor main body 10 to the self-leakage circuit assembly 20. Therefore, by using the installation mode of the X capacitor device for interference suppression and taking the cut-off of the alternating current power supply as a discharge starting command, the self-electricity discharge is automatically formed in the X capacitor device, the interference influence on the external printed circuit board is suppressed to the minimum, and the dependence on the discharge circuit of the external printed circuit board is avoided. The aforementioned connected equipment is specifically one or more of a refrigerator, a washing machine, an air conditioner, a household appliance, a cooking appliance, a dust collector, a small appliance, a television, a server, a personal computer, a notebook computer, a display, a projector, a workstation, and the like. The interference suppression X capacitor device can be safely used in the application meeting the 6kV lightning stroke test condition in use, and can safely bear severe input surge and voltage swell within a voltage-resistant range. In the normal power-on state, the current of the discharge resistor is almost completely blocked, so that the power loss of the discharge loop is reduced to zero. When the system is disconnected from the AC power grid, the chip can automatically switch on the resistor within a specified time to safely discharge the X capacitor, so that the danger that a user bears electric shock is avoided, and the system meets the safety requirement.
With respect to a specific structure of the self-bleeding circuit assembly 20, in a preferred example, the self-bleeding circuit assembly 20 includes an internal circuit board 21, a parallel resistor 22 disposed on the internal circuit board 21, and a controller chip device 23 disposed on the internal circuit board 21 and connected in series with the parallel resistor 22, referring to fig. 5, a bleeding circuit 24 is formed in the internal circuit board 21, and short-circuit terminals 25 of the bleeding circuit 24 are located on two sides of the internal circuit board 21 for short-circuiting the extension pins 11 and 12. Therefore, the specific structure of the self-bleeding circuit assembly 20 is utilized to realize the self-bleeding function of small size embedded in the X capacitor, and the controller chip device 23 is used to actively and automatically connect the parallel resistor 22 and the X capacitor body 10 in series with each other in a power-off state as a driving command, wherein the self-bleeding includes both automatic bleeding and self-bleeding. The parallel resistor 22 is a resistor with reduced number of resistors to concentrate heat generation and avoid the loss of self-bleeding function caused by the open circuit of a single resistor. The bleeder circuit 24 is overlapped on the surface mounting covering surface of the X capacitor body 10.
Regarding an example combination of the extension pins 11 and 12 being shorted to the self-bleeding circuit assembly 20 and the installation orientation of the self-bleeding circuit assembly 20, in a preferred example, referring to fig. 5 and 2, the shorting terminal 25 is in the shape of an annular pad, the portion of the extension pins 11 and 12 penetrating into the shorting terminal 25 is soldered to the shorting terminal 25, and the surface of the internal circuit board 21 for installing the parallel resistor 22 and the controller chip device 23 faces away from the X capacitor body 10. Thus, the shorting terminal 25 utilized in the self-bleeding circuit assembly 20 has an annular pad shape for penetration bonding and soldering of the extended pins 11, 12. The exposed parts of the extension pins 11 and 12 are not easy to bend and shake to cause welding fracture, and the positioning of the built-in circuit board 21 is facilitated when the sealing colloid 30 is poured. Particularly, it is preferable that the device mounting surface of the built-in circuit board 21 faces away from the X capacitor body 10, so as to facilitate repair of the bleeder circuit and the parallel resistor 22 and the controller chip device 23 connected thereto, and also to avoid spatial interference of the parallel resistor 22 and the controller chip device 23 with the X capacitor body 10.
Referring to fig. 5 and 3, in a preferred example, the combination of the parallel resistors 22 and the controller chip device 23 of the self-bleeding circuit assembly 20, the parallel resistors 22 are arranged in multiple groups on two sides of the controller chip device 23, the bleeding circuit 24 includes an inner collecting bridge 26 connecting the controller chip device 23 and the parallel resistors 22, and a chip contact 23A on one side of the controller chip device 23 and an inner resistor contact 22A of the corresponding group of the parallel resistors 22 are both located on the inner collecting bridge 26. Therefore, by the multi-group configuration of the parallel resistors 22, the controller chip device 23 is connected in series between the groups of parallel resistors 22, and the automatic switching circuit for detecting the existence of the alternating current can be bidirectionally detected. With the internal bus bridge 26 of the bleeder circuit, the self-bleeding function is not affected by the break of either chip contact 23A or inner resistive contact 22A. In the present embodiment, the parallel resistors 22 have two sets of two parallel resistors, each set of two parallel resistors may be a surface-mounted resistor or a resistor circuit integrally formed on the internal circuit board 21, as shown in fig. 4 and 5, and the parallel resistors 22 are denoted as R1, R2, R3 and R4. In the present embodiment, the built-in circuit board 21 has 4 chip contacts 23A and 2 inner resistive contacts 22A on one side corresponding to the controller chip device 23. The total resistance of each set of parallel resistors 22 is preferably between 6.8M Ω and 120K Ω, with a discharge time constant of less than 1 and a discharge time of less than 2 s.
With respect to the combination of the parallel resistor 22 and the extension pins 11,12 of the self-bleeding circuit assembly 20, in a preferred example, referring to fig. 5 and fig. 3, the bleeding circuit 24 further includes an outer collection bridge 27 for connecting the parallel resistor 22 and the short-circuit terminal 25, and the outer resistor contact 22B and the short-circuit terminal 25 of the corresponding group of the parallel resistors 22 are both located on the outer collection bridge 27, preferably, the short-circuit terminal 25 and the controller chip device 23 have a primary packaging structure, the encapsulant 30 is a secondary packaging structure, and further seals the controller chip device 23. Therefore, the external collection bridge 27 of the bleeder circuit is utilized, the fracture of any external resistance contact 22B does not affect the self-bleeding function, and the secondary packaging structure of the sealing colloid 30 is used for sealing the controller chip device 23, so that the chip contact 23A of the controller chip device 23 can be packaged and protected. In the present embodiment, the inner collection bridge 26 and the outer collection bridge 27 are formed by forming the chip contact 23A, the inner resistive contact 22A, the outer resistive contact 22B and the short-circuit terminal 25 through openings of solder mask layers on a strip-shaped copper surface or a metal layer on the internal circuit board 21, so as to form a corresponding pad structure.
For the specific description of the controller chip device 23 of the self bleeding circuit assembly 20, fig. 6 shows a circuit schematic diagram of the controller chip device 23 included in some preferred embodiments of the present invention; fig. 7 is a schematic diagram showing the external shape of the controller chip device 23 included in some preferred embodiments of the present invention (a is a top view, and B is a side view). Referring to fig. 6, in a preferred example, based on a specific circuit design of the controller chip device 23, the specific circuit design may specifically include connections of a PMU (power management unit), a DET (data acquisition unit), a DRV1 (first driving unit), and a DRV2 (second driving unit) to the MOS transistor, when an input power of an alternating current is turned on and connected to the X capacitor body 10 and is connected to the controller chip device 23 in parallel, the circuit of the controller chip device 23 is automatically turned off, and when the input power of the alternating current is turned off and is connected to the X capacitor body 10, a power signal cannot be transmitted to the controller chip device 23, the circuit of the controller chip device 23 is automatically turned on, so that the parallel resistors 22 on two sides of the controller chip device 23 are connected. Referring to fig. 7, the controller chip device 23 has device pins 23B on both sides for bonding to chip contacts 23A on the built-in circuit board 21. The controller chip device 23 may be of SOP8 package architecture with 4 device pins 23B on each side. The 8 device pins 23B of the controller chip device 23 are labeled 1 to 8 in fig. 4 and labeled X1 in fig. 6, the labels 1 to 4 are power switch pins on the first side, the labels 5 to 8 are power switch pins on the second side, and the connection of the power switch pins on the two sides is controlled by the controller chip device 23 with an automatic switching function.
In addition, other embodiments of the present invention also provide a method for manufacturing an X capacitor device for interference suppression, and fig. 8 is a related manufacturing flow diagram. The manufacturing method can be combined with fig. 1 and fig. 2 and includes the following steps:
step S1, preparing an X capacitor body 10, connecting a plurality of extension pins 11,12 by an electrode of the X capacitor body 10, wherein the X capacitor body 10 has a capacitance capacity of more than or equal to 0.1 uF;
step S2, mounting the X capacitor main body 10 in the capacitor shell 40, and predetermining the size of the capacitor for subsequent perfusion process;
step S3, installing a self-bleeding circuit assembly 20, short-circuiting the extension pins 11,12, and constructing a bleeding internal circulation series circuit in the capacitor;
step S4, forming an encapsulant 30 by encapsulation, where the encapsulant 30 seals the X capacitor body 10 and the self-bleeding circuit assembly 20, the encapsulant 30 further seals the self-bleeding circuit assembly 20 and the short-circuit point 13 of the extension pins 11,12, and the extension pins 11,12 are exposed out of the encapsulant 30.
Step S2 is a selection step to install the X capacitor body 10 in the capacitor housing 40 to facilitate the potting of the encapsulant 30. in other variations, step S2 may be skipped directly in applications that do not require a capacitor housing, using array mold-in-place (MAP) techniques.
The implementation principle of the embodiment is as follows: an X capacitor with a self-bleeding function is manufactured by preparing an X capacitor body 10 connected with a plurality of extension pins 11,12, installing a self-bleeding circuit assembly 20, and forming a sealant 30 by potting.
In a preferred example, the step S1 of preparing the X capacitor main body 10 specifically includes metallizing a polypropylene film, and then rolling the obtained metallized polypropylene film into a roll to form the X capacitor main body 10. The X capacitor main body 10 formed by winding the metallized polypropylene film can have a large adjustable capacitor capacity according to the number of winding turns.
In a preferred example, after the step S1 of preparing the X capacitor body 10 and before the step S2 of installing the X capacitor body 10 in the capacitor case 40, the manufacturing method further includes forming a vacuum impregnation layer 14 on the surface of the X capacitor body 10, wherein the vacuum impregnation layer 14 having a high dielectric constant insulating material can protect the electrode of the X capacitor body 10 from touching other metal conductive surfaces in the subsequent process.
The embodiments of the present invention are merely preferred embodiments for easy understanding or implementing of the technical solutions of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes in structure, shape and principle of the present invention should be covered by the claims of the present invention.
Claims (10)
1. An interference suppressing X capacitor device, comprising:
an X capacitor body (10) connected by electrodes of the X capacitor body (10) to a plurality of extension pins (11,12), the X capacitor body (10) having a capacitance of 0.1uF or more;
a self bleeding circuit assembly (20) shorted to the extension pin (11, 12);
the encapsulation body (30) that the embedment formed, seal X electric capacity main part (10) with from bleeder circuit subassembly (20), encapsulation body (30) still seals extend pin (11,12) with from short circuit point (13) of bleeder circuit subassembly (20), extend pin (11,12) expose in encapsulation body (30).
2. The interference suppression X-capacitor device according to claim 1, wherein the self-bleeding circuit assembly (20) comprises an internal circuit board (21), a parallel resistor (22) disposed on the internal circuit board (21), and a controller chip device (23) disposed on the internal circuit board (21) and connected in series with the parallel resistor (22), a bleeding circuit (24) is formed in the internal circuit board (21), and shorting terminals (25) of the bleeding circuit (24) are located on two sides of the internal circuit board (21) for shorting the extension pins (11, 12).
3. The X capacitor device for interference suppression according to claim 2, wherein the short-circuit end point (25) is in the shape of an annular pad, the extending pins (11,12) penetrate through the short-circuit end point (25) and are welded with the short-circuit end point (25), and the surface of the built-in circuit board (21) for mounting the parallel resistor (22) and the controller chip device (23) faces away from the X capacitor body (10).
4. The X-capacitor apparatus for interference suppression according to claim 2, wherein the number of the extension pins (11,12) is only two, and the parallel number of the resistors (22) is 2 or more.
5. The X capacitor device for interference suppression according to claim 2, wherein the parallel resistors (22) are arranged in multiple groups on two sides of the controller chip device (23), the bleeder circuit (24) includes an inner convergence bridge (26) for connecting the controller chip device (23) and the parallel resistors (22), and a chip contact (23A) on one side of the controller chip device (23) and an inner resistor contact (22A) on a corresponding group of the parallel resistors (22) are both located on the inner convergence bridge (26).
6. The interference suppression X-capacitor device according to claim 5, wherein the bleeder circuit (24) further comprises an outer collection bridge (27) for connecting the parallel resistors (22) and the shorting terminal (25), and the outer resistor contacts (22B) and the shorting terminal (25) of the corresponding group of the parallel resistors (22) are located on the outer collection bridge (27), preferably, the controller chip device (23) has a primary packaging structure, and the encapsulant (30) has a secondary packaging structure and also seals the controller chip device (23).
7. The interference-suppressing X capacitor device according to claim 1, further comprising a capacitor case (40), wherein the X capacitor body (10) is mounted in the capacitor case (40), and the sealing compound (30) is formed by pouring in the capacitor case (40);
preferably, the surface of the X capacitor body (10) is formed with a vacuum impregnation layer (14);
specifically, the X capacitor main body (10) is formed by winding a metallized polypropylene film into a roll.
8. The interference suppressing X-capacitor apparatus according to any one of claims 1-7, wherein when the interference suppressing X-capacitor apparatus is mounted on an external printed circuit board and power is cut off, a self-charge bleed-off within the interference suppressing X-capacitor apparatus is automatically formed from the X-capacitor body (10) to the self-bleeding circuit assembly (20).
9. A method for manufacturing an X capacitor device for suppressing interference, comprising:
preparing an X capacitor body (10), and connecting a plurality of extension pins (11,12) from electrodes of the X capacitor body (10), wherein the X capacitor body (10) has a capacitor capacity of more than or equal to 0.1 uF;
-mounting a self-bleeding circuit assembly (20) short-circuited with the extension pin (11, 12);
the embedment forms and seals colloid (30), seal colloid (30) seal X electric capacity main part (10) with from bleeder circuit subassembly (20), seal colloid (30) still seal from bleeder circuit subassembly (20) with short circuit point (13) of extension pin (11,12), extension pin (11,12) expose in seal colloid (30).
10. The method for manufacturing an interference suppressing X-capacitor device according to claim 9, wherein the method further comprises, after the X-capacitor body (10) is prepared and before the molding compound (30) is formed by potting, mounting the X-capacitor body (10) in a capacitor case (40) for performing a potting process for forming the molding compound (30);
preferably, the manufacturing method further comprises forming a vacuum impregnation layer (14) to a surface of the X capacitor body (10) after the X capacitor body (10) is prepared and before the X capacitor body (10) is installed in a capacitor case (40);
specifically, the X capacitor main body (10) is prepared by the steps of metalizing a polypropylene film and winding the obtained metalized polypropylene film into a roll to form the X capacitor main body (10).
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| CN202010536782.6A CN111584236A (en) | 2020-06-12 | 2020-06-12 | X-capacitor device for suppressing interference and method for manufacturing the same |
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| CN201285708Y (en) * | 2008-10-17 | 2009-08-05 | 东明机电（深圳）有限公司 | Capacitor with leak resistor built-in |
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