CN111581820B - Novel simulation method for melting additive manufacturing process of laser area array selected area - Google Patents

Novel simulation method for melting additive manufacturing process of laser area array selected area Download PDF

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CN111581820B
CN111581820B CN202010381836.6A CN202010381836A CN111581820B CN 111581820 B CN111581820 B CN 111581820B CN 202010381836 A CN202010381836 A CN 202010381836A CN 111581820 B CN111581820 B CN 111581820B
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CN111581820A (en
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王晨光
沈显峰
王国伟
王开甲
吴鸿飞
孙凯华
陈金明
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Institute of Mechanical Manufacturing Technology of CAEP
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    • G06F30/20Design optimisation, verification or simulation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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    • G06FELECTRIC DIGITAL DATA PROCESSING
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Abstract

The invention discloses a novel simulation method for a melting additive manufacturing process of a laser area array selected area, which comprises the following steps of: s1, designing a point source array, wherein a point source is a heat source for forming a point-like light spot; s2, comparing the point source array with a pattern to be exposed, and lightening a related point source to form a planar light spot; s3, setting boundary conditions of the planar light spots, and loading a heat source; and S4, adjusting the temperature distribution of the exposure area by adjusting the thermal power and/or the exposure time of the corresponding point source. The method has strong feasibility, is suitable for combining numerical simulation with actual processing, takes the simulation as an auxiliary means for predicting and parameter-adjusting parameter optimization, and is beneficial to realizing the actual area array exposure of the area array process.

Description

Novel simulation method for melting additive manufacturing process of laser area array selected area
Technical Field
The invention relates to the field of additive manufacturing and rapid forming, in particular to a novel simulation method for a melting additive manufacturing process of a laser area array selection area.
Background
Metal additive manufacturing is a novel additive manufacturing mode in the field of additive manufacturing, and is mainly based on a melting deposition principle. The metal melting deposition mostly adopts electron beams or lasers as energy sources, and related process modes are continuously innovated and optimized and are gradually paid more attention by researchers in the field. The powder-laying selective laser melting process in the traditional metal melting deposition technology is a typical process method in the additive manufacturing process. The process has the advantages of high precision, short processing period, high forming density, good forming quality and the like, and solves the manufacturing problems that the traditional machining technology is difficult to prepare parts with small allowance and high precision, parts with complex shapes, parts produced in small batches or singly and the like.
However, the technology adopts a point-by-point scanning mode, and has the defects of long scanning time, uneven stress distribution caused by different point scanning sequences and the like when a large section is fused.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the invention provides a novel simulation method for a melting and material-increasing manufacturing process of a laser area array selection area, which solves the problems by adopting a point-by-point scanning mode and having the defects of long scanning time, uneven stress distribution caused by different point scanning sequences and the like when a large section is melted.
The invention is realized by the following technical scheme:
a novel simulation method for a melting additive manufacturing process of a laser area array selected area comprises the following steps:
s1, designing a point source array, wherein a point source is a heat source for forming a point-like light spot;
s2, comparing the point source array with a pattern to be exposed, and lightening a related point source to form a planar light spot;
s3, setting boundary conditions of the planar light spots, and loading a heat source;
and S4, adjusting the temperature distribution of the exposure area by adjusting the thermal power and/or the exposure time of the corresponding point source. Through the area array selective area exposure process completed by the steps, better process parameters which can be adopted by actual area array fusion can be obtained.
The laser beam processing method can array the point-like beams, realizes surface area fusion of the surface powder layer to be processed in a multi-point high-density array mode, is suitable for different model patterns by selecting different point sources for matching, regulates and controls temperature distribution of an exposure area by controlling thermal power of each point source, shortens laser scanning fusion time, improves processing efficiency, reduces deformation and research and development cost, and has important significance for promoting development of laser additive manufacturing and realizing high-efficiency and high-quality additive manufacturing.
And (3) carrying out numerical simulation on the surface light spot temperature field by using a finite element calculation method, setting the size of the base material and thermophysical parameters thereof, and setting a Gaussian heat source and parameter values.
Further preferably, the heat source is a gaussian heat source.
Further preferably, in S1, designing the point source array includes designing a type of the point source array and parameters related to the point source array; the types of the point source array comprise a square lattice array, a hexagonal array and an annular array; the relevant parameters of the point source array comprise the density of light spots thrown by the point source, the number of the light spots, the distance between the light spots and the radius of a single-light-spot heat source.
In the hardware design of the point source array, the number of the arrays can be adjusted, the array types include but are not limited to a square lattice array and a hexagonal array, and an annular array and the like can also be adopted. Wherein, 4 point sources which are nearest to and equidistant from each point source are arranged around each point source of the square array, which is called as a uniform point source array; the hexagonal array has 6 nearest and equidistant point sources around each point source, which is called non-uniform point source array.
Simulating a set area array exposure area under the set substrate condition, wherein the size of the exposure area is adjustable and selectable in the simulation step; set lattice spot light is put in the area, and the density and the number of the lattice spot light are adjustable; the distance between each light spot is set to be 0.1mm-1mm, and the radius of a single light spot heat source is designed to be 50 μm-500 μm.
Further preferably, in the hardware design of the point source array, the array plate is an aspheric arc surface.
Further preferably, in S2, the pattern to be exposed is subjected to gray scale processing to generate a binary gray scale map, and then the binary gray scale exposure pattern is loaded into the point source array for matching to generate the planar light spot.
The binary gray-scale map only comprises a gray-scale value 0 and a gray-scale value 255, the gray-scale value of the area to be exposed is 255, and the gray-scale value of the area which does not need to be exposed is 0.
Further preferably, the method of gray scale processing includes: slicing the stl format file of the design model, distinguishing and polarizing a to-be-exposed area of the slice layer by adopting a gray processing algorithm, extracting an exposure contour by adopting boundary extraction, taking the gray value in the contour as 255 as the to-be-exposed area, and taking the gray value in other areas as 0 as a non-exposed area.
Further preferably, in S3, the slice layer of the three-dimensional model is processed, boundary coordinates of the region to be exposed are extracted, and the boundary coordinates are matched with coordinates of each unit of the point source array for reference of a boundary heat input control scheme.
Further preferably, the slice layer of the three-dimensional model includes any layer of stl format file slices of the three-dimensional model, or each slice layer continuously imported by using external codes.
Further preferably, in S4, adjusting the temperature distribution of the exposure area is implemented by using point-source non-uniform exposure: the regulation and control make the heat power of each point source in the point source array be in gradient distribution by adjusting the power of the point source corresponding to different positions of the exposure area, and finally realize the uniform distribution of the temperature of the exposure area.
Further preferably, the different positions of the exposure area comprise the intersection positions of the filling area, the boundary and the heat affected zone.
The point source non-uniform exposure operation method comprises the following steps:
after the setting of the exposure area selection and the like is finished, the tetrahedral mesh is divided, the calculation is started, and the temperature field result under the convergence is obtained.
The heat source environment with uniform power in the selected area is changed, the power of the filled central area is reduced, the boundary power is kept medium, the power of a near boundary area is kept high, and the power of the near boundary area and the power of the central area are in gradient gradual change. And recalculating to obtain the temperature field result under convergence.
And the temperature field data of uniform regulation and control and non-uniform regulation and control are compared, so that the optimization brought by the non-uniform regulation and control and the value of the corresponding parameters are easily obtained.
The invention has the following advantages and beneficial effects:
the laser beam processing device can array the point-like beams, realizes surface area fusion of the surface powder layer to be processed in a multi-point high-density array mode, is suitable for different model patterns by selecting different point sources for matching, regulates and controls temperature distribution of an exposure area by controlling thermal power and exposure time of each point source, shortens laser scanning fusion time, improves processing efficiency, reduces deformation, reduces research and development cost, and has important significance for promoting development of laser additive manufacturing and realizing high-efficiency and high-quality additive manufacturing. The details are as follows:
1. the invention upgrades the spot scanning of the existing selective laser melting into surface scanning, namely enlarges the spot size, increases the spot shape characteristics, modulates the spot into the shape of the section to be sintered, improves the efficiency, and simultaneously exposes and sinters the whole surface.
2. The parameters of the area array exposure, such as exposure intensity, exposure time and the like, are determined by taking temperature field simulation as guiding reference, and the switching light of the single-tube area array unit is determined by comparing the point position coordinates of each point source unit with the position of the area array light spot in the area to be processed.
3. According to the invention, the parameters are adjusted through temperature field simulation calculation to obtain the temperature field information, and the parameter input threshold value and the adjustable range thereof required in the process of processing different powder materials can be obtained, so that the process parameters suitable for processing can be conveniently obtained, a complex trial and error experiment is avoided, and the research and development cost and time consumption are reduced.
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The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a temperature field simulation of a low melting point Sn-9Zn alloy under area array exposure;
FIG. 2 is an isotherm of a low-melting Sn-9Zn alloy under area array exposure;
FIG. 3 shows the design of the array exposure area and the design of the dot matrix heat source according to the present invention;
FIG. 4 is a 6061 series aluminum alloy surface light spot uniform point source temperature field simulation 1;
FIG. 5 is a 6061 series aluminum alloy surface light spot non-uniform point source temperature field simulation 1;
FIG. 6 is a 6061 series aluminum alloy surface light spot uniform point source temperature field simulation 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
The embodiment provides a novel method for simulating a melting additive manufacturing process in a laser area array selected area, which comprises the following specific steps:
step 1, designing a point source array
Simulating an 80mm × 80mm area array exposure area under the condition of a 200mm × 200mm × 25mm substrate, wherein the size of the exposure area is adjustable and selectable in the simulation step; 80 multiplied by 80 lattice spot light is thrown in the area, and the density and the number of the lattice spot light are adjustable; the space between each light spot is 0.1mm-1mm, and the radius of the heat source with single light spot is 50 μm-500 μm.
This step requires setting of material properties and their thermophysical parameters.
Step 2, stl format file slice batch boundary extraction and gray level processing
Exporting the designed three-dimensional model into an stl format file, compiling a program to call the model for slicing and outputting each layer of picture, calling layered pictures for batch boundary extraction and gray level processing by the compiling program to generate a binary gray level picture, taking a gray level matrix and matching the matrix with a point source array.
And the boundary extraction adopts a Sobel operator, outputs the extracted boundary gray matrix A, fills the region gray matrix B, and converts the gray positions of the matrix A and the matrix B into coordinate positions. And taking the continuous gray value area of the matrix B as a filling area, and corresponding each coordinate point in the matrix A to each unit coordinate of the point source as the reference of the boundary heat input control scheme.
Step 3, carrying out region selection by matching gray value 255 region with point source array
The binary gray-scale map only comprises a gray-scale value 0 and a gray-scale value 255, the gray-scale value of the area to be exposed is 255, and the gray-scale value of the area which does not need to be exposed is 0. And (3) solving the intersection of the coordinate matrix obtained in the step (2) and the point source array by the writing program to obtain the serial number of the point source to be lighted, and finishing the region selection.
Step 4, setting boundary conditions and Gaussian heat source parameters
The boundary condition is set as the constant temperature of the 5 surfaces of the substrate, the 5 surfaces 323K can also be adopted, other 5-surface constant temperature methods also belong to the patent description of the invention according to different actual materials, and the top surface is set as an open boundary for natural heat dissipation.
The Gaussian heat source is set to be 0.3W-2.5W of power of a diode single tube, and the range is used for 6061 aluminum alloy, and is adjusted for different materials or to be adjusted. The calculation mode of the heat source power adopts a generalized source type.
Step 5, selecting area light spot exposure and point source non-uniform regulation and control
After the setting of the exposure area selection area, the boundary condition, the heat source parameter and the like is finished, the tetrahedral mesh is divided, the calculation is started, and the temperature field result under the convergence is obtained.
Changing the heat source environment of uniform power of the selected area, reducing the power of the filled central area, keeping the boundary power at a medium level, keeping the power of a near-boundary area at a high level, and making the power gradually change in a gradient manner by taking the near-boundary area as a transition area from the central area. And recalculating to obtain the temperature field result under convergence.
And the temperature field data of uniform regulation and non-uniform regulation are compared, so that the optimization brought by the non-uniform regulation and the value of the corresponding parameters are easily obtained.
Example 2
In this example, an area array exposure molten metal additive manufacturing experiment was simulated on a substrate 200mm long by 200mm wide by 25mm high by taking a low melting point metal Sn-9Zn alloy as an example. This embodiment is used to illustrate the simulation process of the temperature field of the customized spot shape, as shown in fig. 1 and fig. 2.
An array of point sources is first designed. Creating a substrate of 200mm multiplied by 25mm, simultaneously creating an area array exposure area of 80mm multiplied by 80mm, wherein the size of the exposure area can be adjusted and selected in the simulation step; 80 x 80 array point light spots are put in the area, and the density and the number of the array point light spots are adjustable; the distance between the thrown light spots is 1mm, and the radius of the single light spot heat source is 500 mu m.
The substrate material is Sn-9Zn, and thermophysical parameters are set so as to simulate the temperature field for processing Sn-9Zn alloy powder.
The simulated spot pattern of the embodiment does not come from stl files, and the exposure pattern is selectively drawn in the spot array formed by putting the point source array. The shape of the surface light spot is set to be a chamfer frame shape to simulate the distribution of the temperature field of the surface light spot of the equal chamfer frame shape, the size of the chamfer frame shape is 17mm multiplied by 17mm, the frame thickness is 1mm, and the chamfer angle is 6mm multiplied by 6mm. The input laser power is set to be 2W, the focusing radius of the diode single-tube laser is 500 mu m, and the boundary of the processing platform is 5 surfaces, and the temperature is constant at normal temperature. Setting up the thermal physical property parameter of Sn-9Zn alloy, and taking the density as 7g/cm 3 The heat conductivity coefficient is 67W/(m.K), the constant-pressure hot melting is 220J/(kg.DEG C), a temperature field at 0.2s under the transient condition is researched, the optimal exposure instant moment of a heat affected zone close to the set spot shape is observed, the spot temperature at the optimal exposure moment reaches an alloy liquid phase point, and the heat affected zone has no difference with the preset spot shape. According to actual requirements, the input parameters of the point source laser power can be adjusted to adjust the exposure intensity or adjust the exposure time; the exposure power of the L-shaped area can be set in a linear gradient mode according to the gray value range of the gray matrix obtained by gray processing, the boundary exposure time is set to be 0% -100% of the exposure time of the filling area, an input parameter group which is most beneficial to the process is obtained, and the parameter group is used as the input in the actual process.
Example 3
In this embodiment, a 6061 aluminum alloy is taken as an example, and an area array exposure molten metal additive manufacturing experiment is simulated on a substrate with a length of 200mm × a width of 200mm × a height of 25mm, and this embodiment is used to illustrate the function and effect of point source non-uniform control.
An array of point sources is designed. Creating a substrate of 200mm multiplied by 25mm, simultaneously creating an area array exposure area of 80mm multiplied by 80mm, wherein the size of the exposure area can be adjusted and selected in the simulation step; 80 multiplied by 80 array point light spots are put in the area, and the density and the number of the array point light spots are adjustable; the distance between the thrown light spots is 1mm, and the radius of the single light spot heat source is 500 mu m.
The substrate material was set to 6061 aluminum alloy, and thermophysical parameters were set to simulate the temperature field in which 6061 aluminum alloy powder was processed. The simulated spot pattern is not from stl format files, and the exposure pattern is selectively drawn in the spot array formed by the point source array. The surface light spot shape is set as a graph shown in fig. 4, the setting mode of the graph corresponding to a point source is the same as that of fig. 3 corresponding to the embodiment 2, and the comparison of the temperature fields of uniform regulation and non-uniform regulation is simulated to explain the action and significance of the non-uniform regulation.
The input laser power is set to be 1.5W, the focusing radius of the diode single-tube laser is 500 mu m, and the boundary of the processing platform is 5 surfaces, and the temperature is constant at normal temperature. Setting the thermophysical property parameter of 6061 aluminum alloy, and taking the density of 2.7g/cm 3 The thermal conductivity is 155W/(m.K), the constant-pressure hot melting is 896J/(kg.DEG C), a temperature field is studied at 0.1s under the transient condition, the optimal exposure instant time of a heat affected zone close to the set spot shape is observed, the spot temperature reaches an alloy liquid phase point at the optimal exposure time, the heat affected zone is not poor in the preset spot shape, but local high-temperature areas exist at sharp corners, intersection points and the like, and have high-density isothermal lines, which are reflected as uneven temperature fields and are not beneficial to accurate sintering of shape characteristics, and the method is shown in figure 4.
According to the actual requirement, in order to obtain a uniform temperature field, the isothermal line density is uniform everywhere, a high-temperature area is eliminated, laser power input parameters are adjusted to reduce local heat input, areas such as sharp corners and corners can also be identified by using boundary extraction, and the point source power of the sharp corners, the corners and intersection points is set to be 50% of a standard value, namely 0.75W in the embodiment. Therefore, the temperature field of point source non-uniform regulation simulation shown in fig. 5 is obtained, the characteristics of sharp corners, intersection points and the like in fig. 5 are closer to the shape of a preset light spot, and the intersection of a heat affected zone is reduced.
Example 4
Similar to example 3, under the same simulation conditions, the simulated surface light spot shape is changed into a square, the temperature field of the uniform point source simulation is shown in fig. 6, the heat affected zone of the temperature field is larger, the shape of the temperature field is greatly different from that of the preset square light spot, the isotherm in the central area is concentrated at high density, and the temperature is higher.
The non-uniform point source is gradually arranged from the center of a square to the outside in a gradient manner and is mainly divided into three levels, namely a center filling area, a near boundary transition area and a boundary area, wherein the boundary area is 1.5W, the near boundary transition area is an annular area between the boundary and a center area, the size of the area is determined according to the simulation effect, and the power of the area is 60 percent of the standard value of the boundary area, namely 0.9W; the center-filled region is 30% of the standard value of the boundary region, i.e. 0.45W. Other simulation parameters are the same as those in the embodiment 2, a temperature field of non-uniform point source simulation is obtained, a heat affected zone of the temperature field is closer to a preset square light spot, the shape characteristic of the light spot is kept good, an isothermal line of an exposure area is uniformly distributed, and a large-area with high temperature concentration does not exist.
The temperature distribution regulation and control is regulated through power and exposure time, which means that different powers are adopted at different positions to achieve the purpose of uniform temperature distribution (as in the above case), if the point positions adopt the same power, the temperature field can be uniformly distributed by controlling the exposure time of the different point positions, for example, the power is all 3W, the boundary is exposed for 0.7s, the internal filling area is exposed for 0.5s, the boundary is exposed to the internal transition area for 0.6s, when the time reaches 0.5s, the temperature field belongs to the temperature field which is not regulated, the temperature field presents that the isotherm of the central area is dense, the temperature is high, the isotherm is gradually lower outwards, the isotherm is also gradually sparse, the time is continuously increased, the exposure of the central area is stopped, the exposure of the transition area and the boundary is continuously carried out, the peripheral temperature is gradually increased to be close to the internal temperature, the exposure of the transition area is stopped when the time reaches 0.6s, the temperature of the transition area is close to the internal area, but the boundary and the exposure to be continuously carried out for 0.1s, and the purpose of uniform temperature regulation and control of the temperature field is achieved.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (8)

1. A novel simulation method for a melting additive manufacturing process of a laser area array selection area is characterized by comprising the following steps:
s1, designing a point source array, wherein a point source is a heat source for forming a point-like light spot;
s2, comparing the point source array with a pattern to be exposed, and lightening a related point source to form a planar light spot;
s3, setting boundary conditions of the planar light spots, and loading a heat source;
s4, adjusting the temperature distribution of the exposure area by adjusting the thermal power and/or the exposure time of the corresponding point source;
in S4, adjusting the temperature distribution of the exposure area by adopting point source non-uniform exposure: regulating and controlling point source power corresponding to different positions of the exposure area to enable the heat power of each point source in the point source array to be in gradient distribution, and finally achieving uniform distribution of the temperature of the exposure area;
The different positions of the exposure area comprise the intersection positions of the filling area, the boundary and the heat affected zone.
2. The simulation method for the novel melting additive manufacturing process of the laser area array selected area according to claim 1, wherein the heat source is a gaussian heat source.
3. The novel simulation method for the melting additive manufacturing process of the laser area array selected area according to claim 1, wherein in S1, designing the point source array comprises designing a type of the point source array and parameters related to the point source array;
the types of the point source array comprise a square lattice array, a hexagonal array and an annular array;
the relevant parameters of the point source array comprise the density of light spots thrown by the point source, the number of the light spots, the distance between the light spots and the radius of a single-light-spot heat source.
4. The simulation method for the melting additive manufacturing process of the novel laser area array selected area according to claim 1, wherein in the hardware design of the point source array, an array plate is an aspheric arc surface.
5. The simulation method for the melting additive manufacturing process of the novel laser area array selected area according to claim 1, wherein in S2, the gray scale of the pattern to be exposed is processed to generate a binary gray scale image, and then the binary gray scale exposure pattern is loaded into the point source array for matching to generate the planar light spot.
6. The simulation method of the novel laser area array selected area melting additive manufacturing process according to claim 5, wherein the gray processing method comprises: slicing the stl format file of the design model, distinguishing and polarizing a to-be-exposed area of the slice layer by adopting a gray processing algorithm, extracting an exposure contour by adopting boundary extraction, taking the gray value in the contour as 255 as the to-be-exposed area, and taking the gray value in other areas as 0 as a non-exposed area.
7. The novel simulation method for the melting additive manufacturing process of the laser area array selected area according to claim 1, wherein in S3, the slice layer of the three-dimensional model is processed, boundary coordinates of an area to be exposed are extracted, and the boundary coordinates are matched with coordinates of each unit of the point source array and used for reference of a boundary heat input control scheme.
8. The simulation method for the melting additive manufacturing process of the novel laser area array selected area according to claim 7, wherein the slice layer of the three-dimensional model comprises any one of stl-format file slices of the three-dimensional model or each slice layer continuously imported by using external codes.
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