CN111579587B - Detection device and detection method for detecting thermal resistance of heat conducting material - Google Patents
Detection device and detection method for detecting thermal resistance of heat conducting material Download PDFInfo
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- CN111579587B CN111579587B CN202010576580.4A CN202010576580A CN111579587B CN 111579587 B CN111579587 B CN 111579587B CN 202010576580 A CN202010576580 A CN 202010576580A CN 111579587 B CN111579587 B CN 111579587B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Abstract
The invention provides a detection device for detecting thermal resistance of a heat conducting material, which comprises a high-temperature detection unit adsorbed at a heating end of the heat conducting material, and comprises a heating module and a high-temperature acquisition module. The heating module is used for heating the heating end, and the high-temperature acquisition module is configured to acquire heating temperature data of the heated heating end. A low temperature detection unit adsorbed at the heat transfer end of the heat conductive material configured to collect heat transfer temperature data at the heat transfer end. A measurement control unit that controls the high temperature and low temperature detection unit and is configured to receive heating temperature data from the high temperature detection unit and heat transfer temperature data from the low temperature detection unit; and determining a thermal resistance of the thermally conductive material based on the heating temperature data and the heat transfer temperature data. The scheme of the invention not only can be suitable for the heat conduction materials with larger difference in size specification, but also can adsorb the heat conduction materials in a non-fixed mode, so that the detection operation is simpler and more convenient.
Description
Technical Field
The present invention relates generally to the field of detection. More particularly, the present invention relates to a detection device for detecting thermal resistance of a heat conductive material and a detection method thereof.
Background
In the application of the industrial field, especially in the industries of raw material processing, manufacturing of heat dissipation profiles and the use of heat conduction materials, the problem of heat dissipation is solved, and the selection of the heat conduction materials becomes an essential link in the industrial heat energy design. For heat conducting materials of different materials and different sizes, the thermal resistance value of the heat conducting materials needs to be detected to determine relevant parameters. Therefore, there is a greater need for a detection device that detects the thermal resistance of thermally conductive materials. However, the existing device for detecting the thermal resistance of the heat conducting material has strict limitation on the size specification of the heat conducting material to be detected, so that the heat conducting material with large size specification difference cannot be detected. In addition, the heat conducting material to be tested needs to be fixed on the detection device to execute further detection operation, so that the detection operation process is complex.
Therefore, how to provide a detection device which has no limitation on the size and specification of the heat conducting material, does not need to carry out complex fixed installation on the heat conducting material to be detected, and has simple operation process is a problem to be solved at present.
Disclosure of Invention
To solve at least the above-mentioned technical problems, in one aspect, the present invention provides a detection device for detecting thermal resistance of a heat conductive material, comprising:
a high temperature detection unit adsorbed at a heating end of the heat conductive material and including a heating module for heating the heating end and a high temperature acquisition module configured to acquire heating temperature data at the heating end after heating;
a low temperature detection unit adsorbed at a heat transfer end of the heat conductive material and configured to collect heat transfer temperature data at the heat transfer end; and
a measurement control unit that controls the high temperature detection unit and the low temperature detection unit and is configured to:
receiving the heating temperature data from the high temperature detection unit and the heat transfer temperature data from the low temperature detection unit; and
and determining the thermal resistance of the heat conducting material according to the heating temperature data and the heat transfer temperature data.
In one embodiment, the high temperature acquisition module comprises a high temperature flange and a high temperature sensor fixed in the high temperature flange, wherein the high temperature flange is used for being adsorbed on the heating end of the heat conducting material, and the high temperature sensor is configured to acquire the heating temperature data and transmit the heating temperature data to the measuring and calculating control unit.
In another embodiment, the high temperature flange includes a high temperature flange upper cover, a high temperature flange lower cover, and a high temperature flange plate disposed between the high temperature flange upper cover and the high temperature flange lower cover, wherein:
the high temperature flange upper cover and the high temperature flange plate are respectively arranged with a plurality of suction holes aligned with each other for being adsorbed to the heat conductive material, and the high temperature flange plate includes a height Wen Qilu communicating with the plurality of suction holes thereof in the circumferential direction, and the high temperature flange lower cover includes at least one high temperature air transfer hole arranged to be in butt joint with the suction holes communicating with the high temperature flange upper cover and the high temperature flange plate so as to transfer the absorbed air to the measuring and calculating control unit through the high temperature air path.
In one embodiment, a fixing device for fixing the high-temperature sensor is arranged at the center through hole of the high-temperature flange along the axis, and the heating module is arranged between the outer surface of the fixing device and the inner annular surface of the high-temperature flange.
In another embodiment, the high temperature flange lower cover is further arranged with at least one of a wire hole of the heating module and a wire hole of the high temperature sensor.
In yet another embodiment, the low temperature detection unit includes a low temperature flange for adsorption to the heat transfer end of the heat conductive material and a low temperature sensor fixed inside the low temperature flange, and the low temperature sensor is configured to collect the heat transfer temperature data and transmit the data to the measurement control unit.
In one embodiment, the low temperature flange includes a low temperature flange upper cover, a low temperature flange lower cover, and a low temperature flange plate disposed between the low temperature flange upper cover and the low temperature flange lower cover, wherein:
the low temperature flange upper cover and the low temperature flange plate are respectively arranged with a plurality of suction holes aligned with each other for being adsorbed to the heat conductive material, and the low temperature flange plate includes a low temperature air path communicating the plurality of suction holes thereof in a circumferential direction, and the low temperature flange lower cover includes a wire outlet hole of the low temperature sensor and at least one low temperature air transfer hole arranged to be in butt joint with the suction holes communicating the low temperature flange upper cover and the low temperature flange plate so as to transfer the absorbed air to the measuring and calculating control unit through the low temperature air path.
In another embodiment, the measurement control unit includes:
a measurement control module configured to receive the heating end temperature data from the high temperature detection unit and the heat transfer end temperature data of the low temperature detection unit, and determine a thermal resistance of the thermally conductive material from a power parameter, the heating end temperature data, and the heat transfer end temperature data; and
and the adsorption control module is used for controlling the high-temperature detection unit and the low-temperature detection unit to perform adsorption operation on the heat conducting material.
In one embodiment, the adsorption control module includes a high temperature adsorption control module and a low temperature adsorption control module, wherein the high temperature adsorption control module is in communication with the high temperature transfer pores through a high temperature adsorption gas path and configured to control the adsorption of the high temperature detection unit to the heating end of the heat conductive material, and the low temperature adsorption control module is in communication with the low temperature transfer pores through a low temperature adsorption gas path and configured to control the adsorption of the low temperature detection unit to the heat transfer end of the heat conductive material.
In another aspect, a detection method for determining thermal resistance of a thermally conductive material using the detection apparatus of the foregoing and various embodiments described later thereof includes:
disposing a high temperature detection unit at a heating end of the thermally conductive material;
disposing a low temperature detection unit at a heat transfer end of the thermally conductive material;
starting the detection device so as to enable the high-temperature detection unit and the low-temperature detection unit to be respectively adsorbed at the heating end and the heat transfer end through the measuring and calculating control unit;
heating the heating end by using a heating module;
the high-temperature acquisition module and the low-temperature detection unit are used for respectively acquiring heating temperature data and heat transfer temperature data; and
and determining the thermal resistance of the heat conducting material according to the heating temperature data and the heat transfer temperature data by utilizing the measuring and calculating control unit.
By utilizing the detection device and the detection method thereof provided by the invention, the detection device and the detection method thereof can be suitable for the heat conduction materials with larger difference in parameters such as appearance, size and the like, and the heat conduction materials to be detected are adsorbed in a non-fixed mode, so that complex fixing operation on the heat conduction materials to be detected is not needed, and the detection operation is simpler and more convenient.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 is a schematic diagram showing the structure of a detection device according to an embodiment of the present invention;
fig. 2a,2b and 2c are schematic structural views showing a high temperature detection unit of a detection device according to an embodiment of the present invention;
fig. 3a,3b and 3c are schematic structural views showing a low temperature detection unit of a detection device according to an embodiment of the present invention; and
fig. 4 is a flowchart illustrating a method of performing detection using a detection apparatus according to an embodiment of the present invention.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic diagram showing the structure of a detection apparatus 100 according to an embodiment of the present invention. As shown, the detection apparatus 100 of the present invention may include a high temperature detection unit 102, a low temperature detection unit 104, and a measurement control unit 106. In the process of collecting the temperature of the heat-conducting material 108, the high temperature detecting unit 102 and the low temperature detecting unit 104 are respectively adsorbed on the heating end 1081 and the heat transfer end 1082 of the heat-conducting material 108, and are respectively used for collecting the heating temperature data of the heating end 1081 and the heat transfer temperature data of the heat transfer end 1082.
In one embodiment, the high temperature detection unit 102 may include a heating module 107 (shown in a dashed box) and a high temperature acquisition module 109. The heating module 107 may be used as a heat source of the heat conducting material 108 for heating the heating end 1081 of the heat conducting material. The high temperature acquisition module may be configured to acquire heated temperature data at the heated end 1081. Further, the high temperature collection module may include a high temperature flange 113 and a high temperature sensor 111 fixed inside thereof. The high temperature flange 113 is used to be adsorbed to the heating end of the heat conductive material, and may include a high temperature flange upper cover 115, a high temperature flange 117, and a high temperature flange lower cover 119. The high temperature sensor 111 may be configured to collect the heating temperature data and transmit it to the measurement control unit 106.
In another embodiment, the low temperature detection unit 104 may be configured to collect heat transfer temperature data at the heat transfer end 1082. Further, the low temperature detecting unit may include a low temperature flange and a low temperature sensor fixed inside thereof. The low temperature flange is configured to be adsorbed to the heat transfer end 1082 of the thermally conductive material. The low temperature sensor may be configured to collect the heat transfer temperature data and transmit it to the evaluation control unit 106.
The measurement control unit 106 may control the high temperature detection unit 102 and the low temperature detection unit 104 during the process of detecting the heat conductive material. Further, the evaluation control unit may be configured to receive the heating temperature data from the high temperature detection unit 102 and the heat transfer temperature data from the low temperature detection unit 104, and may determine the thermal resistance of the heat conductive material from the heating temperature data and the heat transfer temperature data.
In one application scenario, the measurement and calculation control unit may be flexibly connected to the high temperature detection unit 102 through a high temperature loop 123 (e.g. a high temperature cable) and a high temperature adsorption gas path 121 (e.g. a high temperature gas pipe). The high temperature loop 123 includes a heating module loop and a high temperature sensor loop. The heating module loop is used for electrically connecting the heating module with the measuring and calculating control unit. The high temperature sensor loop is used for transmitting the heating temperature data to the measuring and calculating control unit by the high temperature sensor. As will be appreciated by those skilled in the art, the measurement and control unit may be similarly flexibly connected to the low temperature detection unit 104 through a low temperature sensor circuit and a low temperature adsorption gas circuit. Therefore, the detection device provided by the invention can be suitable for detecting the heat conduction materials with large differences in parameters such as appearance, size and the like. Specifically, in the detection preparation stage, the length data of the high-low temperature loop and the high-low temperature adsorption gas path, which are respectively connected with the high-temperature detection unit and the low-temperature detection unit by the measuring and calculating control unit, can be determined according to the relevant parameters such as the appearance, the size and the like of the heat conducting material, so that the heat conducting material can be adsorbed and detected.
In one embodiment, the measurement control unit 106 may include an adsorption control module for controlling the high temperature detection unit and the low temperature detection unit to perform an adsorption operation on the heat conductive material. In a specific application scenario, the adsorption control module may include a high-temperature adsorption control module and a low-temperature adsorption control module, so that a pressure control range required for reliably adsorbing both ends of the heat-conducting material may be determined according to the related parameters of the heat-conducting material. Further, the high temperature adsorption control module may be connected to the high temperature air transfer hole through a high temperature adsorption air path 121 (e.g., a high temperature resistant air pipe), and may be configured to control the high temperature detection unit to be closely adsorbed to the heating end of the heat conductive material, so as to ensure accuracy of the collected heating temperature data. Similarly, the low-temperature adsorption control module may be in communication with the low-temperature air transfer hole through a low-temperature adsorption air path (e.g., a high-temperature-resistant air pipe), and may be configured to control the low-temperature detection unit 104 to be closely adsorbed to the heat transfer end of the heat conductive material, so that accuracy of collected heat transfer temperature data may be ensured.
Further, the evaluation control unit 106 may include an evaluation control module that may be configured to receive the heating end temperature data from the high temperature detection unit and the heat transfer end temperature data of the low temperature detection unit, and determine a thermal resistance of the heat conductive material based on a power parameter, the heating end temperature data, and the heat transfer end temperature data. In one embodiment, the heat transfer value Φ may be obtained according to fourier's law using equation (1):
Φ＝-λA(dt/dx) (1)；
where Φ is the heat conduction (in watts), λ is the coefficient of thermal conductivity, and a is the heat transfer area (in square meters). t is the temperature (in Kelvin, abbreviated as "K"), x is the coordinate on the thermally conductive surface (in meters), and (dt/dx) is the rate of change of the temperature of the object in the x-direction.
After obtaining the heat conduction amount of the heat conduction material using the formula (1), the thermal resistance value of the heat conduction material of the present invention can be obtained using the following formula (2):
R＝(TC-TD)/P (2)
wherein R is a thermal resistance value, TC is heating temperature data, TD is heat transfer temperature data, and P is a power parameter.
According to different application scenes, the power parameters of the invention can be obtained by combining the detected parameters such as the material quality and the area of the heat conducting material, the heat conducting quantity and the like with empirical values. In a specific application scenario, the influence parameters of the thermal resistance can be calculated according to the environmental temperature, the air heat dissipation influence, the heating temperature data, the heating condition of the heat transfer temperature data and the like, and the thermal resistance value obtained according to the formula (2) is adjusted by combining the empirical value to obtain the final thermal resistance value result.
The structure of the detection device and its functions are described in detail above with reference to fig. 1, and the structural relationships between the high temperature detection unit and the low temperature detection unit will be exemplarily described below with reference to fig. 2 to 3, respectively.
Fig. 2a,2b and 2c are schematic structural views showing a high temperature detection unit of a detection device according to an embodiment of the present invention. The high temperature flange 113 of the high temperature detection unit shown in connection with fig. 1 may include a high temperature flange upper cover 115 (shown in fig. 2 a), a high temperature flange lower cover 119 (shown in fig. 2 c), and a high temperature flange plate 117 (shown in fig. 2 b) disposed between the high temperature flange upper cover and the high temperature flange lower cover.
Fig. 2a illustrates a top view of the high temperature flange upper cover 115 to the left. To facilitate understanding of its overall structure, the right-hand view of fig. 2a shows its structural view in different directions. As can be seen from the left and right diagrams of fig. 2a, the high temperature flange upper cover has a cylindrical overall structure and has a top surface of a flange-like ring structure. Further, the high temperature flange upper cover is symmetrically provided with a plurality of suction holes 201 for sucking the heat conductive material. In addition, an upper cover through hole 202 communicated with the high temperature flange is arranged at the center of the high temperature flange upper cover, so that the high temperature sensor can reliably contact the heating end through the upper cover through hole 202, and heating temperature data are acquired.
The left-hand side of fig. 2b shows a top view of the high-temperature flange 117. For a more visual understanding of the structure, the middle and right views of fig. 2b show schematic diagrams of the front and back sides of the high temperature flange, respectively. As can be seen from the left and middle views of fig. 2b, a plurality of suction holes 203 similar to the suction holes 201 of fig. 2a are arranged on the ring surface of the high temperature flange, and the plurality of suction holes 203 and the plurality of suction holes 201 of fig. 2a may be aligned with each other for being adsorbed to the heating end of the heat conductive material. Further, as can be seen in the middle and right views of fig. 2b, the high temperature flange may include a height Wen Qilu 206 communicating with a plurality of suction holes 203 in the circumferential direction thereof for sucking the heat conductive material.
The left and middle diagrams of fig. 2b show that a fixing device 205 (e.g. a metal block) for fixing the high temperature sensor is arranged along the axis at the position corresponding to the upper cover through hole 202 shown in fig. 2a at the center through hole of the high temperature flange. Further, the heating module 107 may be disposed between an outer surface of the fixture 205 and an inner circumferential surface of the high temperature flange. In an application scene, a metal block is arranged at the center of the high-temperature flange, and a high-temperature sensor can be placed in the metal block for acquiring the heated temperature data of the heating end. Further, the heating module 107 may include a winding fixing ring disposed at an outer surface of the metal block, and a heating coil wound around the winding fixing ring. The heating coil can be electrically connected to the measuring and calculating control unit by, for example, a high-temperature-resistant cable, for continuous heating of the heating end as a heating source.
Fig. 2c shows a bottom view of the high temperature flange lower cover 119. The high temperature flange lower cover may include at least one high temperature transfer hole 207, and the high temperature transfer hole 207 may be arranged to be in butt joint with the one or more suction holes 201 communicating with the high temperature flange upper cover and the one or more suction holes 203 of the high temperature flange plate, so that the high temperature air path 206 transfers the absorbed air from the high temperature transfer hole 207 to the measuring and calculating control unit through a high temperature adsorption air path to form an adsorption structure adsorbing the heating end. Further, the high temperature flange lower cover may further be provided with at least one of the wire hole 208 of the heating module and the wire hole 209 of the high temperature sensor as a connection channel of the aforementioned high temperature circuit. In one application scenario, the high-temperature flange upper cover is arranged on the upper layer of the high-temperature flange, the high-temperature flange plate is arranged in the middle of the high-temperature flange upper cover, and the high-temperature flange lower cover is arranged on the lower layer of the high-temperature flange upper cover, and the high-temperature flange upper cover, the high-temperature flange lower cover and the high-temperature flange lower cover can be fixed through screws for example to form the high-temperature flange.
Fig. 3a,3b and 3c are schematic structural views showing a low temperature detection unit of a detection device according to an embodiment of the present invention. The aforementioned low temperature detection unit 104 may include a low temperature flange and a low temperature sensor. Similarly, the low temperature flange may include a low temperature flange upper cover (as shown in fig. 3 a), a low temperature flange lower cover (as shown in fig. 3 c), and a low temperature flange plate (as shown in fig. 3 b) disposed between the low temperature flange upper cover and the low temperature flange lower cover. The low temperature flange of the low temperature detection unit shown in fig. 3a-3c has similar component functions and structural relationships to the high temperature flange of the high temperature detection unit shown in fig. 2a-2c, except that the low temperature flange shown in fig. 3 does not include the heating module shown in fig. 2. In view of this, the component functions and structural relationships of the high-temperature flange described in connection with fig. 2 are equally applicable to those of the low-temperature flange described in fig. 3, and thus will not be described in detail.
The low temperature flange upper cover shown in fig. 3a and the low temperature flange plate shown in fig. 3b may be respectively provided with a plurality of suction holes aligned with each other for being adsorbed to the heat transfer end of the heat conductive material, and the low temperature flange plate may include a low temperature gas path 301 communicating the plurality of suction holes thereof in the circumferential direction. The low temperature flange lower cover shown in fig. 3c may include a wire outlet hole 304 and at least one low temperature gas transfer hole 303 of the low temperature sensor 302 as shown in fig. 3 b. The low temperature air transfer holes are arranged to interface with one or more air suction holes communicating with the low temperature flange upper cover and the low temperature flange plate, so that the low temperature air path 301 transfers the absorbed air from the low temperature air transfer holes 303 to the measurement control unit through the low temperature adsorption air path to form an adsorption structure for adsorbing the heat transfer end. Further, the low temperature sensor wire outlet 304 may be used as a connection channel of a low temperature circuit, and the heat transfer temperature data may be transmitted to the measurement control unit through the aforementioned low temperature circuit.
Fig. 4 is a flowchart illustrating a method 400 of performing detection using a detection device according to an embodiment of the present invention. The detection device may employ an architecture as shown in fig. 1-3.
As shown in fig. 4, at step 401, the method 400 may arrange a high temperature detection unit at the heated end of the thermally conductive material. At step 402, the method 400 may arrange a low temperature detection unit at a heat transfer end of the thermally conductive material. After completion of the aforementioned detection preparation, the method 400 proceeds to step 403, where the detection device is activated so that the high temperature detection unit and the low temperature detection unit can be adsorbed at the heating end and the heat transfer end, respectively, by the evaluation control unit. In one embodiment, the measurement control unit may include an adsorption control module, which may include a high temperature adsorption control module and a low temperature adsorption control module. The high temperature adsorption control module is communicated with the high temperature air transmission hole of the high temperature detection unit through a high temperature adsorption circuit, the low temperature adsorption control module is communicated with the low temperature air transmission hole of the low temperature detection unit through a low temperature adsorption circuit, the high temperature adsorption control module can be configured to control the high temperature detection unit to be adsorbed on the heating end of the heat conducting material, and the low temperature adsorption control module can be configured to control the low temperature detection unit to be adsorbed on the heat conducting end of the heat conducting material.
In performing thermal resistance testing of a thermally conductive material, at step 404, method 400 may utilize a heating module of the high temperature testing unit as a heat generating source to heat a heated end of the thermally conductive material. Next, at step 405, the method 400 may acquire heating temperature data of the heating end and heat transfer temperature data of the heat transfer end through the high temperature acquisition module and the low temperature detection unit, respectively. In one application scenario, a time period may be selected based on empirical values such that the heating temperature data and the heat transfer temperature data of the heat conducting material may reach a steady state during the time period.
Finally, at step 406, the method 400 may utilize the evaluation control unit to determine a thermal resistance of the thermally conductive material based on the heating temperature data and the heat transfer temperature data in combination with the power parameter. In one embodiment, the evaluation control unit may include an evaluation control module that may be configured to receive the heating end temperature data from the high temperature detection unit and the heat transfer end temperature data from the low temperature detection unit. In one application scenario, the measurement control module may obtain the calculated thermal resistance value of the heat conducting material according to the power parameter and the temperature data of the heating end and the heat transfer end. Then, according to the related parameters such as ambient temperature, air heat dissipation influence, collected heating temperature data, heating condition of heat transfer temperature data and the like, influence parameters are calculated by combining with the empirical values, and the calculated thermal resistance value is adjusted by utilizing the influence parameters so as to output a final thermal resistance result. Further, a temperature resistance curve can be drawn according to heat transfer end temperature data corresponding to the temperature rise of the power parameter.
It should be understood that the terms "first," "second," "third," and "fourth," etc. in the claims, specification, and drawings of this disclosure are used for distinguishing between different objects and not for describing a particular sequential order. The terms "comprises" and "comprising" when used in the specification and claims of this disclosure are taken to specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the present disclosure is for the purpose of describing particular embodiments only, and is not intended to be limiting of the disclosure. As used in this disclosure and in the claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the present disclosure and claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
While various embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only and not by way of limitation. Numerous modifications, changes, and substitutions will occur to those skilled in the art without departing from the spirit and scope of the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention.
Claims (8)
1. A detection apparatus for detecting thermal resistance of a thermally conductive material, comprising:
a high temperature detection unit including a heating module and a high temperature collection module, the high temperature collection module including a high temperature flange upper cover, a high temperature flange lower cover, and a high temperature flange plate disposed between the high temperature flange upper cover and the high temperature flange lower cover, the high temperature flange upper cover and the high temperature flange plate being respectively provided with a plurality of suction holes aligned with each other for being adsorbed to a heating end of the heat conductive material, and the high temperature flange plate including a high Wen Qilu communicating the plurality of suction holes thereof in a circumferential direction, the high temperature flange lower cover including at least one high temperature air transfer hole arranged to be in butt joint with the suction holes communicating the high temperature flange upper cover and the high temperature flange plate so as to transfer absorbed air to a measurement and calculation control unit through the high temperature air path, the heating module being for heating the heating end, and the high temperature collection module being configured to collect heating temperature data at the heating end after heating;
a low temperature detecting unit including a low temperature flange upper cover, a low temperature flange lower cover, and a low temperature flange plate arranged between the low temperature flange upper cover and the low temperature flange lower cover, the low temperature flange upper cover and the low temperature flange plate being respectively arranged with a plurality of suction holes aligned with each other for adsorbing to a heat transfer end of the heat conductive material, and the low temperature flange plate including a low temperature gas path communicating the plurality of suction holes thereof in a circumferential direction, the low temperature flange lower cover including a wire hole of the low temperature sensor and at least one low temperature gas transfer hole arranged to interface with the suction holes communicating the low temperature flange upper cover and the low temperature flange plate so as to transfer the absorbed air to a measurement and calculation control unit through the low temperature gas path, and the low temperature detecting unit being configured to collect heat transfer temperature data at the heat transfer end; and
a measurement control unit that controls the high temperature detection unit and the low temperature detection unit and is configured to:
receiving the heating temperature data from the high temperature detection unit and the heat transfer temperature data from the low temperature detection unit; and
and determining the thermal resistance of the heat conducting material according to the heating temperature data and the heat transfer temperature data.
2. The detection device of claim 1, wherein the high temperature acquisition module further comprises a high temperature sensor fixed inside the high temperature flange, wherein the high temperature flange is configured to be adsorbed to a heating end of the thermally conductive material, the high temperature sensor configured to acquire the heating temperature data and transmit to the measurement control unit.
3. The detection device according to claim 2, wherein a fixing device for fixing the high-temperature sensor is arranged at a center through hole of the high-temperature flange along an axis, and the heating module is arranged between an outer surface of the fixing device and an inner circumferential surface of the high-temperature flange.
4. The inspection apparatus of claim 1, wherein the high temperature flange lower cover is further arranged with at least one of a wire hole of the heating module and a wire hole of the high temperature sensor.
5. The detection device of claim 1, wherein the low temperature detection unit further comprises a low temperature sensor fixed inside the low temperature flange, wherein the low temperature flange is configured to be adsorbed to a heat transfer end of the heat conductive material, and the low temperature sensor is configured to collect the heat transfer temperature data and transmit to the measurement control unit.
6. The detection apparatus according to claim 1, wherein the measurement control unit includes:
a measurement control module configured to receive the heating end temperature data from the high temperature detection unit and the heat transfer end temperature data of the low temperature detection unit, and determine a thermal resistance of the thermally conductive material from a power parameter, the heating end temperature data, and the heat transfer end temperature data; and
and the adsorption control module is used for controlling the high-temperature detection unit and the low-temperature detection unit to perform adsorption operation on the heat conducting material.
7. The detection device of claim 6, wherein the adsorption control module comprises a high temperature adsorption control module and a low temperature adsorption control module, wherein the high temperature adsorption control module is in communication with the high temperature transfer port through a high temperature adsorption gas path and configured to control the adsorption of the high temperature detection unit to the heating end, and the low temperature adsorption control module is in communication with the low temperature transfer port through a low temperature adsorption gas path and configured to control the adsorption of the low temperature detection unit to the heat transfer end.
8. A detection method for determining thermal resistance of a thermally conductive material using the detection apparatus according to any one of claims 1 to 7, comprising:
disposing a high temperature detection unit at a heating end of the thermally conductive material;
disposing a low temperature detection unit at a heat transfer end of the thermally conductive material;
starting the detection device so as to enable the high-temperature detection unit and the low-temperature detection unit to be respectively adsorbed at the heating end and the heat transfer end through the measuring and calculating control unit;
heating the heating end by using a heating module;
the high-temperature acquisition module and the low-temperature detection unit are used for respectively acquiring heating temperature data and heat transfer temperature data; and
and determining the thermal resistance of the heat conducting material according to the heating temperature data and the heat transfer temperature data by utilizing the measuring and calculating control unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010576580.4A CN111579587B (en) | 2020-06-22 | 2020-06-22 | Detection device and detection method for detecting thermal resistance of heat conducting material |
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| CN202010576580.4A CN111579587B (en) | 2020-06-22 | 2020-06-22 | Detection device and detection method for detecting thermal resistance of heat conducting material |
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| CN111579587A CN111579587A (en) | 2020-08-25 |
| CN111579587B true CN111579587B (en) | 2023-05-30 |
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