CN111579185A - Reliability acceleration test method and device for electronic equipment for submarine - Google Patents

Reliability acceleration test method and device for electronic equipment for submarine Download PDF

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CN111579185A
CN111579185A CN202010277421.4A CN202010277421A CN111579185A CN 111579185 A CN111579185 A CN 111579185A CN 202010277421 A CN202010277421 A CN 202010277421A CN 111579185 A CN111579185 A CN 111579185A
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temperature
acceleration
reliability
stress
submarine
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CN111579185B (en
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胡湘洪
李人擎
宋岩
王春辉
李劲
陆家乐
曾庆国
谢章用
江丰
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China Electronic Product Reliability and Environmental Testing Research Institute
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China Electronic Product Reliability and Environmental Testing Research Institute
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00Vibration-testing of structures; Shock-testing of structures
    • G01M7/02Vibration-testing by means of a shake table
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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Abstract

The application relates to a reliability accelerated test method and device for electronic equipment for a submarine. The reliability accelerated test method for the electronic equipment for the submarine comprises the following steps: acquiring a reference profile; obtaining the conventional stress reliability test time: confirming a reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine; and performing a reliability acceleration test by adopting the reliability acceleration profile, and outputting a reliability MTBF index of the electronic equipment for the submarine. The method and the device can realize rapid evaluation of the reliability index, improve the reliability test method of the electronic equipment in the submarine cabin, and provide guidance and reference for the reliability test engineering application of the electronic equipment in the submarine cabin.

Description

Reliability acceleration test method and device for electronic equipment for submarine
Technical Field
The application relates to the technical field of electronic equipment testing, in particular to a method and a device for testing reliability of electronic equipment for a submarine in an accelerated manner.
Background
With the development of the scientific and technical level and the improvement of the use requirements of electronic products, the reliability requirements of electronic equipment in the cabin for the submarine are higher and higher.
The accelerated test is based on a stress accumulated damage model theory, on the premise of not changing the failure mechanism of the electronic product, the test time is shortened by improving the test stress, the electronic product is required to generate the same accumulated damage under a higher test stress condition as that under a conventional stress condition, namely, the environmental stress (including the stress magnitude and the duration) after the acceleration is equivalent to the accumulated influence of the environmental stress before the acceleration on the failure of the electronic product, so that the reliability level of the electronic product is rapidly evaluated.
In the implementation process, the inventor finds that at least the following problems exist in the conventional technology: for high-reliability submarine electronic equipment, index assessment is carried out by adopting a traditional reliability test method, the development and production costs caused by test time and test expenses are not bearable, and the problem that the reliability index cannot be accurately verified exists.
Disclosure of Invention
In view of the above, it is necessary to provide a submarine electronic device reliability accelerated test method and device capable of verifying reliability index of a highly reliable long-life submarine electronic device.
In order to achieve the above object, in one aspect, an embodiment of the present invention provides a method for accelerated reliability testing of an electronic device for a submarine, including:
acquiring a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
obtaining the conventional stress reliability test time: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
confirming a reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine;
and performing a reliability acceleration test by adopting the reliability acceleration profile, and outputting a reliability MTBF index of the electronic equipment for the submarine.
In one embodiment, the electronics for the submarine comprise electronics in a submarine bay; the conventional stress profile is a three-comprehensive-environment test profile with temperature control electronic equipment in the submarine cabin, which is confirmed according to GJB899A-2009 standard; environmental stress types include temperature, vibration, and humidity; the acceleration model comprises a constant-temperature acceleration model, a temperature circulation acceleration model and a vibration stress acceleration model;
further comprising the steps of:
selecting acceleration stress according to the type of the environmental stress; the accelerated stress comprises constant temperature, temperature cycle and vibration stress;
and respectively determining a constant-temperature acceleration model, a temperature cycle acceleration model and a vibration stress acceleration model based on the acceleration stress.
In one embodiment, the step of identifying a reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability test time includes:
confirming a high-temperature working stress acceleration factor of a reliability acceleration test based on a constant-temperature acceleration model; the high-temperature working stress is determined according to an empirical value or obtained according to a strengthening test result of the electronic equipment for the submarine;
performing equivalent conversion based on a constant-temperature acceleration model, a high-temperature working stress acceleration factor, the duration of each constant-temperature section in a reference profile and the conventional stress reliability test time to obtain the total high-temperature duration of the reliability acceleration test;
and determining the total low-temperature duration according to the conventional stress reliability test time.
In one embodiment, the step of identifying the high temperature operating stress acceleration factor of the reliability acceleration test based on the constant temperature acceleration model comprises:
and determining the high-temperature working stress acceleration factor by adopting an Arrhenius model.
In one embodiment, the step of identifying a reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability test time includes:
acquiring a temperature cycle acceleration factor according to the temperature cycle acceleration model;
and acquiring the temperature cycle times of the accelerated stress according to the conventional stress reliability test time and the temperature cycle acceleration factor.
In one embodiment, in the step of obtaining the temperature cycle acceleration factor according to the temperature cycle acceleration model, the temperature cycle acceleration factor is obtained based on the following formula:
Figure BDA0002445306380000031
wherein A isF temperature cycleThe temperature cycling acceleration factor under each temperature cycling stress; Δ T represents a temperature change difference of the temperature cycle; t represents the temperature change time and the total duration of the high temperature in the temperature cycle process; t represents the maximum temperature of the temperature cycle stress; subscript Acc represents an accelerated stress condition and subscript use represents a conventional stress condition; t isAcc_maxRepresents the maximum temperature of the temperature cycle stress under the accelerated stress condition; t isuse_maxThe maximum temperature of the temperature cycling stress under the conventional stress condition is shown.
In one embodiment, the step of identifying a reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability test time includes:
obtaining high-temperature total duration, low-temperature total duration, temperature cycle time and accelerated stress temperature cycle times based on a constant-temperature accelerated model, a temperature cycle accelerated model, a reference profile and conventional stress reliability test time;
obtaining high-temperature duration and low-temperature duration in a single accelerated cycle test based on the high-temperature total duration, the low-temperature total duration and the accelerated temperature cycle times;
confirming the sum of the high temperature duration, the low temperature duration and the temperature cycle time as a single accelerated cycle test time;
confirming an acceleration factor under each vibration stress according to the vibration stress acceleration model; the vibration stress acceleration model comprises an inverse power rate model;
and acquiring the application time of the transportation vibration frequency spectrum and the application time of the battle damage spectrum based on the acceleration factors under each vibration stress, the conventional stress reliability test time and the single acceleration cycle test time.
An accelerated reliability testing device for an electronic device for a submarine, comprising:
the reference profile acquisition module is used for acquiring a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
the test time acquisition module is used for acquiring the test time of the conventional stress reliability: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
the acceleration profile acquisition module is used for confirming a reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine;
and the reliability index acquisition module is used for performing a reliability acceleration test by adopting the reliability acceleration profile and outputting a reliability MTBF index of the electronic equipment for the submarine.
A computer device comprising a memory storing a computer program and a processor implementing the steps of the method when the processor executes the computer program.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the above-mentioned method.
One of the above technical solutions has the following advantages and beneficial effects:
the reliability acceleration profile is confirmed based on the acceleration model and the reference profile, then the reliability acceleration profile is adopted to carry out reliability acceleration test, and the reliability MTBF index of the electronic equipment for the submarine is output; according to the method, the conventional stress profile is used as a reference profile, the reliability acceleration profile is determined based on the acceleration model, the test time can be shortened, and the reliability MTBF index can be quickly evaluated. The method improves the reliability test method of the electronic equipment in the submarine cabin, and can provide guidance and reference for the reliability test engineering application of the electronic equipment in the submarine cabin.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of a method for accelerated reliability testing of an electronic device for a submarine according to an embodiment;
FIG. 2 is a schematic diagram of an exemplary cross-section of a conventional stress reliability test according to one embodiment;
FIG. 3 is a cross-sectional view of an exemplary combat damage frequency spectrum stress test;
FIG. 4 is a schematic cross-sectional view of a transportation vibration spectrum stress test in one embodiment;
FIG. 5 is a schematic cross-sectional view of an accelerated test of a transport vibration spectrum stress in one embodiment;
FIG. 6 is a schematic diagram of an embodiment of a reliability acceleration profile;
FIG. 7 is a schematic cross-sectional view illustrating reliability acceleration in another embodiment;
FIG. 8 is a block diagram of an apparatus for accelerated reliability testing of an electronic device for a submarine according to an embodiment;
FIG. 9 is a diagram showing an internal structure of a computer device in one embodiment;
fig. 10 is an internal structural view of a computer device in another embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
At present, electronic equipment for submarines mainly makes a test section and carries out a reliability assessment test according to GJB899A-2009 and an implementation method for reliability assessment test of electronic equipment for naval (2002). However, for the electronic equipment for the index ship with high reliability and long service life, a corresponding accelerated test section and a test method are not available at present. How to verify the reliability index of the electronic equipment for the submarine with high reliability and long service life is a difficult problem to be solved urgently.
The acceleration test profile is formulated based on a corresponding acceleration model, support and reference are provided for engineering application, and an effective method is provided for solving the problem of reliable MTBF (Mean Time Between Failure) index assessment of the high-reliability long-life electronic equipment for the boat.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The reliability accelerated test method for the submarine electronic equipment can be applied to the submarine cabin electronic equipment, and is particularly suitable for reliability MTBF index assessment of the long-service-life submarine electronic equipment.
In one embodiment, as shown in fig. 1, there is provided a reliability accelerated test method for an electronic device for a submarine, which is described by taking the method as an example of being applied to an electronic device in a submarine cabin, and includes the following steps:
step 102, acquiring a reference profile; the reference profile includes a conventional stress profile obtained according to the kind of the submarine electronic equipment.
The reference profile may be a conventional stress profile obtained according to the type of the electronic equipment for the submarine. For example, a conventional reliability test profile is developed according to GJB899A-2009 Standard and Navy electronic Equipment reliability identification test implementation method (2002). In one particular example, the electronics for the submarine include electronics in a submarine bay; the reference profile can be a three-comprehensive-environment test profile with temperature control electronic equipment in the submarine cabin, which is confirmed according to GJB899A-2009 standard.
Specifically, the application provides that a conventional stress load spectrum is determined by taking a conventional stress profile as a reference profile; for example, as shown in the conventional stress profile example shown in fig. 2, for a submarine with temperature-controlled electronic equipment in a cabin, a triple-integrated environmental test profile with temperature-controlled equipment installed in the submarine is selected as a conventional stress profile according to GJB899A-2009, and the operating temperature of the electronic equipment in the cabin is generally set to be-10 ℃ to +50 ℃, and the storage temperature is set to be-50 ℃ to +65 ℃.
Step 104, obtaining conventional stress reliability test time: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
specifically, taking the reliability index including the MTBF index as an example, after the reference profile is confirmed, the test statistical plan and the total test time t can be determined according to the MTBF index requirement of the submarine electronic device and the requirement in the GJB899A-20090. For example, assuming that the MTBF index of the temperature control electronic equipment in a cabin for a certain submarine is 6000h, a GJB899A-2009 '20-1' statistical test scheme is selected, and the total test time is determined to be t0=6000*1.61=9660h。
Step 106, confirming a reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine;
the acceleration model can be obtained according to the environmental stress type of the electronic equipment for the submarine.
Specifically, the method comprises the steps that a conventional stress profile is used as a reference profile, and a reliability acceleration profile is confirmed based on an acceleration model, so that the test time is shortened, and the reliability index is quickly evaluated; the method and the device process the reference profile to obtain the acceleration profile for the reliability verification test.
In one particular example, the environmental stress types may include temperature, vibration, and humidity; the acceleration model can comprise a constant-temperature acceleration model, a temperature cycle acceleration model and a vibration stress acceleration model;
further comprising the steps of:
selecting acceleration stress according to the type of the environmental stress; the accelerated stress comprises constant temperature, temperature cycle and vibration stress;
and respectively determining a constant-temperature acceleration model, a temperature cycle acceleration model and a vibration stress acceleration model based on the acceleration stress.
Specifically, in the long-term use process of the electronic equipment for the submarine, due to the influence of environmental factors such as temperature stress, humidity stress, mechanical stress and the like, the electronic equipment for the submarine generates a series of physical and chemical effects, so that the electronic equipment for the submarine loses efficacy and the reliability level is reduced. The environmental stresses that have the greatest impact on submarine electronics are temperature and vibration. The method and the device select constant temperature, temperature cycle and vibration stress as acceleration stress, and further obtain acceleration models corresponding to different stress types. The acceleration model may include a constant temperature acceleration model, a temperature cycle acceleration model, and a vibration stress acceleration model. In a specific example, the constant-temperature acceleration model can be realized by an Arrhenius model, the temperature cycle acceleration model can be realized by a Norris-Landzberg improved model, and the vibration stress acceleration model can be realized by an inverse power rate model.
It should be noted that the type of test stress in the reliability acceleration profile of the present application can be consistent with the conventional test stress in the conventional stress profile, including temperature, temperature cycling, vibration, humidity, and electrical stress. The temperature working stress acceleration factor and the high-temperature equivalent total duration can be obtained through a constant-temperature acceleration model, and the temperature cyclic stress equivalent calculation can be realized through a temperature cyclic acceleration model; and acquiring single acceleration cycle test time, and acquiring transportation vibration spectrum application time and combat damage spectrum application time by adopting a vibration stress acceleration model. And determines the relevant values of other stresses (e.g., humidity and electrical stress, etc.) to form an acceleration test profile, i.e., a reliability acceleration profile in the present application.
And 108, performing a reliability acceleration test by adopting the reliability acceleration profile, and outputting a reliability MTBF index of the electronic equipment for the submarine.
Specifically, the reliability MTBF index of the electronic equipment for the submarine can be accurately output by adopting the reliability acceleration profile to carry out the reliability acceleration test. Meanwhile, the test time of the reliability acceleration profile based on the application can be obviously shortened compared with the total test time.
The reliability acceleration test method for the electronic equipment for the submarine confirms the reliability acceleration profile based on the acceleration model and the reference profile, further adopts the reliability acceleration profile to carry out reliability acceleration test, and outputs the reliability MTBF index of the electronic equipment for the submarine; according to the method, the conventional stress profile is used as a reference profile, the reliability acceleration profile is determined based on the acceleration model, the test time can be shortened, and the reliability index can be quickly evaluated. The method improves the reliability test method of the electronic equipment in the submarine cabin, and can provide guidance and reference for the reliability test engineering application of the electronic equipment in the submarine cabin.
It should be understood that, although the steps in the flowchart of fig. 1 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 1 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
In one embodiment, an accelerated reliability test method for an electronic device for a submarine is provided, which is described by taking the method as an example of the application of the method to the electronic device in a submarine cabin, and comprises the following steps:
acquiring a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
obtaining the conventional stress reliability test time: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
confirming a reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine;
and performing a reliability acceleration test by adopting the reliability acceleration profile, and outputting a reliability MTBF index of the electronic equipment for the submarine.
In a specific embodiment, the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time may include:
confirming a high-temperature working stress acceleration factor of a reliability acceleration test based on a constant-temperature acceleration model; the high-temperature working stress is determined according to an empirical value or obtained according to a strengthening test result of the electronic equipment for the submarine;
performing equivalent conversion based on the constant-temperature acceleration model, the high-temperature working stress acceleration factor, the duration of each constant-temperature section in the reference profile and the conventional stress reliability test time to obtain the total high-temperature duration of the reliability acceleration test;
and determining the total low-temperature duration according to the conventional stress reliability test time.
Specifically, according to the constant-temperature acceleration model, the higher the temperature stress, the shorter the test time; in order to avoid changing the failure mechanism of an electronic product, a fault and a fault mode which cannot occur in the using process are introduced, the temperature is not too high, and the temperature can be obtained according to the intensified test result or experience analysis of electronic equipment for the submarine, so that the high-temperature working temperature is obtained.
And further based on a constant-temperature acceleration model, calculating the duration equivalent conversion of the duration of each constant-temperature section to the duration of the high-temperature working temperature (60 ℃) of the acceleration test according to the duration and the acceleration factor of each constant-temperature section, namely. Meanwhile, the total temperature cycle times and the total duration time at the low temperature of-10 ℃ are determined according to the conventional stress reliability test time.
In a specific embodiment, the step of identifying the temperature stress acceleration factor of the reliability acceleration test based on the constant temperature acceleration model may include:
determining a high-temperature working stress acceleration factor by adopting an Arrhenius model; wherein the high temperature working stress is 60 ℃.
Specifically, the temperature stress can be confirmed based on the following formula:
Figure BDA0002445306380000091
wherein ρ (T) is the reaction rate; a is a constant independent of temperature; eaUsing eV as unit for activation energy, K is Boltzmann constant 8.617385 × 10-5eV/K, and T is absolute temperature, wherein, in order to keep failure mechanism unchanged, high temperature work should be carried outThe force can be determined to be 60 ℃.
In a specific embodiment, the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time may include:
acquiring a temperature cycle acceleration factor according to the temperature cycle acceleration model;
and acquiring the temperature cycle times of the accelerated stress according to the conventional stress reliability test time and the temperature cycle acceleration factor.
Specifically, according to the temperature cycle acceleration model, the larger the temperature difference of the temperature cycle in the acceleration test, the smaller the number of cycles. In particular, the electronic device temperature difference Δ T for acceleration stressAccThe temperature change rate in the accelerated test of the electronic equipment can be 70 ℃, so that the temperature change rate is not less than the maximum temperature change rate in the conventional stress profile, namely 1 ℃/min. The temperature cycle acceleration factor can be calculated through a temperature cycle acceleration model.
Furthermore, the accelerated stress temperature cycle times can be obtained according to the conventional stress reliability test time and the temperature cycle acceleration factor.
In one embodiment, in the step of obtaining the temperature cycle acceleration factor according to the temperature cycle acceleration model, the temperature cycle acceleration factor is obtained based on the following formula:
Figure BDA0002445306380000101
wherein A isF temperature cycleThe temperature cycling acceleration factor under each temperature cycling stress; Δ T represents a temperature change difference of the temperature cycle; t represents the temperature change time and the total duration of the high temperature in the temperature cycle process; t represents the maximum temperature of the temperature cycle stress; subscript Acc represents an accelerated stress condition and subscript use represents a conventional stress condition; t isAcc_maxRepresents the maximum temperature of the temperature cycle stress under the accelerated stress condition; t isuse_maxThe maximum temperature of the temperature cycling stress under the conventional stress condition is shown.
In a specific embodiment, the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile and the conventional stress reliability test time may include:
obtaining high-temperature total duration, low-temperature total duration, temperature cycle time and accelerated stress temperature cycle times based on a constant-temperature accelerated model, a temperature cycle accelerated model, a reference profile and conventional stress reliability test time;
and obtaining the high-temperature duration and the low-temperature duration in a single accelerated cycle test based on the high-temperature total duration, the low-temperature total duration and the accelerated temperature cycle times.
Confirming the sum of the high temperature duration, the low temperature duration and the temperature cycle time as a single accelerated cycle test time;
confirming an acceleration factor under each vibration stress according to the vibration stress acceleration model; the vibration stress acceleration model comprises an inverse power rate model;
and acquiring the application time of the transportation vibration frequency spectrum and the application time of the battle damage spectrum based on the acceleration factors under each vibration stress, the conventional stress reliability test time and the single acceleration cycle test time.
To further illustrate the concept of the present application, the following is described with reference to a specific example:
(1) determining a test statistical scheme and a test total time t according to MTBF index requirements of electronic equipment for submarines and requirements in GJB899A-20090. For example, assuming that the MTBF index of the temperature control electronic equipment in a cabin for a certain submarine is 6000h, a GJB899A-2009 '20-1' statistical test scheme is selected, and the total test time is determined to be t0=6000*1.61=9660h。
(2) The application proposes a relevant procedure for determining a conventional stress load spectrum; aiming at the situation that temperature control electronic equipment is arranged in a cabin for a submarine, a triple comprehensive environment test section with temperature control of equipment (arranged in the submarine) is selected as a conventional stress section according to GJB899A-2009, the working temperature of the electronic equipment in the cabin is generally set to be-10 ℃ to +50 ℃, the storage temperature is set to be-50 ℃ to +65 ℃, and a typical conventional stress section example is determined and can be shown as figure 2.
(3) Confirming the acceleration stress and the acceleration model;
in the long-term use process of the electronic equipment for the submarine, due to the influence of environmental factors such as temperature stress, humidity stress, mechanical stress and the like, the electronic equipment for the submarine generates a series of physical and chemical effects, so that the electronic equipment for the submarine loses efficacy and the reliability level is reduced. The environmental stresses that have the greatest impact on submarine electronics are temperature and vibration. Constant temperature, temperature cycle and vibration stress are selected as acceleration stress, and acceleration models corresponding to different stress types are as follows.
Firstly, acquiring a constant-temperature acceleration model; according to the GB/T34986-2017 standard, an Allenis model can be generally adopted as an acceleration model when the temperature is taken as the acceleration stress.
Figure BDA0002445306380000111
Wherein ρ (T) is the reaction rate; a is a constant independent of temperature; eaActivation energy E can be determined by a reliability prediction method based on stress analysis, wherein activation energy E is expressed in eV, K is Boltzmann constant 8.617385 × 10-5eV/K, and T is absolute temperaturea. The determination may also be made based on empirical values.
Acquiring a temperature circulation acceleration model; the application provides that a Norris-Landzberg improved model is selected as a temperature cycle acceleration model, and the method specifically comprises the following steps:
Figure BDA0002445306380000112
wherein A isF temperature cycleThe temperature cycling acceleration factor under each temperature cycling stress; Δ T represents a temperature change difference of the temperature cycle; t represents the temperature change time and the total duration of the high temperature in the temperature cycle process (representing the process of changing from low temperature to high temperature or from high temperature to low temperature); t represents a maximum temperature of stress in the temperature cycle (a high temperature value in the temperature cycle, i.e., a high temperature operating temperature); subscript Acc denotes an accelerated stress condition, use denotes a conventional stress condition; t isAcc_maxRepresents the maximum temperature of the temperature cycle stress under the accelerated stress condition; t isuse_maxThe maximum temperature of the temperature cycling stress under the conventional stress condition is shown.
Obtaining a vibration stress acceleration model; according to the GJB 150A-2009 standard, the vibration stress acceleration model in the present application can be generally described by an inverse power-law model:
Figure BDA0002445306380000121
wherein A isF vibrationRepresenting acceleration factors under different vibration stresses; w denotes the acceleration spectral density, t1Denotes the vibration time, the subscript Acc denotes the acceleration stress condition, use denotes the conventional stress condition.
(3) Designing an acceleration profile, namely confirming a reliability acceleration profile based on an acceleration model, a reference profile and conventional stress reliability test time;
the accelerated test stress types were consistent with the conventional test stresses, including temperature, temperature cycling, vibration, humidity, and electrical stress.
Firstly, temperature stress;
according to the constant-temperature acceleration model, the higher the temperature stress is, the shorter the test time is; in order to avoid changing the failure mechanism of the electronic product, faults and fault modes which cannot occur in the using process are introduced, the temperature is not too high, and the electronic product can be obtained according to the intensified test result or experience analysis of the marine electronic equipment. In order to keep the failure mechanism unchanged, the low-temperature working temperature stress in the acceleration profile is determined to be-10 ℃, and the high-temperature working temperature stress is determined to be 60 ℃.
According to GJB899A-2009, for electronic equipment in a submarine cabin, cold soaking and hot soaking tests are required to be carried out in the first 3 cycles, the total time is 6 hours respectively, therefore, before an acceleration test, 12 hours of cold soaking (-50 ℃) and hot soaking tests (65 ℃) are carried out, namely, the cold soaking (-50 ℃) is carried out for 6 hours, the hot soaking tests (65 ℃) are carried out for 6 hours, the effective test time is counted, and t for the electronic equipment needs to be equivalently completed by carrying out the acceleration test0-12 ═ 9648h test.
High temperature equivalent total duration;
according to the constant-temperature acceleration model, the duration equivalent of each constant-temperature section to the duration of 60 ℃ in the acceleration test is calculated according to the duration and the acceleration factor of each constant-temperature section (see fig. 2). According to the testThe total cycle number is 402 times determined by time, and the total duration time at the low temperature of-10 ℃ is 1809 h. From the above-described Arrhenius model and empirical information, the activation energy E can be determinedaThe temperature of the electronic device is 0.7eV, and the temperature conversion result of the electronic device can be shown in Table 1.
As shown in fig. 2, the duration and the acceleration factor of each constant temperature segment may refer to an acceleration factor of 60 ℃ relative to each temperature segment (e.g., 0, 22 ℃, etc.).
As can be seen from Table 1, the total duration of the elevated temperature at 60 ℃ is 1583.81 h.
TABLE 1 accelerated test high temperature equivalent duration
Figure BDA0002445306380000131
Equivalent calculation of temperature circulating stress;
according to the temperature cycle acceleration model, the larger the temperature difference of the temperature cycle in the acceleration test is, the fewer the cycle times are. For acceleration stress, the electronic device temperature difference Δ TAccThe temperature change rate in the accelerated test of the electronic equipment is not less than the maximum temperature change rate in the conventional stress profile, namely 1 ℃/min. By adjusting tAccThe method ensures that the accelerated temperature cycle times obtained through the temperature cycle acceleration coefficient are consistent with the accelerated temperature cycle times obtained through the high-temperature retention time, and simultaneously takes the high-temperature duration time of 10 hours, the accelerated stress cycle times of 158 times, the low-temperature duration time of 11.45 hours and the engineering treatment of 11 hours in a single cycle to ensure the engineering implementation. The electronic equipment temperature change rate is 1.16 ℃/min.
Note that t isAccThe corresponding value may be 6.00, indicating that a tune to 6 is a result, such as a tune from 1 to 10; wherein 6 satisfies the condition that the accelerated temperature cycle number obtained by the temperature cycle acceleration coefficient is consistent with the accelerated temperature cycle number obtained by the high temperature holding time.
Because the low temperature does not have the acceleration effect, if the electronic product is not sensitive to the low-temperature stress due to failure, the low-temperature holding time can be adjusted according to the temperature stabilization time of the electronic product, for example, if the temperature stabilization time of the electronic product is 2 hours, the low temperature can be held for 2 hours; the temperature stabilization time of the electronic product can be obtained through actual measurement or determined by adopting GJB/Z4 according to a gravimetric method.
Fourthly, single accelerated cycle test time;
in the accelerated test, the total duration of a single cycle is the sum of the high-temperature duration, the low-temperature duration and the warm-cycle time and is 23 h. Therefore, the total time for the accelerated test was 3634 h.
Vibrating stress;
the vibration stress is randomly extracted every 24h for 6h, wherein 3h is a vibration cycle (20min applied combat damage spectrum and 160min applied transport random spectrum), 2412h of vibration is needed to be applied in 402 cycles, wherein 268h of combat damage spectrum is applied and 2144h of transport random spectrum is applied. A combat damage spectrum and a transportation random spectrum, as shown in fig. 3 and 4.
According to the vibration stress acceleration model, the power spectral density of the acceleration of the transportation vibration frequency spectrum is increased to 1.6g2and/Hz, as shown in fig. 5, the acceleration factor is 6.55 (i.e., (1.6/1.0) ^ 4; where the acceleration factor refers to the acceleration factor of the vibration stress, and the corresponding acceleration factor can be calculated for each stress in the application), and the application time of the transportation vibration spectrum is 2144/6.55 h or 328 h. The vibration stress after acceleration is evenly distributed into 158 cycles (i.e. the number of acceleration stress cycles), the time for applying the combat damage spectrum in a single acceleration cycle is 268/158-1.7 h, i.e. 102min, and the time for applying the transportation random spectrum 328/158 is 2.1h, i.e. 126 min. The vibration stress in a single acceleration cycle is applied for 2 times, a battle damage spectrum is firstly applied for 51min each time, then a transportation vibration spectrum is applied for 63min, and the vibration time points are 6h section points and 16h section points in the section.
Sixthly, other stress;
humidity stress-10 deg.C, humidity control is not performed, and 95%, 65% and 95% humidity is applied at 60 deg.C. Electrical stress: the nominal voltage accounts for 50% of the total test time. The upper and lower limits of voltage each account for 25% of the total test time. The test object power-on working time is 90% of the test time.
In summary, an acceleration test profile (i.e., a reliability acceleration profile) is formed as shown in fig. 6. The test time was shortened from 9648 to 3634h based on this profile.
If a certain electronic product fails and is not sensitive to low temperature and constant temperature, the acceleration profile is adjusted according to the temperature stabilization time of 2h as shown in fig. 7. Based on the reliability acceleration profile, the acceleration test time is 2212h according to the number of acceleration cycles of 158, that is, the test development time is shortened from 9648 to 2212h based on the profile.
In the above way, the reliability acceleration test section is provided for the problem that the high-reliability MTBF index of the electronic equipment in the submarine cabin is difficult to assess, the reliability test method of the electronic equipment in the submarine cabin is perfected, and guidance and reference are provided for the reliability test engineering application of the electronic equipment in the submarine cabin. Specifically, based on corresponding acceleration models such as temperature and vibration, the reliability section of the electronic product in the submarine cabin in GJB899A-2009 is used as a reference section, and the reliability MTBF index acceleration test section of the electronic product in the submarine cabin is worked out, so that the test time can be shortened, and the reliability index can be quickly evaluated.
In one embodiment, as shown in fig. 8, there is provided an accelerated reliability testing apparatus for an electronic device for a submarine, comprising:
a reference profile obtaining module 810, configured to obtain a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
a test time obtaining module 820, configured to obtain a conventional stress reliability test time: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
an acceleration profile obtaining module 830, configured to determine a reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the electronic equipment for the submarine;
and the reliability index acquisition module 840 is used for performing a reliability acceleration test by using the reliability acceleration profile and outputting a reliability MTBF index of the electronic equipment for the submarine.
For specific limitations of the reliability acceleration test device for the electronic equipment for the submarine, reference may be made to the above limitations of the reliability acceleration test method for the electronic equipment for the submarine, and details are not repeated here. All or part of each module in the reliability acceleration test device for the electronic equipment for the submarine can be realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as shown in fig. 9. The computer device includes a processor, a memory, a network interface, and a database connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer device is used for storing data such as acceleration models, stress profiles and the like. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to realize the reliability accelerated test method of the electronic equipment for the submarine.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 10. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to realize the reliability accelerated test method of the electronic equipment for the submarine. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the configurations shown in fig. 9 and 10 are block diagrams of only some of the configurations relevant to the present disclosure, and do not constitute a limitation on the computing devices to which the present disclosure may be applied, and that a particular computing device may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of any one of the above-mentioned submarine electronic device reliability acceleration test methods when executing the computer program.
In one embodiment, a computer readable storage medium is provided, having a computer program stored thereon, where the computer program when executed by a processor implements the steps of any of the above described submarine electronic device reliability acceleration test methods.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus DRAM (RDRAM), and interface DRAM (DRDRAM).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A reliability accelerated test method for an electronic device for a submarine is characterized by comprising the following steps:
acquiring a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
obtaining the conventional stress reliability test time: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
confirming a reliability acceleration profile based on an acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the submarine electronic equipment;
and performing a reliability acceleration test by using the reliability acceleration profile, and outputting a reliability MTBF index of the electronic equipment for the submarine.
2. The accelerated reliability testing method for electronic equipment for submarines according to claim 1, wherein the electronic equipment for submarines comprises electronic equipment in a submarine cabin; the conventional stress profile is a three-comprehensive-environment test profile with temperature control electronic equipment in the submarine cabin, which is confirmed according to GJB899A-2009 standard; the environmental stress types comprise temperature, vibration and humidity; the acceleration model comprises a constant-temperature acceleration model, a temperature circulation acceleration model and a vibration stress acceleration model;
further comprising the steps of:
selecting acceleration stress according to the environmental stress type; the acceleration stress comprises constant temperature, temperature cycle and vibration stress;
and respectively determining the constant-temperature acceleration model, the temperature cycle acceleration model and the vibration stress acceleration model based on the acceleration stress.
3. The accelerated reliability testing method for an electronic device for a submarine according to claim 2, wherein the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability testing time comprises:
confirming a high-temperature working stress acceleration factor of the reliability acceleration test based on the constant-temperature acceleration model; the high-temperature working stress is determined according to an empirical value or obtained according to a strengthening test result of the electronic equipment for the submarine;
performing equivalent conversion based on the constant-temperature acceleration model, the high-temperature working stress acceleration factor, the duration of each constant-temperature section in the reference profile and the conventional stress reliability test time to obtain the total high-temperature duration of the reliability acceleration test;
and determining the total low-temperature duration according to the conventional stress reliability test time.
4. The accelerated reliability test method for the submarine electronic device according to claim 3, wherein the step of confirming the high-temperature operating stress acceleration factor of the accelerated reliability test based on the constant-temperature acceleration model comprises:
and determining the high-temperature working stress acceleration factor by adopting an Arrhenius model.
5. The accelerated reliability testing method for an electronic device for a submarine according to claim 2, wherein the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability testing time comprises:
acquiring a temperature cycle acceleration factor according to the temperature cycle acceleration model;
and acquiring the accelerated stress temperature cycle times according to the conventional stress reliability test time and the temperature cycle acceleration factor.
6. The accelerated reliability test method for the electronic equipment of the submarine according to claim 5, wherein in the step of obtaining the temperature cycle acceleration factor according to the temperature cycle acceleration model, the temperature cycle acceleration factor is obtained based on the following formula:
Figure FDA0002445306370000021
wherein A isF temperature cycle(ii) is the temperature cycling acceleration factor at each temperature cycling stress; Δ T represents a temperature change difference of the temperature cycle; t represents the temperature change time and the total duration of the high temperature in the temperature cycle process; t represents the maximum temperature of the temperature cycle stress; subscript Acc represents an accelerated stress condition and subscript use represents a conventional stress condition; t isAcc_maxRepresents the maximum temperature of the temperature cycle stress under the accelerated stress condition; t isuse_maxThe maximum temperature of the temperature cycling stress under the conventional stress condition is shown.
7. The accelerated reliability testing method for an electronic device for a submarine according to claim 2, wherein the step of confirming the reliability acceleration profile based on the acceleration model, the reference profile, and the conventional stress reliability testing time comprises:
obtaining a high-temperature total duration time, a low-temperature total duration time, a temperature cycle time and an accelerated stress temperature cycle number based on the constant-temperature acceleration model, the temperature cycle acceleration model, the reference profile and the conventional stress reliability test time;
obtaining high-temperature duration and low-temperature duration in a single accelerated cycle test based on the high-temperature total duration, the low-temperature total duration and the accelerated high-temperature cycle times;
identifying the sum of the high temperature duration, the low temperature duration and the warm cycle time as a single accelerated cycle test time;
confirming an acceleration factor under each vibration stress according to the vibration stress acceleration model; the vibration stress acceleration model comprises an inverse power rate model;
and acquiring the application time of the transportation vibration frequency spectrum and the application time of the combat damage spectrum based on the acceleration factors under the vibration stresses, the conventional stress reliability test time and the single acceleration cycle test time.
8. An accelerated reliability testing device for an electronic device for a submarine, comprising:
the reference profile acquisition module is used for acquiring a reference profile; the reference profile comprises a conventional stress profile obtained according to the type of the electronic equipment for the submarine;
the test time acquisition module is used for acquiring the test time of the conventional stress reliability: the conventional stress reliability test time is determined according to the reliability MTBF index and the GJB899A-2009 standard requirement;
the acceleration profile acquisition module is used for confirming a reliability acceleration profile based on an acceleration model, the reference profile and the conventional stress reliability test time; the acceleration model is obtained according to the environmental stress type of the submarine electronic equipment;
and the reliability index acquisition module is used for performing a reliability acceleration test by adopting the reliability acceleration profile and outputting a reliability MTBF index of the electronic equipment for the submarine.
9. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the steps of the method of any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.
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