CN111570218A - Protection method for welding seal - Google Patents
Protection method for welding seal Download PDFInfo
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- CN111570218A CN111570218A CN202010455776.8A CN202010455776A CN111570218A CN 111570218 A CN111570218 A CN 111570218A CN 202010455776 A CN202010455776 A CN 202010455776A CN 111570218 A CN111570218 A CN 111570218A
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- solder print
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/006—Safety devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Abstract
The specification provides a solder print protection method, which comprises the steps of covering glue liquid on a solder print area through glue dispensing equipment, enabling the glue liquid to be attached to the solder print, and adhering the glue liquid to the solder print area after the glue liquid is solidified, so as to achieve the purpose of protecting the solder print. According to the method, the dispensing head is driven by the dispensing equipment to move according to the preset path, and the glue solution between the adjacent paths is partially overlapped, so that the glue solution can completely cover the welding area. The glue solution can be well attached to welding marks, the falling risk cannot exist, the safety performance of the workpiece is improved, and the service life of the workpiece is prolonged. And when the glue solution is added into the glue dispensing equipment, the glue dispensing equipment does not need to be stopped, so that the glue dispensing efficiency is improved.
Description
Technical Field
The specification relates to the field of welding, in particular to a protection method for welding marks.
Background
Currently, during the manufacturing process of the battery, a welding process is often used to connect the workpieces. For example, the positive electrode tab and the positive electrode connecting piece and the negative electrode tab and the negative electrode connecting piece of the battery are welded by an ultrasonic welding process. For another example, the top cover plate and the positive connecting piece, and the top cover plate and the negative connecting piece are welded by a laser welding process. And the welding mark after welding has the risk that welding slag falls off and the welding mark is broken, and metal scraps after the welding slag falls off or the welding mark is broken can fall into the battery core, so that the battery is short-circuited. Therefore, in order to prevent welding slag from falling off and welding mark from breaking, the welding mark after super welding is generally protected, and then subsequent processes such as core combination of a battery core, insulation film wrapping, shell entering and the like are performed. In the prior art, a method of sticking adhesive tapes on a welding area is mostly adopted for welding protection. However, the welding area is uneven after welding, so that the adhesive tape has poor attaching effect and has a falling risk.
Therefore, a more reliable solder print protection method is required.
Disclosure of Invention
The present specification provides a more reliable solder print protection method.
According to the protection method for the welding seal provided by the specification, the glue solution is covered on the welding seal area through the glue dispensing equipment, the glue solution is attached to the welding seal, and the glue solution is bonded with the welding seal area after being solidified, so that the purpose of protecting the welding seal is achieved. According to the method, the dispensing head is driven by the dispensing equipment to move according to the preset path, and the glue solution between the adjacent paths is partially overlapped, so that the glue solution can completely cover the welding area. The glue solution can be well attached to welding marks, the falling risk cannot exist, the safety performance of the workpiece is improved, and the service life of the workpiece is prolonged.
The protection method for the solder print comprises the following steps: setting a workpiece to be processed to a preset position, and determining an initial dispensing position of the workpiece to be processed; driving a dispensing head of dispensing equipment to move according to a preset path, and coating a glue solution on a welding and printing area of the workpiece to be processed, wherein the overlapping area of the glue solution between adjacent paths is 20% -50%; and solidifying the glue solution.
In some embodiments, the predetermined path is a traverse/longitudinal reciprocating path.
In some embodiments, the predetermined path is a circular path.
In some embodiments, the glue covering the solder printing area has a thickness of 0.1-0.5 mm.
In some embodiments, the glue solution is a liquid hot melt glue obtained by heating and melting a hot melt glue block.
In some embodiments, the hot melt adhesive block is a polyolefin type hot melt adhesive resistant to electrolyte above 85 ℃, and the molecular precipitation rate and the expansion rate of the hot melt adhesive block are less than 5% when the hot melt adhesive block is soaked in the electrolyte above 85 ℃ for 7 days.
In some embodiments, the bond strength of the hot melt adhesive block to the copper or aluminum material is 1-3 Mpa.
In some embodiments, the heating temperature is 160-190 ℃.
In some embodiments, the glue is a thermoset glue.
In some embodiments, said curing said glue comprises: and heating the welding and printing area covered with the glue solution to solidify the glue solution.
In some embodiments, said curing said glue comprises: and irradiating the welding and printing area covered with the glue solution by light to solidify the glue solution.
According to the technical scheme, the welding seal protection method provided by the specification covers the glue solution on the welding seal area through the glue dispensing equipment, so that the glue solution is attached to the welding seal, and the glue solution is bonded with the welding seal area after being cured, so that the purpose of protecting the welding seal is achieved. According to the method, the dispensing head is driven by the dispensing equipment to move according to the preset path, and the glue solution between the adjacent paths is partially overlapped, so that the glue solution can completely cover the welding area. The glue solution can be well attached to welding marks, the falling risk cannot exist, the safety performance of the workpiece is improved, and the service life of the workpiece is prolonged. And when the glue solution is added into the glue dispensing equipment, the glue dispensing equipment does not need to be stopped, so that the glue dispensing efficiency is improved.
Other functions of the present application will be partially set forth in the following description. The contents of the following figures and examples will be apparent to those of ordinary skill in the art in view of this description. The inventive aspects of this application can be fully explained by the practice or use of the methods, apparatus and combinations described in the detailed examples below.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a solder print protection method according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a solder printing region of a lithium battery provided in an embodiment of the present disclosure;
fig. 3 is a schematic diagram of dispensing a solder printing area of a lithium battery according to an embodiment of the present disclosure.
Detailed Description
The following description is presented to enable any person skilled in the art to make and use the present description, and is provided in the context of a particular application and its requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present description. Thus, the present description is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. For example, as used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," and/or "including," when used in this specification, are intended to specify the presence of stated integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The term "A on B" as used in this specification means that A is either directly adjacent (above or below) B or indirectly adjacent (i.e., separated by some material) to B; the term "A within B" means that A is either entirely within B or partially within B.
These and other features of the present specification, as well as the operation and function of the elements of the structure related thereto, and the combination of parts and economies of manufacture, may be particularly improved upon in view of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended as a definition of the limits of the specification. It should also be understood that the drawings are not drawn to scale.
In the prior art, a method of taping a solder printing area is generally adopted to protect the solder printing area. However, the adhesive tape is unstable in adhesion effect and easy to fall off, so that the quality of the battery is affected; moreover, different sizes need to be cut according to different welding and printing areas, adhesive tapes with different thicknesses are prepared, time and labor are wasted, the adhesive tapes need to be replaced after the adhesive tapes are used up, and the sticking efficiency is affected.
The specification provides a solder print protection method. The method can be applied to the field of battery manufacturing, and can also be applied to any other field needing protective welding. For example, in the field of robot manufacturing, in order to prevent welding slag from falling inside equipment and affecting the quality of the equipment, a welding area needs to be protected frequently. In practical application, the solder printing protection method described in the specification can be applied to a plurality of fields, which are not listed in the specification.
Fig. 1 is a schematic diagram of a solder print protection method P100 according to an embodiment of the present disclosure. As shown in fig. 1, the dispensing apparatus 200 is used for dispensing a workpiece 400 to be processed. The dispensing apparatus 200 may include a frame 220, a dispensing head 240, and a drive assembly 260. In some embodiments, the dispensing apparatus 200 may further include a control component 280.
The frame 220 is a mounting base of the dispensing apparatus 200. The drive assembly 260 is mounted to the frame 220. A drive assembly 260 is coupled to the dispensing head 240 for driving the dispensing head 240 to move or rotate relative to the frame 220. The dispensing head 240 is a mechanism for coating a glue solution, and the glue solution is coated on the welding and printing area 420 of the workpiece 400 to be processed through the dispensing head 240. In some embodiments, the dispensing apparatus 200 may further include a control component 280. The control assembly 280 may be communicatively coupled to the drive assembly 260 for controlling the drive direction and drive speed of the drive assembly 280, and thus the path and speed of movement of the dispensing head 240.
As shown in fig. 1, the method P100 may include:
s120: setting the workpiece 400 to be processed to a preset position, and determining the initial dispensing position of the workpiece 400 to be processed.
As shown in fig. 1, before dispensing the workpiece 400 to be processed, in order to ensure the dispensing effect and the uniformity of the glue solution application, the workpiece 400 to be processed needs to be positioned and fixed. The workpiece 400 to be processed may be fixed to the frame 220 of the dispensing apparatus 200, or may be fixed to another fixing apparatus (not shown in fig. 1). The workpiece 400 to be processed is set at the preset position, and the initial dispensing position of the solder printing region 420 of the workpiece 400 to be processed is determined, so that the dispensing head 240 is aligned with the initial dispensing position. By fixing the workpiece 400 to be processed, the position of the workpiece 400 to be processed can be ensured not to move in the dispensing process, so that the uniformity of the glue solution coating is ensured, and the quality of the glue solution coating is improved. By adjusting the relative position between the initial dispensing position and the dispensing head 240, the workpiece 400 to be processed and the dispensing head 240 are positioned, thereby ensuring that the solder printing area 420 is completely covered and avoiding the phenomena of missing coating and wrong coating.
S140: and driving a dispensing head 240 of the dispensing device 200 to move according to a preset path, and coating the glue solution on a welding and printing area 420 of the workpiece 400 to be processed, wherein the overlapping area of the glue solution between adjacent paths is 20% -50%.
After the workpiece 400 to be processed is fixed, the glue solution is extruded out of the dispensing head 240 under the action of pressure and coated on the welding area 420, and the glue solution is adhered to the welding area 420 of the workpiece 400 to be processed; the driving assembly 260 drives the dispensing head 240 to move along a preset path, so that the glue solution completely covers the welding area 420. By controlling the moving speed and the moving path of the dispensing head 240, the uniformity and the integrity of the glue solution coating are ensured, and the glue solution coating quality is improved.
A feed opening (not shown in fig. 1) is provided on the dispensing head 240 for supplying the dispensing head 240 with the glue solution. In the process of dispensing the solder printing area 420, the glue solution can be provided for the solder printing area 420 from the supply port at any time, so that the continuity of dispensing is ensured, the machine does not need to be stopped, and the dispensing efficiency is improved. Therefore, the solder print protection method P100 described in this specification improves the work efficiency compared to the conventional protection method.
In some embodiments, the glue solution may be a liquid hot melt glue after the hot melt glue block is heated to melt. In other embodiments, the glue may be a thermosetting glue.
When the glue solution is a liquid hot melt glue after being heated and melted, the dispensing head 240 further includes a heating assembly (not shown in fig. 1). The solid hot melt adhesive block 600 is added into the dispensing head 240 from the feeding port, and the hot melt adhesive block 600 is melted into the adhesive solution by heating of the heating assembly. The hot melt adhesive block 600 is solid at normal temperature. When the workpiece 400 to be processed is a lithium battery, the hot melt adhesive block 600 is a polyolefin type hot melt adhesive resistant to electrolyte at a temperature of more than 85 ℃. It is known that a large amount of electrolyte is usually contained in a lithium battery, and in order to ensure the safety of the lithium battery in the use process, the used glue solution needs to resist the electrolyte with the temperature of more than 85 ℃, so as to ensure that the glue solution can also play a good role in protecting the welding area 420 even in the electrolyte of the lithium battery. In addition, when the hot melt adhesive block 600 is soaked in the electrolyte at the temperature of more than 85 ℃ for 7 days, the molecular precipitation rate and the expansion rate are less than 5%. Precipitates in the electrolyte of the hot melt adhesive block 600 at 85 ℃ or higher may be released into the electrolyte, thereby affecting the performance of the electrolyte and further affecting the performance of the lithium battery. Therefore, in order to ensure the performance of the lithium battery, the hot melt adhesive block 600 with the molecular precipitation rate and the expansion rate of less than 5 percent when the lithium battery is soaked in the electrolyte for 7 days at the temperature of more than 85 ℃ needs to be selected. In some embodiments, in order to ensure the bonding strength between the glue and the solder printing region 420, so that the glue does not easily fall off during use, the bonding strength between the hot melt glue block 600 and the metal needs to be tested. The bonding strength between the hot melt adhesive block 600 and the copper or aluminum material is preferably 1-3 Mpa. The heating temperature of the hot melt adhesive block 600 meeting the requirement is 160-190 ℃.
The glue solution can be thermosetting glue solution which is liquid at normal temperature and is solidified in the welding and printing area 420 after being heated so as to achieve the purpose of protecting welding and printing.
Specifically, the glue solution covered on the solder printing area 420 has a thickness of 0.1-0.5 mm. When the thickness of the glue solution is less than 0.1mm, the glue solution cannot completely cover the welding and printing area 420, and the protection effect of welding and printing is poor. When the thickness of the glue solution is larger than 0.5mm, the size of the workpiece 400 to be processed is changed. The thickness of the glue solution can be adjusted by adjusting the liquid outlet speed of the glue dispensing head 240 and/or the moving speed of the glue dispensing head 240.
The predetermined path is preset by the control unit 280 according to the size and shape of the solder area 420. For the purpose of illustration, the lithium battery is used as the workpiece 400 to be processed, and the solder printing region 820 on the cover plate 800 of the lithium battery is taken as an example for description. Fig. 2 is a schematic diagram of a solder printing region 820 of a lithium battery according to an embodiment of the present disclosure. The solder areas 822 and 826 shown in fig. 2 are solder areas 820 at two different locations on the cover plate 800 of the lithium battery, respectively. The black lines in fig. 2 are welds, and a plurality of welds constitute a weld region. The portion in the dashed box is the solder print area 820.
In some embodiments, the predetermined path is a traverse/longitudinal reciprocating path. In some embodiments, the predetermined path is a circular path. Fig. 3 is a schematic diagram illustrating dispensing of a solder printing area 820 of a lithium battery according to an embodiment of the present disclosure. For convenience of illustration, the printing area 822 is dispensed using a laterally reciprocating path and the printing area 826 is dispensed using a circular path in fig. 3. However, in practical applications, the cover plate 800 of the same lithium battery can be dispensed by using the same predetermined path. As shown in fig. 3, in the dispensing process of the solder printing area 822, the dispensing head 240 moves along a preset transverse reciprocating path to make the glue solution cover the solder printing area 822, so as to form a first glue solution surface 823. Of course, the preset path may also be a longitudinal reciprocating path, that is, the dispensing head 240 moves along the preset longitudinal reciprocating path. During dispensing of the solder printing area 826, the dispensing head 240 moves along a predetermined circular path to cover the solder printing area 826 with the glue solution, so as to form a second glue level 827. In order to allow the glue to completely cover the solder area 820. During the movement of the dispensing head 240, the glue solution between adjacent paths needs to be partially overlapped to ensure that there is no missing coating portion between adjacent paths. The overlapping area of the glue solution between the adjacent paths is 20-50%. As shown in fig. 3, the shaded portion between adjacent paths in the first glue level 823 is an area 824 where the first glue levels overlap. The portion of the second glue level 827 where shading is accentuated between adjacent paths is the region 828 where the second glue level overlaps. When the overlapping area is less than 20%, there may be a spot where the coating is missed, and the effect of solder print protection is not good. When the overlapping area is larger than 50%, the dispensing efficiency is low, and the time consumption is long.
The shape and size of the welding area 420 of different workpieces 400 to be processed are often different, and the thickness of the glue coverage is also different. When the solder printing area 420 is changed, the dispensing of different solder printing areas 420 can be realized only by adjusting the parameters of the control assembly 280 and changing the moving path, the moving speed and/or the liquid outlet speed of the dispensing head 240, and the operation is simple and easy for batch operation.
S160: and curing the glue solution.
After the glue solution is coated on the solder printing area 420, the glue solution needs to be cured, so that the glue solution is completely bonded with the solder printing area 420. When the glue solution is a liquid hot melt adhesive after being heated and melted, the liquid hot melt adhesive can be naturally cooled and solidified. No additional means are generally required to cure it. Typically, the hot melt adhesive glue is cured within 20-P100s after it is applied to the solder print area 420. Of course, the curing time of the hot melt adhesive liquid in different models is different.
When the glue solution is thermosetting glue solution, in order to accelerate the curing of the thermosetting glue solution, a certain auxiliary means is usually required. Thermosetting adhesive liquid is generally liquid at normal temperature and becomes solid when the temperature rises. Therefore, the solder printing area 420 covered with the glue solution is generally heated and/or irradiated by light to accelerate the temperature rise, so that the glue solution curing is accelerated and the production efficiency is improved.
In summary, in the solder print protection method P100 provided in this specification, the glue solution is covered on the solder print area 420 by the dispensing device 200 to protect the solder print. Even if the shapes of the welding and printing areas 420 are different and uneven, the glue solution can be well attached to the welding and printing areas 420 and is adhered to the welding and printing areas 420, and the purpose of protecting welding and printing is achieved. In the dispensing process, the dispensing head 240 moves according to a preset path, so that the uniformity and integrity of the covering of the glue solution are ensured, and the quality of the covering of the glue solution is improved. The adhesive strength of the cured adhesive solution is high, the adhesive solution is not easy to fall off, and the safety performance and the service life of the workpiece 400 to be processed are improved. Moreover, in the working process of the dispensing head 240, the glue solution can be added at any time without stopping, so that the dispensing efficiency is improved. For the solder printing areas 420 with different shapes and sizes, the dispensing of the different solder printing areas 420 can be realized only by adjusting the parameters of the control assembly 280 and changing the moving path, the moving speed and/or the liquid outlet speed of the dispensing head 240, and the operation is simple and easy for batch operation.
In conclusion, upon reading the present detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure can be presented by way of example only, and not limitation. Those skilled in the art will appreciate that the present description is intended to cover various reasonable changes, adaptations, and modifications of the embodiments described herein, although not explicitly described herein. Such alterations, improvements, and modifications are intended to be suggested by this specification, and are within the spirit and scope of the exemplary embodiments of this specification.
Furthermore, certain terminology has been used in this specification to describe embodiments of the specification. For example, "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined as suitable in one or more embodiments of the specification.
It should be appreciated that in the foregoing description of embodiments of the specification, various features are grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the specification, for the purpose of aiding in the understanding of one feature. This is not to be taken as an admission that any of the features are required in combination, and it is fully possible for one skilled in the art to extract some of the features as separate embodiments when reading this specification. That is, embodiments in this specification may also be understood as an integration of a plurality of sub-embodiments. And each sub-embodiment described herein is equally applicable to less than all features of a single foregoing disclosed embodiment.
Each patent, patent application, publication of a patent application, and other material, such as articles, books, descriptions, publications, documents, articles, and the like, cited herein is hereby incorporated by reference. All matters hithertofore set forth herein except as related to any prosecution history, may be inconsistent or conflicting with this document or any prosecution history which may have a limiting effect on the broadest scope of the claims. Now or later associated with this document. For example, if there is any inconsistency or conflict in the description, definition, and/or use of terms associated with any of the included materials with respect to the terms, descriptions, definitions, and/or uses associated with this document, the terms in this document are used.
Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of the present specification. Other modified embodiments are also within the scope of this description. Accordingly, the disclosed embodiments are to be considered in all respects as illustrative and not restrictive. Those skilled in the art may implement the applications in this specification in alternative configurations according to the embodiments in this specification. Therefore, the embodiments of the present description are not limited to the embodiments described precisely in the application.
Claims (11)
1. A method of solder print protection comprising:
setting a workpiece to be processed to a preset position, and determining an initial dispensing position of the workpiece to be processed;
driving a dispensing head of dispensing equipment to move according to a preset path, and coating a glue solution on a welding and printing area of the workpiece to be processed, wherein the overlapping area of the glue solution between adjacent paths is 20% -50%; and
and curing the glue solution.
2. A method of solder print protection according to claim 1 in which the predetermined path is a traverse/longitudinal reciprocating path.
3. The solder print protection method of claim 1 wherein the predetermined path is a circular path.
4. The solder print protection method according to claim 1, wherein the thickness of the glue solution covering the solder print area is 0.1-0.5 mm.
5. The solder print protection method according to claim 1, wherein the glue solution is a liquid hot melt glue obtained by melting a hot melt glue block by heating.
6. The method for protecting a solder print according to claim 5, wherein the hot melt adhesive block is a polyolefin type hot melt adhesive resistant to an electrolyte solution at a temperature of 85 ℃ or higher, and the molecular precipitation rate and the expansion rate of the hot melt adhesive block are less than 5% when the hot melt adhesive block is immersed in the electrolyte solution at a temperature of 85 ℃ or higher for 7 days.
7. The solder print protection method of claim 5, wherein the adhesion strength of the hot-melt adhesive mass to the copper or aluminum material is 1-3 Mpa.
8. The solder print protection method according to claim 5, wherein the heating temperature is 160 to 190 ℃.
9. The solder print protection method according to claim 1, wherein the glue is a thermosetting glue.
10. The solder print protection method of claim 9, wherein the curing the glue solution comprises: and heating the welding and printing area covered with the glue solution to solidify the glue solution.
11. The solder print protection method of claim 9, wherein the curing the glue solution comprises: and irradiating the welding and printing area covered with the glue solution by light to solidify the glue solution.
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| CN202010455776.8A CN111570218A (en) | 2020-05-26 | 2020-05-26 | Protection method for welding seal |
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| CN202010455776.8A CN111570218A (en) | 2020-05-26 | 2020-05-26 | Protection method for welding seal |
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| CN112976002A (en) * | 2021-02-25 | 2021-06-18 | 浙江大学山东工业技术研究院 | Industrial automation welding robot |
| CN117890377A (en) * | 2024-02-22 | 2024-04-16 | 宁德时代新能源科技股份有限公司 | Battery monomer flexible connecting piece detection system and point detection method |
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Application publication date: 20200825 |