CN111559884A - Particle sound absorption board prepared from thermosetting binder - Google Patents
Particle sound absorption board prepared from thermosetting binder Download PDFInfo
- Publication number
- CN111559884A CN111559884A CN202010442638.6A CN202010442638A CN111559884A CN 111559884 A CN111559884 A CN 111559884A CN 202010442638 A CN202010442638 A CN 202010442638A CN 111559884 A CN111559884 A CN 111559884A
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- CN
- China
- Prior art keywords
- aggregate particles
- particle
- resin
- gel solvent
- particulate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 title claims abstract description 86
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 22
- 239000011230 binding agent Substances 0.000 title claims description 9
- 238000010521 absorption reaction Methods 0.000 title abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 26
- 239000004576 sand Substances 0.000 claims abstract description 11
- 239000011324 bead Substances 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 3
- 239000008262 pumice Substances 0.000 claims abstract description 3
- 239000002893 slag Substances 0.000 claims abstract description 3
- 238000009826 distribution Methods 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 27
- 239000007788 liquid Substances 0.000 abstract description 20
- 239000006185 dispersion Substances 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 238000004880 explosion Methods 0.000 abstract description 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 9
- 229910000077 silane Inorganic materials 0.000 abstract description 9
- 229910021529 ammonia Inorganic materials 0.000 abstract description 6
- 239000011259 mixed solution Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 29
- 238000002844 melting Methods 0.000 description 16
- 238000010009 beating Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 12
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 12
- 150000002513 isocyanates Chemical class 0.000 description 12
- 230000008018 melting Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000002184 metal Substances 0.000 description 9
- 238000005303 weighing Methods 0.000 description 9
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 8
- 239000004844 aliphatic epoxy resin Substances 0.000 description 8
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 8
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 8
- 229920000459 Nitrile rubber Polymers 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 6
- 239000012943 hotmelt Substances 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 4
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 3
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- RUNBDQGENXJZOO-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]hept-5-ene-3,4-dicarboxylate Chemical compound C1C2OC2=CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 RUNBDQGENXJZOO-UHFFFAOYSA-N 0.000 description 3
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 description 3
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- -1 di (2-ethyl) hexyl phthalate Chemical compound 0.000 description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 2
- 229960001826 dimethylphthalate Drugs 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000011491 glass wool Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011325 microbead Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- 239000005077 polysulfide Substances 0.000 description 2
- 150000008117 polysulfides Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 206010000369 Accident Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000746 Structural steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/14—Polyepoxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/242—Moulding mineral aggregates bonded with resin, e.g. resin concrete
- B29C67/243—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
- C04B26/32—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/82—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to sound only
- E04B1/84—Sound-absorbing elements
- E04B1/86—Sound-absorbing elements slab-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/52—Sound-insulating materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Acoustics & Sound (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Architecture (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Mechanical Engineering (AREA)
- Building Environments (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010110606.6A CN111138124A (en) | 2020-02-24 | 2020-02-24 | Particle sound absorption board prepared from thermosetting binder with low melting temperature and application thereof |
CN2020101106066 | 2020-02-24 | ||
CN2020101105716 | 2020-03-20 | ||
CN202010110571.6A CN111139011A (en) | 2020-03-20 | 2020-03-20 | Thermosetting binder with low melting temperature |
CN202010318744 | 2020-04-21 | ||
CN2020103187443 | 2020-04-21 | ||
CN2020103187570 | 2020-04-21 | ||
CN202010318757 | 2020-04-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111559884A true CN111559884A (en) | 2020-08-21 |
CN111559884B CN111559884B (en) | 2021-03-23 |
Family
ID=72074871
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010442638.6A Active CN111559884B (en) | 2020-02-24 | 2020-05-22 | Particle sound absorption board prepared from thermosetting binder |
CN202010442657.9A Active CN111574107B (en) | 2020-02-24 | 2020-05-22 | Thermosetting binder |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010442657.9A Active CN111574107B (en) | 2020-02-24 | 2020-05-22 | Thermosetting binder |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN111559884B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113524734A (en) * | 2021-06-08 | 2021-10-22 | 正升环境科技股份有限公司 | Particle board forming method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801495A (en) * | 1984-05-17 | 1989-01-31 | Hoechst Aktiengesellschaft | Decorative panel with improved surface characteristics |
CN108117312A (en) * | 2017-12-26 | 2018-06-05 | 正升环境科技股份有限公司 | A kind of decoration acoustic absorption and preparation method thereof |
CN108164771A (en) * | 2017-12-27 | 2018-06-15 | 河北金威新型建筑材料有限公司 | The production method of noise reduction acoustic board |
CN109231884A (en) * | 2017-07-10 | 2019-01-18 | 正升环境科技股份有限公司 | Polymer particle acoustic board and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102191004B (en) * | 2010-12-31 | 2014-02-05 | 莱芜金鼎电子材料有限公司 | Thermosetting adhesive for flexible basic material and preparation method thereof |
CN105950027B (en) * | 2016-05-26 | 2019-08-09 | 航天材料及工艺研究所 | A kind of epoxyn and preparation method thereof |
CN109535660A (en) * | 2018-12-18 | 2019-03-29 | 深圳航天科技创新研究院 | A kind of fire-retardant prepreg resin of the rapid curing that viscosity is controllable and preparation method thereof |
-
2020
- 2020-05-22 CN CN202010442638.6A patent/CN111559884B/en active Active
- 2020-05-22 CN CN202010442657.9A patent/CN111574107B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801495A (en) * | 1984-05-17 | 1989-01-31 | Hoechst Aktiengesellschaft | Decorative panel with improved surface characteristics |
CN109231884A (en) * | 2017-07-10 | 2019-01-18 | 正升环境科技股份有限公司 | Polymer particle acoustic board and preparation method thereof |
CN108117312A (en) * | 2017-12-26 | 2018-06-05 | 正升环境科技股份有限公司 | A kind of decoration acoustic absorption and preparation method thereof |
CN108164771A (en) * | 2017-12-27 | 2018-06-15 | 河北金威新型建筑材料有限公司 | The production method of noise reduction acoustic board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113524734A (en) * | 2021-06-08 | 2021-10-22 | 正升环境科技股份有限公司 | Particle board forming method |
Also Published As
Publication number | Publication date |
---|---|
CN111574107A (en) | 2020-08-25 |
CN111559884B (en) | 2021-03-23 |
CN111574107B (en) | 2023-01-17 |
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Denomination of invention: A particle sound-absorbing plate prepared from thermosetting adhesive Effective date of registration: 20210804 Granted publication date: 20210323 Pledgee: Industrial Bank Limited by Share Ltd. Chengdu branch Pledgor: ZHENG SHENG ENVIRONMENTAL TECHNOLOGY Co.,Ltd. Registration number: Y2021510000167 |
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Denomination of invention: A particle sound-absorbing board prepared from thermosetting adhesives Effective date of registration: 20230814 Granted publication date: 20210323 Pledgee: Industrial Bank Limited by Share Ltd. Chengdu branch Pledgor: ZHENG SHENG ENVIRONMENTAL TECHNOLOGY Co.,Ltd. Registration number: Y2023980051873 |
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Granted publication date: 20210323 Pledgee: Industrial Bank Limited by Share Ltd. Chengdu branch Pledgor: ZHENG SHENG ENVIRONMENTAL TECHNOLOGY Co.,Ltd. Registration number: Y2023980051873 |
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Denomination of invention: A particle sound-absorbing board prepared from thermosetting adhesive Granted publication date: 20210323 Pledgee: Industrial Bank Limited by Share Ltd. Chengdu branch Pledgor: ZHENG SHENG ENVIRONMENTAL TECHNOLOGY Co.,Ltd. Registration number: Y2024980038293 |
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