CN111559884A - Particle sound absorption board prepared from thermosetting binder - Google Patents

Particle sound absorption board prepared from thermosetting binder Download PDF

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CN111559884A
CN111559884A CN202010442638.6A CN202010442638A CN111559884A CN 111559884 A CN111559884 A CN 111559884A CN 202010442638 A CN202010442638 A CN 202010442638A CN 111559884 A CN111559884 A CN 111559884A
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aggregate particles
particle
resin
gel solvent
particulate
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CN111559884B (en
Inventor
李航
杨宝山
李朝阳
沈加曙
贾荷香
唐云
侯强
何海林
杨鑫
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Zisen Environmental Technology Co ltd
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Zisen Environmental Technology Co ltd
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Priority claimed from CN202010110606.6A external-priority patent/CN111138124A/en
Priority claimed from CN202010110571.6A external-priority patent/CN111139011A/en
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02Macromolecular compounds
    • C04B26/10Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/14Polyepoxides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/242Moulding mineral aggregates bonded with resin, e.g. resin concrete
    • B29C67/243Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/30Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
    • C04B26/32Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/82Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to sound only
    • E04B1/84Sound-absorbing elements
    • E04B1/86Sound-absorbing elements slab-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets
    • B29L2007/002Panels; Plates; Sheets
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/52Sound-insulating materials

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Architecture (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Building Environments (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a particle board made by adding thermosetting adhesive and the application of the particle board as a sound absorption and insulation board of a closed space. The particle board comprises aggregate particles, a gel solvent and a resin mixture. The aggregate particles are selected from one or more of aeolian sand, machine-made sand, pumice, glass beads, vitrified beads and slag, wherein the gel solvent consists of a resin mixed solution, silane and graphene dispersion liquid in a certain proportion, and the resin mixed solution consists of organic resin and ammonia substances in a certain proportion. The particle sound absorption and insulation board can be well exploded and fused during explosion and fire, and sufficient space and time are provided for fire fighting.

Description

Particle sound absorption board prepared from thermosetting binder
Technical Field
The invention relates to a thermosetting adhesive, in particular to a thermosetting adhesive with low melting temperature and application of the thermosetting adhesive with low melting temperature in a particle board material.
Background
The particle board material has good sound absorption performance, and thermosetting adhesive is adopted as the adhesive of aggregate particles in a plurality of novel particle sound absorption boards. The thermosetting adhesive is crosslinked and cured under specific conditions, and generally has no melting point and the thermal decomposition temperature of more than 250 ℃ because the crosslinking density is high and the chain segment is not easy to move. In particulate sound absorbing panels, it is difficult for the higher temperatures to destroy the integrity of the particulate sound absorbing panel. The inventor finds that the particle sound-absorbing board made of the thermosetting adhesive is applied to industries such as civil use, industry, electric power, traffic, petroleum and the like which have control requirements on sound environment, and the effect is very good in a large number of innovative technical researches and developments.
The converter transformer is a main noise source during the operation of the converter station, and the traditional noise reduction measure is to use a sound insulation plate and a support frame to form a noise reduction structure system. At present, a BOX-IN top sound insulation board is a 150mm metal module, and the main structure of the metal module is as follows: 1.5mm galvanized sheet panel +32kg/m3Glass wool, glass fiber cloth and a 0.8mm galvanized hole plate structure. The top sound insulation plate is connected with the BOX-IN steel structural steel beam by metal clamping pieces and bolts; the facade acoustic baffle is 100mm metal module, and metal module's major structure is: 1.5mm galvanized sheet panel +32kg/m3Glass wool, glass fiber cloth and a 0.8mm galvanized hole plate structure. The vertical sound insulation board and the BOX-IN steel structure upright post are tightly propped and fixed by adopting an inserted angle steel. Obviously, the traditional sound insulation board has poor sound insulation effect, the metal module has high cost and high dependence on installation conditions.
In recent years, explosion and fire accidents of converter transformers have shown that: IN case of explosion and fire, the fire extinguishing system IN the BOX-IN can be damaged by the splashes generated by the sound insulation plate under the action of the explosion, no matter the traditional sound insulation plate or the current metal module; the closed space formed by the metal mold blocks has the advantage that the internal pressure is instantly increased, and the metal mold blocks cannot automatically fall off, so that the fire-fighting medium is prevented from being sprayed to the transformer by external fire-fighting equipment, and the external fire-fighting is prevented from extinguishing fire.
In the prior patent literature, in order to solve the technical problems of explosion and fire of the converter station, there are two technical means:
prior patent document 1: CN110152223A discloses an extra-high voltage converter transformer protective structure, has adopted a high temperature fusible many empty amortization structures, and wherein the porous sound absorbing structure of high temperature fusible material is possessed sufficient mechanical strength at ordinary times to the high temperature fusible amortization structure, satisfies last people's inspection and repair demand, when the change current transformer takes place the conflagration, can reach 150 ℃ because of burning high temperature and melt rapidly and disappear and form the opening.
Prior patent document 2: CN110180109A discloses a BOX-IN device with a sound insulation module and a fire-fighting module, wherein a top noise reduction module is a sound absorption and insulation plate arranged at the top, the sound absorption and insulation plate is divided into an explosion release and drop sound insulation plate and a fixed sound insulation plate according to regions, and the explosion release and drop sound insulation plate is made of high-temperature hot-melt materials and can automatically drop when a fire disaster happens; fixed sound insulation board adopts the packing sound insulation board, packs and sets up one deck hot melt material board between sound insulation board and the support steel construction, and hot melt material board extends to let out to explode the bottom that drops the sound insulation board and supports it, and hot melt material board plays the supporting role to letting out to explode the sound insulation board that drops and fill the sound insulation board at ordinary times, and when the change of current becomes to catch fire, hot melt material board can melt very fast, lets out to explode and drops the sound insulation board and can drop. Wherein the high-temperature hot melting material of the explosion venting and dropping sound insulation board is a thermoplastic resin material.
As can be seen from the above documents 1 and 2: document 1 does not disclose the material of the high-temperature fusible material, and only a plurality of points in the specification describe that the material can be melted without dripping; document 2 discloses that the explosion-releasing and dropping-off sound-insulating panel is made of a high-temperature hot-melt material, such as a thermoplastic resin material.
The inventor comprehensively considers acoustic performance, environmental protection requirements, economic cost and mechanical requirements, and creatively applies the particle sound absorption board material to the convertor station, so that the convertor station has the economic advantages of stable acoustic performance, excellent environmental protection performance, low maintenance cost and low disposal cost. Meanwhile, the transformer can normally work during installation and maintenance, can be fused and shed at the temperature of more than 150 ℃, and cannot generate covering damage to the transformer under the condition of organic material melting. When explosion happens, the particle sound absorption plate generates cracks, so that the particle sound absorption plate has better explosion venting performance and prevents secondary damage.
Disclosure of Invention
The invention aims to solve the fire protection requirement of the existing closed space like a converter substation and the like, provides a thermosetting adhesive, further provides a particle sound-absorbing board prepared from the thermosetting adhesive, further provides application of the particle sound-absorbing board IN the closed space such as a sound-insulating board on the top and/or vertical surface of a BOX-IN, and further provides a preparation method of the particle sound-absorbing board.
The technical scheme of the invention is as follows:
a thermosetting adhesive comprising a gel solvent and a resin flexibilizing agent.
Further, the gel solvent comprises a resin mixed solution, silane and a graphene dispersion liquid.
Further, the resin mixed solution is composed of organic resins and ammonia substances.
The organic resin is selected from one or any combination of linear aliphatic epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin and organic silicon resin with good aging resistance, and the resin has good adhesion performance and mechanical performance besides good aging resistance, so that the sound absorption plate has good structural strength.
The ammonia is selected from one or any combination of aliphatic polyamine, alicyclic polyamine, polyether amine, polyamide and aromatic polyamine, and the ammonia can endow different properties to the product according to different types (different chemical structures), such as: the polyether amine and the polyamide enable the toughness of the product to be better, and the aromatic property improves the mechanical property, corrosion resistance and water resistance of the product. The difference of ammonia substances causes the difference of the properties of the cured thermosetting resin, and the difference of amine values (active hydrogen equivalent) causes the difference of the addition amount.
The ammonia is isophorone diamine.
The graphene dispersion liquid is prepared by dispersing graphene or graphene oxide into a solvent, wherein the solvent is one or more selected from N-methyl pyrrolidone, ethanol, isopropanol or water, and the solid content of the graphene or graphene oxide dispersion liquid is 1-5 wt%. The graphene or graphene oxide exists in the form of a single sheet or a plurality of sheets in the dispersion liquid, is not easy to agglomerate, and can be fully and uniformly mixed with other components in the gel solvent.
The resin flexibilizer is selected from carboxyl liquid nitrile rubber, hydroxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, isocyanate and dimethyl phthalate (DMP); diethyl phthalate (DEP); di-n-butyl phthalate (DBP); dioctyl phthalate (DOP); butyl Benzyl Phthalate (BBP); di (2-ethyl) hexyl phthalate (DEHP), dioctyl phthalate (DOP); diisononyl phthalate (DINP) or any combination thereof. The required fusing temperature is adjusted by adding a specific proportion of resin flexibilizer.
A particulate acoustical panel made from a thermosetting binder includes aggregate particles, a gel solvent, and a resin flexibilizing agent.
Further, the aggregate particles are selected from one or more of aeolian sand, machine-made sand, pumice, glass beads, vitrified beads and slag.
Further, the roundness and sphericity of the aggregate particles are more than or equal to 0.7.
Further, the particle size of the aggregate particles is more than or equal to 80 meshes.
Further, the content of the gel solvent is 4-10% of the weight of the aggregate particles.
Further, the resin flexibilizer accounts for 2-9% of the weight of the aggregate particles.
The use of a thermosetting binder to prepare acoustical panels comprising particles in enclosed spaces.
Further, the closed space is a closed space formed by sound insulation plates of a BOX-IN IN the converter station.
A method for preparing a particulate sound-absorbing panel, the particulate sound-absorbing panel comprising aggregate particles, a gel solvent and a resin flexibilizer;
firstly, fully and uniformly mixing a gel solvent in a gel mixer;
secondly, introducing the uniformly mixed gel solvent obtained in the first step into a mixer, and uniformly stirring the gel solvent and the aggregate particles;
thirdly, placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and the thickness of the die;
fourthly, the mold horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mold after the mold passes through the hopper;
fifthly, the mould performs beat vibration on the particle mixture to compact through a beat vibration forming mechanism;
and sixthly, baking the die for 50-70 minutes at 120-170 ℃ for curing and forming, and demolding at room temperature.
Further, in the preparation step before the first step, graphene or graphene oxide is uniformly dispersed in a solvent.
Has the advantages that:
the invention bonds aggregate particles with different grades by adjusting different proportions of a gel solvent and a resin flexibilizer to obtain the low-fusing-temperature particle sound-absorbing board with different fusing temperatures. Wherein the resin flexibilizer plays a role in reducing the fusing temperature of the plate. In many resin toughening patents, the above flexibilizers are used, but the flexibilizers are used as the flexibilizers, and the toughening principle is to increase the free volume of chain segments in the resin, improve the motion of the chain segments, and further improve the toughness of the resin.
The invention discovers that the elastic modulus, the glass transition temperature and the thermal stability of a cured product are sacrificed when the resin is toughened, and the inventor adds a proper amount of a flexibilizer in the technical research and development process to obtain the thermosetting adhesive with different fusing temperatures on the premise of keeping the mechanical properties of the cured product. The reaction type flexibilizers such as carboxyl-terminated liquid nitrile rubber, hydroxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, isocyanate and the like react with resin groups to reduce the crosslinking density of the resin and increase chain segments, and the movement of the chain segments causes the movement of the whole molecular chain at a proper temperature, so that the collapse of the product at a low fusing temperature is caused. Non-reactive flexibilizers such as diethyl phthalate (DEP); di-n-butyl phthalate (DBP); dioctyl phthalate (DOP); butyl Benzyl Phthalate (BBP); di (2-ethyl) hexyl phthalate (DEHP), dioctyl phthalate (DOP); diisononyl phthalate (DINP), etc., by increasing the free volume of the segment, the movement of the segment causes the movement of the entire molecular chain and, in turn, the collapse of the low-melting temperature product at a suitable temperature.
The invention prepares the particle acoustic board with different low melting temperatures by adjusting the adding amount of the resin flexibilizer and compounding different flexibilizers.
The graphene dispersion liquid has good dispersibility, can form a uniform solution after being stirred with a gel solvent, and can make up the loss well when the mechanical performance of the low-fracture-temperature particle acoustic board is reduced under the condition that a large amount of resin flexibilizer is added.
The invention provides the application of the low-melting temperature particle acoustic board IN the BOX-IN, and when the 80kPa explosion impact is carried out, obvious damage and small fragment blocks are not generated; at 160kPa impact, only cracks and no small pieces were produced. At 240kPa explosive impact, cracks appeared on the surface of the sample, and no significant breakage was observed. When the sleeve is exploded, fine fragments are not generated to be projected outwards, secondary damage is not caused, and the safety and the reliability are realized. When the converter transformer equipment explodes, the particle sound absorption plate is damaged, internal pressure is released, and explosion destructive force is reduced.
The invention provides an application of a low-melting temperature particle acoustic board IN BOX-IN, wherein the time of fire resistance integrity does not exceed 5min, namely: in case of fire, the particle sound absorption board can be destroyed within 5 min. Meanwhile, when the particle sound-absorbing board falls off, all the particle sound-absorbing boards are fused and fall off in small blocks, so that the problem that the flame is blocked to influence the external fire extinguishing when the large blocks fall off is solved, and the success rate of external fire extinguishing is ensured.
The invention provides an application of a low-melting-temperature particle sound absorption board IN BOX-IN, the weighted sound insulation quantity of the particle sound absorption board is not lower than 38dB, wherein the sound insulation quantity of 100HZ is 28.3 dB. After the particle sound absorption board is installed into a BOX-IN, the requirement of 25dB of integral noise reduction is met. IN the aspect of load bearing performance, when the particle sound absorption board is used for the BOX-IN top, the requirements that the uniformly distributed live load of the top surface is not less than 0.7kN/m2 and the standard value of the top surface construction or overhaul local concentrated load is not less than 1.0kN are met.
Description of the drawings:
FIG. 1: DSC curves for different resin flexibilizer contents;
FIG. 2: the bending strength curve of the low-melting-temperature particle acoustic board with different resin flexibilizer contents;
FIG. 3: bending strength curve of low-melting temperature particle acoustic board with different graphene contents.
Detailed Description
The present invention will be further described below for better understanding of the objects, technical solutions and technical effects of the present invention, but the scope of the present invention is not limited to the following examples, and it is not necessary to limit the application of the thermosetting binder having a low melting temperature to the preparation of the particulate acoustic panel.
The content of the gel solvent in the low fusing temperature particle acoustic board is 4-10% of the weight of the aggregate particles, and the content of the resin flexibilizer is 2-9% of the weight of the aggregate particles. Only a part of the components is selected and the ratio of the part of the components is described in detail below, and it is not meant to indicate that only the following components and the ratio of the components can be selected.
Example 1
100 parts of 120-mesh machine-made sand with the roundness and the sphericity of 0.8 is weighed, 5 parts of a gel solvent and 9 parts of isocyanate are weighed, wherein 3.5 parts of 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester (alicyclic epoxy resin), 0.1 part of 1, 6-hexanediol diglycidyl ether (aliphatic epoxy resin), 0.0075 part of silane, 0.0025 part of graphene dispersion liquid and 1.39 parts of isophorone diamine are contained in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 60 minutes at 150 ℃ for curing and forming, and demoulding is carried out at room temperature.
In addition, weighing the gel solvent and the isocyanate with the same proportion, uniformly stirring, baking for 60 minutes at 150 ℃ for curing and forming, cooling, and taking a small sample for DSC test.
Example 2
Comparative example 1, except that the isocyanate portion was changed to 8 parts, the remaining materials and fabrication process were consistent.
Example 3
Comparative example 1 except that the isocyanate portion was changed to 7 parts, the remaining materials and fabrication process were consistent.
Example 4
Comparative example 1 except that the isocyanate portion was changed to 6 parts, the remaining materials and fabrication process were consistent.
Example 5
Comparative example 1 except that the isocyanate portion was changed to 5 parts, the remaining materials and fabrication process were consistent.
Example 6
Comparative example 1 except that the isocyanate portion was changed to 4 portions, the remaining materials and fabrication process were consistent.
Example 7
Comparative example 1, except that the isocyanate portion was changed to 3 parts, the remaining materials and fabrication process were consistent.
Example 8
Comparative example 1 except that the isocyanate portion was changed to 2 parts, the remaining materials and fabrication process were consistent.
Example 9
Comparative example 1, except that the isocyanate portion was changed to 0 parts, the remaining materials and fabrication process were consistent.
Example 10
Comparative example 1, except that the graphene fraction was changed to 0.003, the remaining materials and fabrication process were consistent.
Example 11
In comparative example 1, except that the graphene part was changed to 0.0035 parts, the remaining materials and the manufacturing process were consistent.
Example 12
In comparative example 1, except that the graphene part was changed to 0.004 part, the remaining materials and the manufacturing process were consistent.
Example 13
In comparative example 1, except that the graphene part was changed to 0.0045 parts, the rest materials and the manufacturing process were consistent.
Example 14
Comparative example 1, except that the graphene part was changed to 0.005 part, the remaining materials and the fabrication process were consistent.
Examples of the selection of other components are as follows:
example 15:
weighing 100 parts of aeolian sand with the roundness and the sphericity of 0.8 and 100-150 meshes; weighing 4 parts of gel solvent and 8 parts of carboxyl-terminated liquid nitrile rubber, wherein 3 parts of bisphenol F epoxy resin, 0.04 part of 1, 4-butanediol diglycidyl ether (aliphatic epoxy resin), 0.004 part of silane, 0.902 part of polyamide and 0.002 part of graphene dispersion liquid are contained in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 50 minutes at 120 ℃ for curing and forming, and demoulding is carried out at room temperature.
Example 16:
100 parts of 120-mesh vitrified microbead with roundness and sphericity of 0.8 are weighed, 8 parts of gel solvent, 9 parts of diisononyl phthalate (DINP), 5.6 parts of 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester (alicyclic epoxy resin), 0.16 part of 1, 6-hexanediol diglycidyl ether (aliphatic epoxy resin), 0.012 part of silane, 0.004 part of graphene dispersion liquid and 2.24 parts of mixed solution of isophorone diamine and p-phenylenediamine are weighed in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 50 minutes at 150 ℃ for curing and forming, and demoulding is carried out at room temperature.
Example 17:
weighing 100 parts of aeolian sand with roundness and sphericity of 0.75 and 100-120 meshes; weighing 4 parts of gel solvent, 8 parts of carboxyl-terminated liquid nitrile rubber, 3 parts of 4, 5-epoxy tetrahydrophthalic acid diglycidyl ester, 0.04 part of 1, 4-butanediol diglycidyl ether (aliphatic epoxy resin), 0.004 part of silane, 0.902 part of 1.3-cyclohexyldimethylamine and 0.002 part of graphene dispersion liquid in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 50 minutes at 120 ℃ for curing and forming, and demoulding is carried out at room temperature.
Example 18:
weighing 100 parts of aeolian sand with roundness and sphericity of 0.75 and 100-120 meshes; weighing 5 parts of a gel solvent, 6 parts of hydroxyl-terminated liquid nitrile rubber, 3.75 parts of 4, 5-epoxy tetrahydrophthalic acid diglycidyl ester, 0.05 part of 1, 4-butanediol diglycidyl ether (aliphatic epoxy resin), 0.005 part of silane, 0.6275 parts of 13-cyclohexyldimethylamine, 0.5 part of m-xylylenediamine and 0.0025 part of graphene dispersion liquid in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 50 minutes at the temperature of 140 ℃ for curing and forming, and the mould is demoulded at room temperature.
Example 19:
100 parts of 100-mesh vitrified microbead with roundness and sphericity of 0.8 are weighed, 8 parts of gel solvent, 7 parts of Butyl Benzyl Phthalate (BBP), 5.6 parts of 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester (alicyclic epoxy resin), 0.16 part of 1, 6-hexanediol diglycidyl ether (aliphatic epoxy resin), 0.012 part of silane, 0.004 part of graphene dispersion liquid and 2.24 parts of diaminodiphenylmethane are weighed in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 60 minutes at 150 ℃ for curing and forming, and demoulding is carried out at room temperature.
Example 20:
weighing 100 parts of aeolian sand with roundness and sphericity of 0.75 and 100-120 meshes; weighing 5 parts of a gel solvent, namely di-n-butyl phthalate (DBP), wherein 3.75 parts of 4, 5-epoxy tetrahydrophthalic acid diglycidyl ester, 0.05 part of 1, 4-butanediol diglycidyl ether (aliphatic epoxy resin), 0.005 part of silane, 0.6275 parts of aminoethyl piperazine, 0.5 part of m-xylylenediamine and 0.0025 part of graphene dispersion liquid in the gel solvent.
Firstly, fully and uniformly mixing a gel solvent in a gel mixer; then pouring the gel solvent into a mixer to be uniformly stirred with the aggregate particles; then placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and thickness of the die; the mould horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mould after the mould passes through the hopper; then the mould is used for beating and vibrating the particle mixture to be compact through a beating and vibrating forming mechanism; then the mould is baked for 50 minutes at the temperature of 140 ℃ for curing and forming, and the mould is demoulded at room temperature.
The tests carried out on the above examples 1 to 14 gave the following results:
FIG. 1 is a DSC curve of different resin flexibilizer contents, and in example 9, no flexibilizer is added, and no melting peak is observed in the DSC curve, but a decomposition peak appears at 300 ℃. The melting temperature of the gel solvent is gradually reduced along with the increase of the content of the resin flexibilizer, which shows that the low-melting-temperature thermosetting adhesive with different melting temperatures can be obtained by adjusting the content of the resin flexibilizer, and further the low-melting-temperature particle sound-absorbing board with different melting temperatures can be obtained.
Fig. 2 shows the bending strength curve of the low-melting temperature particulate acoustic panel with different resin flexibilizer contents, the bending strength of the particulate acoustic panel is the greatest when no resin flexibilizer is added in example 9, and the mechanical properties of the particulate acoustic panel are reduced as the content of the resin flexibilizer is increased.
Fig. 3 is a curve of the bending strength of the low-melting-temperature particle sound-absorbing panel with different graphene contents, and the curve can be obtained, and along with the increase of the graphene contents, the bending strength of the low-melting-point fire-fighting module sound-absorbing panel is increased and then reduced, because the excessive graphene contents cause sheet agglomeration, the dispersion in a gelling solvent is further influenced, and the strength is finally reduced.
The tests carried out on the above examples 15-20, the low-melting-temperature thermosetting binder obtained, and the particulate acoustic panel produced from the low-melting-temperature thermosetting binder meet the technical requirements of the present invention.
The above examples are intended to be illustrative of possible embodiments of the invention and are not intended to limit the scope of the invention, which is intended to be covered by the claims unless the invention is modified or practiced in a manner that is equivalent to the practice of the invention or otherwise applied to a fire fighting environment other than that of the converter, but which is also intended to meet the fire fighting requirements.

Claims (10)

1. A particulate acoustical panel made from a thermosetting binder includes aggregate particles, a gel solvent, and a resin flexibilizing agent.
2. The particulate acoustic panel according to claim 1, wherein the aggregate particles are selected from one or more of aeolian sand, machine-made sand, pumice, glass beads, vitrified beads and slag.
3. The particulate sound absorbing panel as claimed in claim 2, wherein the aggregate particles have a roundness and sphericity of 0.7 or more.
4. The particulate sound-absorbing panel as claimed in any one of claims 1 to 3, wherein the aggregate particles have a particle size of 80 mesh or more.
5. The particulate acoustic panel according to claim 1, wherein the gel solvent is contained in an amount of 4 to 10% by weight based on the weight of the aggregate particles.
6. The particulate acoustic panel according to claim 1 or 2, wherein the resin flexibilizing agent is 2 to 9% by weight of the aggregate particles.
7. The use of a thermosetting binder to prepare acoustical panels comprising particles in enclosed spaces.
8. Use of a particle sound absorber as claimed IN claim 7 for acoustic barriers IN an enclosed space, said enclosed space being an enclosed space formed by acoustic barriers of a BOX-IN a converter station.
9. A method for manufacturing a particulate sound-absorbing panel according to claim 1, the particulate sound-absorbing panel comprising aggregate particles, a gel solvent and a resin flexibilizing agent, the method comprising the steps of:
firstly, fully and uniformly mixing a gel solvent in a gel mixer;
secondly, introducing the uniformly mixed gel solvent obtained in the first step into a mixer, and uniformly stirring the gel solvent and the aggregate particles;
thirdly, placing the mixture in a distribution hopper, wherein the outlet of the distribution hopper is matched with the width and the thickness of the die;
fourthly, the mold horizontally and continuously passes below the hopper through the conveying mechanism, and a layer of particle mixture is uniformly distributed at each part in the mold after the mold passes through the hopper;
fifthly, the mould performs beat vibration on the particle mixture to compact through a beat vibration forming mechanism;
and sixthly, baking the die for 50-70 minutes at 120-170 ℃ for curing and forming, and demolding at room temperature.
10. The manufacturing method as claimed in claim 9, wherein the graphene or graphene oxide is uniformly dispersed in the solvent in a preparation step prior to the first step.
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CN202010110571.6A CN111139011A (en) 2020-03-20 2020-03-20 Thermosetting binder with low melting temperature
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