CN112430013A - High-molecular two-component high-temperature-resistant heat-insulating material and application thereof - Google Patents
High-molecular two-component high-temperature-resistant heat-insulating material and application thereof Download PDFInfo
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- CN112430013A CN112430013A CN202011152496.6A CN202011152496A CN112430013A CN 112430013 A CN112430013 A CN 112430013A CN 202011152496 A CN202011152496 A CN 202011152496A CN 112430013 A CN112430013 A CN 112430013A
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- 239000011810 insulating material Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 78
- 239000011347 resin Substances 0.000 claims abstract description 78
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000011324 bead Substances 0.000 claims abstract description 53
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000011521 glass Substances 0.000 claims abstract description 50
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 35
- 239000002270 dispersing agent Substances 0.000 claims abstract description 35
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 32
- 238000002156 mixing Methods 0.000 claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 230000003712 anti-aging effect Effects 0.000 claims abstract description 27
- 238000009413 insulation Methods 0.000 claims abstract description 27
- 229920001709 polysilazane Polymers 0.000 claims abstract description 26
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 26
- 239000004964 aerogel Substances 0.000 claims abstract description 24
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 238000004134 energy conservation Methods 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 50
- 239000007788 liquid Substances 0.000 claims description 22
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 22
- 239000012774 insulation material Substances 0.000 claims description 12
- 239000004952 Polyamide Substances 0.000 claims description 10
- 239000004965 Silica aerogel Substances 0.000 claims description 10
- 229920002647 polyamide Polymers 0.000 claims description 10
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 claims description 9
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical group NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 3
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 claims description 3
- 229960001124 trientine Drugs 0.000 claims description 3
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical compound C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 16
- 239000002131 composite material Substances 0.000 abstract description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000004005 microsphere Substances 0.000 description 8
- 238000004321 preservation Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910018557 Si O Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000004794 expanded polystyrene Substances 0.000 description 2
- 239000004795 extruded polystyrene foam Substances 0.000 description 2
- 229920000592 inorganic polymer Polymers 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
- C04B26/32—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00431—Refractory materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/30—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values
- C04B2201/32—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values for the thermal conductivity, e.g. K-factors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/50—Mortars, concrete or artificial stone characterised by specific physical values for the mechanical strength
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
Abstract
The invention discloses a high-molecular two-component high-temperature-resistant heat-insulating material and application thereof, wherein the high-molecular two-component high-temperature-resistant heat-insulating material comprises the following raw materials in parts by weight: 30-50 parts of silicon dioxide aerogel, 15-25 parts of organic silicon modified epoxy resin, 1-5 parts of polysilazane resin, 6-10 parts of glass beads, 0.1-1 part of silicon carbide micro powder, 3-7 parts of silane coupling agent, 3-7 parts of dispersing agent, 4-10 parts of curing agent and 1-3 parts of anti-aging agent. According to the invention, the silicon carbide micro powder is modified and matched with the organic silicon resin, so that the mechanical strength of the material can be increased; the polysilazane resin is matched with the glass beads, so that the heat insulation performance of the composite material can be improved. The heat-insulating board prepared by mixing other raw materials and the silicon dioxide aerogel can resist high temperature and has good heat-insulating property, and the mechanical property of the heat-insulating material can be improved, so that the heat-insulating board can be widely applied to energy conservation and heat insulation of buildings.
Description
Technical Field
The invention relates to the technical field of heat insulation materials, in particular to a high-molecular two-component high-temperature-resistant heat insulation material and application thereof.
Background
The external wall insulation board in China probably has several types of polystyrene foam plastic boards, gypsum boards, cement boards and expanded perlite boards, the several types of insulation boards have advantages, but the functions are single, and the performance requirements of a building envelope structure cannot be completely met, so that the existing composite material insulation board is more emphasized and is rapidly developed, the composite material insulation board is a novel external wall insulation board and has multidirectional excellent performance, but the technical development is not too mature relatively, the manufacturing process is complex and diverse, and the performance is not stable enough. Currently, the popular exterior wall insulation boards are mainly formed by EPS (expanded polystyrene foam), XPS (extruded polystyrene foam), PUR (rigid polyurethane foam), PIR (rigid polyisocyanate foam), and the like. The main disadvantages of these materials are flammability (although partly nonflammable, but also high smoke generation), toxicity of the gas and extreme hazard to human body. And the raw materials are mainly high-carbon, non-renewable and recyclable petrochemical materials, and the price is high.
The efficient heat-insulating property of the silica aerogel is expected to greatly reduce the loss of energy, especially in the building industry and the thermal industry, the application of the silica aerogel heat-insulating material is expected to greatly reduce the loss in the air conditioner energy consumption and the heat transmission process of a building, and the silica aerogel has good hydrophobic property, heat resistance and corrosion resistance, so that the silica aerogel becomes a heat-insulating material with the best development prospect. Patent with application number 201810188206.X discloses a high-performance insulation board, which takes silicon dioxide aerogel as a main raw material, but the prepared insulation board has lower mechanical property and lower high-temperature resistance. Therefore, a high-temperature resistant heat insulation material is needed, which uses silica aerogel as a main raw material and has the advantages of low thermal conductivity, good mechanical properties, excellent temperature resistance and the like.
Disclosure of Invention
Aiming at the prior art, the invention aims to provide a high-molecular two-component high-temperature-resistant heat-insulating material and application thereof. On the premise of keeping the heat preservation property, the high temperature resistance of the heat preservation material is further enhanced, the mechanical property of the heat preservation material is improved, and the service life of the heat preservation material is prolonged.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a high-molecular two-component high-temperature-resistant heat-insulating material, which comprises the following raw materials in parts by weight:
30-50 parts of silicon dioxide aerogel, 15-25 parts of organic silicon modified epoxy resin, 1-5 parts of polysilazane resin, 6-10 parts of glass beads, 0.1-1 part of silicon carbide micro powder, 3-7 parts of silane coupling agent, 3-7 parts of dispersing agent, 4-10 parts of curing agent and 1-3 parts of anti-aging agent.
Preferably, the particle size of the silicon dioxide aerogel is 10-20nm, and the bulk density is 40-60kg/m3(ii) a The glass beads have a particle size of 20-50 μm and a bulk density of 100-3。
Preferably, the silane coupling agent is one of gamma-methacryloxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane or vinyltrichlorosilane.
Preferably, the fineness of the silicon carbide micro powder is 1500 meshes.
Preferably, the anti-aging agent is one or more of DPPD, CPPD or 4010 NA.
Preferably, the curing agent is triethylene tetramine or polyamide.
The second aspect of the present invention provides a preparation method of the polymer two-component high temperature resistant insulation material, which comprises the following steps:
(1) uniformly mixing silicon carbide micro powder with a silane coupling agent accounting for 10-20% of the mass fraction of the silicon carbide micro powder, and drying to obtain modified silicon carbide; uniformly mixing the glass beads with 1 part of silane coupling agent to obtain modified glass beads;
(2) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, and adding the modified silicon carbide and the modified glass beads obtained in the step (1) for ultrasonic dispersion; adding silica aerogel beads and the rest of silane coupling agent, and continuing to perform ultrasonic dispersion to obtain a resin thick liquid;
(3) sequentially adding an anti-aging agent and a dispersing agent into the thick resin liquid, heating and stirring until the anti-aging agent and the dispersing agent are completely dissolved, adding a curing agent, and stirring at 60-70 ℃ to obtain heat-insulating resin;
(4) and (3) putting the heat-insulating resin into a mould, and curing at constant temperature to obtain the high-performance heat-insulating board.
Preferably, in step (1), the temperature for drying is 70 ℃.
Preferably, in the step (4), the temperature of the constant-temperature curing is 160 ℃, and the time is 20-40 min.
In a third aspect of the invention, the high-temperature-resistant insulation board prepared by the preparation method is provided.
The fourth aspect of the invention provides an application of the high-temperature-resistant heat-preservation plate in building energy conservation and heat preservation.
The heat insulating material of the present invention may be also produced into heat insulating structure in different shapes based on the shape and use occasion of building.
The invention has the beneficial effects that:
(1) the invention mixes the organic silicon modified resin with the polysilazane resin, the organic silicon resin is an element organic resin, and the bond energy of Si-O bond in the main chain is 452kJ/mol, which is far more than 356kJ/mol of the bond energy of C-C bond, so the invention has the advantages of excellent insulativity, good high temperature resistance and waterproofness, excellent weatherability, etc. Polysilazane resins are inorganic polymers having a main chain of Si — N, and can be converted into SiCN, SiCNO or silica ceramics under high temperature conditions due to the particularity of their chemical structures. The polysilazane resin is matched with the glass beads, so that the heat insulation performance of the composite material can be improved.
(2) According to the invention, the modified silicon carbide micro powder is added into the filler and is matched with the organic silicon resin, so that the mechanical strength of the material can be increased, and meanwhile, the high-temperature resistance of the composite material can be improved. The material of the invention can be applied to high-temperature places, and the application range of the material is expanded.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
As described in the background section, the existing foamed thermal insulation materials require the addition of a large amount of foaming agent, which is harmful to the environment and human body. The thermal insulation material using the silica aerogel as the main raw material has poor mechanical property and poor high temperature resistance. The thermal insulation material using silica aerogel as the main raw material needs to be continuously studied, so that the thermal insulation material can be more widely applied.
Based on the above, the invention aims to provide a high-molecular two-component high-temperature-resistant heat-insulating material. The organic silicon resin is an element organic resin, and has the advantages of excellent insulation, good high temperature resistance and water resistance, excellent weather resistance and the like because the bond energy of Si-O bonds in the main chain is 452kJ/mol and is far greater than the bond energy of C-C bonds 356 kJ/mol. Polysilazane resins are inorganic polymers having a main chain of Si — N, and can be converted into SiCN, SiCNO or silica ceramics under high temperature conditions due to the particularity of their chemical structures. The polysilazane resin is matched with the glass beads, so that the heat insulation performance of the composite material can be improved. The silicon carbide micro powder can improve the overall strength of the material. After the silicon carbide micro powder is added into the organic silicon resin, the tensile strength and toughness of the material are improved, and a certain impact load is borne, so that the wear resistance of the composite material is obviously improved. Meanwhile, the modified silicon carbide micropowder can improve the high-temperature resistance of the composite material.
Although the silicon carbide has high stability, the heat conductivity coefficient is also high, and too much addition can influence the heat insulation performance of the heat insulation material and improve the heat conductivity coefficient of the material. Through research and invention, when the addition amount of the silicon carbide micro powder is 0.1-1 part, the influence on the heat insulation performance of the material is small, and the mechanical performance of the material is greatly improved. Meanwhile, the inventor also researches the addition of the coupling agent, and when the silicon carbide micro powder is modified, the heat insulation performance and the mechanical performance of the material can reach better values when the use amount of the coupling agent accounts for 10-20% of the mass fraction of the silicon carbide micro powder.
In order to make the technical solutions of the present application more clearly understood by those skilled in the art, the technical solutions of the present application will be described in detail below with reference to specific embodiments.
The test materials used in the examples of the present invention are all conventional in the art and commercially available.
Description of the drawings: the organic silicon modified epoxy resin SH-9607 is purchased from limited amount of chemical industry in the New four seas in Hubei.
Polysilazane resin (IOTA OPSZ 1800) was purchased from yota silicone oil limited, ibian.
Dispersant BYK-110 is a product of Bike, Germany, and is available from Bofeng chemical Co., Ltd, Dongguan.
Silicon carbide micropowder 1500# was purchased from Zhengzhou mountain river abrasives Ltd.
Example 1
(1) 30kg of silicon dioxide aerogel, 25kg of organic silicon modified epoxy resin, 1kg of polysilazane resin, 10kg of glass microspheres, 0.2kg of silicon carbide micropowder, 3kg of vinyl trichloro-silicon, 7kg of dispersing agent, 4kg of triethylene tetramine and 1kg of DPPD are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.02kg of silane coupling agent, and drying at 70 ℃ for 2h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing organic silicon modified epoxy resin and polysilazane resin, stirring at 400r/min for 5min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 20 min; adding silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 0.5h at the ultrasonic frequency of 2000Hz to obtain a resin thick liquid;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at 60 ℃ at 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at 70 ℃ at 2000r/min for 30min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 20min at 160 ℃ to obtain the high-performance heat-insulating plate.
Example 2
(1) 50kg of silicon dioxide aerogel, 15kg of organic silicon modified epoxy resin, 5kg of polysilazane resin, 6kg of glass microspheres, 1kg of silicon carbide micro powder, 7kg of 3-aminopropyltriethoxysilane, 3kg of dispersing agent, 10kg of polyamide, 1.5kg of CPPD and 4010NA1.5kg are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.2kg of silane coupling agent, and drying at 70 ℃ for 4h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 40 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing to perform ultrasonic dispersion for 1h at the frequency of 2000Hz to obtain a resin thick liquid;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at 60 ℃ at 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at 70 ℃ at 2000r/min for 30min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 40min at 160 ℃ to obtain the high-performance heat-insulating plate.
Example 3
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 3kg of polysilazane resin, 8kg of glass microspheres, 0.6kg of silicon carbide micro powder, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 4010NA1.0kg of epoxy resin are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.09kg of silane coupling agent, and drying at 70 ℃ for 3h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at 60 ℃ at 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at 70 ℃ at 2000r/min for 30min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 1
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 8kg of glass beads, 0.6kg of silicon carbide micro powder, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 4010NA1.0kg of silicon carbide micro powder are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.09kg of silane coupling agent, and drying at 70 ℃ for 3h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and 3kg of deionized water uniformly, stirring for 5min at a speed of 400r/min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 2
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 3kg of polysilazane resin, 8kg of glass microspheres, 0.6kg of silicon carbide micro powder, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 4010NA1.0kg of epoxy resin are weighed.
(2) Uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified glass beads and the silicon carbide micro powder obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 3
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 3kg of polysilazane resin, 8kg of glass microspheres, 0.6kg of silicon carbide micro powder, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 4010NA1.0kg of epoxy resin are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.03kg of silane coupling agent, and drying at 70 ℃ for 3h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 4
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 3kg of polysilazane resin, 8kg of glass microspheres, 0.6kg of silicon carbide micro powder, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 4010NA1.0kg of epoxy resin are weighed.
(2) Uniformly mixing silicon carbide micro powder with 0.15kg of silane coupling agent, and drying at 70 ℃ for 3h to obtain modified silicon carbide for later use; uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified silicon carbide and the modified glass beads obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 5
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 8kg of glass microsphere, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPDL and 4010NA1.0kg of epoxy resin are weighed.
(2) Uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and 3kg of deionized water uniformly, stirring for 5min at a speed of 400r/min, adding the modified glass beads obtained in the step (2) and the silicon carbide micro powder, and performing ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Comparative example 6
(1) 40kg of silicon dioxide aerogel, 20kg of organic silicon modified epoxy resin, 3kg of polysilazane resin, 8kg of glass microspheres, 5kg of gamma-methacryloxypropyltrimethoxysilane, 5kg of dispersing agent, 8kg of polyamide, 1.0kg of CPPD and 1.0kg of 4010NA1.0kg of polysiloxane are weighed.
(2) Uniformly mixing the glass beads with 1kg of silane coupling agent to obtain modified glass beads;
(3) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, stirring at 400r/min for 5min, adding the modified glass beads and the silicon carbide micro powder obtained in the step (2) for ultrasonic dispersion at an ultrasonic frequency of 2000Hz for 30 min; adding the silicon dioxide aerogel beads and the rest silane coupling agent, stirring at 800r/min for 5min, continuing ultrasonic dispersion for 45min, and obtaining resin thick liquid at the frequency of 2000 Hz;
(4) sequentially adding the anti-aging agent and the dispersing agent into the thick resin liquid, stirring at the temperature of 60-70 ℃ for 2000r/min until the anti-aging agent and the dispersing agent are completely dissolved, adding the curing agent, and stirring at the temperature of 60-70 ℃ for 30min at 2000r/min to obtain heat-insulating resin;
(5) and (3) putting the heat-insulating resin into a mould, and curing for 30min at 160 ℃ to obtain the high-performance heat-insulating plate.
Test examples
The performance of the insulation boards prepared in examples 1-3 and comparative examples 1-6 was tested. The results are shown in Table 1.
TABLE 1
As can be seen from Table 1, the insulation board prepared in the embodiment 3 has the best performance, and the insulation board prepared by the method is higher than comparative examples 1-6 in the aspects of heat insulation performance, temperature resistance, tensile strength and compressive strength. The heat insulation board provided by the invention has excellent high temperature resistance, and can be widely applied to the field of high temperature resistance heat insulation.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A high-molecular two-component high-temperature-resistant heat-insulating material is characterized by comprising the following raw materials in parts by weight:
30-50 parts of silicon dioxide aerogel, 15-25 parts of organic silicon modified epoxy resin, 1-5 parts of polysilazane resin, 6-10 parts of glass beads, 0.1-1 part of silicon carbide micro powder, 3-7 parts of silane coupling agent, 3-7 parts of dispersing agent, 4-10 parts of curing agent and 1-3 parts of anti-aging agent.
2. The polymer two-component high-temperature-resistant heat-insulating material as claimed in claim 1, wherein the silica aerogel has a particle size of 10-20nm and a bulk density of 40-60kg/m3(ii) a The glass beads have a particle size of 20-50 μm and a bulk density of 100-3。
3. The polymer two-component high-temperature-resistant heat-insulating material as claimed in claim 1, wherein the silane coupling agent is one of gamma-methacryloxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane or vinyltrichlorosilane.
4. The high molecular two-component high temperature resistant heat insulation material as claimed in claim 1, wherein the fineness of the silicon carbide micro powder is 1500 meshes.
5. The high molecular two-component high temperature resistant heat insulation material according to claim 1, wherein the anti-aging agent is one or more of DPPD, CPPD or 4010 NA.
6. The high molecular two-component high temperature resistant heat insulating material according to claim 1, wherein the curing agent is triethylene tetramine or polyamide.
7. The method for preparing the heat insulation board by using the high molecular two-component high temperature resistant heat insulation material as claimed in any one of claims 1 to 6 is characterized by comprising the following steps:
(1) uniformly mixing silicon carbide micro powder with a silane coupling agent accounting for 10-20% of the mass fraction of the silicon carbide micro powder, and drying to obtain modified silicon carbide; uniformly mixing the glass beads with 1 part of silane coupling agent to obtain modified glass beads;
(2) mixing and stirring the organic silicon modified epoxy resin and the polysilazane resin uniformly, and adding the modified silicon carbide and the modified glass beads obtained in the step (1) for ultrasonic dispersion; adding silica aerogel beads and the rest of silane coupling agent, and continuing to perform ultrasonic dispersion to obtain a resin thick liquid;
(3) sequentially adding an anti-aging agent and a dispersing agent into the thick resin liquid, heating and stirring until the anti-aging agent and the dispersing agent are completely dissolved, adding a curing agent, and stirring at 60-70 ℃ to obtain heat-insulating resin;
(4) and (3) putting the heat-insulating resin into a mould, and curing at constant temperature to obtain the high-performance heat-insulating board.
8. The preparation method of claim 7, wherein the constant-temperature curing temperature is 160 ℃ and the time is 20-40 min.
9. A high temperature resistant insulation board prepared by the preparation method of claim 7 or 8.
10. The use of the high temperature resistant insulation panel of claim 9 in building energy conservation and insulation.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114044647A (en) * | 2021-10-30 | 2022-02-15 | 万华建筑科技有限公司 | Preparation process of A2-grade nano inorganic insulation board |
| CN117229038A (en) * | 2023-10-27 | 2023-12-15 | 佛山市陶莹新型材料有限公司 | Foamed ceramic heat insulation material, preparation method thereof and product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180065892A1 (en) * | 2015-04-10 | 2018-03-08 | Evonik Degussa Gmbh | Method for producing a molded heat-insulating element |
| CN108178559A (en) * | 2018-03-07 | 2018-06-19 | 吴斌成 | A kind of high-performance thermal insulation board |
| CN110373108A (en) * | 2018-04-13 | 2019-10-25 | 中国科学院化学研究所 | A kind of high-temperature insulation coating and its preparation method and application |
-
2020
- 2020-10-26 CN CN202011152496.6A patent/CN112430013A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180065892A1 (en) * | 2015-04-10 | 2018-03-08 | Evonik Degussa Gmbh | Method for producing a molded heat-insulating element |
| CN108178559A (en) * | 2018-03-07 | 2018-06-19 | 吴斌成 | A kind of high-performance thermal insulation board |
| CN110373108A (en) * | 2018-04-13 | 2019-10-25 | 中国科学院化学研究所 | A kind of high-temperature insulation coating and its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 舒友: "《涂料配方设计与制备》", 31 August 2014, 西南交通大学出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114044647A (en) * | 2021-10-30 | 2022-02-15 | 万华建筑科技有限公司 | Preparation process of A2-grade nano inorganic insulation board |
| CN117229038A (en) * | 2023-10-27 | 2023-12-15 | 佛山市陶莹新型材料有限公司 | Foamed ceramic heat insulation material, preparation method thereof and product |
| CN117229038B (en) * | 2023-10-27 | 2024-03-12 | 佛山市陶莹新型材料有限公司 | Foamed ceramic heat insulation material, preparation method thereof and product |
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