CN111558896B - Wafer protection mechanism, device and method - Google Patents

Wafer protection mechanism, device and method Download PDF

Info

Publication number
CN111558896B
CN111558896B CN202010700098.7A CN202010700098A CN111558896B CN 111558896 B CN111558896 B CN 111558896B CN 202010700098 A CN202010700098 A CN 202010700098A CN 111558896 B CN111558896 B CN 111558896B
Authority
CN
China
Prior art keywords
shaft assembly
drive shaft
wafer protection
driving shaft
protection mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010700098.7A
Other languages
Chinese (zh)
Other versions
CN111558896A (en
Inventor
王建新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202010700098.7A priority Critical patent/CN111558896B/en
Publication of CN111558896A publication Critical patent/CN111558896A/en
Application granted granted Critical
Publication of CN111558896B publication Critical patent/CN111558896B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The embodiment of the invention discloses a wafer protection mechanism, a device and a method; the mechanism may include: the clutch device comprises a first driving motor, a first driving shaft assembly, a second driving shaft assembly and a clutch device; wherein the first drive shaft assembly is connected with the first drive motor, and the clutch device is arranged at the connection of the first drive shaft assembly and the second drive shaft assembly to joint or separate the first drive shaft assembly and the second drive shaft assembly; the clutch device separates the first driving shaft assembly from the second driving shaft assembly under the set torque moment; the set torque moment is used for representing the wafer breakage or slip-out state.

Description

Wafer protection mechanism, device and method
Technical Field
The embodiment of the invention relates to a wafer processing technology, in particular to a wafer protection mechanism, a device and a method.
Background
In the wafer processing procedure, after a crystal bar or a silicon ingot produced by a crystal pulling process is cut to obtain a wafer, in order to reduce the phenomena of damage, contamination of impurities, thickness deviation or fluctuation and the like of the surface of the wafer caused by cutting, the cut wafer is usually subjected to the procedures of grinding, polishing and the like, and the operations of grinding, polishing and the like are carried out, so that the damage and the impurities of the surface of the wafer can be reduced, and the unevenness or the fluctuation of the surface of the wafer can be eliminated, so that the flatness can be improved.
Since the thickness of the wafer is very thin, the wafer is easily damaged or slipped out during the process of improving the flatness by grinding or polishing, and if the above phenomenon cannot be found in time during the process of processing and the flatness improving operation such as grinding or polishing is stopped, the device for improving the flatness operation such as a grinding device or a polishing device is easily damaged. In order to avoid the above problems, it is necessary to detect the breakage or slip of the wafer during the flatness improvement operation.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a wafer protection mechanism, apparatus and method; the damage or the roll-off condition of the wafer can be detected in the operation process of improving the flatness, the operation of improving the flatness is stopped in time, the device for improving the flatness operation is protected, and the service life of the device for improving the flatness operation is prolonged.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a wafer protection mechanism, where the mechanism includes: the clutch device comprises a first driving motor, a first driving shaft assembly, a second driving shaft assembly and a clutch device; wherein the first drive shaft assembly is connected with the first drive motor, and the clutch device is arranged at the connection of the first drive shaft assembly and the second drive shaft assembly to joint or separate the first drive shaft assembly and the second drive shaft assembly; the clutch device separates the first driving shaft assembly from the second driving shaft assembly under the set torque moment; the set torque moment is used for representing the wafer breakage or slip-out state.
In a second aspect, an embodiment of the present invention provides a wafer protection device, where the device includes: plummer, processing head, rigid body pivot, second driving motor and first aspect wafer protection mechanism, wherein, the plummer with second drive axle subassembly rigid connection in the mechanism subassembly, the processing head passes through rigid body pivot with second drive motor rigid connection, first driving motor driven rotatory direction in the mechanism subassembly with the same but rotation rate difference of direction that second driving motor driven rotatory realizes the plummer with processing head relative motion.
In a third aspect, an embodiment of the present invention provides a wafer protection device, where the device includes: plummer, processing head, rigid body pivot, second driving motor and first aspect wafer protection mechanism, wherein, the processing head with second drive axle subassembly rigid connection in the mechanism subassembly, the plummer passes through the rigid body pivot with second drive motor rigid connection, first driving motor in the mechanism subassembly driven rotatory direction with the same but rotation rate difference of direction that second driving motor driven rotatory realizes the plummer with processing head relative motion.
In a fourth aspect, an embodiment of the present invention provides a wafer protection method, where the method is applied to the apparatus in the second aspect or the third aspect, and the method includes:
rigidly connecting a second driving shaft assembly in the wafer protection mechanism assembly with a bearing table or a processing head;
a first driving motor in the mechanism assembly drives a first driving shaft assembly in the mechanism assembly to rotate around a shaft through rigid connection; the rotation direction of the first driving motor is the same as that of a second driving motor in the wafer protection device, and the rotation speed of the first driving motor is different from that of the second driving motor;
a second driving shaft assembly and a first driving shaft assembly in the mechanism assembly are connected through a clutch device in the mechanism assembly, and the rotation of the first driving shaft assembly is transmitted to the second driving shaft assembly, so that the first driving shaft assembly and the second driving shaft assembly can rotate as a whole, and the bearing table or the processing head is driven to rotate;
the clutch separates the first drive shaft assembly from the second drive shaft assembly at a set torque to prevent the transmission of the rotation of the first drive shaft assembly to the second drive shaft assembly, which stops rotating.
The embodiment of the invention provides a wafer protection mechanism, a device and a method; when the mechanism is used, the second drive shaft assembly is rigidly connected with the bearing table or the processing head, so that when the first drive motor drives the first drive shaft assembly to rotate around the shaft through rigid connection, the rotation of the first drive shaft assembly can be transmitted to the second drive shaft assembly corresponding to the connection of the second drive shaft assembly and the first drive shaft assembly through the clutch device, so that the first drive shaft assembly and the second drive shaft assembly can rotate as a whole to drive the bearing table or the processing head to rotate; the clutch device separates the first drive shaft assembly and the second drive shaft assembly corresponding to the set torque moment, so that the rotation of the first drive shaft assembly can be prevented from being transmitted to the second drive shaft assembly, and the second drive shaft assembly stops rotating, so that the grinding or polishing process can be stopped in time under the condition that the wafer is damaged or slides out.
Drawings
FIG. 1 is a schematic diagram illustrating a wafer protection apparatus according to a conventional embodiment;
FIG. 2 is a schematic diagram illustrating a wafer protection mechanism according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another wafer protection mechanism according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a wafer protection device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating the relationship between torque and cylinder air pressure provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram of another wafer protection apparatus according to an embodiment of the present invention;
fig. 7 is a schematic flow chart illustrating a wafer protection method according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
The terms of orientation of up, down, left, right, front, back, top, bottom, and the like referred to or may be referred to in this specification are defined relative to the configuration shown in the drawings, and are relative terms, and thus may be changed correspondingly according to the position and the use state of the device. Therefore, these and other directional terms should not be construed as limiting terms.
At present, the wafer production and processing procedure mainly includes the main steps of crystal bar growth, crystal bar cutting and outer diameter grinding, crystal bar slicing to obtain wafers, wafer surface grinding, polishing, cleaning and the like, and the wafers after being cleaned can be packaged and delivered from a factory for chip manufacturing after being inspected. In order to reduce damage to the wafer surface, reduce impurities on the wafer surface, and improve the flatness and planarity of the wafer surface, the wafer obtained through the dicing process usually employs a grinding and polishing process. Specifically, the grinding process is a finishing process of the surface of the wafer by using abrasive particles coated or pressed on a grinder and by a relative motion of the grinder and the wafer under a certain pressure; polishing, a Chemical Mechanical Polishing (CMP) process, is commonly used, in which a wafer is rotated relative to a Polishing pad in the presence of a Polishing slurry, and a certain pressure is applied to complete Polishing by the combined action of Mechanical grinding and Chemical etching. It can be seen from the above that, the grinding and polishing processes both utilize relative motion to process the surface of the wafer under a certain pressure condition, and both processes can improve the flatness of the wafer, and with reference to the common points and similarities between the grinding apparatus and the polishing apparatus in the process operation, see fig. 1, which shows an apparatus 1 for improving the flatness of the wafer, which can be applied to both the grinding process performed by the grinding apparatus and the polishing operation performed by the polishing apparatus in the conventional technical solution, the apparatus 1 may include: the machining device comprises a bearing table A11 and a machining head A12, wherein the bearing table A11 is rigidly connected with a driving motor A14 through a rigid body rotating shaft A13, the machining head A12 is rigidly connected with a driving motor B16 through a rigid body rotating shaft B15, and the driving motor A14 and the driving motor B16 are driven to rotate in the same direction but at different rotating speeds so as to realize relative movement of the bearing table A11 and the machining head A12, as shown by arrows in FIG. 1.
It should be noted that, during the grinding process or the polishing process, the carrier a 11 is used to contact the surface to be processed of the wafer, and a retaining ring (shown in black) is disposed below the processing head a 12 to accommodate the wafer and keep the wafer in position, so that the wafer does not move or slide during the grinding or polishing process. Therefore, the carrier a 11 may be generally referred to as a polishing disk.
With the apparatus 1 shown in fig. 1, when the wafer is accommodated in the retaining ring provided below the processing head a 12, the front surface of the wafer is brought into contact with the susceptor a 11, and the back surface of the wafer is brought into contact with the lower surface of the processing head a 12, whereby the wafer is ground or polished by the above-mentioned relative movement. In some examples, the apparatus 1 can be used to perform a lapping process while the carrier a 11 is coated or pressed with abrasive grains in a portion contacting a wafer. In some examples, the apparatus 1 can be used to perform a polishing operation when the carrier a 11 is covered with a polishing pad at a portion in contact with a wafer and the wafer is subjected to a polishing process using a polishing agent. It should be noted that, since the grinding operation and the polishing operation are both performed under a certain pressure, the wafer may be broken or slipped out during the grinding or polishing process, and after the breakage or slipping occurs, if the processing head a 12 and the carrier a 11 continuously move relatively, the processing head a 12 and the carrier a 11 may be damaged. In order to detect the occurrence of the above phenomenon in time, the related art employs an optical reflection sensor to irradiate a certain point on the processed wafer, and indirectly detect the state of the wafer through the reflected light of the point. However, the scheme has the defects that the sensing area is small, the detection site is fixed, and the slipped wafer cannot be accurately detected when not reaching the detection position point of the optical sensor; also, if the rotational speed is relatively low during polishing, the diffuse reflection due to the debris is even less detectable by the optical sensor when the wafer is broken. Therefore, the related technical scheme cannot directly detect the wafer breakage or slipping-out phenomenon, and the grinding or polishing process cannot be stopped in time when the wafer breakage or slipping-out phenomenon occurs.
Through the process of analyzing the wafer breaking or slipping phenomenon, the following can be found: when the wafer is damaged or slips off during the grinding or polishing process, the friction coefficient of the wafer surface is increased, and then under the same pressure, the friction force is correspondingly increased, so that the rotation speed of the driving motor a 14 or the driving motor B16 is reduced, and the torque moment to be overcome by the driving motor a 14 or the driving motor B16 to maintain the original rotation speed is increased, so that the torque moment feedback current of the driving motor a 14 or the driving motor B16 is increased. Based on the above findings, the embodiment of the invention is expected to detect the wafer breakage or slipping out by the change of the torque, and timely stop the grinding or polishing process based on the change of the torque, so as to protect the wafer and the device for improving the flatness operation, and prolong the service life of the device for improving the flatness operation. For example, as shown in fig. 2, embodiments of the present invention are expected to provide a wafer protection mechanism 2, where the mechanism 2 may be applied to the apparatus 1 shown in fig. 1, and the mechanism may include: a first drive motor 21, a first drive shaft assembly 22, a second drive shaft assembly 23, and a clutch device 24; wherein, the first driving shaft assembly 22 is connected with the first driving motor 21, and the clutch device 24 is arranged at the connection of the first driving shaft assembly 22 and the second driving shaft assembly 23 to join or separate the first driving shaft assembly 22 and the second driving shaft assembly 23; the clutch device 24 separates the first driving shaft assembly 22 from the second driving shaft assembly 23 under the set torque moment; the set torque moment is used for representing the wafer breakage or slip-out state.
Based on the mechanism 2 shown in fig. 2, during the application process, the second driving shaft assembly 23 is usually rigidly connected to the carrier a 11 or the processing head a 12 in the apparatus 1, so that when the first driving motor 21 drives the first driving shaft assembly 22 to rotate around the axis through the rigid connection, the rotation of the first driving shaft assembly 22 can be transmitted to the second driving shaft assembly 23 corresponding to the engagement of the second driving shaft assembly 23 and the first driving shaft assembly 22 by the clutch device 24, so that the first driving shaft assembly 22 and the second driving shaft assembly 23 can rotate as a whole to drive the carrier a 11 or the processing head a 12 to rotate; the clutch device 24 separates the first drive shaft assembly 22 from the second drive shaft assembly 23 corresponding to the set torque, so that the rotation of the first drive shaft assembly 22 is prevented from being transmitted to the second drive shaft assembly 23, and the second drive shaft assembly 23 stops rotating, so that the grinding or polishing process can be stopped in time when the wafer is damaged or slips out.
For the mechanism 2 shown in fig. 2, in some possible implementations, referring to fig. 3, the clutch element 24 comprises a groove 241 and a projection 242, the groove 241 conforming to the projection 242; the groove 241 is disposed at the connecting end of the second driving shaft assembly 23 engaged with the first driving shaft assembly 22, and the protrusion 242 is disposed at the connecting end of the first driving shaft assembly 22 engaged with the second driving shaft assembly 23.
With respect to the clutch 24, specifically, since the groove 241 is matched with the protrusion 242, when the protrusion 242 is inserted into the groove 241, the second driving shaft assembly 23 is engaged with the first driving shaft assembly 22, so that the first driving shaft assembly 22 and the second driving shaft assembly 23 can rotate as a whole. In some examples, the shape of the protrusion 242 is preferably a triangular prism, a round steel ball, a wedge-shaped structure, etc., and the shape of the groove 241 is matched with the shape of the protrusion 242. In addition to the above examples, in the specific implementation process of the embodiment of the present invention, as long as the clutch device can be stably disengaged under a fixed applied force, and some specific pressure can be applied to control the engagement, the mechanical structure that can also adjust the magnitude of the force critical point during disengagement can be applied to the structure of the clutch device 24 shown in fig. 2, and details of the embodiment of the present invention are not repeated.
With the mechanism 2 shown in fig. 2, since the mechanism 2 is applied to the apparatus 1 for improving the flatness of the wafer, it is necessary to provide a certain pressure condition for the grinding or polishing operation to be performed, regardless of the rigid connection between the second drive shaft assembly 23 of the mechanism 2 and the carrier table a 11 or the processing head a 12 of the apparatus 1. In some possible implementations, referring to fig. 3, the mechanism 2 may further include a cylinder 25 disposed at the first drive shaft assembly 22 for providing a set pressure to maintain the engaged state of the clutch 24. Specifically, in conjunction with the clutch device 24 shown in fig. 3, the cylinder 25 may be connected with the protrusion 242, so that the protrusion 242 may be inserted into the groove 241 by pressurization, and under the stable rotation condition, the pressure provided by the cylinder 25 may keep the protrusion 242 in the groove 241, and furthermore, if the torque moment is increased to a certain extent, the pressure provided by the cylinder 25 may not keep the protrusion 242 in the groove 241, the protrusion 242 may slide out of the groove 241, and the sliding-out cylinder 25 may release the provided pressure completely. With the above detailed description, engagement and disengagement of the clutch element 24 is achieved.
In conjunction with fig. 1 to 3, the mechanism 2 shown in fig. 2 or 3 is integrated into the apparatus 1 shown in fig. 1, so as to obtain a wafer protection apparatus 4 according to the embodiment of the present invention shown in fig. 4, where the apparatus 4 may include: first plummer 41, first processing head 42, first rigid body pivot 43, second driving motor 44 and fig. 2 or fig. 3 wafer protection mechanism 2, wherein, first plummer 41 with second driving shaft subassembly 23 rigid connection in the mechanism 2 subassembly, first processing head 42 passes through first rigid body pivot 43 with second driving motor 44 rigid connection, the direction of first driving motor 21 driven rotation in the mechanism 2 subassembly with the direction of second driving motor 44 driven rotation is the same but the rotational speed is different in order to realize first plummer 41 with first processing head 42 relative motion.
In the embodiment of the apparatus 4 shown in fig. 4, a polishing process is taken as an example to make a clear and brief description, and in this particular example, the first carrier 41 may be an abrasive disc. The first machining head 42 may be a grinding head. It is understood that, based on the above-mentioned many similarities between the grinding process and the polishing process, the following specific embodiment of the apparatus 4 can be applied to the grinding process, and the detailed description of the embodiment of the present invention is omitted here.
As shown in fig. 4, the first carrier 41 is rigidly connected to the second drive shaft assembly 23 of the assembly of the mechanism 2, and the first drive shaft assembly 22 of the assembly of the mechanism 2 is rigidly connected to the first drive motor 21 of the assembly of the mechanism. For the clutch 24 in the assembly of the mechanism 2, the protrusion 242 is disposed at one end of the first driving shaft assembly 22, preferably in the shape of a triangular prism, and can be inserted into a triangular groove 241 matching with the protrusion, in this specific example, the groove 241 is disposed at one end of the second driving shaft assembly 23, and has a depth of about 10mm, a length of 20mm, and a tip included angle of 60 degrees. When the protrusion 242 is inserted into the groove 241, the second driving shaft assembly 23 can drive the first carrier 41 to rotate through the conduction of the first driving shaft assembly 22.
With reference to the mechanism 2 shown in fig. 3, the moving part of the air cylinder 25 may be connected to the protrusion 242, the body of the air cylinder 25 is connected to the first driving shaft assembly 22, when the air cylinder pressurizes, the protrusion 242 of the triangular prism is inserted into the groove 241, when the first driving shaft assembly 22 is driven to rotate by the first driving motor 21, the second driving shaft assembly 23 is driven to rotate simultaneously due to the acting force between the protrusion 242 of the triangular prism and the groove 241, when the resistance of the second driving shaft assembly 23 increases, and the pressure of the air cylinder 25 cannot keep the protrusion 242 of the triangular prism in the groove 241, the protrusion 242 of the triangular prism slides out of the groove 241, the pressure of the air cylinder 25 is released completely after sliding out, and the power of the first driving shaft assembly 22 is cut off from the second driving shaft assembly 23.
Specifically, the air pressure of the air cylinder 25 may be set according to the threshold value of the power cut-off. For example, when the rotation speed of the polishing disc is 50 revolutions per second, the pressure of the polishing head is 3 Pounds per square inch (psi), and under the condition that the polishing pad covered on the polishing disc is not changed, the torque range corresponding to normal rotation is 67 to 69 nm n.m, at this time, the air pressure of the air cylinder 25 is set to be just enough to prevent the first driving shaft assembly 22 and the second driving shaft assembly 23 from being disengaged, or the air pressure is set to be enough to allow the clutch device 24 to separate the first driving shaft assembly 22 from the second driving shaft assembly 23, the torque of the corresponding air cylinder 25 is 75n.m, the pressure of the corresponding air cylinder 25 is 28psi, when the wafer slips or is damaged, the surface of the wafer changes from the original smooth surface to the rough surface after being damaged, according to the friction formula f = μ × Fn, under the condition that the lower pressure Fn is not changed, the friction coefficient μ increases to cause the increase of the friction force f, and the first driving motor 21 keeps the original rotation speed, the torque to be overcome is increased, so that the feedback current of the torque is increased, which means that the feedback torque is increased, and the torque is increased to more than 81n.m, but the maximum torque corresponding to the separation of the clutch device 24 is 75n.m, at this time, the first driving shaft assembly 22 and the second driving shaft assembly 23 are powered off, and the grinding disc does not rotate any more. The cylinder 25 is provided with a position sensor, and when the clutch element 24 is detected to be separated, the air pressure is reduced to a negative value, so that the convex part 242 of the triangular prism block is completely separated from the groove 242. It will be appreciated that the projection 242 of the clutch member 24 may be of a round steel ball construction, wedge construction, or the like, in addition to a triangular prism. It should be noted that, since the torque may be greater during the increase of the grinding disc rotation speed from 0 to the set rotation speed value than any subsequent time period, the air pressure that can be applied to the air cylinder 25 within seconds of starting the start should be greater than the pressure value corresponding to maintaining the clutch engagement state under the set torque condition, for example, it can be set to about 53psi, so as to prevent the clutch 24 from disengaging during starting, and when the start is completed until the torque is stabilized, the air pressure is reduced to 28psi corresponding to the torque threshold value of 75 n.m.
Fig. 5 shows a graph of the relationship between the torque and the air pressure of the cylinder 25 in the above specific example, and it can be seen from fig. 5 that the torque increases sharply during the increase of the rotation speed from 0 to the set rotation speed value, i.e., during the 1 st to 4 th seconds, when the air pressure of the cylinder is set at about 53psi so as not to disengage the clutch element 24 at the time of activation; from the 5 th to the 18 th seconds, the device 4 operates normally, performing a grinding or polishing process; after 18 seconds, the wafer is damaged or slips out, the torque moment is increased to more than 81N.m, the clutch device 24 is separated, and the air pressure of the air cylinder 25 is rapidly reduced to negative. At this time, the first carrier 41 stops rotating due to the disengagement of the clutch device 24, thereby protecting the device 4 from damage.
In addition to the device 4 shown in fig. 4, the mechanism 2 shown in fig. 2 or fig. 3 is integrated into the device 1 shown in fig. 1 in combination with fig. 1 to fig. 3, so as to obtain a wafer protection device 6 provided by the embodiment of the present invention shown in fig. 6, wherein the device 6 may include: second plummer 61, second processing head 62, second rigid body pivot 63, third driving motor 64 and the wafer protection mechanism 2 shown in fig. 2 or fig. 3, wherein, the second processing head 62 with second drive axle subassembly 23 rigid connection in the mechanism 2 subassembly, the second plummer 61 pass through the second rigid body pivot 63 with third driving motor 64 rigid connection, the direction of the first driving motor 21 driven rotation in the mechanism 2 subassembly with the direction of the driven rotation of third driving motor 64 is the same but the rotation speed is different in order to realize the second plummer 61 with the relative motion of second processing head 62.
Also, the embodiment of the apparatus 6 shown in fig. 6 is briefly described by taking a polishing process as an example, and in this particular example, the second carrier 61 may be an abrasive disk. The second machining head 62 may be a grinding head. It is understood that, based on the above-mentioned many similarities between the grinding process and the polishing process, the following embodiments of the apparatus 6 can be applied to the grinding process, and the details of the embodiments of the present invention are not repeated herein.
As shown in fig. 6, the clutch 24 of the assembly of the mechanism 2 is provided with a protrusion 242 at one end of the first driving shaft assembly 22, preferably in the shape of a triangular prism, which can be inserted into a matching triangular groove 241, in this specific example, the groove 241 is provided at one end of the second driving shaft assembly 23, and has a depth of about 10mm, a length of 20mm and a tip included angle of 60 degrees. When the protrusion 242 is inserted into the groove 241, the second drive shaft assembly 23 is able to rotate the second machining head 62 by conduction through the first drive shaft assembly 22.
With reference to the mechanism 2 shown in fig. 3, the moving part of the air cylinder 25 may be connected to the protrusion 242, the body of the air cylinder 25 is connected to the first driving shaft assembly 22, when the air cylinder is pressurized, the protrusion 242 of the triangular prism is inserted into the groove 241, when the first driving shaft assembly 22 is driven to rotate by the first driving motor 21, the second driving shaft assembly 23 is driven to rotate simultaneously due to the acting force between the protrusion 242 of the triangular prism and the groove 241, when the resistance of the second driving shaft assembly 23 increases, and the pressure of the air cylinder 25 cannot keep the protrusion 242 of the triangular prism in the groove 241, the protrusion 242 of the triangular prism slides out of the groove 241, the pressure of the sliding-out air cylinder 25 is completely released, the power of the first driving shaft assembly 22 is cut off from the second driving shaft assembly 23, and the second processing head 62 stops rotating, so as to protect the device 6 from damage. It can be understood that, for the detailed description of the present specific example, reference may be made to and refer to the foregoing detailed description of the apparatus 4 shown in fig. 4, and details of this embodiment are not repeated.
Referring to fig. 7 in conjunction with the above-mentioned mechanisms and apparatuses shown in fig. 2 to 6, it is shown that an embodiment of the present invention further provides a wafer protection method, which may be applied to the apparatus shown in fig. 4 or 6, and the method may include:
s71: rigidly connecting a second driving shaft assembly in the wafer protection mechanism assembly with a bearing table or a processing head;
s72: a first driving motor in the mechanism assembly drives a first driving shaft assembly in the mechanism assembly to rotate around a shaft through rigid connection; the rotation direction of the first drive motor is the same as that of a second drive motor in the wafer protection device, and the rotation speed of the first drive motor is different from that of the second drive motor;
s73: a second driving shaft assembly and a first driving shaft assembly in the mechanism assembly are connected through a clutch device in the mechanism assembly, and the rotation of the first driving shaft assembly is transmitted to the second driving shaft assembly, so that the first driving shaft assembly and the second driving shaft assembly can rotate as a whole, and the bearing table or the processing head is driven to rotate;
s74: under the set torque moment, the clutch device separates the first drive shaft assembly from the second drive shaft assembly so as to prevent the rotation of the first drive shaft assembly from being transmitted to the second drive shaft assembly, and the second drive shaft assembly stops rotating.
Based on the explanation and description of the foregoing technical solutions, it can be understood that, by applying the method shown in fig. 7 to the wafer protection apparatus shown in fig. 4 or fig. 6, the grinding or polishing process can be stopped in time when the wafer is damaged or slips out, so as to protect the apparatus for improving flatness and prolong the service life of the apparatus for improving flatness.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A wafer protection mechanism, comprising: the clutch device comprises a first driving motor, a first driving shaft assembly, a second driving shaft assembly and a clutch device; wherein the first drive shaft assembly is connected with the first drive motor, and the clutch device is arranged at the connection of the first drive shaft assembly and the second drive shaft assembly to joint or separate the first drive shaft assembly and the second drive shaft assembly; the clutch device separates the first driving shaft assembly from the second driving shaft assembly under the set torque moment; the set torque moment is used for representing the wafer breakage or slip-out state.
2. The wafer protection mechanism of claim 1, wherein when the first drive motor drives the first drive shaft assembly to rotate about the axis via the rigid connection, the clutch device engages the second drive shaft assembly to transmit rotation of the first drive shaft assembly to the second drive shaft assembly; and if the clutch device separates the first driving shaft assembly from the second driving shaft assembly under the set torque moment, the rotation of the first driving shaft assembly is prevented from being transmitted to the second driving shaft assembly, and the second driving shaft assembly stops rotating.
3. The wafer protection mechanism of claim 1, wherein the clutch element comprises a groove and a protrusion, the groove and the protrusion having a shape matching; the groove is formed in the connecting end, engaged with the first drive shaft assembly, of the second drive shaft assembly, and the protrusion is formed in the connecting end, engaged with the second drive shaft assembly, of the first drive shaft assembly.
4. The wafer protection mechanism of claim 3, wherein the protrusion shape comprises a triangular prism, a round steel ball shape, or a wedge structure shape; the shape of the groove is matched with that of the bulge.
5. The wafer protection mechanism of claim 3, further comprising a pneumatic cylinder disposed at the first drive shaft assembly for providing a set pressure to maintain the engaged state of the clutch device.
6. The wafer protection mechanism as claimed in claim 5, wherein the cylinder is connected to the protrusion to press the protrusion into the groove, and the pressure provided by the cylinder is capable of holding the protrusion in the groove; when the torque moment reaches the set torque moment, the pressure provided by the air cylinder cannot enable the lug boss to be kept in the groove, the lug boss slides out of the groove, and the air cylinder releases all the provided pressure after sliding out.
7. The wafer protection mechanism as claimed in claim 5, wherein during the process of increasing the rotation speed of the first driving motor from 0 to a set rotation speed value, the set pressure provided by the cylinder is greater than a pressure value corresponding to maintaining the clutch device in the engaged state under the set torque condition, so as to prevent the clutch device from disengaging during starting.
8. A wafer protection device, comprising: plummer, processing head, rigid body pivot, second driving motor and any one of claims 1 to 7 wafer protection mechanism, wherein, the plummer with second drive axle subassembly rigid connection in the wafer protection mechanism, the processing head passes through the rigid body pivot with second drive motor rigid connection, the direction of first driving motor driven rotation in the wafer protection mechanism with the direction of second driving motor driven rotation is the same but the rotational speed is different in order to realize the plummer with processing head relative motion.
9. A wafer protection device, comprising: plummer, processing head, rigid body pivot, second driving motor and any one of claims 1 to 7 wafer protection mechanism, wherein, the processing head with second drive axle subassembly rigid connection in the wafer protection mechanism, the plummer pass through the rigid body pivot with second driving motor rigid connection, the direction of first driving motor driven rotation in the wafer protection mechanism with the direction of second driving motor driven rotation is the same but the rotational speed is different in order to realize the plummer with processing head relative motion.
10. A wafer protection method applied to the wafer protection device of claim 8 or 9, the method comprising:
rigidly connecting a second driving shaft assembly in the wafer protection mechanism with a bearing table or a processing head;
a first driving motor in the wafer protection mechanism drives a first driving shaft assembly in the wafer protection mechanism to rotate around a shaft through rigid connection; the rotation direction of the first driving motor is the same as that of a second driving motor in the wafer protection device, and the rotation speed of the first driving motor is different from that of the second driving motor;
a second driving shaft assembly in the wafer protection mechanism is connected with the first driving shaft assembly through a clutch device in the wafer protection mechanism, and the rotation of the first driving shaft assembly is transmitted to the second driving shaft assembly, so that the first driving shaft assembly and the second driving shaft assembly can rotate as a whole, and the bearing table or the processing head is driven to rotate;
the clutch separates the first drive shaft assembly from the second drive shaft assembly at a set torque to prevent the transmission of the rotation of the first drive shaft assembly to the second drive shaft assembly, which stops rotating.
CN202010700098.7A 2020-07-20 2020-07-20 Wafer protection mechanism, device and method Active CN111558896B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010700098.7A CN111558896B (en) 2020-07-20 2020-07-20 Wafer protection mechanism, device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010700098.7A CN111558896B (en) 2020-07-20 2020-07-20 Wafer protection mechanism, device and method

Publications (2)

Publication Number Publication Date
CN111558896A CN111558896A (en) 2020-08-21
CN111558896B true CN111558896B (en) 2020-10-23

Family

ID=72070199

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010700098.7A Active CN111558896B (en) 2020-07-20 2020-07-20 Wafer protection mechanism, device and method

Country Status (1)

Country Link
CN (1) CN111558896B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113579989B (en) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 Slip sheet detection device and polishing system
CN117260407B (en) * 2023-11-20 2024-03-12 铭扬半导体科技(合肥)有限公司 Detection method of polishing equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108510B2 (en) * 1990-01-19 1995-11-22 大阪チタニウム製造株式会社 Mirror polishing machine for semiconductor wafers
JPH07299740A (en) * 1994-05-11 1995-11-14 Mitsubishi Materials Corp Wafer polishing device and head of it
JPH10156703A (en) * 1996-11-27 1998-06-16 Nikon Corp Polishing device
KR100865941B1 (en) * 2006-11-28 2008-10-30 세메스 주식회사 Spin head and method for chucking/unchuking substrate using the spin head, and apparatus for treating substrate with the spin head
GB2456291A (en) * 2007-10-31 2009-07-15 Jonathan Robert Hird Using the Johnsen-Rahbeck effect to control friction
CN201340845Y (en) * 2008-12-18 2009-11-04 先进光电器材（深圳）有限公司 Multi-die ring device
CN102626890A (en) * 2012-04-24 2012-08-08 安徽合一电气科技有限公司 Two-sided automatic polishing machine
JP6846176B2 (en) * 2016-11-24 2021-03-24 株式会社ディスコ Grinding device

Also Published As

Publication number Publication date
CN111558896A (en) 2020-08-21

Similar Documents

Publication Publication Date Title
CN111558896B (en) Wafer protection mechanism, device and method
US8748289B2 (en) Method for manufacturing semiconductor device
JP4369378B2 (en) Semiconductor wafer, apparatus and method for manufacturing the semiconductor wafer
US5916015A (en) Wafer carrier for semiconductor wafer polishing machine
TWI540625B (en) Wafer processing method
EP1814149B1 (en) METHOD FOR POLISHING A GaN SUBSTRATE
JP5913839B2 (en) Polishing method
JP2009129970A (en) Polishing apparatus and polishing method
JP2003059873A (en) Pad conditioner of semiconductor polishing apparatus and method of monitoring the pad conditioner
TW200903620A (en) Method for grinding semiconductor wafers
JP4066889B2 (en) Bonded substrate and manufacturing method thereof
CN101620986A (en) Adhesive tape attaching method
WO2005070619A1 (en) Method of grinding wafer and wafer
CN105609414B (en) Method for grinding workpiece
US6719619B2 (en) Quick coupler for mounting a rotational disk
US20150266155A1 (en) Method for producing polished-article
US6666754B1 (en) Method and apparatus for determining CMP pad conditioner effectiveness
US10818500B2 (en) Method for wafer trimming
KR101038548B1 (en) Machining quality judging method for wafer grinding machine and wafer grinding machine
KR102098260B1 (en) Double-headed workpiece grinding method
JP2004148487A (en) Polishing method, and polishing apparatus used in the same method
JP2016078159A (en) Polishing head and polishing apparatus
KR20170038434A (en) Chemical mechanical polishing apparatus for substrate
CN103753379A (en) Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time
US6783441B2 (en) Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant