CN111552617A - NAND Flash temperature acquisition method and device, computer equipment and storage medium - Google Patents
NAND Flash temperature acquisition method and device, computer equipment and storage medium Download PDFInfo
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- CN111552617A CN111552617A CN202010373196.4A CN202010373196A CN111552617A CN 111552617 A CN111552617 A CN 111552617A CN 202010373196 A CN202010373196 A CN 202010373196A CN 111552617 A CN111552617 A CN 111552617A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3037—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3089—Monitoring arrangements determined by the means or processing involved in sensing the monitored data, e.g. interfaces, connectors, sensors, probes, agents
- G06F11/3093—Configuration details thereof, e.g. installation, enabling, spatial arrangement of the probes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to a method and a device for acquiring the temperature of NAND Flash, computer equipment and a storage medium; the NFC state machine issues command descriptors to the NAND particles in each preset time period; the temperature of the interior of the NAND particles is acquired according to the command descriptor, and the acquired temperature data is stored; the NFC state machine issues a temperature acquisition descriptor to the NAND particles; the NAND particles return the stored temperature data to the NFC state machine. According to the invention, the self-resource of the NAND particles is utilized, the temperature of the particles is obtained on the premise of not increasing additional hardware resources, the temperature sensing chip in the particles is positioned in the particles, the temperature sensing of the particles is more accurate and sensitive, the accuracy of the temperature value is improved, meanwhile, the traditional peripheral temperature sensing chip resource and space can be released, and the SSD cost and the power consumption can be reduced.
Description
Technical Field
The invention relates to the technical field of temperature control of NAND Flash, in particular to a method and a device for acquiring the temperature of the NAND Flash, computer equipment and a storage medium.
Background
NAND particles are one of the most important hardware for SSD production, and its temperature control is very important and essential; firstly, NAND has its own prescribed temperature range, secondly, too high temperature also has an influence on data stored in the particles, which easily causes bit (bit, which is the minimum unit of representing information, and is information contained in one bit of binary number or a required amount of information of 1 specified specifically from 2 options) inversion of the data, and the temperature control is premised on correctly acquiring the temperature inside the particles.
The traditional NAND temperature acquisition mode is that a temperature sensing chip is connected to the outside of NAND particles, NAND temperature data are acquired at regular time by matching with a peripheral circuit, when the temperature of the particles changes, the current and the voltage of the temperature sensing chip also change, the temperature of the particles at the moment is judged through a relation curve of the current and the voltage and the temperature, and a main control chip acquires a converted temperature value from the temperature sensing chip through an I2C bus, so that the method has the following disadvantages: 1. an external temperature sensing chip communicated through an I2C bus occupies GPIO resources; 2. the external temperature sensing chip cannot completely and truly reflect the temperature inside the particles; 3. the additional temperature sensing chip and the peripheral circuit thereof occupy the space of the SSD PCB; therefore, the demand cannot be satisfied.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a temperature acquisition method and device of NAND Flash, computer equipment and a storage medium.
In order to achieve the purpose, the invention adopts the following technical scheme:
the temperature acquisition method of the NAND Flash comprises the following steps:
the NFC state machine issues command descriptors to the NAND particles in each preset time period;
the temperature of the interior of the NAND particles is acquired according to the command descriptor, and the acquired temperature data is stored;
the NFC state machine issues a temperature acquisition descriptor to the NAND particles;
the NAND particles return the stored temperature data to the NFC state machine.
The further technical scheme is as follows: the preset time period is 3 seconds.
The further technical scheme is as follows: the temperature data is 8 bits.
The further technical scheme is as follows: after the step "the NAND particle returns the stored temperature data to the NFC state machine", the method further includes: the NFC state machine converts the temperature data into decimal temperature values.
NAND Flash's temperature acquisition device includes: the system comprises a first issuing unit, a collecting and storing unit, a second issuing unit and a returning unit;
the first issuing unit is used for issuing a command descriptor to the NAND particles by the NFC state machine in each preset time period;
the acquisition and storage unit is used for acquiring the temperature of the internal temperature of the NAND particles according to the command descriptor and storing the acquired temperature data;
the second issuing unit is used for issuing the temperature acquisition descriptor to the NAND particles by the NFC state machine;
the return unit is used for the NAND particles to return the stored temperature data to the NFC state machine.
The further technical scheme is as follows: the preset time period is 3 seconds.
The further technical scheme is as follows: the temperature data is 8 bits.
The further technical scheme is as follows: further comprising: and the conversion unit is used for converting the temperature data into a decimal temperature value by the NFC state machine.
A computer device comprises a memory and a processor, wherein a computer program is stored on the memory, and the processor executes the computer program to realize the temperature acquisition method of the NAND Flash.
A storage medium storing a computer program comprising program instructions which, when executed by a processor, may implement the temperature acquisition method of NAND Flash as described above.
Compared with the prior art, the invention has the beneficial effects that: the self resource of the NAND particles is fully utilized, the particle temperature is obtained on the premise that extra hardware resources are not needed to be added, the temperature sensing chip inside the particles is located inside the particles, the temperature sensing of the particles is more accurate and sensitive, the accuracy of temperature values is improved, meanwhile, the traditional peripheral temperature sensing chip resource and space can be released, the SSD cost and the power consumption can be reduced, and the requirement can be better met.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a prior art temperature acquisition application scenario;
FIG. 2 is a schematic flowchart of a temperature obtaining method for NAND Flash according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an application scenario in the temperature obtaining method for NAND Flash according to the embodiment of the present invention;
FIG. 4 is a schematic block diagram of a temperature obtaining device of NAND Flash according to an embodiment of the present invention;
FIG. 5 is a schematic block diagram of a computer device provided by an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Please refer to the embodiments shown in fig. 1 to 5, wherein, please refer to the application scenario of temperature acquisition in the prior art shown in fig. 1; a set of peripheral circuits containing temperature sensing chips are built around NAND Flash (one type of Flash memory) particles; when the particle temperature changes, the current and voltage of the temperature sensing chip also change, the particle temperature at the moment is judged through a relation curve of the current and voltage and the temperature, and the main control chip obtains the converted temperature value from the temperature sensing chip through an I2C bus, so that the method has the following defects: 1. an external temperature sensing chip communicated through an I2C bus occupies GPIO resources; 2. the external temperature sensing chip cannot completely and truly reflect the temperature inside the particles; 3. the additional temperature sensing chip and its peripheral circuits occupy space of the SSD PCB board.
Referring to fig. 2 to 3, the present invention discloses a method for obtaining a temperature of a NAND Flash, including the following steps:
s1, the NFC state machine issues command descriptors to the NAND particles in each preset time period;
in this embodiment, the NFC state machine generates a command descriptor for driving temperature, and then issues the command descriptor to the NAND particles in each preset time period; wherein the preset time period is 3 seconds. In other embodiments, the preset time period may also be other values, and is set according to actual needs to adapt to different application scenarios.
S2, acquiring the temperature of the internal temperature of the NAND particles according to the command descriptor, and storing the acquired temperature data;
in this embodiment, the internal temperature of the NAND particle drives the internal temperature sensing operation according to the received command descriptor, performs temperature acquisition inside the NAND particle, and stores the acquired temperature data in a fixed memory space of the NAND particle.
Further, in this embodiment, the temperature data is 8 bits. In other embodiments, the temperature data may be other values to suit different application scenarios.
S3, the NFC state machine issues a temperature acquisition descriptor to the NAND particles;
in this embodiment, the NFC state machine generates a temperature acquisition descriptor, and then issues the temperature acquisition descriptor to the NAND particle.
S4, the NAND particle returns the stored temperature data to the NFC state machine.
As shown in fig. 3, after the step S4, the method further includes: and the NFC state machine converts the temperature data into decimal temperature values according to the particle handbook, and then gives the converted temperature values to global variables for other modules of a Controller (Controller) to call.
Referring to fig. 4, the present invention also discloses a temperature obtaining device for NAND Flash, including: a first issuing unit 10, a collecting and storing unit 20, a second issuing unit 30, and a returning unit 40;
the first issuing unit 10 is configured to issue a command descriptor to the NAND particle by the NFC state machine in each preset time period;
the acquisition and storage unit 20 is used for acquiring the temperature of the internal temperature of the NAND particles according to the command descriptor and storing the acquired temperature data;
the second issuing unit 30 is configured to issue a temperature acquisition descriptor to the NAND particles by the NFC state machine;
the return unit 40 is used for the NAND particles to return the stored temperature data to the NFC state machine.
Wherein the preset time period is 3 seconds.
Wherein, the temperature data is 8 bit.
Wherein, the device still includes: and the conversion unit 50 is used for converting the temperature data into decimal temperature values by the NFC state machine.
It should be noted that, as can be clearly understood by those skilled in the art, the specific implementation processes of the temperature obtaining apparatus and each unit of the NAND Flash may refer to the corresponding descriptions in the foregoing method embodiments, and for convenience and brevity of description, no further description is provided herein.
The temperature acquisition means of the NAND Flash described above may be implemented in the form of a computer program that can be run on a computer device as shown in fig. 5.
Referring to fig. 5, fig. 5 is a schematic block diagram of a computer device according to an embodiment of the present application; the computer device 500 may be a terminal or a server, where the terminal may be an electronic device with a communication function, such as a smart phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster composed of a plurality of servers.
Referring to fig. 5, the computer device 500 includes a processor 502, memory, and a network interface 505 connected by a system bus 501, where the memory may include a non-volatile storage medium 503 and an internal memory 504.
The non-volatile storage medium 503 may store an operating system 5031 and a computer program 5032. The computer program 5032 comprises program instructions that, when executed, cause the processor 502 to perform a temperature acquisition method for NAND Flash.
The processor 502 is used to provide computing and control capabilities to support the operation of the overall computer device 500.
The internal memory 504 provides an environment for running the computer program 5032 in the non-volatile storage medium 503, and when the computer program 5032 is executed by the processor 502, the processor 502 can be enabled to execute a temperature obtaining method of the NAND Flash.
The network interface 505 is used for network communication with other devices. Those skilled in the art will appreciate that the configuration shown in fig. 5 is a block diagram of only a portion of the configuration associated with the present application and does not constitute a limitation of the computer device 500 to which the present application may be applied, and that a particular computer device 500 may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
It should be understood that, in the embodiment of the present Application, the Processor 502 may be a Central Processing Unit (CPU), and the Processor 502 may also be other general-purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, and the like. Wherein a general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
It will be understood by those skilled in the art that all or part of the flow of the method implementing the above embodiments may be implemented by a computer program instructing associated hardware. The computer program includes program instructions, and the computer program may be stored in a storage medium, which is a computer-readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the flow steps of the embodiments of the method described above.
Accordingly, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program, wherein the computer program comprises program instructions which, when executed by a processor, can implement the temperature acquisition method of NAND Flash described above.
The storage medium may be a usb disk, a removable hard disk, a Read-Only Memory (ROM), a magnetic disk, or an optical disk, which can store various computer readable storage media.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, various elements or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented.
The steps in the method of the embodiment of the invention can be sequentially adjusted, combined and deleted according to actual needs. The units in the device of the embodiment of the invention can be merged, divided and deleted according to actual needs. In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a storage medium. Based on such understanding, the technical solution of the present invention essentially or partially contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a terminal, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (10)
- The temperature obtaining method of the NAND Flash is characterized by comprising the following steps of:the NFC state machine issues command descriptors to the NAND particles in each preset time period;the temperature of the interior of the NAND particles is acquired according to the command descriptor, and the acquired temperature data is stored;the NFC state machine issues a temperature acquisition descriptor to the NAND particles;the NAND particles return the stored temperature data to the NFC state machine.
- 2. The method for acquiring the temperature of the NAND Flash according to claim 1, wherein the preset time period is 3 seconds.
- 3. The method for acquiring the temperature of the NAND Flash according to claim 1, wherein the temperature data is 8 bits.
- 4. The method for acquiring the temperature of the NAND Flash according to claim 1, wherein after the step "the NAND particles return the stored temperature data to the NFC state machine", the method further comprises: the NFC state machine converts the temperature data into decimal temperature values.
- The temperature acquisition device of the NAND Flash is characterized by comprising: the system comprises a first issuing unit, a collecting and storing unit, a second issuing unit and a returning unit;the first issuing unit is used for issuing a command descriptor to the NAND particles by the NFC state machine in each preset time period;the acquisition and storage unit is used for acquiring the temperature of the internal temperature of the NAND particles according to the command descriptor and storing the acquired temperature data;the second issuing unit is used for issuing the temperature acquisition descriptor to the NAND particles by the NFC state machine;the return unit is used for the NAND particles to return the stored temperature data to the NFC state machine.
- 6. The device for acquiring the temperature of the NAND Flash according to claim 5, wherein the preset time period is 3 seconds.
- 7. The NAND Flash temperature acquisition device according to claim 5, wherein the temperature data is 8 bit.
- 8. The NAND Flash temperature acquisition device according to claim 5, further comprising: and the conversion unit is used for converting the temperature data into a decimal temperature value by the NFC state machine.
- 9. A computer device characterized in that the computer device comprises a memory on which a computer program is stored and a processor which, when executing the computer program, implements the temperature acquisition method of NAND Flash as claimed in any one of claims 1 to 4.
- 10. A storage medium storing a computer program comprising program instructions which, when executed by a processor, implement the temperature acquisition method of NANDFlash of any of claims 1-4.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010373196.4A CN111552617A (en) | 2020-05-06 | 2020-05-06 | NAND Flash temperature acquisition method and device, computer equipment and storage medium |
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| CN202010373196.4A CN111552617A (en) | 2020-05-06 | 2020-05-06 | NAND Flash temperature acquisition method and device, computer equipment and storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114121137A (en) * | 2021-11-12 | 2022-03-01 | 苏州浪潮智能科技有限公司 | Nand Flash particle power consumption test system and method |
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| CN109783297A (en) * | 2019-01-10 | 2019-05-21 | 湖南国科微电子股份有限公司 | A kind of solid state hard disk uses the wide method for improving of temperature and solid state hard disk |
| CN110058957A (en) * | 2019-04-22 | 2019-07-26 | 湖南国科微电子股份有限公司 | A kind of solid state hard disk error correcting capability method for improving and solid state hard disk |
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- 2020-05-06 CN CN202010373196.4A patent/CN111552617A/en active Pending
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| US8514646B1 (en) * | 2012-05-09 | 2013-08-20 | Storart Technology Co. Ltd. | Method for improving performance when flash memory storage device works in wide temperature range |
| CN109783297A (en) * | 2019-01-10 | 2019-05-21 | 湖南国科微电子股份有限公司 | A kind of solid state hard disk uses the wide method for improving of temperature and solid state hard disk |
| CN110058957A (en) * | 2019-04-22 | 2019-07-26 | 湖南国科微电子股份有限公司 | A kind of solid state hard disk error correcting capability method for improving and solid state hard disk |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114121137A (en) * | 2021-11-12 | 2022-03-01 | 苏州浪潮智能科技有限公司 | Nand Flash particle power consumption test system and method |
| CN114121137B (en) * | 2021-11-12 | 2023-11-10 | 苏州浪潮智能科技有限公司 | Nand Flash particle power consumption testing system and method |
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