CN111548194A - Preparation method of printed circuit board - Google Patents
Preparation method of printed circuit board Download PDFInfo
- Publication number
- CN111548194A CN111548194A CN202010476829.4A CN202010476829A CN111548194A CN 111548194 A CN111548194 A CN 111548194A CN 202010476829 A CN202010476829 A CN 202010476829A CN 111548194 A CN111548194 A CN 111548194A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- copper
- manufacturing
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
Abstract
The invention discloses a preparation method of a printed circuit board, which comprises the following steps: printing copper paste on a substrate to form a pattern, and drying to obtain a printed circuit board with a copper powder pattern; under the protection of a non-oxidizing atmosphere, a printed circuit board with copper powder patterns is heated through high-frequency electromagnetic induction, the copper powder is melted and adhered to form a copper layer of an integrated pattern, the copper powder is melted in a short time through a high-frequency electromagnetic oscillation mode, a complete circuit copper layer is formed, meanwhile, a ceramic substrate serving as a base material is hardly subjected to thermal shock to generate a fracture risk, the sintering time is short, the energy input is accurate, the requirement of a protective atmosphere can be lowered, and the formed metal copper layer has the characteristics of being excellent in definition, low in oxidation degree and good in conductivity.
Description
Technical Field
The invention relates to a preparation method of a circuit board, in particular to a preparation method of a printed circuit board, and belongs to the field of electronic element preparation processes.
Background
Printed Circuit Boards (PCBs) are widely used in almost all electronic devices as a fundamental and important component of the modern electronics industry. At present, the printed circuit board is mainly prepared by an etching method, and the main principle is that a copper-clad plate is adopted as a raw material, under the protection of photosensitive resin, oxidizing etching liquid is used, the copper foil of the unnecessary part is etched and removed according to the requirements of a circuit design drawing, a basic circuit is formed, then a series of chemical and physical treatments are carried out, and components are welded, so that the functional circuit board is formed. The above process is to remove the excess copper layer on the complete copper layer by etching to form the designed circuit pattern, and is therefore also called subtractive process.
In the process, the etching process is a process which has serious influence on the environment and human body, the main component of the etching liquid is liquid consisting of an oxidant and dilute acid, a large amount of copper ions are added into the waste liquid after etching, and the post-treatment difficulty of the waste liquid is very high. In the treatment process, corrosive acid mist can be generated to influence equipment, personnel and environment, and meanwhile, the etched copper-clad plate needs to be cleaned by a large amount of water to remove etching liquid and also generates a large amount of metal ion acidic waste liquid.
Therefore, the conventional PCB production, as a highly polluted industry, is subject to various degrees of restrictions in various regions, and the restrictions tend to be more and more severe as social development and environmental protection are increased.
In contrast to the subtractive process, the sintering of the powder material allows the direct formation of lines on the blank substrate as required by the design, a process known as additive. Sintering is a process of depositing metal powder in a desired pattern (typically by printing with a metal paste) and then thermally fusing the powder together to form a complete conductive path.
At present, the process is generally applied to the production of thick film circuits, and conductive paste is prepared by adopting powder of noble metals such as silver, palladium and the like, and dispersing agent, auxiliary agent and the like for circuit printing. Because the production cost is high, the method can only be applied to the fields of thick film circuits with small area and high added value, and is difficult to be applied to printed circuit boards with sensitive cost on a large scale. If the application range of the process needs to be expanded, expensive noble metals such as gold, silver and platinum are inevitably replaced by cheap materials such as copper and aluminum. However, copper and aluminum, although inexpensive, are prone to oxidation problems during high temperature sintering, and, if light, reduce conductivity, and if heavy, completely oxidize and cannot be used, so strict atmosphere protection is required to cope with metal oxidation during long temperature ramp-up and ramp-down.
Meanwhile, the traditional box furnace or tunnel furnace is adopted for sintering metal powder, a longer temperature rise and drop process is needed to reduce thermal shock to the ceramic substrate, a large amount of heat is used for heating the ceramic substrate and dissipating the ceramic substrate instead of heating the metal to be melted clearly, and the process is high in energy consumption and low in production efficiency.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a method for preparing a printed circuit board, which has the advantages of short heating time, high production efficiency, small copper layer oxidation and greatly improved economical efficiency and product quality.
The technical scheme is as follows: the preparation method of the printed circuit board comprises the following steps:
(1) printing copper paste on a substrate to form a pattern, and drying to obtain a printed circuit board with a copper powder pattern;
(2) under the protection of non-oxidizing atmosphere, the printed circuit board with the copper powder pattern is heated through high-frequency electromagnetic induction, and the copper powder is melted and mutually adhered to form a copper layer with an integrated pattern.
Further, the copper paste is prepared from the following raw material components: copper powder, deionized water and an auxiliary agent, wherein the mass ratio of the copper powder to the deionized water to the auxiliary agent is 50-80:20-50:0.05-15, the auxiliary agent comprises a binder, a rheological agent or an antioxidant, and the mass ratio of the binder to the rheological agent or the antioxidant is 0.05-5:0-10: 0-5.
Preferably, the binder is one or more of carboxymethyl cellulose, carboxymethyl cellulose salt, hydroxymethyl cellulose salt, polyvinyl alcohol, polyacrylate or water-soluble copolymer of acrylate. The rheological agent is one of ethanol, acetone, methanol, isopropanol, glycerol, polyethylene glycol or polysiloxane.
Further, the induction heating frequency is 500KHz-2000 KHz. The induction heating time is 10 seconds to 10 minutes.
Preferably, the non-oxidizing atmosphere is an argon atmosphere or a hydrogen atmosphere, and the non-oxidizing atmosphere is a gas atmosphere provided to prevent substantial oxidation of the copper powder during sintering.
The substrate is a ceramic substrate, and the ceramic substrate is a flat plate-shaped material with the thickness of 0.2-5mm and sintered by one or more of silicon oxide, aluminum nitride, magnesium oxide and zirconium oxide. The drying device is one of an oven, an infrared dryer, or a microwave dryer.
Has the advantages that: compared with the prior art, the invention has the following remarkable advantages: the invention provides a method for directly and locally heating the metal copper powder on the printed circuit board by adopting a high-frequency induction mode aiming at the process characteristics of producing the printed circuit board by a powder sintering method, and the heating principle of a high-frequency induction furnace is that induced current is generated in metal by adopting high-frequency electromagnetic oscillation, so that thermal shock is hardly generated on a ceramic substrate except for a metal circuit pattern, the energy utilization rate is very high, and the method is very suitable for sintering the printed circuit board; the method for sintering the printed circuit board has the advantages of short heating time, high production efficiency, small copper layer oxidation and great improvement on economy and product quality.
Detailed Description
The technical solution of the present invention is further illustrated by the following examples.
Example 1
The preparation method of the printed circuit board of the embodiment is as follows:
printing the copper paste on an alumina ceramic plate with the thickness of 0.2mm by using a 100 mu m steel mesh, and drying in an oven to obtain a clear and stable printing pattern, wherein the thickness of the pattern is 90 mu m, and the density of the pattern is 5.1g/cm3Wherein the mass ratio of the copper powder, the deionized water and the auxiliary agent in the copper slurry is 50:20:0.05, and the mass ratio of the binder, the rheological agent or the antioxidant in the auxiliary agent is 0.05:10: 5; the binder is sodium carboxymethylcellulose and hydroxymethyl cellulose in a mass ratio of 1: 1; the rheological agent is ethanol; the antioxidant is vitamin C.
The obtained pattern was sintered for 2 minutes in a high frequency furnace (20KW, 500KHz) under argon protection to obtain a conductive layer having a density of 7.86g/cm3The compactness reaches over 88 percent, and the resistivity is 3.31 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 2
The preparation method of the printed circuit board of the embodiment is as follows:
the copper paste was printed on a 5mm thick oxygen screen using a 100 μm steel screenDrying the sintered ceramic plate of silicon nitride and aluminum nitride in an infrared drier to obtain a clear and stable printed pattern with a thickness of 90 μm and a density of 5.1g/cm3Wherein the mass ratio of copper powder, deionized water and an auxiliary agent in the copper slurry is 80:50:15, and the mass ratio of a binder and an antioxidant in the auxiliary agent is 5: 4; the adhesive is polyvinyl alcohol; the antioxidant is hydroquinone.
The obtained pattern was sintered for 10 seconds in a high frequency furnace (20KW, 1000KHz) under argon protection to obtain a conductive layer having a density of 7.53g/cm3The compactness reaches over 84 percent, and the resistivity is 4.33 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 3
The preparation method of the printed circuit board of the embodiment is as follows:
printing the copper paste on a magnesia and zirconia sintered ceramic plate with a thickness of 3mm by using a 100 mu m steel mesh, and drying in a microwave dryer to obtain a clear and stable printing pattern with a thickness of 90 mu m and a density of 5.1g/cm3The mass ratio of the copper powder to the deionized water to the auxiliary agent in the copper slurry is 60:40:10, and the mass ratio of the binder to the rheological agent in the auxiliary agent is 3: 5; the binder is carboxymethyl cellulose and sodium carboxymethyl cellulose in a mass ratio of 1: 1; the rheological agent is acetone.
The obtained pattern was sintered for 10 minutes in a high frequency furnace (20KW, 2000KHz) under hydrogen protection to obtain a conductive layer having a density of 7.88g/cm3The density reaches over 88.5 percent, and the resistivity is 3.2 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 4
In the embodiment, the binder is a water-soluble copolymer of sodium polyacrylate and sodium acrylate with the mass ratio of 1:1, the rheological agent is methanol, other raw materials, the proportion, the preparation method and the detection method are the same as those in the embodiment 1, and the density of the obtained conductive layer is 8.03g/cm3The compactness reaches more than 90 percent, and the resistivity is 2.6 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 5
In the embodiment, isopropanol is selected as the rheological agent, other raw materials, proportion, preparation method and detection method are the same as those in the embodiment 1, and the density of the obtained conductive layer is 8.06g/cm3The compactness reaches more than 90 percent, and the resistivity is 2.5 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 6
The rheological agent in the embodiment adopts glycerol, other raw materials, proportion, preparation method and detection method are the same as those in the embodiment 1, and the density of the obtained conductive layer is 8.03g/cm3The compactness reaches more than 90 percent, and the resistivity is 2.5 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 7
In the embodiment, the rheological agent is polyethylene glycol, other raw materials, the proportion, the preparation method and the detection method are the same as those in the embodiment 1, and the density of the obtained conductive layer is 8.01g/cm3The compactness reaches more than 90 percent, and the resistivity is 2.7 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Example 8
In the embodiment, polysiloxane is selected as the rheological agent, other raw materials, the proportion, the preparation method and the detection method are the same as those in the embodiment 1, and the density of the obtained conductive coating is 8.0g/cm3The compactness reaches more than 89 percent, and the resistivity is 3.0 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 1
The frequency of the high frequency furnace in this comparative example was 400KHz, and other raw materials, operation steps and detection methods were the same as in example 1, to obtain a conductive layer having a density of 6.36g/cm3The compactness reaches more than 71 percent, and the resistivity is 8.3 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 2
In this comparative example, the pattern was sintered for 5 seconds in a high-frequency furnace, and the other raw materials, the operation steps and the detection method were the same as those of example 1, to obtain a conductive pattern layer having a density of 6.1g/cm3The compactness reaches more than 68 percent, and the resistivity is 20.3 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 3
In this comparative example, the pattern was sintered in a high-frequency furnace for 15 minutes, and the other raw materials, the operation steps and the inspection method were the same as in example 1, to obtain a conductive pattern layer having a density of 7.89g/cm3The density reaches over 88.5 percent, and the resistivity is 3.18 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 4
In this comparative example, the pattern was sintered in an oxidizing atmosphere, and the other raw materials, the operation steps and the inspection method were the same as in example 1, to obtain a conductive layer having a density of 7.73g/cm3The compactness reaches over 86 percent, and the resistivity is 10.3 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 5
The mass ratio of the binder, the rheological agent or the antioxidant in the auxiliary agent of the comparative example is 0.03:10:5, and other raw materials, the proportion, the operation steps and the detection method are the same as those in example 1. The obtained binder solution is too dilute to suspend and disperse the copper powder well, and the pattern obtained after coating and drying cannot be well bonded on a substrate, so that powder is seriously dropped in the drying process.
Comparative example 6
The mass ratio of the binder, the rheological agent or the antioxidant in the auxiliary agent of the comparative example is 6:10:5, and other raw materials, the proportion, the operation steps and the detection method are the same as those in the example 1. The obtained binder solution is in the shape of jelly and cannot well disperse the copper powder.
Comparative example 7
In the comparative example, no ethanol was added, and other raw materials, ratios, operation steps and detection methods were the same as those in example 1. The obtained pattern has a small amount of bubbles and holes, and is sintered for 10 minutes at 1000 ℃ in an argon atmosphere furnace, and the density of the pattern is 7.96g/cm3The compactness reaches more than 90 percent, and the resistivity is 4.06 × 10-8Omega/m (pure copper 1.75 × 10-8Ω/m)。
Comparative example 8
The mass ratio of the binder, the rheological agent or the antioxidant in the auxiliary agent of the comparative example is 0.05:12:5, and other raw materials, the proportion, the operation steps and the detection method are the same as those in example 1. After the ethanol is added, a copper paste system is separated and has no fluidity.
Claims (10)
1. A method for preparing a printed circuit board is characterized by comprising the following steps:
(1) printing copper paste on a substrate to form a pattern, and drying to obtain a printed circuit board with a copper powder pattern;
(2) under the protection of non-oxidizing atmosphere, the printed circuit board with the copper powder pattern is heated through high-frequency electromagnetic induction, and the copper powder is melted and mutually adhered to form a copper layer with an integrated pattern.
2. The method for manufacturing a printed circuit board according to claim 1, wherein: the induction heating frequency is 500KHz-2000 KHz.
3. The method for manufacturing a printed circuit board according to claim 1, wherein: the induction heating time is 10 seconds to 10 minutes.
4. The method for manufacturing a printed circuit board according to claim 1, wherein the copper paste comprises the following raw material components: the copper powder, the deionized water and the auxiliary agent are in a mass ratio of 50-80:20-50:0.05-15, the auxiliary agent comprises a binder, a rheological agent or an antioxidant, and the mass ratio of the binder, the rheological agent or the antioxidant is 0.05-5:0-10: 0-5.
5. The method for manufacturing a printed circuit board according to claim 4, wherein: the binder is one or more of carboxymethyl cellulose, carboxymethyl cellulose salt, hydroxymethyl cellulose salt, polyvinyl alcohol, polyacrylate or water-soluble copolymer of acrylate.
6. The method for manufacturing a printed circuit board according to claim 4, wherein: the rheological agent is one of ethanol, acetone, methanol, isopropanol, glycerol, polyethylene glycol or polysiloxane.
7. The method for manufacturing a printed circuit board according to claim 1, wherein: the non-oxidizing atmosphere is an argon atmosphere or a hydrogen atmosphere.
8. The method for manufacturing a printed circuit board according to claim 1, wherein: the substrate is a ceramic substrate.
9. The method for manufacturing a printed circuit board according to claim 8, wherein: the ceramic substrate is a flat material with the thickness of 0.2-5mm and sintered by one or more of silicon oxide, aluminum nitride, magnesium oxide and zirconium oxide.
10. The method for manufacturing a printed circuit board according to claim 1, wherein: the drying device is one of an oven, an infrared dryer or a microwave dryer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010476829.4A CN111548194A (en) | 2020-05-29 | 2020-05-29 | Preparation method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010476829.4A CN111548194A (en) | 2020-05-29 | 2020-05-29 | Preparation method of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111548194A true CN111548194A (en) | 2020-08-18 |
Family
ID=71999024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010476829.4A Pending CN111548194A (en) | 2020-05-29 | 2020-05-29 | Preparation method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111548194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2803667C1 (en) * | 2022-07-26 | 2023-09-19 | Акционерное общество "Научно-производственное предприятие "Пульсар" | Method for manufacturing ceramic boards for microwave monolithic integrated circuits |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| CN1104014A (en) * | 1993-10-22 | 1995-06-21 | 泰瑞那加技术公司 | Composite substrates for preparation of printed circuits |
| US5587111A (en) * | 1990-03-29 | 1996-12-24 | Vacuum Metallurgical Co., Ltd. | Metal paste, process for producing same and method of making a metallic thin film using the metal paste |
| TW498349B (en) * | 2000-04-25 | 2002-08-11 | Murata Manufacturing Co | Electroconductive composition and printed circuit board using the same |
| CN101056499A (en) * | 2006-04-10 | 2007-10-17 | E.I.内穆尔杜邦公司 | Organic encapsulant compositions for protection of electronic components |
| CN101304637A (en) * | 2007-05-10 | 2008-11-12 | 三星电机株式会社 | Wiring forming method of printed circuit board |
| CN102993614A (en) * | 2012-11-10 | 2013-03-27 | 江苏瑞德新能源科技有限公司 | Water-based carrier for electronic paste, electronic paste containing water-based carrier and preparation method of electronic paste |
| CN103087582A (en) * | 2013-01-25 | 2013-05-08 | 天津理工大学 | Preparation method of low-temperature sintering nano copper conductive ink |
| CN103137243A (en) * | 2011-11-22 | 2013-06-05 | 旭硝子株式会社 | Conductive paste, and preparing method of conductive paste |
| CN103146260A (en) * | 2013-03-20 | 2013-06-12 | 中国人民解放军国防科学技术大学 | Conductive printing ink composition, conductive film layer as well as preparation method of conductive film layer and application of conductive printing ink composition |
| CN104221094A (en) * | 2012-03-29 | 2014-12-17 | 东进世美肯株式会社 | Copper paste composition for printing, and method of forming metal pattern using same |
| CN104485154A (en) * | 2014-12-24 | 2015-04-01 | 苏州晶讯科技股份有限公司 | Electronic copper-containing paste capable of forming copper circuit through laser radiation |
| CN104508759A (en) * | 2012-05-18 | 2015-04-08 | 材料概念有限公司 | Conductive paste, method for forming wiring, electronic component, and silicon solar cell |
| CN104505137A (en) * | 2014-12-10 | 2015-04-08 | 南京工业大学 | Conductive copper paste and preparation method and use thereof |
| CN106205771A (en) * | 2016-06-30 | 2016-12-07 | 金陵科技学院 | A kind of preparation method of oxidation resistant copper conductor slurry |
| CN106887268A (en) * | 2017-01-07 | 2017-06-23 | 东莞易力禾电子有限公司 | Silk-screen printing circuit electrode and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
| CN107146652A (en) * | 2017-04-26 | 2017-09-08 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
| CN110545627A (en) * | 2018-05-29 | 2019-12-06 | 林世智 | Manufacture of circuit board with electrostatic printed conductive circuit |
| CN110586952A (en) * | 2018-06-22 | 2019-12-20 | 天津理工大学 | Room temperature preparation method of nano metal powder and conductive ink thereof |
-
2020
- 2020-05-29 CN CN202010476829.4A patent/CN111548194A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5587111A (en) * | 1990-03-29 | 1996-12-24 | Vacuum Metallurgical Co., Ltd. | Metal paste, process for producing same and method of making a metallic thin film using the metal paste |
| CN1104014A (en) * | 1993-10-22 | 1995-06-21 | 泰瑞那加技术公司 | Composite substrates for preparation of printed circuits |
| TW498349B (en) * | 2000-04-25 | 2002-08-11 | Murata Manufacturing Co | Electroconductive composition and printed circuit board using the same |
| CN101056499A (en) * | 2006-04-10 | 2007-10-17 | E.I.内穆尔杜邦公司 | Organic encapsulant compositions for protection of electronic components |
| CN101304637A (en) * | 2007-05-10 | 2008-11-12 | 三星电机株式会社 | Wiring forming method of printed circuit board |
| JP2008283181A (en) * | 2007-05-10 | 2008-11-20 | Samsung Electro Mech Co Ltd | Method of forming wiring of printed circuit board |
| CN103137243A (en) * | 2011-11-22 | 2013-06-05 | 旭硝子株式会社 | Conductive paste, and preparing method of conductive paste |
| CN104221094A (en) * | 2012-03-29 | 2014-12-17 | 东进世美肯株式会社 | Copper paste composition for printing, and method of forming metal pattern using same |
| CN104508759A (en) * | 2012-05-18 | 2015-04-08 | 材料概念有限公司 | Conductive paste, method for forming wiring, electronic component, and silicon solar cell |
| CN102993614A (en) * | 2012-11-10 | 2013-03-27 | 江苏瑞德新能源科技有限公司 | Water-based carrier for electronic paste, electronic paste containing water-based carrier and preparation method of electronic paste |
| CN103087582A (en) * | 2013-01-25 | 2013-05-08 | 天津理工大学 | Preparation method of low-temperature sintering nano copper conductive ink |
| CN103146260A (en) * | 2013-03-20 | 2013-06-12 | 中国人民解放军国防科学技术大学 | Conductive printing ink composition, conductive film layer as well as preparation method of conductive film layer and application of conductive printing ink composition |
| CN104505137A (en) * | 2014-12-10 | 2015-04-08 | 南京工业大学 | Conductive copper paste and preparation method and use thereof |
| CN104485154A (en) * | 2014-12-24 | 2015-04-01 | 苏州晶讯科技股份有限公司 | Electronic copper-containing paste capable of forming copper circuit through laser radiation |
| CN106205771A (en) * | 2016-06-30 | 2016-12-07 | 金陵科技学院 | A kind of preparation method of oxidation resistant copper conductor slurry |
| CN106887268A (en) * | 2017-01-07 | 2017-06-23 | 东莞易力禾电子有限公司 | Silk-screen printing circuit electrode and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
| CN107146652A (en) * | 2017-04-26 | 2017-09-08 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
| CN110545627A (en) * | 2018-05-29 | 2019-12-06 | 林世智 | Manufacture of circuit board with electrostatic printed conductive circuit |
| CN110586952A (en) * | 2018-06-22 | 2019-12-20 | 天津理工大学 | Room temperature preparation method of nano metal powder and conductive ink thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2803667C1 (en) * | 2022-07-26 | 2023-09-19 | Акционерное общество "Научно-производственное предприятие "Пульсар" | Method for manufacturing ceramic boards for microwave monolithic integrated circuits |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5615401B1 (en) | Copper fine particle dispersion, conductive film forming method, and circuit board | |
| CN103369851A (en) | Printed circuit board and manufacturing method thereof | |
| JP2007324301A (en) | Method for manufacturing nitride ceramics circuit board | |
| CN102762037B (en) | A kind of ceramic circuit board and manufacture method thereof | |
| CN111548194A (en) | Preparation method of printed circuit board | |
| CN107021788B (en) | Aluminum nitride ceramic refrigerating sheet and processing method thereof | |
| CN110572934A (en) | Method and system for manufacturing multilayer ceramic substrate | |
| JP3924479B2 (en) | Manufacturing method of ceramic circuit board | |
| CN202551486U (en) | PCB (printed circuit board) | |
| CN111654980A (en) | Preparation method of glass substrate printed circuit board | |
| JPH035075B2 (en) | ||
| KR101404681B1 (en) | Flexible PCB manufacturing method using high temperature heat treatment and the Flexible PCB thereof | |
| RU2307486C1 (en) | Method for manufacturing electronic boards | |
| JP2001342073A (en) | Manufacturing method of glass ceramic substrate | |
| JPS59162169A (en) | Ceramics and multilayer distribution panel | |
| KR101116134B1 (en) | Board for led package and method of manufacture the same | |
| JP7340179B2 (en) | Method for manufacturing a conductor, method for manufacturing a wiring board, and composition for forming a conductor | |
| JPS61140195A (en) | Making of ceramic wiring board | |
| JPS641079B2 (en) | ||
| NZ209104A (en) | Thick-film circuit with a substrate containing molybdenum | |
| JPH03169096A (en) | Manufacture of multilayer circuit board | |
| CN114071886A (en) | Manufacturing method of Mini-LED substrate precision circuit | |
| JP2001284479A (en) | Manufacturing method of glass ceramic board | |
| JPH058866B2 (en) | ||
| JPH05129770A (en) | Soldering auxiliary layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210325 Address after: 266111 No.6, Jinxia Road, high tech Zone, Chengyang District, Qingdao City, Shandong Province Applicant after: QINGDAO ZHONGQING ELECTRONIC SOFTWARE Co.,Ltd. Address before: No. 606, ningliu Road, Liuhe District, Nanjing City, Jiangsu Province, 211500 Applicant before: Nanjing Kaitai Chemical Technology Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220303 Address after: 510000 room 209, building 1, No. 318, Waihuan West Road, University Town, Xiaoguwei street, Panyu District, Guangzhou, Guangdong Applicant after: Guangzhou Qingmiao New Material Technology Co.,Ltd. Address before: 266111 No.6, Jinxia Road, high tech Zone, Chengyang District, Qingdao City, Shandong Province Applicant before: QINGDAO ZHONGQING ELECTRONIC SOFTWARE Co.,Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200818 |