CN111543873B

CN111543873B - Whole bamboo processing splicing-free chopping board and using method

Info

Publication number: CN111543873B
Application number: CN202010519549.7A
Authority: CN
Inventors: 李拥军; 李冠德
Original assignee: Hunan Jiale Bamboo Co ltd
Current assignee: Hunan Jiale Bamboo Co ltd
Priority date: 2020-06-09
Filing date: 2020-06-09
Publication date: 2021-05-18
Anticipated expiration: 2040-06-09
Also published as: CN111543873A

Abstract

The embodiment of the invention discloses a non-splicing chopping block for processing whole bamboos and a using method thereof. When the cold and hot ends of the semiconductor refrigerating piece are switched, the heat exchange of air in the upper cavity and the air in the lower cavity are realized by opening the fan assembly in advance, and the initial temperature of the upper end and the lower end of the semiconductor refrigerating piece is quickly recovered. The chopping board has the advantages of ingenious structural concept, rapid temperature adjustment of the chopping board, convenient use, safety and sanitation.

Description

Whole bamboo processing splicing-free chopping board and using method

Technical Field

The embodiment of the invention relates to the technical field of kitchen supplies, in particular to a whole bamboo processing splicing-free chopping board and a using method thereof.

Background

With the enhancement of environmental awareness and the improvement of living quality requirements of people, the bamboo products have natural sterilization effect and can play a role in automatic sterilization, and more bamboo products are applied, in particular to the production and the manufacture of chopping boards.

In the prior art, the production of the chopping block is divided into a whole bamboo process and a bamboo chopping block splicing process. The bamboo splicing process is formed by bonding bamboo strips with a proper amount of glue under high-temperature softening, so that seams are easy to crack in use, the glue is released, and food is polluted; the whole bamboo technology is to flatten the original cylindrical bamboo section into a whole seamless bamboo board after softening, two or more seamless flattened bamboo boards are formed by gluing and pressing, and the chopping board manufactured by the whole bamboo technology can not make food directly contact with an adhesive in the normal use process. Therefore, the chopping board produced by the whole bamboo process is the preferable chopping board product.

In the prior art, in the cooking process of high-end food materials, a harsh food material processing temperature is needed, and the cutting of the food materials on a chopping board is particularly important as the first cooking step. The existing chopping block only has a heating function, is mainly used for solving the problem of mildewing of the chopping block, does not have a cooling function, and is difficult to be suitable for processing food materials with harsh temperature requirements; meanwhile, the existing chopping block can not be rapidly cooled after being heated, and only can wait for the natural cooling of the chopping block, thereby bringing inconvenience to the use.

Therefore, how to provide a non-spliced cutting board for processing whole bamboos and realize the functions of heating and cooling at the same time is a technical problem to be solved urgently by technical personnel in the field.

Disclosure of Invention

Therefore, the embodiment of the invention provides a whole bamboo processing splicing-free chopping board and a using method thereof, and aims to solve the related technical problems in the prior art.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

according to a first aspect of the embodiments of the present invention, there is provided a whole bamboo processing non-splicing chopping block, comprising an upper plate, a middle plate, a lower plate, an upper chamber, a lower chamber, semiconductor refrigeration sheets, a conversion controller, a first channel, a second channel, a one-way valve, a fan assembly, a fastening piece and a fastening piece groove, wherein a plurality of fastening piece grooves are uniformly arranged on outer edges of the upper plate and the lower plate, the fastening piece is arranged on an outer edge of the middle plate, the fastening piece is in splicing matching with the fastening piece groove, the upper chamber is formed between the upper plate and the middle plate, the middle plate and the lower plate form the lower chamber, the semiconductor refrigeration sheets respectively contacting with the upper chamber and the lower chamber are arranged in the center of the middle plate, the conversion lower chamber electrically connected with the semiconductor refrigeration sheets is arranged on the outer edge of the middle plate, the first channel and the second channel which are communicated with the upper chamber and the upper chamber are also arranged on the middle plate, and the second channel is also provided with a fan assembly, and the fan assembly is electrically connected with the conversion controller.

Further, still include a plurality of backup pads, the backup pad is located the upper chamber, the vertical setting of backup pad, backup pad upper end in close contact with the upper plate, board between backup pad lower extreme in close contact with.

Further, the rubber plate fixing device further comprises a mounting hole and a rubber plate, wherein the mounting hole is formed in the center of the lower plate, and the rubber plate is arranged on the mounting hole.

The rubber plate is provided with a third channel and a fourth channel, the third channel is arranged below the first channel, and the fourth channel is arranged below the second channel.

Furthermore, the rubber plate further comprises rubber covered edges, and the rubber covered edges are arranged on the outer edge and the lower end of the lower plate in an enclosing mode.

Further, still include the breather pipe, the breather pipe is located the third passageway upper end, be used for with first passageway butt joint.

Furthermore, the temperature sensing color changing strip is further included, and the temperature sensing color changing strip is stuck to the upper end of the upper plate.

According to a second aspect of the embodiments of the present invention, there is provided a method for using a cutting board, which is a non-spliced cutting board processed from whole bamboo as described above, comprising the steps of:

s1: adjusting a conversion controller, starting a semiconductor refrigerating sheet to heat the upper cavity by the upper end of the semiconductor refrigerating sheet, distinguishing whether the preset temperature is reached through a temperature sensing color changing strip, and starting to use a chopping board after the preset temperature is reached;

s2: the adjusting and converting controller is used for closing the semiconductor refrigeration piece, starting the fan assembly, enabling air in the upper cavity and the lower cavity to flow and exchange heat, enabling the upper end and the lower end of the semiconductor refrigeration piece to recover to the initial temperature, distinguishing whether the temperature reaches the preset temperature through the temperature sensing color-changing strip, and closing the fan assembly after the preset temperature is reached;

s3: the adjusting and converting controller is used for opening the semiconductor refrigerating sheet, so that the upper cavity is cooled by the upper end of the semiconductor refrigerating sheet, whether the preset temperature is reached or not is judged through the temperature sensing color changing strip, and the chopping board is used after the preset temperature is reached.

Further, the method also comprises the following steps:

s4: and pushing a third channel on the rubber plate to enable the vent pipe to be communicated with the first channel, adjusting the conversion controller and starting the fan assembly.

The embodiment of the invention has the following advantages:

according to the chopping board, the semiconductor refrigerating piece is arranged on the middle board, so that the chopping board can be heated or cooled in a smaller space, and the temperature of the chopping board can be adjusted more quickly; meanwhile, the first channel, the second channel and the fan assembly are arranged on the partition board, and air in the upper cavity and air in the lower cavity can be mixed through the fan assembly, so that the temperature of the cold end and the hot end of the semiconductor refrigerating piece can be adjusted, the semiconductor refrigerating piece can be quickly restored to an initial state, the hot end and the cold end of the semiconductor refrigerating piece are switched through the switching controller, the purpose of quickly adjusting the temperature of the chopping board is achieved, and meanwhile, the use stability of the semiconductor refrigerating piece is guaranteed; meanwhile, the vent pipe is arranged on the third channel, and the first channel and the third channel can be communicated through the vent pipe, so that air in the upper cavity and the lower cavity is replaced through the fan assembly, the cleanness of the air in the chopping board is guaranteed, and the mildew is prevented. The chopping board has the advantages of ingenious structural concept, rapid temperature adjustment of the chopping board, convenient use, safety and sanitation.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

FIG. 1 is a schematic front view of a non-spliced cutting board for processing whole bamboo according to an embodiment of the present invention;

fig. 2 is a schematic top view of a whole bamboo processing non-spliced chopping board provided in an embodiment of the present invention;

FIG. 3 is a schematic front view of an exploded view of a non-spliced cutting board for processing whole bamboo according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view of FIG. 3 provided in accordance with an embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of FIG. 4A according to an embodiment of the present invention;

FIG. 6 is a top view of a spacer provided in accordance with an embodiment of the present invention;

in the figure:

1, putting the plate on; 2, a plate; 3, a lower plate; 4 an upper cavity; 5, a lower cavity; 6, semiconductor refrigerating sheets; 7 a conversion controller; 8 a first channel; 9 a second channel; 10 a one-way valve; 11 a fan assembly; 12, a fastening piece; 13 fastener slots; 14 a support plate; 15 mounting holes; 16 rubber plates; 17 a third channel; 18 a fourth channel; 19 rubber wrapping; 20 a breather pipe; 21 thermochromic strip.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to solve the related technical problems in the prior art, according to a first aspect of the embodiment of the invention, the application provides a whole bamboo processing splicing-free chopping board, aiming at realizing the heating and cooling functions of the chopping board and simultaneously realizing the rapid temperature regulation of the chopping board. Referring to fig. 1-6, the semiconductor refrigeration device specifically includes an upper plate 1, a middle plate 2, a lower plate 3, an upper chamber 4, a lower chamber 5, a semiconductor refrigeration sheet 6, a conversion controller 7, a first passage 8, a second passage 9, a check valve 10, a fan assembly 11, a fastener 12, and a fastener groove 13. This embodiment uses circular chopping block as an example, the outward flange of upper plate 1 and hypoplastron 3 evenly sets up a plurality of

fastener grooves

13, 2 outward flanges of interval board be equipped with fastener 12 that fastener groove 13 is pegged graft and is matchd, promptly when the installation, fastener 12 of 2 outward flanges upper ends of interval board inserts in the fastener groove 13 of upper plate 1, realizes between board 2 and upper plate 1 fixed connection, and is the same, and fastener 12 of 2 outward flanges lower extreme of interval board inserts in the fastener groove 13 of hypoplastron 3, realizes between board 2 and the fixed connection of hypoplastron 3. Through above-mentioned structure, realize the stable installation of chopping block, the junction of upper plate 1, interval board 2 and hypoplastron 3 sets up the viscose to prevent gas leakage. An upper cavity 4 is formed between the upper plate 1 and the middle plate 2, and particularly, as shown in the figure, the upper cavity 4 is formed in the top of the upper plate 1, so that air can be stored conveniently. The lower cavity 5 is formed by the middle plate 2 and the lower plate 3, and particularly, as shown in the figure, the lower cavity 5 is formed in the bottom of the lower plate 3, so that air can be stored conveniently. The middle plate 2 center be equipped with semiconductor refrigeration piece 6 that epicoele 4 and lower chamber 5 contacted respectively, it is specific, set up a hole that holds semiconductor refrigeration piece 6 in the middle plate 2 center, fix semiconductor refrigeration piece 6 on this place hole again, the upper end and the epicoele 4 contact of semiconductor refrigeration piece 6, the lower extreme and the lower chamber 5 contact of semiconductor refrigeration piece 6, produce cold junction and hot junction through semiconductor refrigeration piece 6 behind the circular telegram to influence the temperature in epicoele 4 and lower chamber 5. It should be noted that no gap is left at the joint of the semiconductor refrigeration plate 6 and the middle plate 2, which does not cause the air in the upper chamber 4 and the lower chamber 5 to directly contact.

The outer edge of the middle plate 2 is provided with a conversion controller 7 electrically connected with the semiconductor refrigerating sheet 6, the conversion controller 7 is at least used for controlling the semiconductor refrigerating sheet 6, and the main function is that the upper end and the lower end of the semiconductor refrigerating sheet 6 are switched between the cold end and the hot end by changing the positive and negative electrode connection wires of the semiconductor refrigerating sheet 6, so that the temperature in the upper cavity 4 and the lower cavity 5 is adjusted. When the refrigerator is used, the conversion controller 7 is used for electrifying the semiconductor refrigerating sheet 6, so that the upper end of the semiconductor refrigerating sheet 6 is a hot end, and the lower end of the semiconductor refrigerating sheet 6 is a cold end, the temperature of the air in the upper cavity 4 rises, and the temperature of the upper plate 1 rises through heat transfer; on the contrary, the conversion controller 7 energizes the semiconductor refrigeration sheet 6, so that the upper end of the semiconductor refrigeration sheet 6 is a cold end, and the lower end of the semiconductor refrigeration sheet 6 is a hot end, so that the temperature of the air in the upper chamber 4 is reduced, and the temperature of the upper plate 1 is reduced through heat transfer.

And the intermediate plate 2 is also provided with a first channel 8 and a second channel 9 which are communicated with the upper cavity 4 and the lower cavity 5, so that the mutual replacement and mixing of air in the upper cavity 4 and the lower cavity 5 are conveniently realized. The first passage 8 and the second passage 9 are both provided with one-way valves 10, in this embodiment, the one-way valve 10 arranged on the first passage 8 is arranged in a forward direction and only enables air to flow from the upper chamber 4 to the lower chamber 5, and the one-way valve 10 arranged on the second passage 9 is arranged in a reverse direction and only enables air to flow from the lower chamber 5 to the upper chamber 4, so that control is conveniently achieved. And a fan assembly 11 is further arranged on the second channel 9, and the fan assembly 11 is used for providing power for air flowing between the upper cavity 4 and the lower cavity 5. The fan assembly 11 is electrically connected to the converting controller 7, and therefore, the converting controller 7 further has a function of controlling the fan assembly 11 to be turned on or off.

Because set up epicoele 4 in the upper plate 1, in order to prevent that upper plate 1 from taking place to warp in the use, furtherly, still set up a plurality of backup pads 14, a plurality of backup pads 14 parallel arrangement, backup pad 14 is located in the epicoele 4, backup pad 14 vertical setting, backup pad 14 upper end in close contact with upper plate 1, backup pad 14 lower extreme in close contact with intermediate lamella 2. The support plate 14 provides support between the upper plate 1 and the intermediate plate 2, improving the stability of the use of the upper plate 1, while the support plate 14 may be provided with holes through which air passes, thereby not causing free flow of air in the upper chamber 4.

In order to control the air temperature and cleanliness in the upper chamber 4 and the lower chamber 5, further, a mounting hole 15 and a rubber plate 16 are included. Specifically, a mounting hole 15 is formed in the center of the lower plate 3, and the rubber plate 16 is provided with the mounting hole 15. Further, the rubber plate comprises a third channel 17 and a fourth channel 18, the rubber plate 16 is provided with the third channel 17 and the fourth channel 18, the third channel 17 is arranged below the first channel 8, and the fourth channel 18 is arranged below the second channel 9. Therefore, through the arrangement of the third channel 17 and the fourth channel 18, at least the communication and replacement of the lower cavity 5 with the outside air can be realized, and through the communication of the lower cavity 5 with the outside air, the cleanness of the air in the lower cavity 5 is ensured, and the mildew is prevented.

In the use process, in order to prevent the chopping board from deviating during vibration, further, a rubber covered edge 19 is arranged, as shown in the figure, the rubber covered edge 19 is arranged around the outer edge and the lower end of the lower plate 3, so that the lower end of the rubber covered edge 19 can be in contact with the table top to play a role in buffering and preventing deviation; meanwhile, the rubber covered edge 19 can surround the outer side wall of the lower plate 3, so that protection is realized. Based on the structure, when the temperature stabilizing device is used, the lower cavity 5 is isolated from the outside, so that the temperature stability in the upper cavity 4 and the lower cavity 5 is ensured in the using process.

In order to further realize the replacement of the air in the upper chamber 4, a vent pipe 20 is further provided, and the vent pipe 20 is arranged at the upper end of the third channel 17 and is used for being in butt joint with the first channel 8. In the natural state, the upper end of the vent pipe 20 is not in contact communication with the first passage 8, so that only air flow between the upper chamber 4 and the lower chamber 5 is realized when the fan assembly 11 is turned on; when the rubber sheet 16 is pressed up manually, the upper end of the air duct 20 is inserted into the first passage 8 and communication with the first passage 8 is achieved, and in the case of opening the fan assembly 11, the flow direction of the air is: the outside air-the fourth channel 18-the lower cavity 5-the fan assembly 11-the second channel 9-the upper cavity 4-the first channel 8-the vent pipe 20-the third channel 17-the outside air. Therefore, the air in the upper chamber 4 and the lower chamber 5 can be replaced at the same time, the cleanness of the air in the upper chamber 4 and the lower chamber 5 is ensured, and the mildew is prevented.

Furthermore, the temperature sensing color changing strip 21 is also included, and the temperature sensing color changing strip 21 is adhered to the upper end of the upper plate 1. The user can judge the temperature of chopping block basically through observing temperature sensing discoloration strip 21, in good time application chopping block.

s1: the conversion controller 7 is adjusted, the semiconductor refrigeration piece 6 is started, the upper end of the semiconductor refrigeration piece 6 is a hot end, the upper end of the semiconductor refrigeration piece 6 is used for heating the upper cavity 4, whether the preset temperature is reached or not is judged through the temperature sensing color-changing strip 21, the chopping block starts to be used after the preset temperature is reached, and the next step is carried out after the use is finished.

S2: adjusting conversion controller 7, closing semiconductor refrigeration piece 6, and open fan assembly 11, make the interior air-moving heat exchange of epicoele 4 and cavity 5 down (the mode that the air flows in first passageway 8 and second passageway 9 is no longer repeated), thereby carry out the mixing heat exchange with the interior air of epicoele 4 and cavity 5 down, the air that mixes the flow carries out the heat exchange with the upper end and the lower extreme of semiconductor refrigeration piece 6 simultaneously, make the upper end and the lower extreme of semiconductor refrigeration piece 6 resume initial temperature fast, whether discerning through temperature sensing discoloration strip 21 has reached and has predetermine the temperature, and after reaching predetermineeing the temperature, close fan assembly 11. The use method in the step can enable the cold end and the hot end of the semiconductor refrigeration piece 6 to recover the initial temperature quickly, and the switching controller 7 is convenient to change the wiring of the semiconductor refrigeration piece 6. Therefore, the step can avoid the damage of the semiconductor refrigerating sheet 6 caused by directly changing the wiring of the semiconductor refrigerating sheet 6 (the damage of temperature impact caused by directly switching the cold end and the hot end of the semiconductor refrigerating sheet 6).

S3: based on the steps, the conversion controller 7 is adjusted, the semiconductor refrigerating sheet 6 is started, the upper end of the semiconductor refrigerating sheet 6 is enabled to cool the upper cavity 4, whether the preset temperature is reached or not is judged through the temperature sensing color changing strip 21, and the chopping board is started to be used after the preset temperature is reached.

S4: pushing the third channel 17 on the rubber plate 16 to connect the vent pipe 20 with the first channel 8 adjusts the switching controller 7 and turns on the fan assembly 11.

According to the chopping board, the semiconductor refrigerating sheet 6 is arranged on the middle board 2, so that the chopping board can be heated or cooled in a smaller space, and the temperature of the chopping board can be adjusted more rapidly; meanwhile, the first channel 8, the second channel 9 and the fan assembly 11 are arranged on the partition board 2, and air in the upper cavity 4 and the lower cavity 5 can be mixed through the fan assembly 11, so that the cold end and the hot end of the semiconductor refrigerating sheet 6 can be subjected to temperature regulation, the semiconductor refrigerating sheet 6 can be quickly restored to an initial state, the hot end and the cold end of the semiconductor refrigerating sheet 6 are converted through the conversion controller 7, the purpose of quickly adjusting the temperature of the chopping block is achieved, and meanwhile, the use stability of the semiconductor refrigerating sheet 6 is guaranteed; meanwhile, the vent pipe 20 is arranged on the third channel 17, the first channel 8 and the third channel 17 can be communicated through the vent pipe 20, so that air in the upper cavity 4 and the lower cavity 5 can be replaced through the fan assembly 11, the air in the chopping board is ensured to be clean, and the occurrence of mildew is prevented. The chopping board has the advantages of ingenious structural concept, rapid temperature adjustment of the chopping board, convenient use, safety and sanitation.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. The utility model provides a whole bamboo processing does not have concatenation chopping block, its characterized in that includes upper plate, intermediate plate, hypoplastron, epicoele, cavity of resorption, semiconductor refrigeration piece, conversion controller, first passageway, second passageway, check valve, fan subassembly, fastener and fastener groove, the outward flange of upper plate and hypoplastron evenly sets up a plurality of fastener grooves, the intermediate plate outward flange be equipped with the fastener groove grafting matched fastener, form the epicoele between upper plate and the intermediate plate, intermediate plate and hypoplastron form the cavity of resorption, the intermediate plate center be equipped with the semiconductor refrigeration piece that epicoele and cavity of resorption contacted respectively, the intermediate plate outward flange be equipped with the conversion controller that semiconductor refrigeration piece electricity is connected, still be equipped with first passageway and the second passageway of intercommunication epicoele and cavity of resorption on the intermediate plate, all be equipped with the check valve on first passageway and the second passageway, the check valve that sets up on the first passageway is forward setting, the one-way valve arranged on the second channel is arranged in a reverse direction, the second channel is also provided with a fan assembly, and the fan assembly is electrically connected with the conversion controller.

2. The cutting board for processing whole bamboo without splicing as claimed in claim 1, further comprising a plurality of supporting plates, wherein the supporting plates are arranged in the upper cavity, the supporting plates are vertically arranged, the upper ends of the supporting plates are in close contact with the upper plate, and the lower ends of the supporting plates are in close contact with the middle plate.

3. The cutting board for processing whole bamboo without splicing as claimed in claim 2, further comprising a mounting hole and a rubber plate, wherein the mounting hole is formed in the center of the lower board, and the rubber plate is provided with the mounting hole.

4. The cutting board for processing whole bamboo without splicing as claimed in claim 3, further comprising a third channel and a fourth channel, wherein the rubber board is provided with the third channel and the fourth channel, the third channel is arranged below the first channel, and the fourth channel is arranged below the second channel.

5. The cutting board for processing whole bamboo without splicing as claimed in claim 4, further comprising rubber wrapping edges, wherein the rubber wrapping edges are arranged around the outer edge and the lower end of the lower board.

6. The cutting board for processing whole bamboo without splicing as claimed in claim 5, further comprising a vent pipe arranged at the upper end of the third channel for butting against the first channel.

7. The whole bamboo processing splicing-free chopping board as claimed in claim 6, further comprising temperature-sensitive color-changing strips, wherein the temperature-sensitive color-changing strips are adhered to the upper end of the upper board.

8. A method of using a cutting board using the whole bamboo as claimed in claim 7, comprising the steps of:

9. A method of using an anvil as claimed in claim 8, further comprising the steps of: