CN111540994A - Transmission line and electronic device - Google Patents
Transmission line and electronic device Download PDFInfo
- Publication number
- CN111540994A CN111540994A CN201911329151.0A CN201911329151A CN111540994A CN 111540994 A CN111540994 A CN 111540994A CN 201911329151 A CN201911329151 A CN 201911329151A CN 111540994 A CN111540994 A CN 111540994A
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- China
- Prior art keywords
- hole
- transmission line
- layer
- signal line
- isolation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The invention provides a transmission line and electronic equipment, wherein the transmission line also comprises a first signal line embedded in the first ground layer and a second signal line embedded in the substrate layer, and the transmission line is provided with a through hole penetrating through the first ground layer, the substrate layer and the second ground layer so as to electrically connect the first signal line and the second signal line; the first grounding layer is provided with an avoiding groove, the first signal line is arranged in the avoiding groove, and the second grounding layer is provided with a first isolating groove around the through hole so as to electrically isolate the through hole from the second grounding layer. According to the transmission line provided by the invention, the through holes are formed in the substrate layer, so that the diameter is smaller, more space is provided for impedance adjustment of the transmission line, the processing process is simpler, the yield is high, and the yield of the transmission line is greatly improved.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to the field of signal transmission, and in particular, to a transmission line and an electronic device.
[ background of the invention ]
In the development of radio frequency transmission lines, vias have been an important part. Electromagnetic leakage, isolation problems and return loss problems caused by the via holes are always the key points of optimization. Compared with a through hole, the processing capacity of the existing blind hole is limited and large, and the overall performance of the transmission line can be directly influenced. At present, the mode of changing the inner layer wire into the outer layer wire mostly adopts the form of a blind hole, and in addition, a grounding through hole needs to be drilled around the blind hole to prevent electromagnetic leakage. However, in the prior art, the transition from the inner layer wire to the outer layer wire is realized in a blind hole mode, the size of the blind hole is greatly limited by the processing capacity, the diameter of the blind hole needs to be larger than the thickness of the lamination layer at present, so that the adjustment of the impedance at the through hole is limited, more importantly, the sizes of the corresponding hole ring and the corresponding counter hole ring are also increased, the return loss of the actual performance is poor, and the optimization space is small.
[ summary of the invention ]
It is an object of the present invention to provide a transmission line that reduces the problem of performance return loss.
According to the technical scheme, the transmission line comprises a first ground layer, a second ground layer and a substrate layer, wherein the substrate layer is arranged between the first ground layer and the second ground layer; the first grounding layer is provided with an avoiding groove, and the first signal line is arranged in the avoiding groove; the second grounding layer is provided with a first isolation groove around the through hole so as to electrically isolate the through hole from the second grounding layer.
Further, the transmission line still is provided with first ring hole, first ring hole sets up dodge the inslot, first ring hole is located the through-hole periphery and with the through-hole with first signal line electricity is connected.
Furthermore, the transmission line is further provided with a second hole ring, the second hole ring is arranged on the layer where the second signal line is located, and the second hole ring is arranged on the periphery of the through hole and electrically connected with the through hole and the second signal line.
The transmission line is further provided with a third hole ring, the third hole ring is arranged on the second grounding layer, the third hole ring is annularly arranged on the through hole and electrically connected with the through hole, and the first isolation groove is annularly arranged on the third hole ring.
The invention also provides electronic equipment, which comprises a metal structural part and the transmission line, wherein the transmission line is combined with the metal structural part.
Further, the metal structure is electrically connected to the second ground plane.
Furthermore, the metal structure is provided with a second isolation groove, and the second isolation groove is respectively communicated with the through hole and the first isolation groove so as to electrically isolate the metal structure from the through hole.
Further, the electronic device further includes a conductive portion disposed between the second ground layer and the metal structural member.
Furthermore, the conductive part is provided with an isolation hole which is communicated with the first isolation groove, the second isolation groove and the through hole.
The invention has the beneficial effects that: set up the through-hole in the substrate layer, for the blind hole, it is less to receive the restriction of throughput, and same substrate layer sets up the through-hole and can reach littleer diameter, provides more spaces for the impedance adjustment of transmission line, and the course of working is simpler, and the yield is high, has improved the goodness rate of transmission line greatly.
[ description of the drawings ]
FIG. 1 is an exploded perspective view of a transmission line according to an embodiment of the present invention;
FIG. 2 is a perspective assembly view of a transmission line of an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along A-A of FIG. 2;
fig. 4 is an enlarged view of B in fig. 3.
Description of the drawings: 1. a first ground plane; 10. a first signal line; 11. an avoidance groove; 2. a second ground plane; 20. a second signal line; 3. a substrate layer; 4. a through hole; 51. a first isolation trench; 52. a second isolation trench; 6. a metal structural member; 7. a conductive portion; 71. an isolation hole; 81. a first annular ring; 82. a second annular ring; 83. and a third annular ring.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present invention in its various embodiments. However, the technical solution claimed in the present invention can be implemented without these technical details and various changes and modifications based on the following embodiments.
The embodiment of the invention provides a transmission line and electronic equipment, wherein when an antenna is arranged in the electronic equipment, the antenna and a signal processing unit of the electronic equipment need to be electrically connected through the transmission line.
Referring to fig. 1 to 4, a transmission line includes a first ground plane 1, a second ground plane 2, and a substrate layer 3, the substrate layer 3 is disposed between the first ground plane 1 and the second ground plane 2, the transmission line further includes a first signal line 10 embedded in the first ground plane 1 and a second signal line 20 embedded in the substrate layer, and the transmission line is provided with a through hole 4 penetrating through the first ground plane 1, the substrate layer 3, and the second ground plane 2 to electrically connect the first signal line 10 and the second signal line 20; the first ground layer 1 is provided with an avoidance groove 11, and the first signal line 10 is arranged in the avoidance groove 11; the second ground plane 2 is provided with a first isolation groove around the through hole 21 to electrically isolate the through hole 21 from the second ground plane.
In this embodiment, the substrate layer 3 is sandwiched between the first ground layer 1 and the second ground layer 2, and the through hole 4 plated with copper on the surface penetrates through the substrate layer 3; and plating copper on the surface of the through hole 4 to conduct signals. The avoiding groove 11 and the first isolation groove 51 are hollowed in the ground layer, so that the through hole 4 is not in direct contact with the first ground layer 1 and the second ground layer 2, and the first ground layer 1 and the second ground layer 2 are prevented from being electrically connected with the through hole 4. The first signal wire 10 is arranged in the avoiding groove 11 and is electrically connected with the through hole 4 to form a microstrip line; the second signal line 20 is arranged in the substrate layer 3 to form a strip line, the strip line is electrically connected with the through hole 4 and indirectly electrically connected with a microstrip line, so that the transmission line structure which is converted from an inner line to an outer line or from the outer line to the inner line is realized, compared with blind hole connection, the limitation of the processing capacity of the through hole 4 is small, the same environment can reach smaller diameter, more space is provided for the adjustment of impedance, the processing process is simple, and the yield is high.
Preferably, the electronic device includes a metal structural member 6, the metal structural member 6 is made of a conductive material, and the metal structural member 6 is electrically connected to the second ground plane 2. The metal structure member 6 is provided with a second isolation groove 52, and the second isolation groove 52 is communicated with the through hole 4 and the first isolation groove 51, so that the metal structure member is electrically isolated from the through hole.
Specifically, metallic structure 6 is used for fixed transmission line to can strengthen the bulk strength of transmission line, the lateral direction that metallic structure 6 and second ground plane 2 contact is kept away from the direction of second ground plane 2 sunken, just the projection of first isolation groove 51 and through-hole 4 is all in the recess scope of second isolation groove 52, and through setting up second isolation groove 52, avoided through-hole 4 and metallic structure 6 to be connected, make through-hole 4 ground connection, prevent the signal access stratum of through-hole 4 in the recess top of second isolation groove 52 in through-hole 4 and first isolation groove 51 suspension promptly. Meanwhile, a closed structure formed between the metal structural part 6 and the second ground plane 2 can prevent electromagnetic leakage.
Preferably, the electronic device further includes a conductive portion 7, the conductive portion 7 is disposed between the second ground layer 2 and the metal structural member 6, the conductive portion 7 is provided with an isolation hole, and the isolation hole 71 communicates the first isolation groove 51, the second isolation groove 52, and the through hole 4.
Specifically, the conductive part 7 may be nickel-plated conductive cloth 7, gold-plated conductive cloth 7, carbon-plated conductive cloth 7, or aluminum foil fiber composite cloth with conductive characteristics, and the conductive part 7 is added between the second ground layer 2 and the metal structural member 6 to increase the conductive performance between the second ground layer 2 and the metal structural member 6. It will be understood that the isolation hole 71 is provided at the projected position of the conductive portion 7 with respect to the through hole 4, and on the one hand, the isolation hole 71 communicates with the through hole 4 and the second isolation groove 52, so as to prevent the conductive portion 7 from being electrically connected with the through hole 4, which leads to the grounding of the through hole 4.
Preferably, the transmission line is further provided with a first hole ring 81 and a second hole ring 82; the first hole ring 81 is arranged in the avoiding groove 11, and the first hole ring 81 is annularly arranged around the through hole 4 and electrically connected with the through hole 4 and the first signal line 10. The second hole ring 82 is disposed on the layer where the second signal line 20 is located, and the second hole ring 82 is disposed around the periphery of the through hole and electrically connected to the through hole 4 and the second signal line 20. The transmission line is further provided with a third hole ring 83, the third hole ring 83 is disposed on the second ground layer 2, the third hole ring 83 is annularly disposed on the through hole 4 and electrically connected to the through hole 4, and the first isolation slot 51 is annularly disposed on the third hole ring 83.
Specifically, the welding area of the through hole 4 is increased by the hole ring, and the contact area with the first signal line 10 and the second signal line 20 is increased, so that the connection of the through hole 4 with the first signal line 10 and the second signal line 20 is more stable.
In the embodiment that the above-mentioned provided, set up through-hole 4 in substrate layer 3, for the blind hole, the through-hole receives the restriction of processing ability less, and same substrate layer 3 sets up through-hole 4 and can reach littleer diameter, provides more spaces for the impedance adjustment of transmission line, and the course of working is simpler, and the yield is high, has improved the goodness rate of transmission line greatly.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (9)
1. A transmission line comprises a first grounding layer, a second grounding layer and a substrate layer, wherein the substrate layer is arranged between the first grounding layer and the second grounding layer; the first grounding layer is provided with an avoiding groove, and the first signal line is arranged in the avoiding groove; the second grounding layer is provided with a first isolation groove around the through hole so as to electrically isolate the through hole from the second grounding layer.
2. The transmission line of claim 1, further comprising a first annular ring disposed in the avoiding groove, the first annular ring being disposed at a periphery of the through hole and electrically connected to the through hole and the first signal line.
3. The transmission line of claim 1, further comprising a second annular ring disposed at a level of the second signal line, the second annular ring being disposed at a periphery of the through hole and electrically connected to the through hole and the second signal line.
4. The transmission line of claim 1, further comprising a third ring disposed on the second ground layer, wherein the third ring is disposed around and electrically connected to the via, and wherein the first isolation slot is disposed around the third ring.
5. An electronic device comprising a metallic structure, characterized in that the electronic device further comprises a transmission line according to any of the preceding claims 1-4, said transmission line being bonded to said metallic structure.
6. The electronic device of claim 5, wherein the second ground plane is electrically connected to the metallic structure.
7. The electronic device of claim 6, wherein the metal structure is provided with a second isolation groove, and the second isolation groove is respectively communicated with the through hole and the first isolation groove so as to electrically isolate the metal structure from the through hole.
8. The electronic device of claim 7, further comprising a conductive portion disposed between the second ground layer and the metallic structure.
9. The electronic device according to claim 8, wherein the conductive portion is provided with an isolation hole that communicates the first isolation groove, the second isolation groove, and the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911329151.0A CN111540994A (en) | 2019-12-20 | 2019-12-20 | Transmission line and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911329151.0A CN111540994A (en) | 2019-12-20 | 2019-12-20 | Transmission line and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111540994A true CN111540994A (en) | 2020-08-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911329151.0A Pending CN111540994A (en) | 2019-12-20 | 2019-12-20 | Transmission line and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111540994A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0848447A2 (en) * | 1996-12-12 | 1998-06-17 | Sharp Kabushiki Kaisha | Transmission circuit using strip line in three dimensions |
| FR2797351A1 (en) * | 1999-08-03 | 2001-02-09 | Mitsubishi Electric Corp | Supply for substrate line conductor includes holes passing through substrates with high impedance surroundings to enable HF supply |
| CN1531841A (en) * | 2001-01-16 | 2004-09-22 | ��ķ�����عɷ�����˾ | High frequency printed circuit board via VIA |
| CN101662882A (en) * | 2005-01-25 | 2010-03-03 | 财团法人工业技术研究院 | Transmission hole of matched high frequency broadband impedance |
| CN102804365A (en) * | 2010-03-31 | 2012-11-28 | 古河电气工业株式会社 | High-frequency circuit board |
-
2019
- 2019-12-20 CN CN201911329151.0A patent/CN111540994A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0848447A2 (en) * | 1996-12-12 | 1998-06-17 | Sharp Kabushiki Kaisha | Transmission circuit using strip line in three dimensions |
| FR2797351A1 (en) * | 1999-08-03 | 2001-02-09 | Mitsubishi Electric Corp | Supply for substrate line conductor includes holes passing through substrates with high impedance surroundings to enable HF supply |
| CN1531841A (en) * | 2001-01-16 | 2004-09-22 | ��ķ�����عɷ�����˾ | High frequency printed circuit board via VIA |
| CN101662882A (en) * | 2005-01-25 | 2010-03-03 | 财团法人工业技术研究院 | Transmission hole of matched high frequency broadband impedance |
| CN102804365A (en) * | 2010-03-31 | 2012-11-28 | 古河电气工业株式会社 | High-frequency circuit board |
Non-Patent Citations (1)
| Title |
|---|
| MARIO LEIB.ET.AL: "An ultra-wideband vertical transition from microstrip to stripline in PCB technology", 《2010 IEEE INTERNATIONAL CONFERENCE ON ULTRA-WIDEBAND》 * |
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Application publication date: 20200814 |