CN101997564B - Multi-antenna communication apparatus - Google Patents

Multi-antenna communication apparatus Download PDF

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Publication number
CN101997564B
CN101997564B CN 200910169392 CN200910169392A CN101997564B CN 101997564 B CN101997564 B CN 101997564B CN 200910169392 CN200910169392 CN 200910169392 CN 200910169392 A CN200910169392 A CN 200910169392A CN 101997564 B CN101997564 B CN 101997564B
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antenna
circuit board
communication apparatus
multi
ground
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CN 200910169392
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Chinese (zh)
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CN101997564A (en )
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吴民仲
罗绍谨
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雷凌科技股份有限公司
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Abstract

本发明的多天线通信装置包含具有多层导体的电路板及两个天线组件。 Multi-antenna communication apparatus according to the present invention comprises a circuit board and an antenna assembly having two layers of conductors. 所述天线组件分别设置于所述电路板的不同层的天线部上。 The antenna assemblies are disposed on different layers of an antenna portion of the circuit board. 所述天线组件设置于所述电路板的天线部上,且各具有一接地端。 The antenna assembly is disposed on the antenna portion of the circuit board, and each having a ground terminal. 所述接地端电性连接至所述电路板中不同层的导体,且所述两个天线组件之间的电流路径经由所述两个天线组件中的其中一个的所述接地端至另一层电路板的主接地通孔,并电性连接至所述两个天线组件中的其中另一个的所述接地端。 Said ground terminal is electrically connected to the conductors of different layers of the circuit board, and the current path between the two ends of the antenna assembly via the two antennas wherein the ground is a component to another said ground terminal ground vias main circuit board, and electrically connected to the antenna assembly wherein two of the other.

Description

多天线通信装置技术领域[0001] 本发明涉及无线通信装置,特别涉及多天线的无线通信装置。 Multi-antenna communication apparatus Technical Field [0001] The present invention relates to wireless communications, and more particularly relates to a multi-antenna radio communication apparatus. 背景技术[0002] 传统的无线通信装置在发射端使用单一天线发射电磁波以传输信号,而在接收端亦使用单一天线以接收电磁波所搭载的信号。 [0002] Conventional wireless communication apparatus radiates electromagnetic waves to transmit signals at the receiving end also uses a single antenna to receive an electromagnetic wave signal using a single antenna mounted at the transmitting end. 然而随着通信算法的演进以及集成电路制造方法的进步,无线通信装置不再只局限于使用单一天线作为发射和接收电磁波的组件。 However, with the advances in integrated circuit manufacturing method, and an evolved communication method, the wireless communication device is no longer confined to a single antenna assembly as transmitting and receiving electromagnetic waves. [0003] 多输入多输出(mult1-1nput and mult1-output, ΜΙΜΟ)的无线通信装置使用多个天线作为发射和接收电磁波的组件。 [0003] Multiple Input Multiple Output (mult1-1nput and mult1-output, ΜΙΜΟ) radio communication apparatus using multiple antennas as assemblies of transmitting and receiving electromagnetic waves. 由于其具有空间差异(spectral diversity)的特性,多输入多输出的无线通信装置能在不牺牲频宽以及功率消耗的条件下达到较高的传输通量以及较远的传输距离。 Because of its spatial difference (spectral diversity) characteristics of the MIMO wireless communication apparatus can achieve high throughput and transmission at transmission distance without sacrificing bandwidth and power consumption. 由于具备上述这种优点,多输入多输出的无线通信装置已逐渐成为主流的无线通信装置。 This includes the above advantages, the multiple input multiple output wireless communication device has gradually become the mainstream of the wireless communication device. [0004] 在无线通信装置的设计中,一般设置一天线装置于一射频(radio frequency,RF)电路电路板的天线部。 [0004] In the design of wireless communication device, an antenna device is generally provided in a radio frequency antenna portion (radio frequency, RF) circuit board. 传统射频电路为使接地电压均匀分布,都会在电路板上的空旷部位广设主接地通孔(global ground via)。 Traditional RF circuit voltage uniform distribution of the ground, will open wide portion disposed on the main circuit board ground vias (global ground via). 图1显示一传统的双天线通信装置的电路板布局方式。 1 shows a conventional two-circuit board antenna communication apparatus layout. 如图1所示,该双天线通信装置100包含射频电路电路板110,其中该射频电路电路板110包含四层电路板,并均匀设置贯穿该四层电路板110的多个主接地通孔140。 1, the dual-antenna radio communication apparatus 100 comprises a circuit board 110, wherein the radio frequency circuit board 110 comprises four circuit board, and a plurality of uniformly disposed through the through-hole 140 of the main ground of the circuit board 110 of the four-layer . 该射频电路电路板110另包含一第一天线组件120和一第二天线组件130。 The RF circuit 110 further comprises a circuit board assembly 120, a first antenna and a second antenna assembly 130. 该第一天线组件120设置于第一层电路板的天线部,而该第二天线组件130则设置于第四层电路板的天线部。 The first antenna portion of antenna assembly 120 disposed on a first side of the board, and the antenna assembly 130 disposed on the fourth layer of the antenna portion of the circuit board. [0005] 无线通信装置多半要求具有较高的辐射效率,而在多输入多输出的无线通信装置中,天线之间的隔离度是影响天线辐射效率的重要因素。 [0005] Most of the radio communication apparatus requires a high radiation efficiency, whereas in a multiple input multiple output wireless communication device, isolation between the antennas is an important factor affecting the radiation efficiency of the antenna. 然而,随着消费性电子对产品要求轻、薄、短、小的趋势,各种无线通信装置亦逐渐缩小而使得天线之间的摆放距离缩短,故进而造成天线之间的隔离度降低。 However, as consumer electronics products required to be light, thin, short, small trend, various wireless communication devices also tapered such that the distance between the antennas placed shortened, thereby causing it to reduce the isolation between the antennas. [0006] 为解决天线之间的隔离度降低的问题,一般在两支天线的馈入点之间加入开路传输线,或在两支天线的馈入点之间的电路板挖槽。 [0006] In order to solve the isolation between the antenna problem of the reduction is generally between the antenna feed point is added two open transmission line, a circuit board or the grooving between two feeding points of the antenna. 图2显示以天线馈入之点之间加入开路传输线的方式应用于图1的双天线通信装置。 Figure 2 shows the embodiment added to the open transmission line between the antenna feed point to a double-antenna communication apparatus of FIG. 如图2所示,该第一天线组件120和该第二天线组件130分别设置于该射频电路电路板110的左右两侧以增加隔离度。 2, the first antenna component 120 and the second antenna assembly 130 are disposed around the RF circuit on both sides of the circuit board 110 to provide additional isolation. 该双天线通信装置100又于所述天线的馈入点之间增加长度为该双天线通信装置100所发射电磁波1/4波长的开路传输线,以进一步增加天线之间的隔离度。 The dual-antenna communication between the apparatus 100 and the feeding point of the antenna to increase the length of the dual-antenna communication apparatus open transmission line quarter wavelength of electromagnetic waves emitted 100, to further increase the isolation between antennas for. [0007] 图3显示以天线馈入点之间的电路板挖槽应用于图1的双天线通信装置。 [0007] FIG. 3 shows the circuit board between the antenna feed point the antenna to a double chamfer 1 of the communication apparatus of FIG. 如图3所示,该第一天线组件120和该第二天线组件130分别设置于该射频电路电路板110的左右两侧以增加隔离度。 As shown in FIG. 3, the first antenna component 120 and the second antenna assembly 130 are disposed around the RF circuit on both sides of the circuit board 110 to provide additional isolation. 该双天线通信装置100又于所述天线的馈入点之间的该射频电路电路板110挖槽,其中该挖槽的长度约为该双天线通信装置100所发射电磁波1/4波长,且该挖槽部位无表面组件或走线,以进一步增加天线之间的隔离度。 The dual antenna 100 and the communication apparatus 110 to the RF circuit of the circuit board between the grooving feeding point of the antenna, wherein the chamfer is approximately the length of the dual-antenna communication 1/4 wavelength electromagnetic wave emission device 100, and the chamfer surface portion without traces or components, to further increase the isolation between antennas. [0008] 然而,上述两种增加天线之间隔离度的方式皆增加额外的电路板面积或制造步骤。 [0008] However, increasing the isolation between the two antennas embodiment are additional board area or manufacturing steps. 因此,当设计小尺寸的无线通信装置,例如通用串行总线(Universal Serial Bus,USB)装置时,所述方式即难以加以应用。 Thus, when the radio communication apparatus small-sized design, such as a universal serial bus (Universal Serial Bus, USB) apparatus, in a manner that is difficult to be applied. [0009] 图4显示图1的双天线通信装置的侧视图。 [0009] FIG. 4 shows a side view of the dual-antenna communication apparatus 1 of FIG. 如图4所示,该第一天线组件120和该第二天线组件130之间的电流路径自该第一天线组件120经由该第一天线组件120的接地端,连接至第二层电路板天线部的主接地通孔140,连接至第三层电路板天线部的主接地通孔140,再经由该第二天线组件130的接地端连接至该第二天线组件130。 4, the first current path between the antenna assembly 120 and the second antenna assembly 130 from the first antenna assembly 120 via the ground terminal of the first antenna assembly 120 is connected to the second antenna circuit board layer the main portion of ground vias 140, ground vias connected to the main circuit board of the third layer of the antenna portion 140, and then connected to the antenna assembly 130 via the ground terminal of the antenna assembly 130. 如图4所示,如此短的电流路径造成该第一天线组件120和该第二天线组件130之间的耦合效应过大,而使得彼此之间的隔离度过低。 , Such a short current path shown in Figure 4 causes the first antenna component 120 and the second antenna coupling effect between the assembly 130 is too large, such that the isolation between them is too low. [0010] 据此,有必要设计一种新型的电路板布局方式,其可在不增加电路板面积的情况下,提高天线之间的隔离度及天线辐射效率。 [0010] Accordingly, it is necessary to design a new board layout, which may be, without increasing the area of ​​the board, and improve the isolation between the antenna radiation efficiency of the antenna. 发明内容[0011] 本发明的多天线通信装置打破传统射频电路的设计观念,通过减少天线之间的接地通孔而增加天线之间的回流路径以减轻电路板上地电流的回流耦合效应,进而达到高天线之间的隔离度及天线辐射效率的目的。 SUMMARY OF THE INVENTION [0011] The multi-antenna communication apparatus according to the present invention is to break the traditional RF circuit design concept, and by increasing the return path between the ground vias to reduce the antenna between the antennas to mitigate the effects of coupling the circuit board to reflux current, and further purpose and antenna isolation between the high radiation efficiency of the antenna. [0012] 本发明的实施例的多天线通信装置包含具有多层导体的电路板及两个天线组件。 [0012] Multi-antenna communication apparatus of an embodiment of the present invention comprises a circuit board and an antenna assembly having two layers of conductors. 所述天线组件设置于该电路板的天线部上,且各具有一接地端。 The antenna assembly is disposed on the antenna portion of the circuit board, and each having a ground terminal. 所述接地端电性连接至该电路板中不同层的导体,并且其中所述两个天线组件之间的电流路径经由所述两个天线组件中的其中一个的所述接地端至另一层电路板的主接地通孔,并电性连接至所述两个天线组件中的其中另一个的所述接地端。 Said ground terminal is electrically connected to the conductors of different layers of the circuit board, and wherein said current path between said two antenna assembly via a ground terminal wherein the two antenna assembly to another said ground terminal ground vias main circuit board, and electrically connected to the antenna assembly wherein two of the other. [0013] 本发明的另一实施例的多天线通信装置包含四层电路板、一第一天线组件和一第二天线组件。 [0013] The multi-antenna communication apparatus according to another embodiment of the present invention comprising a four-layer circuit board, a first antenna assembly and a second antenna assembly. 所述电路板于天线部以外区域具有贯穿各层的主接地通孔。 Said circuit board having a main ground vias through layers in a region other than the antenna portion. 该第一天线组件设置于最上层电路板的天线部。 The first antenna assembly is provided in the uppermost portion of the antenna circuit board. 该第二天线组件设置于最下层电路板的天线部。 The second antenna assembly disposed in the lowermost portion of the antenna circuit board. 该第一天线组件经由一第一接地端电性连接至第二层电路板的导线,再电性连接至第二层电路板的主接地通孔。 The first antenna assembly is connected via a first grounding terminal electrically to the conductor layer of the second circuit board, and then electrically connected to the main ground vias of the second layer of the circuit board. 该第二天线组件经由一第二接地端电性连接至第三层电路板的导线,再电性连接至第三层电路板的主接地通孔。 The second antenna assembly is connected via a second ground conductor electrically to the circuit board of the third layer, and then electrically connected to the main ground vias third layer of the circuit board. 附图说明[0014] 图1显示一传统的双天线通信装置的电路板布局方式;[0015] 图2显示另一传统的双天线通信装置的电路板布局方式;[0016] 图3显示另一传统的双天线通信装置的电路板布局方式;[0017] 图4显示一传统的双天线通信装置的侧视图;[0018] 图5显示本发明的实施例的多天线通信装置的示意图;[0019] 图6显示本发明的实施例的多天线通信装置的侧视图;以及[0020] 图7显示本发明的另一实施例的多天线通信装置的示意图。 BRIEF DESCRIPTION [0014] FIG. 1 shows a conventional circuit board layout of the dual-antenna communication apparatus; [0015] Figure 2 shows another conventional circuit board layout of the dual-antenna communication apparatus; [0016] FIG. 3 shows another traditional circuit board layout of the dual-antenna communication apparatus; [0017] FIG. 4 shows a side view of a conventional dual-antenna communication apparatus; [0018] FIG. 5 is a schematic embodiment of a multi-antenna communication apparatus according to the present embodiment of the invention is shown; [0019 ] shows an embodiment of the present invention is a side view of the multi-antenna communication apparatus of FIG. 6; and [0020] Figure 7 shows another multi-antenna communication apparatus according to the present embodiment of the invention. FIG. [0021]【主要组件符号说明】[0022] 100双天线通信装置[0023] 110射频电路电路板[0024] 120第一天线组件[0025] 130第二天线组件[0026] 140主接地通孔[0027] 500多天线通信装置[0028] 510射频电路电路板[0029] 520第一天线组件[0030] 530第二天线组件[0031] 540主接地通孔[0032] 550 导线[0033] 560 导线[0034] 700多天线通信装置[0035] 710射频电路电路板[0036] 720第一天线组件[0037] 730第二天线组件[0038] 740主接地通孔具体实施方式[0039] 图5显示本发明的实施例的多天线通信装置的示意图。 [0021] The main components REFERENCE NUMERALS [0022] 100 pairs of antenna communication apparatus [0023] 110 RF circuit board [0024] 120 first antenna assembly [0025] 130 second antenna assembly [0026] 140 main ground via [ 0027] 500 antenna communication apparatus [0028] 510 RF circuit board [0029] 520 first antenna assembly [0030] 530 second antenna assembly [0031] 540 of the main ground vias [0032] 550 conductor [0033] 560 wires [ 0034] 700 antenna communication apparatus [0035] 710 RF circuit board [0036] 720 first antenna assembly [0037] 730 second antenna assembly [0038] 740 of the main ground vias DETAILED DESCRIPTION [0039] FIG. 5 shows the invention the multi-antenna communication apparatus in a schematic embodiment. 如图5所示,该多天线通信装置500为一双天线通信装置。 5, the multi-antenna communication apparatus 500 to one pair of antenna communication apparatus. 该多天线通信装置500包含射频电路电路板510,其中该射频电路电路板510举例来说包含四层电路板。 The multi-antenna communication apparatus 500 includes a radio frequency circuit of the circuit board 510, wherein the radio frequency circuit board 510 comprises four circuit board for example. 该射频电路电路板510另包含一第一天线组件520和一第二天线组件530。 The radio frequency circuit board 510 further comprises a first antenna assembly 520 and a second antenna assembly 530. 该第一天线组件520设置于第一层电路板的天线部的左侦牝而该第二天线组件530则设置于第四层电路板的天线部的右侧。 The first antenna assembly 520 disposed in the left portion of the first layer of the antenna circuit board and the female investigation antenna assembly 530 disposed on the right side of the antenna portion of the fourth layer circuit board. 该第一天线组件520和该第二天线组件530的排列可采左右对称。 The arrangement of the first antenna component 520 and the second antenna assembly 530 can be taken symmetrical. 该射频电路电路板510仅于其主板部均匀设置贯穿该四层电路板510的多个主接地通孔540,而于其天线部并无设置主接地通孔540。 The radio frequency circuit board 510 is provided only uniform portion thereof motherboard through a plurality of main circuit board of the four-layer ground vias 540 510, and the antenna portion thereof not provided with the through hole 540 of the main ground. [0040] 图6显示本发明的实施例的多天线通信装置的侧视图。 [0040] FIG. 6 shows a side view of the multi-antenna communication apparatus of an embodiment of the present invention. 如图6所示,该第一天线组件520设置于第一层电路板的天线部,而该第一天线组件520的接地端连接至第二层电路板,再经由导线550连接至主板部的主接地通孔540。 6, the first antenna portion of antenna assembly 520 disposed on a first side of the board, and the first ground end of the antenna assembly 520 is connected to a second layer circuit board, then connected to the motherboard 550 via the wire portion main ground vias 540. 该第二天线组件530设置于第四层电路板的天线部,而该第二天线组件530的接地端连接至第三层电路板,再经由导线560连接至主板部的主接地通孔540。 The second antenna portion of the antenna assembly 530 is provided a fourth layer of the circuit board, and the second antenna assembly 530 is connected to the third ground layer of the circuit board, and then connected to the ground via a main portion of the motherboard 540 via a wire 560. 该第一天线组件520和该第二天线组件530之间的电流路径如图6所示,自该第一天线组件520经由该第一天线组件520的接地端,通过第二层电路板的导线550,连接至第二层电路板的主接地通孔540,连接至第三层电路板的主接地通孔540,通过第三层电路板的导线560,再经由该第二天线组件530的接地端连接至该第二天线组件530。 A current path between the first antenna component 520 and the second antenna assembly 530 shown in Figure 6, from the first antenna assembly 520 via the ground terminal of the first antenna assembly 520, through the second conductor layer of the circuit board 550, the second layer is connected to the main circuit board ground vias 540 is connected to ground via the main circuit board 540 of the third layer, the third layer 560 through the wire circuit board, and then is grounded via the second antenna assembly 530 terminal is connected to the antenna assembly 530. [0041] 如图6所示,该第一天线组件520和该第二天线组件530之间的电流路径相比于现有技术有大幅增长,故得以大幅增加天线之间的隔离度。 [0041] As shown in FIG 6, the first current path between the antenna assembly 520 and the second antenna assembly 530 compared to the prior art has increased significantly, and therefore is a substantial increase in isolation between the antennas. 在本发明的部分实施例中,该电流路径的长度约等于该多天线通信装置500的电磁波波长的1/4。 In the part of the present embodiment of the invention, the length of the current path is approximately equal to a quarter wavelength of electromagnetic waves of the multi-antenna communication device 500. 值得注意的是,图6的实施例的多天线通信装置虽将该第一天线组件520和该第二天线组件530设置于不同层电路板,然而本发明的多天线通信装置并不限于此种实施方式。 Notably, the multi-antenna communication apparatus according to the embodiment of FIG 6, although the first antenna component 520 and the second antenna assembly 530 disposed on the different layers of the circuit board, however, multi-antenna communication apparatus according to the present invention is not limited to such embodiment. 例如该第一天线组件520和该第二天线组件530亦可设置于同一层电路板而仍可达到本发明的目的。 For example, the first antenna component 520 and the second antenna assembly 530 may also be disposed in the same layer of the circuit board and still achieve the object of the present invention. 此外,图5的实施例的多天线通信装置虽于天线部并无设置主接地通孔,然而本发明的多天线通信装置并不限于此种实施方式。 Further, the multi-antenna communication apparatus of FIG. 5 embodiment, although not provided in the antenna portion of the main ground vias, however, multi-antenna communication apparatus according to the present invention is not limited to such embodiments. 例如该射频电路电路板510于天线部亦可设置少许主接地通孔,使所述主接地通孔的分布密度小于分布于该射频电路电路板510的主板部的主接地通孔的分布密度。 For example, the radio frequency circuit board 510 to the main antenna portion may also be disposed slightly ground vias, so that the distribution density of the main ground vias is less than the density distribution in the main distribution board ground via the RF circuit portion 510 of the circuit board. 只要所述主接地通孔的设置可增加该第一天线组件520和该第二天线组件530之间的回流路径以减轻该射频电路电路板510上地电流的回流耦合效应,则仍可达到本发明的目的。 As long as the setting main ground vias increase the return path between the first antenna component 520 and the second antenna assembly 530 to mitigate the effects of radio frequency circuit coupled to reflux circuit board 510 on the current, this can reach the the object of the invention. [0042] 图7显示本发明的另一实施例的多天线通信装置的示意图。 [0042] Figure 7 shows a schematic view of a multi-antenna communication apparatus according to another embodiment of the present invention. 该多天线通信装置700为一双天线通信装置,并应用于通用串行总线装置(USB dongle)。 The multi-antenna communication apparatus 700 to one pair of antenna communication apparatus, and the apparatus is applied to a Universal Serial Bus (USB dongle). 如图7所示,该多天线通信装置700的尺寸约为长35毫米,宽11毫米。 As shown in FIG 7, the size of the multi-antenna communication apparatus 700 is approximately 35 mm long, 11 mm wide. 该多天线通信装置700包含射频电路电路板710、一第一天线组件720、一第二天线组件730和多个主接地通孔740。 The multi-antenna radio communication device 700 includes a circuit board 710, a first antenna assembly 720, a second antenna assembly 730 and a plurality of ground vias 740 main. 该射频电路电路板710包含四层电路板。 The radio frequency circuit board 710 comprises four circuit boards. 该第一天线组件720和该第二天线组件730的尺寸约为长10晕米,宽4晕米,并左右对称地设置于该射频电路电路板710的两侧。 The size of the first antenna component 720 and the second antenna assembly 10 length of about 730 meters halo, halo 4 meters wide, and symmetrically disposed on both sides of the circuit board 710 of the radio frequency circuit. 该射频电路电路板710的第二层和第三层皆包含导线以将该第一天线组件720和该第二天线组件730的接地端电性连接至所述主接地通孔740。 The radio frequency circuit board 710 of the second and third layers of wires are to comprise the first antenna assembly 720 and the ground terminal of the antenna assembly 730 is electrically connected to the main ground vias 740. 所述导线的长度约介于8毫米至12毫米之间。 The length of the wire is between about 8-12 mm. 根据图7的电路板布局设计,该多天线通信装置700能良好地操作于2.4至2.5GHz的频率。 The circuit board layout design of FIG. 7, the multi-antenna communication apparatus 700 can operate well at frequencies in the 2.4 to 2.5GHz. [0043] 依照实验结果,图7的多天线通信装置700于操作于2.4至2.5GHz的频率时,在Sll的回响损耗(return loss)均约为-1OdB,达到标准天线的要求。 When [0043] In accordance with experimental results, the multi-antenna communication apparatus 700 in FIG. 7 operating in a frequency of 2.4 to 2.5GHz, the echo loss (return loss) in Sll are about -1OdB, meet the standard requirements of the antenna. 该多天线通信装置700在S21的隔离度方面,在2.4GHz及2.5GHz频率均超过现有技术于同尺寸的多天线通信装置至少IdB的幅度。 The multi-antenna communication apparatus 700 in terms of isolation of S21, 2.4GHz and 2.5GHz frequency in excess of the magnitude of the prior art in the same multi-antenna communication apparatus size of at least IdB. 在增益方面,该多天线通信装置700亦较同尺寸的双天线通信装置具有明显的成长。 In terms of gain, the multi-antenna communication device 700 having a significant growth Yijiao homobifunctional antenna communication apparatus size. [0044] 综上所述,本发明的多天线通信装置打破传统射频电路的设计观念,通过减少天线之间的接地通孔而增加天线之间的回流路径以减轻电路板上地电流的回流耦合效应,而能在不增加电路板面积的情况下,达到大幅增加隔离度的目的。 [0044] In summary, the multi-antenna communication apparatus according to the present invention is to break the traditional RF circuit design concept, and by increasing the return path between the ground vias to reduce the antenna between the antennas in order to reduce the circuit board is coupled to reflux current effect, but can without increasing the area of ​​the circuit board, to achieve a substantial increase in isolation. [0045] 本发明的技术内容及技术特点已揭示如上,然而本领域技术人员仍可能基于本发明的教示及揭示而作出种种不背离本发明精神的替换及修饰。 [0045] The technical contents and technical features of the present invention have been described in detail, those skilled in the art may still be based on the teachings of the present invention and disclosed in various substitutions and modifications made without departing from the spirit of the invention. 因此,本发明的保护范围应不限于实施例所揭示的,而应包括各种不背离本发明的替换及修饰,并被权利要求书的专利范围所涵盖。 Accordingly, the scope of the present invention should not be limited to the embodiments disclosed, but should include various substitutions and modifications without departing from the present invention, and the scope of the patent claims are covered. ` `

Claims (9)

  1. 1.一种多天线通信装置,包含: 具多层导体的电路板;以及两个天线组件,其设置于所述电路板的天线部上,且各具有一接地端; 其中所述接地端电性连接至所述电路板中不同层的导体,并且其中所述两个天线组件之间的电流路径经由所述两个天线组件中的其中一个的所述接地端至另一层电路板的主接地通孔,并电性连接至所述两个天线组件中的其中另一个的所述接地端。 A multi-antenna communication apparatus, comprising: a conductor having a multi-layer circuit board; and two antenna assembly disposed on the antenna portion of the circuit board, and each having a ground; wherein the ground terminal connected to the conductors of different layers of the circuit board, and wherein a current path between the two antennas via the main assembly of the two antenna assembly wherein a ground terminal of the circuit board to another ground via the ground terminal and electrically connected to the antenna assembly wherein two of the other.
  2. 2.根据权利要求1所述的多天线通信装置,其中所述天线组件于所设置的天线部上并无主接地通孔。 2. A multi-antenna communication apparatus according to claim 1, wherein there is no master on the ground via an antenna portion of the antenna assembly to the set.
  3. 3.根据权利要求1所述的多天线通信装置,其中所述天线组件于所设置的天线部上具有主接地通孔,而所述主接地通孔的分布密度小于分布于所述电路板的主板部的主接地通孔的分布密度。 The multi-antenna communication apparatus according to claim 1, wherein a through hole having a main antenna ground portion provided in the antenna assembly, and said distribution density is less than the primary ground vias is distributed to the circuit board the distribution density of the main board ground vias portion.
  4. 4.根据权利要求1所述的多天线通信装置,其中所述天线组件设置于所述电路板的同一层。 The multi-antenna communication apparatus according to claim 1, wherein the antenna assembly disposed in the same layer of said circuit board.
  5. 5.根据权利要求1所述的多天线通信装置,其中所述天线组件设置于所述电路板的不同层。 Multi-antenna communication apparatus according to claim 1, wherein the antenna assembly disposed in different layers of the circuit board.
  6. 6.根据权利要求1所述的多天线通信装置,其中所述电流路径的长度约等于所述多天线通信装置的电磁波波长的1/4。 The multi-antenna communication apparatus according to claim 1, wherein the current path length is approximately equal to 1/4 of the multi-antenna communication apparatus of the wavelength of electromagnetic waves.
  7. 7.根据权利要求1所述的多天线通信装置,其中所述天线组件对称设置于所述电路板的天线部的左右侧。 The multi-antenna communication apparatus according to claim 1, wherein said antenna assembly is provided symmetrically on left and right sides of the antenna portion of the circuit board.
  8. 8.根据权利要求1所述的多天线通信装置,其应用于通用串行总线装置。 Multi-antenna communication apparatus according to claim 1, which is applied to a Universal Serial Bus device.
  9. 9.根据权利要求1所述的多天线通信装置,其操作于2.4至2.5GHz的频率。 9. A multi-antenna communication apparatus according to claim 1, in which the operating frequency of 2.4 to 2.5GHz.
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Citations (3)

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Publication number Priority date Publication date Assignee Title
US5124733A (en) 1989-04-28 1992-06-23 Saitama University, Department Of Engineering Stacked microstrip antenna
CN1713448A (en) 2004-06-22 2005-12-28 明基电通股份有限公司 Antenna device
CN2924811Y (en) 2006-03-02 2007-07-18 汉达精密电子(昆山)有限公司 PCB antenna

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124733A (en) 1989-04-28 1992-06-23 Saitama University, Department Of Engineering Stacked microstrip antenna
CN1713448A (en) 2004-06-22 2005-12-28 明基电通股份有限公司 Antenna device
CN2924811Y (en) 2006-03-02 2007-07-18 汉达精密电子(昆山)有限公司 PCB antenna

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