CN111538696A - Signal loss detection method and device, electronic equipment and medium - Google Patents
Signal loss detection method and device, electronic equipment and medium Download PDFInfo
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Abstract
The application provides a signal loss detection method, a signal loss detection device, an electronic device and a computer-readable storage medium, wherein the method comprises the following steps: acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature; matching the high and low temperature signal loss relation between the target PCB and a preset board to obtain a target high and low temperature signal loss relation corresponding to the target PCB; determining target high-temperature signal loss data based on the relationship between the target normal-temperature signal loss data and the target high-low temperature signal loss; and comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result. According to the method and the device, the high-low temperature signal loss relation is obtained through testing, the target high-temperature signal loss data is determined by utilizing the corresponding target high-low temperature signal loss relation in the actual detection process, the accurate high-temperature signal loss data can be obtained, and the integrity of a PCIE link design signal is further ensured.
Description
Technical Field
The present disclosure relates to the field of detection technologies, and in particular, to a signal loss detection method, a signal loss detection apparatus, an electronic device, and a computer-readable storage medium.
Background
In the design of the Incloud server, particularly in a PCIE high-speed signal interconnection topological link, as the signal rate increases, the signal changes with the change of the operating environment, and the loss changes, particularly the influence of the temperature and the humidity in the operating environment, wherein the humidity can be controlled, but the operating temperature usually reaches a high temperature of 85 ℃, so that the signal integrity is reduced.
For evaluation of a PCIE high-speed link, high-temperature data simulation is used in the related art, but the accuracy of data obtained through simulation is low, which increases a design margin and may result in over-design.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a signal loss detection method, a signal loss detection device, an electronic device and a computer readable storage medium, which can obtain accurate high-temperature signal loss data, and further ensure the integrity of a PCIE link design signal. The specific scheme is as follows:
the application provides a signal loss detection method, which comprises the following steps:
acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature;
matching the high-low temperature signal loss relation between the target PCB and a preset board to obtain a target high-low temperature signal loss relation corresponding to the target PCB;
determining target high-temperature signal loss data based on the target normal-temperature signal loss data and the target high-low-temperature signal loss relation;
and comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
Optionally, the process of establishing the relationship between the signal loss of the preset plate at high and low temperatures includes:
acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting in sequence to obtain corresponding normal-temperature fitting curves;
obtaining high-temperature signal loss data corresponding to the middle loss PCB, the low loss PCB and the ultra-low loss PCB at high temperature, and fitting in sequence to obtain corresponding high-temperature fitting curves;
and determining a high-low temperature signal loss relation according to the normal temperature fitting curve and the high temperature fitting curve so as to obtain the high-low temperature signal loss relation of the middle loss PCB plate, the high-low temperature signal loss relation of the low loss PCB plate and the high-low temperature signal loss relation of the ultra-low loss PCB plate.
Optionally, the temperature range corresponding to the normal temperature is 25-35 ℃, including end points;
correspondingly, the high temperature corresponds to a temperature range of 75-85 degrees celsius, inclusive.
Optionally, the comparing the target high-temperature signal loss data with a preset loss threshold to obtain a detection result includes:
judging whether the target high-temperature signal loss data is within the preset loss threshold value;
if so, determining that the target PCB board is qualified for detection;
and if not, determining that the target PCB is unqualified in detection.
The application provides a signal loss detection device, includes:
the target normal-temperature signal loss data module is used for acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature;
the target high-low temperature signal loss relation obtaining module is used for matching the target PCB board with the high-low temperature signal loss relation of a preset board to obtain a target high-low temperature signal loss relation corresponding to the target PCB board;
a target high-temperature signal loss data obtaining module, configured to determine target high-temperature signal loss data based on a relationship between the target normal-temperature signal loss data and the target high-low-temperature signal loss;
and the detection module is used for comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
Optionally, the method further includes:
the first fitting module is used for acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting the normal-temperature signal loss data in sequence to obtain corresponding normal-temperature fitting curves;
the second fitting module is used for acquiring high-temperature signal loss data corresponding to the middle loss PCB board, the low loss PCB board and the ultra-low loss PCB board at high temperature, and fitting the high-temperature signal loss data in sequence to obtain corresponding high-temperature fitting curves;
and the high-low temperature signal loss relation obtaining module is used for determining a high-low temperature signal loss relation according to the normal temperature fitting curve and the high temperature fitting curve so as to obtain a high-low temperature signal loss relation of the middle loss PCB, a high-low temperature signal loss relation of the low loss PCB and a high-low temperature signal loss relation of the ultralow loss PCB.
Optionally, the temperature range corresponding to the normal temperature is 25-35 ℃, including end points;
correspondingly, the high temperature corresponds to a temperature range of 75-85 degrees celsius, inclusive.
Optionally, the detection module includes:
the judging unit is used for judging whether the target high-temperature signal loss data is within the preset loss threshold value;
the qualified unit is used for determining that the target PCB board is qualified in detection if the target PCB board is qualified;
and the unqualified unit is used for determining that the target PCB is unqualified in detection if the target PCB is not qualified.
The application provides an electronic device, including:
a memory for storing a computer program;
a processor for implementing the steps of the signal loss detection method as described above when executing the computer program.
The present application provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the signal loss detection method as described in cerium.
The application provides a signal loss detection method, which comprises the following steps: acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature; matching the high and low temperature signal loss relation between the target PCB and a preset board to obtain a target high and low temperature signal loss relation corresponding to the target PCB; determining target high-temperature signal loss data based on the relationship between the target normal-temperature signal loss data and the target high-low temperature signal loss; and comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
Therefore, the high-low temperature signal loss relation is obtained through testing, the target PCB board is matched with the high-low temperature signal loss relation of the preset board in the actual detection process, the target high-temperature signal loss data is determined based on the target normal-temperature signal loss data according to the corresponding target high-low temperature signal loss relation, accurate high-temperature signal loss data can be obtained, and the integrity of the PCIE link design signal is guaranteed.
The application also provides a signal loss detection device, an electronic device and a computer readable storage medium, which all have the beneficial effects and are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a signal loss detection method according to an embodiment of the present application;
fig. 2 is a normal temperature fitting curve of an intermediate loss PCB board provided in an embodiment of the present application;
fig. 3 is a normal temperature fitting curve of a low-loss PCB board according to an embodiment of the present disclosure;
fig. 4 is a normal temperature fitting curve of an ultra-low loss PCB board provided in the embodiment of the present application;
fig. 5 is a high temperature fitting curve of an intermediate loss PCB board according to an embodiment of the present disclosure;
fig. 6 is a high temperature fitting curve of a low loss PCB board according to an embodiment of the present invention;
fig. 7 shows a high temperature fitting curve of an ultra-low loss PCB board provided in an embodiment of the present application;
fig. 8 is a schematic structural diagram of a signal loss detection apparatus according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the design of the Incloud server, particularly in a PCIE high-speed signal interconnection topological link, as the signal rate increases, the signal changes with the change of the operating environment, and the loss changes, particularly the influence of the temperature and the humidity in the operating environment, wherein the humidity can be controlled, but the operating temperature usually reaches a high temperature of 85 ℃, so that the signal integrity is reduced. For evaluation of a PCIE high-speed link, high-temperature data simulation is used in the related art, but the accuracy of data obtained through simulation is low, which increases a design margin and may result in over-design. Based on the above technical problem, this embodiment provides a signal loss detection method, which can obtain accurate high-temperature signal loss data, so as to ensure the integrity of a PCIE link design signal, specifically refer to fig. 1, where fig. 1 is a flowchart of the signal loss detection method provided in this embodiment of the present application, and specifically includes:
s110, obtaining target normal-temperature signal loss data of a target PCB to be tested at normal temperature;
testing a PCIE link signal of a target PCB board at normal temperature to obtain target normal-temperature signal loss data, wherein the target PCB board can be any one of an intermediate loss PCB board, a low loss PCB board and an ultra-low loss PCB board. For a specific way of obtaining the target normal-temperature signal loss data through the test, please refer to the related art, which is not described in detail in this embodiment.
Wherein the temperature range corresponding to the normal temperature is 25-35 ℃, including the end points; it is understood that the temperature can be constant or variable when tested at normal temperature, but the temperature must be 25-35 ℃.
S120, matching the high and low temperature signal loss relation between the target PCB and a preset board to obtain a target high and low temperature signal loss relation corresponding to the target PCB;
in step S120, the target PCB board may be matched with the board information of the high and low temperature signal loss of the preset board to obtain the board information corresponding to the target PCB board, and then the corresponding high and low temperature signal loss relationship may be determined according to the board information.
Further, the process of establishing the relationship between the signal loss of the preset high and low temperature of the plate includes:
acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting in sequence to obtain corresponding normal-temperature fitting curves;
obtaining high-temperature signal loss data corresponding to the middle-loss PCB, the low-loss PCB and the ultra-low-loss PCB at high temperature, and fitting the data in sequence to obtain corresponding high-temperature fitting curves;
and determining a high-low temperature signal loss relation according to the normal-temperature fitting curve and the high-temperature fitting curve so as to obtain a high-low temperature signal loss relation of the middle loss PCB plate, a high-low temperature signal loss relation of the low-loss PCB plate and a high-low temperature signal loss relation of the ultra-low loss PCB plate.
Specifically, the conventional board can be divided into three types according to electrical performance parameters, namely a middle loss PCB board, a low loss PCB board and an ultra-low loss PCB board in sequence. In this embodiment, for the middle loss PCB board, the low loss PCB board, and the ultra-low loss PCB board in the production batch under the same manufacturing condition, loss data, i.e., normal temperature signal loss data and high temperature signal loss data, are sequentially obtained for 100 pieces of the middle loss PCB board, the low loss PCB board, and the ultra-low loss PCB board at normal temperature and high temperature; and then fitting the data to obtain a loss curve at high and low temperatures, wherein the loss curve comprises a normal temperature fitting curve and a high temperature fitting curve, and then obtaining a normal temperature and high temperature loss data change relation, namely a high and low temperature signal loss relation, of the three plates according to the high and low temperature loss curve. It is understood that the electrical performance parameters of the PCB board may change when the temperature increases, but the high temperature signal loss test is costly. Therefore, the high-temperature signal loss in the actual test process is determined by taking the high-temperature and low-temperature signal loss relation of the three plates as a basis, the cost is low, and the data is accurate.
Referring to fig. 2 to 7, fitting curves of three boards provided in the embodiment of the present application are shown in fig. 2, which is a normal temperature fitting curve of an intermediate loss PCB board provided in the embodiment of the present application, shown in fig. 3, which is a normal temperature fitting curve of a low loss PCB board provided in the embodiment of the present application, shown in fig. 4, which is a normal temperature fitting curve of an ultra-low loss PCB board provided in the embodiment of the present application, shown in fig. 5, which is a high temperature fitting curve of an intermediate loss PCB board provided in the embodiment of the present application, shown in fig. 6, which is a high temperature fitting curve of a low loss PCB board provided in the embodiment of the present application, and shown in fig. 7, which is a high temperature fitting curve of an ultra-low loss PCB board provided in the embodiment of the present application, wherein an abscissa is a signal rate and an ordinate is a signal loss. Wherein, mid loss panel is middle loss PCB panel promptly: normal temperature loss 1.16 ═ high temperature loss; wherein the lowoss board is a low loss PCB board: normal temperature loss 1.11 ═ high temperature loss; wherein, the ultra low loss board is the ultra low loss PCB board: normal temperature loss 1.08 ═ high temperature loss, wherein normal temperature loss is normal temperature signal loss data, and high temperature loss is high temperature signal loss data; the method is convenient for accurate scheme evaluation in scheme evaluation, is simple, efficient and easy to implement, and simultaneously increases the reliability of system design. Wherein the temperature range corresponding to the normal temperature is 25-35 ℃, including the end points; correspondingly, elevated temperatures correspond to a temperature range of 75-85 degrees celsius, inclusive.
S130, determining target high-temperature signal loss data based on the relation between the target normal-temperature signal loss data and the target high-low temperature signal loss;
specifically, when the target PCB is the middle loss PCB, and the target normal temperature signal loss data is a, the target high temperature signal loss data is 1.16a according to the target high and low temperature signal loss relationship, that is, the high and low temperature signal loss relationship of the middle loss PCB is normal temperature loss × 1.16 — high temperature loss.
And S140, comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
Specifically, the preset loss threshold in this embodiment may be set according to actual conditions, as long as the purpose of this embodiment can be achieved.
Further, comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result, including:
judging whether the target high-temperature signal loss data is within a preset loss threshold value;
if yes, determining that the target PCB board is qualified for detection;
and if not, determining that the target PCB is unqualified in detection.
In the embodiment, the preset loss threshold value is not limited, the user can set the loss threshold value in a self-defined mode, the detection of the corresponding PCB board is qualified only in the preset loss threshold value, and the detection is unqualified if the loss threshold value is not in the range. For example, when the target normal temperature signal loss data is 26GB, the determined target high temperature signal loss data is 29GB based on the relationship between the target normal temperature signal loss data and the target high and low temperature signal loss, but the preset loss threshold is 28GB, the corresponding target PCB board is unqualified to be detected; when the target normal-temperature signal loss data is 24GB, the determined target high-temperature signal loss data is 26GB based on the relation between the target normal-temperature signal loss data and the target high-low temperature signal loss, but the preset loss threshold value is 28GB, the detection of the corresponding target PCB board is qualified.
Based on the technical scheme, the high-low temperature signal loss relation is obtained through testing in the embodiment, the target PCB board is matched with the high-low temperature signal loss relation of the preset board in the actual detection process, the target high-temperature signal loss data is determined based on the target normal-temperature signal loss data according to the corresponding target high-low temperature signal loss relation, accurate high-temperature signal loss data can be obtained, and the integrity of the PCIE link design signal is further ensured.
Referring to fig. 8, the following describes a signal loss detection apparatus provided in an embodiment of the present application, where the signal loss detection apparatus described below and the signal loss detection method described above may be referred to correspondingly, and fig. 8 is a schematic structural diagram of the signal loss detection apparatus provided in the embodiment of the present application, and includes:
a target normal temperature signal loss data module 210, configured to obtain target normal temperature signal loss data of a target PCB board to be tested at normal temperature;
a target high-low temperature signal loss relation obtaining module 220, configured to match a high-low temperature signal loss relation between a target PCB board and a preset board, so as to obtain a target high-low temperature signal loss relation corresponding to the target PCB board;
a target high-temperature signal loss data obtaining module 230, configured to determine target high-temperature signal loss data based on a relationship between the target normal-temperature signal loss data and the target high-low temperature signal loss;
and the detection module 240 is configured to compare the target high-temperature signal loss data with a preset loss threshold to obtain a detection result.
In some specific embodiments, the method further comprises:
the first fitting module is used for acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting the normal-temperature signal loss data in sequence to obtain corresponding normal-temperature fitting curves;
the second fitting module is used for acquiring high-temperature signal loss data corresponding to the middle-loss PCB board, the low-loss PCB board and the ultra-low-loss PCB board at high temperature, and fitting the high-temperature signal loss data in sequence to obtain corresponding high-temperature fitting curves;
and the high-low temperature signal loss relation obtaining module is used for determining a high-low temperature signal loss relation according to the normal temperature fitting curve and the high temperature fitting curve so as to obtain a high-low temperature signal loss relation of the middle loss PCB plate, a high-low temperature signal loss relation of the low loss PCB plate and a high-low temperature signal loss relation of the ultra-low loss PCB plate.
In some specific embodiments, the normal temperature corresponds to a temperature range of 25-35 degrees celsius, inclusive;
correspondingly, elevated temperatures correspond to a temperature range of 75-85 degrees celsius, inclusive.
In some specific embodiments, the detection module 240 includes:
the judging unit is used for judging whether the target high-temperature signal loss data is within a preset loss threshold value;
the qualified unit is used for determining that the target PCB board is qualified for detection if the target PCB board is qualified;
and the unqualified unit is used for determining that the target PCB is unqualified in detection if the target PCB is not qualified.
Since the embodiments of the apparatus portion and the method portion correspond to each other, please refer to the description of the embodiments of the method portion for the embodiments of the apparatus portion, which is not repeated here.
In the following, an electronic device provided by an embodiment of the present application is introduced, and the electronic device described below and the signal loss detection method described above may be referred to correspondingly.
The present embodiment provides an electronic device, including:
a memory for storing a computer program;
a processor for implementing the steps of the signal loss detection method as described above when executing a computer program.
Since the embodiment of the electronic device portion and the embodiment of the signal loss detection method portion correspond to each other, please refer to the description of the embodiment of the signal loss detection method portion for the embodiment of the electronic device portion, which is not repeated here.
The following describes a computer-readable storage medium provided by embodiments of the present application, and the computer-readable storage medium described below and the method described above may be referred to correspondingly.
The present embodiment provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps of the signal loss detection method as described above.
Since the embodiment of the computer-readable storage medium portion and the embodiment of the method portion correspond to each other, please refer to the description of the embodiment of the method portion for the embodiment of the computer-readable storage medium portion, which is not repeated here.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
A signal loss detection method, a signal loss detection apparatus, an electronic device, and a computer-readable storage medium provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A signal loss detection method, comprising:
acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature;
matching the high-low temperature signal loss relation between the target PCB and a preset board to obtain a target high-low temperature signal loss relation corresponding to the target PCB;
determining target high-temperature signal loss data based on the target normal-temperature signal loss data and the target high-low-temperature signal loss relation;
and comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
2. The signal loss detection method according to claim 1, wherein the establishing process of the high and low temperature signal loss relationship of the preset plate material comprises:
acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting in sequence to obtain corresponding normal-temperature fitting curves;
obtaining high-temperature signal loss data corresponding to the middle loss PCB, the low loss PCB and the ultra-low loss PCB at high temperature, and fitting in sequence to obtain corresponding high-temperature fitting curves;
and determining a high-low temperature signal loss relation according to the normal temperature fitting curve and the high temperature fitting curve so as to obtain the high-low temperature signal loss relation of the middle loss PCB plate, the high-low temperature signal loss relation of the low loss PCB plate and the high-low temperature signal loss relation of the ultra-low loss PCB plate.
3. The signal loss detection method of claim 2, wherein the normal temperature corresponds to a temperature range of 25-35 degrees celsius, inclusive;
correspondingly, the high temperature corresponds to a temperature range of 75-85 degrees celsius, inclusive.
4. The signal loss detection method according to claim 2, wherein the comparing the target high-temperature signal loss data with a preset loss threshold to obtain a detection result comprises:
judging whether the target high-temperature signal loss data is within the preset loss threshold value;
if so, determining that the target PCB board is qualified for detection;
and if not, determining that the target PCB is unqualified in detection.
5. A signal loss detection device, comprising:
the target normal-temperature signal loss data module is used for acquiring target normal-temperature signal loss data of a target PCB to be tested at normal temperature;
the target high-low temperature signal loss relation obtaining module is used for matching the target PCB board with the high-low temperature signal loss relation of a preset board to obtain a target high-low temperature signal loss relation corresponding to the target PCB board;
a target high-temperature signal loss data obtaining module, configured to determine target high-temperature signal loss data based on a relationship between the target normal-temperature signal loss data and the target high-low-temperature signal loss;
and the detection module is used for comparing the target high-temperature signal loss data with a preset loss threshold value to obtain a detection result.
6. The signal loss detection device of claim 5, further comprising:
the first fitting module is used for acquiring normal-temperature signal loss data corresponding to the intermediate loss PCB, the low-loss PCB and the ultra-low loss PCB at normal temperature, and fitting the normal-temperature signal loss data in sequence to obtain corresponding normal-temperature fitting curves;
the second fitting module is used for acquiring high-temperature signal loss data corresponding to the middle loss PCB board, the low loss PCB board and the ultra-low loss PCB board at high temperature, and fitting the high-temperature signal loss data in sequence to obtain corresponding high-temperature fitting curves;
and the high-low temperature signal loss relation obtaining module is used for determining a high-low temperature signal loss relation according to the normal temperature fitting curve and the high temperature fitting curve so as to obtain a high-low temperature signal loss relation of the middle loss PCB, a high-low temperature signal loss relation of the low loss PCB and a high-low temperature signal loss relation of the ultralow loss PCB.
7. The signal loss detection device of claim 6, wherein the normal temperature corresponds to a temperature range of 25-35 degrees Celsius, inclusive;
correspondingly, the high temperature corresponds to a temperature range of 75-85 degrees celsius, inclusive.
8. The signal loss detection device of claim 6, wherein the detection module comprises:
the judging unit is used for judging whether the target high-temperature signal loss data is within the preset loss threshold value;
the qualified unit is used for determining that the target PCB board is qualified in detection if the target PCB board is qualified;
and the unqualified unit is used for determining that the target PCB is unqualified in detection if the target PCB is not qualified.
9. An electronic device, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the signal loss detection method according to any one of claims 1 to 4 when executing the computer program.
10. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of the signal loss detection method according to any one of claims 1 to 4.
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| CN108280277A (en) * | 2018-01-12 | 2018-07-13 | 郑州云海信息技术有限公司 | A kind of loss algorithm that transmission line varies with temperature |
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2020
- 2020-04-24 CN CN202010333140.6A patent/CN111538696A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170187585A1 (en) * | 2015-12-26 | 2017-06-29 | Tze-Hui Yew | Technologies for validating operations of devices |
| CN106767960A (en) * | 2016-12-27 | 2017-05-31 | 华中科技大学 | Fibre Optical Sensor Dynamic Signal demodulation method based on spectrum simulation Yu difference algorithm |
| CN108280277A (en) * | 2018-01-12 | 2018-07-13 | 郑州云海信息技术有限公司 | A kind of loss algorithm that transmission line varies with temperature |
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