CN111531984B - Thin film heating module and production method thereof - Google Patents

Thin film heating module and production method thereof Download PDF

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Publication number
CN111531984B
CN111531984B CN202010385932.8A CN202010385932A CN111531984B CN 111531984 B CN111531984 B CN 111531984B CN 202010385932 A CN202010385932 A CN 202010385932A CN 111531984 B CN111531984 B CN 111531984B
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copper foil
polyimide film
polyimide
film
foil electrode
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CN111531984A (en
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岑建军
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Ningbo Jinshan New Material Co ltd
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Ningbo Jinshan New Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
    • B32B38/1816—Cross feeding of one or more of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Abstract

The invention discloses a film heating module and a production method thereof, wherein the film heating module comprises a conductive heating polyimide film, a copper foil electrode is laid on the conductive heating polyimide film, and polyimide bonding resin is filled between the copper foil electrode and the conductive heating polyimide film through mesh small holes so as to firmly fix a copper foil on the conductive heating polyimide film; and hot-pressing insulating packaging layers are overlaid on two sides of the conductive heating polyimide film paved with the copper foil electrode in a sandwich mode, wires are led out by welding the copper foil electrode, and the welding position is packaged and insulated. The film heating module completes the overall insulating packaging, electrifying, heating and high-temperature resisting module form, the copper foil electrode and the conductive heating polyimide film are in close overall contact, the electric contact between the copper foil electrode and the conductive heating polyimide film is guaranteed, the film has good heat radiation effect and good insulativity, the film is rapid in heating and temperature rise, large in heating area, uniform in heating temperature, high in thermoelectric efficiency and safe to use.

Description

Thin film heating module and production method thereof
Technical Field
The present invention relates to a film heating production technology, and more particularly to a film heating module including a hard heating module or a flexible heating module and a production method thereof.
Background
Chinese patent CN101699920B discloses a method for preparing a polyimide heating film, which comprises preparing a conductive film by polymerizing nano conductive metal powder, nano conductive carbon powder and polyimide resin, printing or directly using conductive copper foil as a positive electrode and a negative electrode on the conductive film, and then compounding polyethylene terephthalate or polyether amide or polyimide insulating films on both sides of the conductive film for protection. In the patent application, the heating film adopts conductive metal powder, the connection between the copper foil and the heating film is not clear, namely, the connection is not known really, whether a conductive adhesive or no conductive adhesive exists, the insulating films on two sides are not clear, how the insulating films are adhered together, and whether the adhesive resists high temperature or not during heating is not clear.
Chinese patent CN109714837A application discloses a graphene electrothermal film, which comprises a first insulating protective layer, a radiation shielding layer, a heating layer, a reflective thermal insulation layer and a second insulating protective layer, wherein the heating layer is formed by printing a conductive circuit on a graphene heating sheet, and from the analysis of the published data, the paste only consisting of graphene powder, conductive carbon powder, carbon nanotubes, conductive silver mercury and far infrared mineral material cannot form a sheet by spraying, even if a sheet material substrate is selected additionally, the printing of the conductive circuit on the spraying layer is difficult to realize due to the absence of a curing material in the composition, so from the published data, the heating layer cannot realize the heating purpose and the intended technical effect. The insulating layer in this patent is made of a polyimide resin, but it is not clear whether or not it has adhesive properties. The aluminum-plated polyimide film also has no adhesion property, how the four layers adhere together, and a processing technique for how the four layers adhere together are not clear.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a thin film heating module which has higher heat radiation intensity, is convenient to apply, meets the requirements of hard and flexible application scenes, is safer to use and is suitable for industrial production and a production method thereof.
In order to achieve the purpose, the invention provides a film heating module, which comprises a conductive heating polyimide film, and is characterized in that (A) a copper foil electrode is laid on the conductive heating polyimide film, the thickness of the copper foil electrode is 10-50 micrometers, the width of the copper foil electrode is 2-15 millimeters, the edge of the copper foil electrode is in a continuous zigzag shape, and a reticular pore is arranged in the middle, so that the copper foil and the conductive heating polyimide film are in close contact during packaging, and no air exists in the middle, and excellent conductive performance is obtained; (B) the copper foil electrode is directly attached to the conductive heating polyimide film, and the reticular pores and the saw teeth on the copper foil electrode are filled with polyimide bonding resin when being thermally sealed, and the polyimide bonding resin is connected with the conductive heating polyimide film, so that the copper foil is firmly fixed on the conductive heating polyimide film; (C) two sides of the conductive heating polyimide film paved with the copper foil electrode are provided with insulating packaging layers, and the insulating packaging layers are bondable polyimide films with the thickness of 12.5-125 micrometers or polyimide pre-impregnated glass fiber materials with the thickness of 100-500 micrometers; (D) the bondable polyimide film is thermoplastic polyimide resin with the thickness of 3-25 microns and strong bonding performance at high temperature, which is coated on the composite surface of the traditional thermosetting polyimide film; the polyimide pre-impregnated glass fiber material is prepared by dip-coating polyimide resin with strong bonding performance at high temperature on glass fiber cloth to reduce cost and form a hard module, wherein the glass fiber cloth can be in a twill or plain structure, and the weight ratio of the glass fiber cloth in the pre-impregnated material can be controlled to be 30-70%; (E) the conductive heating polyimide film paved with the copper foil electrode and the insulating packaging layers on the two sides are overlapped and hot-pressed into a whole in a sandwich mode, wires are led out from the copper foil electrode in a welding mode, and the welding position is packaged and insulated. Here, the above-mentioned conductive heat-generating polyimide film, polyimide binder resin, conventional thermosetting polyimide film, thermoplastic polyimide resin exhibiting strong adhesive property at high temperature, and polyimide resin exhibiting strong adhesive property at high temperature are commercially available polyimide series products which are commercially available or custom-made, and will not be described in detail.
The invention provides a production method of a film heating module, which comprises adopting a conductive heating polyimide film, and is characterized in that (A) a copper foil electrode is laid on the conductive heating polyimide film, the thickness of the copper foil electrode is 10-50 micrometers, the width of the copper foil electrode is 2-15 millimeters, the edge of the copper foil electrode is continuous zigzag, a reticular pore is arranged in the middle of the copper foil electrode, (B) the copper foil electrode is directly jointed with the conductive heating polyimide film, the reticular pore and the sawtooth on the copper foil electrode are filled with polyimide bonding resin when in heat sealing, the polyimide bonding resin is connected with the conductive heating polyimide film, and the copper foil is firmly fixed on the conductive heating polyimide film; (C) two sides of the conductive heating polyimide film paved with the copper foil electrode are provided with insulating packaging layers, and the insulating packaging layers are bondable polyimide films with the thickness of 12.5-125 micrometers or polyimide pre-impregnated glass fiber materials with the thickness of 100-500 micrometers; (D) the bondable polyimide film is formed by coating thermoplastic polyimide resin with the thickness of 3-25 microns on one side or the upper side of a traditional thermosetting polyimide film, and has strong bonding performance at high temperature, wherein the polyimide pre-impregnated glass fiber material is formed by dip-coating the polyimide resin with the strong bonding performance at high temperature on glass fiber cloth, the glass fiber cloth can be in a twill or plain structure, and the weight ratio of the glass fiber cloth in the pre-impregnated material can be controlled to be 30-70%; (E) the conductive heating polyimide film paved with the copper foil electrode and the insulating packaging layers on the two sides are overlapped and hot-pressed into a whole in a sandwich mode, a copper foil electrode leading-out position end is found out on one side of the pressed whole, an insulating material is stripped on the copper foil electrode leading-out position end to expose a small hole with the diameter of 4-10 mm, the copper foil is exposed to serve as an electrode leading-out end, then the wire is welded with the copper foil, and the welding position is packaged and insulated by insulating glue or insulating adhesive tape; (F) the polyimide film capable of being bonded is stacked and hot-pressed in a sandwich manner, and the hot-pressing process is carried out at the temperature of 250-350 DEG CDegree, 10kgf/cm2To 20kgf/cm2Pressing under pressure for 1-10 min; the polyimide is pre-impregnated with glass fiber material, and is laminated and hot-pressed in sandwich form at room temperature to 350 deg.C and 10kgf/cm2To 50kgf/cm2Pressing under pressure for 1-10 hr; all two hot pressing processes are carried out in a vacuum environment, and the vacuum is more than 0.08-0.095 MPa.
In order to obtain the determined heating power and the required heating temperature, the copper foil electrode is laid on the conductive heating polyimide film in the production method of the film heating module provided by the invention, and the designed power is obtained by the position of the copper foil electrode on the conductive heating polyimide film and the number and layout of the copper foil electrodes so as to obtain the corresponding required temperature. Here, the conductive heat-generating polyimide film may be commercially available, and when the commercially available conductive heat-generating polyimide film is purchased, the sheet resistance (i.e., the resistance value per square centimeter) of the conductive heat-generating polyimide film is determined, and the conventional conductive heat-generating polyimide film currently has 60 Ω/square centimeter, 100 Ω/square centimeter, and 120 Ω/square centimeter, and of course, other sheet resistances may be customized, and the conductive heat-generating polyimide film may also be a far-infrared conductive heat-generating polyimide film.
The layout comprises different numbers of copper foil electrodes, positions thereof and mutual connection modes, the difference of the different numbers of copper foil electrodes, the positions thereof and the mutual connection modes finally makes the equivalent resistance obtained at the two ends of the input electrode different, and if the equivalent resistance is R1, the equivalent resistance is obtained according to the formula P = V2and/R1, obtaining the required power P, wherein V is the voltage applied across the electrodes.
The film heating module obtained by the production method of the film heating module provided by the invention completes the whole insulating packaging, electrifying, heating and high-temperature resisting module form, particularly, the copper foil electrode and the conductive heating polyimide film are in close overall contact, the electrical contact between the copper foil electrode and the conductive heating polyimide film is ensured, and no gap resistance exists, so that the electrical conversion rate and the use safety of products are improved; the invention can obtain two kinds of flexible and rigid ultrathin film heating modules, which not only has good heat radiation effect, but also has good insulativity, further ensures the use safety, and the film has the advantages of rapid heating and temperature rise, large heating area, uniform heating temperature and high thermoelectric efficiency; the product has flexible design, variable size, and adjustable hardness and hardness.
When the far infrared conductive heating polyimide film with high-efficiency heat radiation intensity (such as a commercially available HT60/HT100/HT120 model) is selected, the film heating module has high infrared spectrum radiation intensity and high-temperature heating function, and generates high-radiation-intensity far infrared spectrum while heating.
It is well known that new coronaviruses can be killed at ultraviolet light or at a temperature of 56 ℃. Recent scientific studies have shown that novel coronavirus (COVID-19), including SARS (SARS) and Middle East Respiratory Syndrome (MERS), are ribonucleic acid viruses (RNA viruses), and under the radiation action of Far Infrared Rays (FIR), the Virus molecules are destroyed, the Virus biological activity is remarkably reduced, and the Virus transmission capacity is rapidly reduced until the Virus is killed. Scientific experiments prove that under the irradiation of infrared spectrum, the molecular electric property in the microorganism is changed, energy is absorbed, and the temperature is increased, so that the sterilization effect is achieved. Meanwhile, scientific research proves that infrared spectroscopy has no influence on deoxyribonucleic acid (DNA) of organisms, so that the safety of the organisms and human bodies is ensured. Therefore, when the far infrared conductive heating polyimide film with high-efficiency heat radiation intensity is adopted, the film has the effects of sterilizing and disinfecting, improving human body microcirculation, preventing and treating diseases and cleaning the environment, and is green, environment-friendly, non-toxic, harmless and safe to use; and can effectively improve the environment abused by new coronavirus and provide a safe environment.
Detailed Description
The invention is further illustrated by the following examples.
Example 1:
the film heating module provided by the embodiment comprises a conductive heating polyimide film (A)A copper foil electrode is laid on the conductive heating polyimide film, the thickness of the copper foil electrode is 10 micrometers, the width of the copper foil electrode is 15 millimeters, continuous saw-toothed shapes are punched on the edge of the copper foil electrode, and a small mesh hole is formed in the middle of the copper foil electrode; (B) the copper foil electrode is directly attached to the conductive heating polyimide film, and the reticular pores and the saw teeth on the copper foil electrode are filled with polyimide bonding resin when being thermally sealed, and the polyimide bonding resin is connected with the conductive heating polyimide film, so that the copper foil is firmly fixed on the conductive heating polyimide film; (C) insulating packaging layers are arranged on two sides of the conductive heating polyimide film paved with the copper foil electrode, and the insulating packaging layers are bondable polyimide films with the thickness of 12.5-125 micrometers; (D) the bondable polyimide film is thermoplastic polyimide resin with the thickness of 3-25 microns and strong bonding performance at high temperature coated on the composite surface of the traditional thermosetting polyimide film; (E) the conductive heating polyimide film paved with the copper foil electrode and the insulating packaging layers on the two sides are overlapped and hot-pressed into a whole in a sandwich mode, wires are led out from the copper foil electrode in a welding mode, and the welding part is packaged and insulated; in addition to the above technical features, the method for producing a thin film heating module according to this embodiment finds an electrode lead-out position end of a copper foil on one side of a laminated whole, strips an insulating material on the electrode lead-out position end to expose a small hole with a diameter of 4 mm, exposes the copper foil to serve as an electrode lead-out end, welds a wire to the copper foil, and encapsulates and insulates the wire at the welded position with an insulating adhesive or an insulating tape; (F) the heat pressing process of laminating and heat pressing the bondable polyimide film in the form of sandwich is that the heat pressing process is carried out at the temperature of 250-350 ℃ and the temperature of 10kgf/cm2To 20kgf/cm2Pressing under pressure for 5 minutes, of course, 1 minute to 10 minutes are also possible; the hot pressing process is carried out in a vacuum environment, and the vacuum degree is controlled to be 0.08-0.095 MPa.
The conductive heat-generating polyimide film, the polyimide adhesive resin, the conventional thermosetting polyimide film, the thermoplastic polyimide resin exhibiting strong adhesive property at high temperature, and the polyimide resin exhibiting strong adhesive property at high temperature described in this embodiment are commercially available polyimide series products which can be purchased or customized, and will not be described in detail herein.
In order to obtain the determined heating power and the required heating temperature, the copper foil electrode is laid on the conductive heating polyimide film in the production method of the film heating module provided by the invention, and the designed power is obtained by the position of the copper foil electrode on the conductive heating polyimide film and the number and layout of the copper foil electrodes so as to obtain the corresponding required temperature. Here, the conductive heat-generating polyimide film may be obtained from the market, and the sheet resistance (i.e. the resistance value per square centimeter) of the conductive heat-generating polyimide film is determined when the commercially available conductive heat-generating polyimide film is purchased, in this embodiment, the conductive heat-generating polyimide film of 60 Ω/square centimeter is selected, the positions of the copper foil electrodes on the conductive heat-generating polyimide film, the number of the copper foil electrodes, and the layout in the layout include different numbers of copper foil electrodes, the positions thereof, and the connection manners therebetween, and the differences in the numbers of copper foil electrodes, the positions thereof, and the connection manners therebetween eventually make the resistances obtained at the two input ends of the copper foil electrodes different, and the resistance at the two input ends of the electrodes is set to be R1, where R1 is the equivalent resistance, the required power P is obtained according to the formula P = V2/R1, where V is the voltage applied across the copper foil electrode.
In this embodiment, a conductive heat-generating polyimide film with a sheet resistance R of 60 Ω/cm is used, and when the length L is 10 cm, the operating voltage V is 36V dc safe low voltage, and the copper foil electrode is disposed on the L side, according to R1= α R L/W, where α is 1, 1/2, 1/3, or 1/4, that is, 2 α on the 2 side are 1, 32 equal average α are 1/2, 4 equal α are 1/3, 5 equal α are 1/4, and R1 is an equivalent resistance, assuming that a is 1, that is, the width W between two electrodes, and W is the width of the conductive heat-generating polyimide film, according to the power density formula: r1= V2The power density P/S was 0.432 watts/cm, the heat generation area S = L W, and W was 5 cm. Different alpha corresponds to the conductive heating polyimide film with different width, so as to achieve the width dimension of the conductive heating polyimide film under the required power density. The copper foil electrode can be determined according to the size of the required conductive heat-generating polyimide filmAnd (4) arranging.
Through detection, when the heating power per square centimeter of the film heating module obtained by the invention is 0.4 watt to 0.8 watt, the heating temperature obtained by corresponding conversion is 150 ℃ to 300 ℃, so that the power density can be usually set to be 0.4 watt/square centimeter to 0.8 watt/square centimeter in application. Different numbers and positions of copper foil electrodes are distributed according to different sizes of the required conductive heating polyimide films, so that different heating temperatures are obtained. Different power densities can be determined according to different heating temperature requirements, and the requirements are met by selecting conductive heating polyimide films with different sheet resistances, the sizes of the conductive heating polyimide films and the layout of the number and the positions of copper foil electrodes.
Example 2:
the difference between the thin film heating module provided in this embodiment and embodiment 1 is that it adopts commercially available models as follows: the far infrared conductive heating polyimide film comprises HT60, HT100 and HT120, wherein (A) a copper foil electrode is laid on the conductive heating polyimide film, the thickness of the copper foil electrode is 50 micrometers, the width of the copper foil electrode is 2 millimeters, continuous saw-toothed shapes are punched on the edge of the copper foil electrode, and a mesh small hole is formed in the middle of the copper foil electrode; (B) the copper foil electrode is directly attached to the conductive heating polyimide film, and the reticular pores and the saw teeth on the copper foil electrode are filled with polyimide bonding resin when being thermally sealed, and the polyimide bonding resin is connected with the conductive heating polyimide film, so that the copper foil is firmly fixed on the conductive heating polyimide film; (C) insulating packaging layers are arranged on two sides of the conductive heating polyimide film paved with the copper foil electrode, and the insulating packaging layers are made of polyimide pre-impregnated glass fiber materials with the thickness of 100-500 micrometers; (D) the polyimide pre-impregnated glass fiber material is prepared by dip-coating polyimide resin with strong bonding performance at high temperature on glass fiber cloth to reduce cost and form a hard module, wherein the glass fiber cloth can be in a twill or plain weave structure, and the weight ratio of glass fiber in the pre-impregnated material can be controlled to be 30-70%; (E) the conductive heating polyimide film with the copper foil electrode and the insulating packaging layers on the two sides are stacked and hot pressed into a whole in a sandwich mode, and the lamination is goodFinding out an electrode leading-out position end of a copper foil on one side of the whole, stripping an insulating material on the copper foil to expose a small hole with the diameter of 10 mm, exposing the copper foil to serve as an electrode leading-out end, welding a wire with the copper foil, and packaging and insulating the welding position by using insulating glue or an insulating tape; (F) the polyimide is pre-impregnated with glass fiber material, and is laminated and hot pressed in sandwich form at room temperature to 350 deg.C and 10kgf/cm2To 50kgf/cm2Pressing under pressure for 1-10 hr; the hot pressing process is carried out in a vacuum pumping environment with the vacuum degree of more than 0.08-0.095 MPa.
In the present embodiment, when the copper foil electrode is laid out, if the α value is difficult to reach 1, 1/2, 1/3 or 1/4, the R value can be adjusted and selected, and the R value is generally 60 Ω/square centimeter, 100 Ω/square centimeter or 120 Ω/square centimeter, and of course, a far infrared conductive heating polyimide film with other resistance values can be ordered, so as to facilitate the layout of the copper foil electrode and meet the scene requirement of heating temperature.

Claims (5)

1. A film heating module comprises a conductive heating polyimide film, and is characterized in that (A) a copper foil electrode is laid on the conductive heating polyimide film, the thickness of the copper foil electrode is 10-50 micrometers, the width of the copper foil electrode is 2-15 millimeters, continuous saw-toothed shapes are punched on the edge of the copper foil electrode, and a mesh small hole is formed in the middle of the copper foil electrode; (B) the copper foil electrode is directly attached to the conductive heating polyimide film, and the reticular pores and the saw teeth on the copper foil electrode are filled with polyimide bonding resin when being thermally sealed, and the polyimide bonding resin is connected with the conductive heating polyimide film, so that the copper foil is firmly fixed on the conductive heating polyimide film; (C) two sides of the conductive heating polyimide film paved with the copper foil electrode are provided with insulating packaging layers, and the insulating packaging layers are bondable polyimide films with the thickness of 12.5-125 micrometers or polyimide pre-impregnated glass fiber materials with the thickness of 100-500 micrometers; (D) the bondable polyimide film is thermoplastic polyimide resin with the thickness of 3-25 micrometers coated on the composite surface of the traditional thermosetting polyimide film and with strong bonding performance at high temperature, and the polyimide pre-impregnated glass fiber material is formed by dip-coating the polyimide resin with strong bonding performance at high temperature on glass fiber cloth; (E) the conductive heating polyimide film paved with the copper foil electrode and the insulating packaging layers on the two sides are overlapped and hot-pressed into a whole in a sandwich mode, wires are led out from the copper foil electrode in a welding mode, and the welding position is packaged and insulated.
2. The film heating module as claimed in claim 1, wherein the conductive and heat-generating polyimide film is a far infrared conductive and heat-generating polyimide film.
3. A production method of a film heating module according to claim 1, which comprises using a conductive heating polyimide film, and is characterized in that (A) a copper foil electrode is laid on the conductive heating polyimide film, the copper foil electrode has a thickness of 10 to 50 micrometers and a width of 2 to 15 millimeters, continuous saw-toothed shapes are punched on the edge of the copper foil electrode, and a mesh-shaped small hole is arranged in the middle of the copper foil electrode, (B) the copper foil electrode is directly attached to the conductive heating polyimide film, and the mesh-shaped small hole and the saw-toothed shapes on the copper foil electrode are filled with polyimide bonding resin during heat sealing, and the polyimide bonding resin is connected with the conductive heating polyimide film, so that the copper foil is firmly fixed on the conductive heating polyimide film; (C) two sides of the conductive heating polyimide film paved with the copper foil electrode are provided with insulating packaging layers, and the insulating packaging layers are bondable polyimide films with the thickness of 12.5-125 micrometers or polyimide pre-impregnated glass fiber materials with the thickness of 100-500 micrometers; (D) the bondable polyimide film is thermoplastic polyimide resin with the thickness of 3-25 micrometers coated on the composite surface of the traditional thermosetting polyimide film and with strong bonding performance at high temperature, and the polyimide pre-impregnated glass fiber material is formed by dip-coating the polyimide resin with strong bonding performance at high temperature on glass fiber cloth; (E) the conductive heating polyimide film with the copper foil electrode and the insulating packaging layers on the two sides are overlaid and hot pressed into a whole in a sandwich mode, the leading-out position end of the copper foil electrode is found out on one side of the pressed whole,stripping the insulating material on the surface to expose a small hole with the diameter of 4-10 mm, exposing the copper foil to be used as an electrode leading-out terminal, welding the wire with the copper foil, and packaging and insulating the welding part by using insulating glue or insulating adhesive tape; (F) the heat pressing process of laminating and heat pressing the bondable polyimide film in the form of sandwich is that the heat pressing process is carried out at the temperature of 250-350 ℃ and the temperature of 10kgf/cm2To 20kgf/cm2Pressing under pressure for 1-10 min; the polyimide is pre-impregnated with glass fiber material, and is laminated and hot-pressed in sandwich form at room temperature to 350 deg.C and 10kgf/cm2To 50kgf/cm2Pressing under pressure for 1-10 hr; all two hot pressing processes are carried out in a vacuum environment, and the vacuum degree is more than 0.08-0.095 MPa.
4. The method for manufacturing a film heating module according to claim 3, wherein the copper foil electrodes are laid on the conductive heating polyimide film by obtaining the designed power to obtain the corresponding required temperature according to the position of the copper foil electrodes on the conductive heating polyimide film and the number and layout of the copper foil electrodes.
5. The method for producing a film heating module according to claim 3 or 4, wherein the conductive heating polyimide film is a far infrared conductive heating polyimide film.
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