CN111522207A - Scanning Mura detection method and device of digital exposure machine - Google Patents

Scanning Mura detection method and device of digital exposure machine Download PDF

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Publication number
CN111522207A
CN111522207A CN202010478131.6A CN202010478131A CN111522207A CN 111522207 A CN111522207 A CN 111522207A CN 202010478131 A CN202010478131 A CN 202010478131A CN 111522207 A CN111522207 A CN 111522207A
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exposure
measurement data
scanning
digital
micromirrors
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CN111522207B (en
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刘鹏
李付强
王志冲
冯京
栾兴龙
袁广才
董学
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BOE Technology Group Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Abstract

The invention provides a method and a device for detecting scanning Mura of a digital exposure machine, wherein the method comprises the following steps: acquiring point coordinates of automatic focusing measurement data at a measurement area j of an exposure substrate scanned for the ith time by an exposure device of the digital exposure machine, and converting the point coordinates into a focusing plane measurement data matrix of M x N, wherein M is the number of micromirrors of the digital micromirror device of the exposure device in a first direction, and N is the number of micromirrors in a second direction; acquiring a difference value matrix of automatic focusing measurement data of each micromirror, which is caused by the angle of the digital micromirror device in a first direction and the angle of the digital micromirror device in a second direction; acquiring the exposure times of the graph of the ith scanning in the measurement area j; according to the focusing plane measurement data matrix, the difference value matrix and the exposure times, determining equivalent automatic focusing measurement data of the ith scanning in the measurement area j; and determining the scanning Mura according to the equivalent automatic focusing measurement data, thereby monitoring the scanning Mura.

Description

Scanning Mura detection method and device of digital exposure machine
Technical Field
The embodiment of the invention relates to the technical field of digital exposure, in particular to a method and a device for detecting scanning Mura of a digital exposure machine.
Background
The digital exposure machine has the advantages of high resolution, no need of manufacturing a Mask plate (Mask) and the like, and is the development direction of the future exposure technology, however, Scan Mura (scanning unevenness) can be caused by the structure and the exposure principle, and no obvious rule can be found between different exposure substrates (glass) in the scanning Mura, so that the scanning Mura is difficult to monitor, and the product quality is directly influenced.
Disclosure of Invention
The embodiment of the invention provides a method and a device for detecting scanning Mura of a digital exposure machine, which are used for solving the problem that the scanning Mura of the digital exposure machine is difficult to monitor.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a scanning Mura detection method for a digital exposure machine, including:
acquiring point coordinates H of autofocus measurement data at measurement region j of an exposure substrate for the ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;
acquiring a difference value matrix of autofocus measurement data of the ith scanning of each micromirror at a measurement area j of the exposure substrate, which is caused by an angle alpha of the digital micromirror device in a first direction and an angle beta of the digital micromirror device in a second direction;
acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
according to the focusing plane measurement data matrix, the difference value matrix and the exposure times, determining equivalent automatic focusing measurement data received by the graph scanned at the measurement area j of the exposure substrate at the ith time;
and determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
Optionally, the difference value matrix BijComprises the following steps:
Figure BDA0002516438450000021
Figure BDA0002516438450000022
Figure BDA0002516438450000023
wherein D isαIs the difference in height in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, DβThe height difference between two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is p1 is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, L ═ M × d, W is the length of the dmd in the second direction, W ═ N × d, and the size of each micromirror is d × d.
Optionally, the number of exposures f (l) is:
Figure BDA0002516438450000024
optionally, the ith scan is equivalent auto-focus measurement received at the pattern at the measurement region j of the exposed substrateVolume data Cij(k) Comprises the following steps:
Figure BDA0002516438450000025
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
Optionally, the determining the equivalent autofocus measurement data received by the pattern at the measurement area j of the exposed substrate for the ith scan further comprises:
plotting at least one of the following graphs:
drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;
drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;
drawing a comparison graph of equivalent auto-focusing measurement data received by graphs at a measurement area j of the exposure substrate by the ith scanning and the (i + 1) th scanning of an exposure device of the digital exposure machine, wherein the exposure time of the digital micromirror device in the first direction during the ith scanning is M times, and the exposure time of the digital micromirror device in the first direction during the (i + 1) th scanning is 1 time;
drawing a comparison graph of equivalent auto-focusing measurement data of two adjacent micromirrors received by the graph of the ith scanning of one exposure device of the digital exposure machine at the measurement area j of the exposure substrate.
Optionally, the determining the scanning Mura of the digital exposure machine according to the equivalent auto-focus measurement data further includes:
and alarming the determined scanning Mura.
In a second aspect, an embodiment of the present invention provides a scanning Mura detection apparatus for a digital exposure machine, including:
a first acquisition module for acquiring point coordinates H of autofocus measurement data at a measurement area j of an exposure substrate for an ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;
a second obtaining module, configured to obtain a difference value matrix of autofocus measurement data at a measurement area j of the exposure substrate for an ith scan of each micromirror, where the difference value matrix is caused by an angle α of the digital micromirror device in the first direction and an angle β of the digital micromirror device in the second direction;
the third acquisition module is used for acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
a first determining module, configured to determine, according to the focusing plane measurement data matrix, the difference value matrix, and the exposure times, equivalent auto-focusing measurement data received by an image scanned at a measurement area j of the exposure substrate for the ith time;
and the second determining module is used for determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
Optionally, the difference value matrix BijComprises the following steps:
Figure BDA0002516438450000041
Figure BDA0002516438450000042
Figure BDA0002516438450000043
wherein D isαIs the difference in height in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, DβThe height difference between two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is p1 is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, L ═ M × d, W is the length of the dmd in the second direction, W ═ N × d, and the size of each micromirror is d × d.
Optionally, the number of exposures satisfies:
Figure BDA0002516438450000044
wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.
Optionally, the ith scanning is equivalent to the auto-focus measurement data C received from the pattern at the measurement region j of the exposed substrateij(k) Comprises the following steps:
Figure BDA0002516438450000051
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
Optionally, the scanning Mura detection apparatus of the digital exposure machine further includes:
a drawing module for drawing at least one of the following charts:
drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;
drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;
drawing a comparison graph of equivalent auto-focusing measurement data received by graphs at a measurement area j of the exposure substrate by the ith scanning and the (i + 1) th scanning of an exposure device of the digital exposure machine, wherein the exposure time of the digital micromirror device in the first direction during the ith scanning is M times, and the exposure time of the digital micromirror device in the first direction during the (i + 1) th scanning is 1 time;
drawing a comparison graph of equivalent auto-focusing measurement data of two adjacent micromirrors received by the graph of the ith scanning of one exposure device of the digital exposure machine at the measurement area j of the exposure substrate.
Optionally, the scanning Mura detection apparatus of the digital exposure machine further includes:
and the alarm module is used for alarming the determined scanning Mura.
In the embodiment of the invention, as the three-dimensional characteristic of the focusing surface and the exposure times (Multiple) are considered, more accurate automatic focusing measurement data can be determined, so that the scanning Mura of the data exposure machine is determined, the difference between each scanning of the digital exposure machine caused by automatic focusing can be analyzed according to the scanning Mura, so that the method has important effects on finding the real machine table factors causing the scanning Mura and solving the scanning Mura scheme, monitors the automatic focusing measurement data of the machine table in real time, alarms the automatic focusing measurement data which may cause the occurrence of the scanning Mura, and can monitor the occurring scanning Mura, thereby having great significance on the feasibility of mass production.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic view of an exposure process of a digital exposure machine;
FIG. 2 is a schematic diagram of a method for measuring the height of an exposed substrate during auto-focus;
FIG. 3 is an auto focus measurement data map;
FIG. 4 is a schematic view of a focusing plane during auto-focusing;
FIG. 5 is a schematic flow chart of a Mura scanning detection method of the digital exposure machine according to the embodiment of the present invention;
FIG. 6 is a schematic view of the scanning sequence and measurement area of the digital exposure machine;
FIG. 7 is a schematic diagram of the process of obtaining equivalent auto-diagonal data of the digital exposure machine according to the embodiment of the present invention;
fig. 8 and 9 are schematic diagrams of the number of exposures during one scan of the digital exposure machine according to the embodiment of the present invention;
FIGS. 10 and 11 show the data as C according to the equivalent auto-focus dataijA comparison schematic diagram of the drawn automatic focusing measurement data map and a lighting effect map of the actual display module;
FIGS. 12 and 13 are schematic diagrams of two-dimensional auto-focus measurement data maps according to embodiments of the present invention;
FIG. 14 is a schematic diagram of a three-dimensional auto-focus measurement data map according to an embodiment of the present invention;
FIGS. 15 and 16 are schematic diagrams of the difference between the equivalent autofocus measurement data received for the graphs at measurement region j of the exposed substrate for the ith and (i + 1) th scans;
FIG. 17 is a diagram illustrating a comparison of equivalent auto-focus measurement data of two adjacent micromirrors received from an ith scan of a pattern at measurement area j of an exposed substrate;
FIG. 18 is an interface diagram of software for mapping autofocus measurement data in an embodiment of the invention;
FIG. 19 is a schematic structural diagram of a scanning Mura detection apparatus of the digital exposure machine in the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The Mura scanning of the digital exposure machine is an urgent problem to be solved at present, and from the lighted display products, the overall law of the Mura scanning can be observed to be randomly distributed on the whole substrate (glass). As shown in fig. 1, which is a schematic view of an exposure process of a digital exposure machine, the factors affecting the exposure quality mainly include the following points: TTZ, the angle of the DMD (Digital micro mirror device); dose (exposure energy); fade (exposure energy blur zone); lens aberration; focus (focal) plane; stage Movement (machine motion condition); pattern index (Pattern Density). The above factors are compared with the random result of the result of Mura scanning, and the factors with random expression are Focus (focusing) plane and Stage Movement (machine motion condition) in the exposure process.
In order to transfer the pattern on the virtual mask to the photoresist completely and precisely, the digital exposure machine must have a certain depth of focus (DOF) to project the pattern on the photoresist layer, so that the entire photoresist layer has the same focusing effect whether it is close to the surface of the photoresist layer or the ground. Generally, the depth of focus provided by the digital exposure machine is expressed by DOF, where K is a constant related to the photoresist and the process parameters, K2 λ/(NA) ^2, NA is the value of the Numerical Aperture (NA) of the lens system of the digital exposure machine, and λ is the light source wavelength of the digital exposure machine. In order to increase the depth of focus of the digital exposure machine, the longer the wavelength of the light source, the better the NA value of the lens system of the digital exposure machine.
The resolution of the digital exposure machine is related to the light source wavelength of the digital exposure machine by R ═ K λ/NA, where K is a constant related to the photoresist and the process parameters, NA is the value of the numerical aperture of the lens system of the digital exposure machine, and λ is the light source wavelength of the digital exposure machine. From the above relationship, it can be known that the shorter the light source wavelength λ of the digital exposure machine, the smaller the resolution of the digital exposure machine. And the larger the NA of the lens system of the digital exposure machine, the smaller the resolution provided by the same digital exposure machine.
It can be seen that if the digital exposure machine has a higher resolution, the DOF is lower.
In order to ensure that the focus plane is always in the DOF in the exposure process, the detection sensor is arranged and used for measuring the height change of the exposure substrate and the machine table, the height of the digital micro-mirror device is adjusted according to the measured height change, and the focus plane is always in the DOF range in the exposure process. As shown in fig. 2, the figure includes three detection sensors for measuring the height of the exposed substrate, and a height (i.e., Autofocus measurement data) is obtained according to the measurement data of the three sensors, and the distance between the digital micromirror device and the exposed substrate is adjusted according to the height, so that the focus plane is always within the DOF, which is the function of Autofocus (Autofocus).
After exposing a complete substrate, the digital exposure machine records the automatic focusing measurement data of all SCANs in different exposure areas (EYE) of the exposed substrate at the same measurement position, draws an automatic focusing measurement data map (automatic focusing measurement data map), and analyzes the deformation of the exposed substrate and the machine.
As shown in fig. 3, the autofocus measurement data map (autofocus height map) is shown, in fig. 3, the abscissa indicates the Scan number (Scan No.) and indicates the nth Scan (Scan), the ordinate indicates the length of the measurement area (Scan position) (the length from the Scan start point), and the data in the two-dimensional map indicates the variation value of the autofocus measurement data in the nth Scan. However, the figure can only analyze the height change of the whole exposure substrate and the machine, and cannot analyze the difference between the scan and the scan caused by the automatic focusing, because the measured automatic focusing measurement data completely ignores the times of the whole Digital Micromirror Device (DMD), the angle of the DMD, and the Multiple (indicating how many micromirrors (mirrors) are exposed to the same position of the exposure substrate), and is completely abstracted into a point coordinate. As shown in fig. 4, the actual focus plane is an angled three-dimensional plane (i.e., the hourglass-shaped pattern in fig. 4), and all of the focus planes are treated as a value in the actual process, which is compatible with the actual observation that the scanning Mura has no obvious regularity between different exposed substrates, indicating that analyzing the autofocus measurement data has a significant effect on the generation of the scanning Mura.
Therefore, how to establish a method for analyzing and scanning Mura from the automatic focusing measurement data plays an important role in finding out real machine factors causing the Mura scanning and solving the Mura scanning scheme, monitors the automatic focusing measurement data of the machine in real time, alarms the automatic focusing measurement data possibly causing the Mura scanning, enables the Mura scanning to be monitored, and has great significance on the feasibility of mass production.
To solve the above problem, referring to fig. 5, an embodiment of the present invention provides a method for scanning Mura detection of a digital exposure machine, including:
step 51: acquiring point coordinates H of autofocus measurement data at measurement region j of an exposure substrate for the ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second directionThe number of (2);
it should be noted that a digital exposure machine includes a plurality of exposure apparatuses, each of which includes a digital micromirror device, and each of the exposure apparatuses corresponds to an exposure field (EYE) on the substrate to be exposed.
This step is to measure the point (i.e. the point coordinate H of the autofocus measurement data)ij) Conversion to measuring plane (i.e. focal plane measurement data matrix A)ij) Specifically, the point coordinate H of the autofocus measurement data at the test area j of the exposure substrate is scanned for the ith timeijEach micromirror (mirror) assigned to the digital micromirror device forms a matrix with the same number of micromirrors of the digital micromirror device, and the autofocus measurement data of each micromirror in the matrix is HijThe measurement point data of the micromirror at the kth row and the l column is Ai,j(k,l)＝Hij. Focusing plane measurement data matrix AijCan be expressed as:
Figure BDA0002516438450000091
as shown in fig. 6, the exposure substrate may be divided into a plurality of exposure fields (EYEs), each exposure field corresponding to one exposure apparatus of the digital exposure machine, and in fig. 6, the exposure substrate is divided into 18 EYEs, each EYE being scanned N times (Scan), each Scan corresponding to N measurement areas.
In the embodiment of the present invention, optionally, the first direction is an X-axis direction, i.e., a horizontal direction, and the second direction is a Y-axis direction, i.e., a vertical direction.
Step 52: acquiring a difference value matrix of autofocus measurement data of the ith scanning of each micromirror at a measurement area j of the exposure substrate, which is caused by an angle alpha of the digital micromirror device in a first direction and an angle beta of the digital micromirror device in a second direction;
this step is to convert the focal plane into a stereoscopic plane.
As shown in fig. 7, the digital micromirror device may have focal plane angles α and β in the horizontal and vertical directions at the time of exposure.
Wherein the number isThe height difference of the micromirrors at both edges of the digital micromirror device in the first direction is H when the angle of the micromirror device in the first direction is αα：
Figure BDA0002516438450000101
When the angle of the digital micro-mirror device in the second direction is β, the height difference of the micro-mirror at the two edges of the digital micro-mirror device in the second direction is Hβ：
Figure BDA0002516438450000102
When the angle of the digital micro-mirror device in the first direction is α, the height difference between two adjacent micro-mirrors of the digital micro-mirror device in the first direction is Dα：
Figure BDA0002516438450000103
Wherein p1 is a utilization rate of micromirrors in a first direction of the dmd, L is a length of the dmd in the first direction, L ═ M × d, W is a length of the dmd in a second direction, W ═ N × d, and a size of each micromirror is d.
When the angle of the digital micromirror device in the second direction is β, the height difference between two adjacent micromirrors in the second direction is Dβ：
Figure BDA0002516438450000104
Wherein p2 is a utilization rate of micromirrors in the second direction of the dmd, L is a length of the dmd in the first direction, L ═ M × d, W is a length of the dmd in the second direction, W ═ N × d, and a size of each micromirror is d.
In the embodiment of the present invention, when calculating the height difference of the micromirror in the first direction, the height difference of the other micromirrors from the micromirror is calculated with the micromirror on one edge of the digital micromirror device in the first direction as a reference, and similarly, when calculating the height difference of the micromirror in the second direction, the height difference of the other micromirrors from the micromirror is calculated with the micromirror on one edge of the digital micromirror device in the second direction as a reference.
BijThe difference value of the autofocus measurement data of the micromirror in the kth row and the l column is Bi,j(k,l)＝l*Dα+k*Dβ。
BijCan be expressed as follows:
Figure BDA0002516438450000111
step 53: acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
the number of exposures (Mutiple value) is the number of micromirrors (mirrors) that are exposed at a time for a pattern at the same position on the substrate to be exposed. As shown in fig. 8, a black dotted line indicates an exposure substrate, a grid Pattern is a digital micromirror device, each grid represents one micromirror, a rectangular Pattern (Pattern) on the exposure substrate indicates a fixed position Pattern on the exposure substrate, and an oval Pattern indicates a flip angle of the micromirror of the digital micromirror device as exposure.
As shown in fig. 9, in the actual exposure process, the digital micromirror device exposes the same Pattern (Pattern) 3 times, i.e. three micromirrors are used for exposure, and the number of exposures is 3. In the actual exposure process, the position of the digital micromirror device is fixed, the exposure substrate moves along the exposure direction, and the process from t1 to t3 is equal-spacing selective micromirror exposure.
The exposure times satisfy:
Figure BDA0002516438450000112
wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.
Step 54: and determining equivalent auto-focusing measurement data received by the graph scanned at the measurement area j of the exposure substrate at the ith time according to the focusing plane measurement data matrix, the difference value matrix and the exposure times.
Wherein the ith scanning is used for scanning the equivalent auto-focusing measurement data C received by the graph at the measurement area j of the exposure substrateij(k) Can be expressed as:
Figure BDA0002516438450000113
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
Step 55: and determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
In the embodiment of the invention, as the three-dimensional characteristic of the focusing surface and the exposure times (Multiple) are considered, more accurate automatic focusing measurement data can be determined, so that the scanning Mura of the data exposure machine is determined, the difference between each scanning of the digital exposure machine caused by automatic focusing can be analyzed according to the scanning Mura, so that the method has important effects on finding the real machine table factors causing the scanning Mura and solving the scanning Mura scheme, monitors the automatic focusing measurement data of the machine table in real time, alarms the automatic focusing measurement data which may cause the occurrence of the scanning Mura, and can monitor the occurring scanning Mura, thereby having great significance on the feasibility of mass production.
Referring again to FIG. 7, the method of detecting the scanning mura of the above-mentioned digital exposure machine will be described, in which (a) of FIG. 7 is measuredPoint coordinates of the autofocus data, and (b) point coordinates Hij→ in-focus plane measurement data matrix AijAnd (C) considering the angles α and β of the DMD in the first and second directions, the DMD size is W x L, the exposure times of the DMD in one scan, the above factors cooperate to cause the graphic received in the location area j in the ith scan to have the equivalent auto-focus data CijBy using CijThe difference between SCAN and SCAN caused by the autofocus data variation can be analyzed.
Will be C from the equivalent auto-focus dataijComparing the drawn auto-focus measurement data map with the lighting effect map of the actual display module, please refer to fig. 10 and fig. 11, it can be seen that the auto-focus measurement data map can accurately simulate the Mura distribution of the actual display module.
In this embodiment of the present invention, optionally, after determining the equivalent autofocus measurement data received by the pattern at the measurement area j of the exposed substrate in the ith scanning, the method further includes:
plotting at least one of the following graphs:
1) drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;
referring to fig. 12 and 13, fig. 12 and 13 are two-dimensional equivalent auto-focus measurement data maps according to an embodiment of the present invention, and the difference between fig. 12 and 13 is that in fig. 13, a Digital Micromirror Device (DMD) has a certain focusing angle (0.7 degrees). In fig. 12 and 13, the first coordinate axis of the two-dimensional equivalent auto focus measurement data map is a Scan serial number (Scan No.), and the second coordinate axis is a measurement area (Scan Position).
2) Drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;
referring to fig. 14, fig. 14 is a three-dimensional equivalent auto focus measurement data map according to an embodiment of the present invention, in fig. 14, a first coordinate axis of the three-dimensional equivalent auto focus measurement data map is a scanning serial number (Scan No.), a second coordinate axis is a measurement area (Scan Position), and a third coordinate axis is equivalent auto focus measurement data (auto focus Height).
The height h on the third axis can be expressed as:
h＝f(i,j,Cij(k))
3) referring to fig. 15 and fig. 16, a comparison graph of equivalent auto-focus measurement data received by graphs at a measurement area j of the exposure substrate for the ith scan and the (i + 1) th scan of an exposure device of the digital exposure machine is drawn, wherein the exposure time of the digital micromirror device in the first direction during the ith scan is M times, and the exposure time of the digital micromirror device in the first direction during the (i + 1) th scan is 1 time, so as to find out the difference between different scans.
The difference in the equivalent autofocus measurement data received by the pattern at measurement area j of the exposed substrate for the ith and (i + 1) th scans can be expressed as:
DH＝Cij(M)-Ci+1j(1)
4) referring to fig. 17, a comparison graph of the equivalent autofocus measurement data of two adjacent micromirrors received by the graph at the measurement area j of the exposure substrate at the ith scanning of an exposure apparatus of the digital exposure machine is drawn, and the difference of the equivalent autofocus measurement data of two adjacent micromirrors can be represented as:
DR＝Cij(j+1)-Ci+1j(j),j＝1,2....,N
in this embodiment of the present invention, optionally, after determining the equivalent autofocus measurement data received by the pattern at the measurement area j of the exposed substrate in the ith scanning, the method further includes:
and alarming the Mura scanning according to the equivalent automatic focusing measurement data of each scanning in one exposure area.
In the embodiment of the present invention, the software interface shown in fig. 18 may be used to draw an autofocus measurement data map, where:
1. the Mode (Mode) can select two modes of 1 EYE internal Scan to Scan and Eye to Eye.
2. Parameter values including Digital Micromirror Device (DMD): angle (Angle), Ratio (Ratio) (i.e. utilization of micromirrors), Resolution (e.g. 1600 × 2560 Resolution) indicate that the dmd has 1600 micromirrors in the first direction and 2560 micromirrors in the second direction.
3. And analyzing the specified Eye.
4. Any SCAN and any measurement region are specified for analysis.
Referring to fig. 19, an embodiment of the present invention further provides a scanning Mura detection apparatus for a digital exposure machine, including:
a first acquisition module for acquiring point coordinates H of autofocus measurement data at a measurement area j of an exposure substrate for an ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;
a second obtaining module, configured to obtain a difference value matrix of autofocus measurement data at a measurement area j of the exposure substrate for an ith scan of each micromirror, where the difference value matrix is caused by an angle α of the digital micromirror device in the first direction and an angle β of the digital micromirror device in the second direction;
the third acquisition module is used for acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
a first determining module, configured to determine, according to the focusing plane measurement data matrix, the difference value matrix, and the exposure times, equivalent auto-focusing measurement data received by an image scanned at a measurement area j of the exposure substrate for the ith time;
and the second determining module is used for determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
Optionally, the difference value matrix BijComprises the following steps:
Figure BDA0002516438450000151
Figure BDA0002516438450000152
Figure BDA0002516438450000153
wherein D isαIs the difference in height in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, DβThe height difference between two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is p1 is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, L ═ M × d, W is the length of the dmd in the second direction, W ═ N × d, and the size of each micromirror is d × d.
Optionally, the number of exposures satisfies:
Figure BDA0002516438450000154
wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.
Optionally, the ith scan is an equivalent auto-focus measurement number received for a pattern at measurement region j of the exposed substrateAccording to Cij(k) Comprises the following steps:
Figure BDA0002516438450000155
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
Optionally, the scanning Mura detection apparatus of the digital exposure machine further includes:
a drawing module for drawing at least one of the following charts:
drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;
drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;
drawing a comparison graph of equivalent auto-focusing measurement data received by graphs at a measurement area j of the exposure substrate by the ith scanning and the (i + 1) th scanning of an exposure device of the digital exposure machine, wherein the exposure time of the digital micromirror device in the first direction during the ith scanning is M times, and the exposure time of the digital micromirror device in the first direction during the (i + 1) th scanning is 1 time;
drawing a comparison graph of equivalent auto-focusing measurement data of two adjacent micromirrors received by the graph of the ith scanning of one exposure device of the digital exposure machine at the measurement area j of the exposure substrate.
Optionally, the scanning Mura detection apparatus of the digital exposure machine further includes:
and the alarm module is used for alarming the determined scanning Mura.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A method for detecting the scanning Mura of a digital exposure machine is characterized by comprising the following steps:
acquiring point coordinates H of autofocus measurement data at measurement region j of an exposure substrate for the ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;
acquiring a difference value matrix of autofocus measurement data of the ith scanning of each micromirror at a measurement area j of the exposure substrate, which is caused by an angle alpha of the digital micromirror device in a first direction and an angle beta of the digital micromirror device in a second direction;
acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
according to the focusing plane measurement data matrix, the difference value matrix and the exposure times, determining equivalent automatic focusing measurement data received by the graph scanned at the measurement area j of the exposure substrate at the ith time;
and determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
2. As claimed inThe method of 1, wherein the difference value matrix BijComprises the following steps:
Figure FDA0002516438440000011
Figure FDA0002516438440000012
Figure FDA0002516438440000013
wherein D isαIs the difference in height in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, DβThe height difference between two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is p1 is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, L ═ M × d, W is the length of the dmd in the second direction, W ═ N × d, and the size of each micromirror is d × d.
3. The method of claim 2, wherein the number of exposures satisfies:
Figure FDA0002516438440000021
wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.
4. The method of claim 3, wherein the ith scan receives equivalent auto-focus measurement data C for a pattern at measurement zone j of the exposed substrateij(k) Comprises the following steps:
Figure FDA0002516438440000022
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
5. The method of claim 1, wherein determining the equivalent autofocus measurement data received for the pattern at measurement area j of the exposed substrate for the ith scan further comprises:
plotting at least one of the following graphs:
drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;
drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;
drawing a comparison graph of equivalent auto-focusing measurement data received by graphs at a measurement area j of the exposure substrate by the ith scanning and the (i + 1) th scanning of an exposure device of the digital exposure machine, wherein the exposure time of the digital micromirror device in the first direction during the ith scanning is M times, and the exposure time of the digital micromirror device in the first direction during the (i + 1) th scanning is 1 time;
drawing a comparison graph of equivalent auto-focusing measurement data of two adjacent micromirrors received by the graph of the ith scanning of one exposure device of the digital exposure machine at the measurement area j of the exposure substrate.
6. The method of claim 1, wherein said determining the scanning Mura of the digital exposure machine from the equivalent autofocus measurement data further comprises:
and alarming the determined scanning Mura.
7. A scanning Mura detection device of a digital exposure machine is characterized by comprising:
a first acquisition module for acquiring point coordinates H of autofocus measurement data at a measurement area j of an exposure substrate for an ith scan of an exposure apparatus of a digital exposure machineijConverting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is HijM is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;
a second obtaining module, configured to obtain a difference value matrix of autofocus measurement data at a measurement area j of the exposure substrate for an ith scan of each micromirror, where the difference value matrix is caused by an angle α of the digital micromirror device in the first direction and an angle β of the digital micromirror device in the second direction;
the third acquisition module is used for acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;
a first determining module, configured to determine, according to the focusing plane measurement data matrix, the difference value matrix, and the exposure times, equivalent auto-focusing measurement data received by an image scanned at a measurement area j of the exposure substrate for the ith time;
and the second determining module is used for determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.
8. The apparatus of claim 7, wherein the disparity value matrix BijComprises the following steps:
Figure FDA0002516438440000031
Figure FDA0002516438440000032
Figure FDA0002516438440000041
wherein D isαIs the difference in height in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, DβThe height difference between two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is p1 is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, L ═ M × d, W is the length of the dmd in the second direction, W ═ N × d, and the size of each micromirror is d × d.
9. The apparatus of claim 8, wherein the number of exposures satisfies:
Figure FDA0002516438440000042
wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.
10. The apparatus of claim 9, wherein the ith scan is equivalent autofocus measurement data C received for a pattern at measurement area j of the exposed substrateij(k) Comprises the following steps:
Figure FDA0002516438440000043
Bi,j(k,l)＝l*Dα+k*Dβ
wherein, Bij(k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.
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JP2006178057A (en) * 2004-12-21 2006-07-06 Integrated Solutions:Kk Exposure apparatus
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