CN111521648A - Oxygen sensor chip with heating circuit wrapped by cast alumina - Google Patents
Oxygen sensor chip with heating circuit wrapped by cast alumina Download PDFInfo
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- CN111521648A CN111521648A CN202010366339.9A CN202010366339A CN111521648A CN 111521648 A CN111521648 A CN 111521648A CN 202010366339 A CN202010366339 A CN 202010366339A CN 111521648 A CN111521648 A CN 111521648A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 40
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000001301 oxygen Substances 0.000 title claims abstract description 28
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 28
- 239000010410 layer Substances 0.000 claims abstract description 153
- 230000007704 transition Effects 0.000 claims abstract description 24
- 239000011241 protective layer Substances 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 13
- 238000007650 screen-printing Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims abstract description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 238000000498 ball milling Methods 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 8
- 238000000462 isostatic pressing Methods 0.000 claims description 8
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 235000021323 fish oil Nutrition 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 2
- 238000007766 curtain coating Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 14
- 238000009413 insulation Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The invention relates to the field of oxygen sensor manufacturing, and particularly discloses an oxygen sensor chip with a heating circuit wrapped by cast alumina. The transition layer is added between the circuit layer and the protective layer and then is tightly laminated together, the transition layer can completely wrap the heating circuit on the circuit layer, so that a good insulation effect is achieved, compared with a mode of printing an insulation layer by using a screen printing technology, the mode of laminating the transition layer and the circuit layer together has lower technical requirements, and the realization is easier in actual operation.
Description
Technical Field
The invention relates to the field of oxygen sensor manufacturing, in particular to an oxygen sensor chip with a heating circuit wrapped by cast alumina.
Background
In order to reduce the exhaust emission pollution of an engine and improve the comprehensive utilization rate of fuel gas, an oxygen sensor is designed for setting the air-fuel ratio of mixed gas, and due to the inherent characteristics of the oxygen sensor, the oxygen sensor outputs a random signal in a cold state, the signal has no reference significance, and normal gas detection can be started at room temperature only after heat control is added.
The oxygen sensor chip is a thermal control chip, the most core part in the chip is a heating circuit, and the traditional heating circuit insulation is to print an insulating layer on a zirconia substrate printed with the heating circuit by a screen printing technology. The printing insulating layer has higher requirements on the printing process, and if the printing insulating layer is poor in the printing process, the performance of the oxygen sensor chip is greatly influenced.
Disclosure of Invention
The invention aims to solve the problem of high requirement of the printing process of the existing printing insulating layer, and designs an oxygen sensor chip with a heating circuit wrapped by cast alumina.
The technical scheme of the invention is that the oxygen sensor chip with the heating circuit wrapped by the cast alumina comprises a circuit layer printed with the heating circuit, protective layers wrapping the circuit layer are covered on the upper side and the lower side of the circuit layer, a transition layer is laminated between the circuit layer and the protective layers, and the transition layer is a matrix prepared by mixing and casting zirconia and alumina according to different proportions.
More specifically, the transition layer is composed of a plurality of layers of matrixes with different components, the transition layer is formed by laminating three layers of matrixes, namely a zirconium-based layer, an intermediate layer and an aluminum-based layer, wherein the zirconium-based layer is a matrix with the thickness of 50 microns formed by mixing and casting 80% of zirconia and 20% of alumina; the middle layer is a matrix which is formed by mixing and casting 50% of zirconia and 50% of alumina into a thickness of 70 mu m; the aluminum-containing layer is a matrix which is prepared by mixing and casting 20% of zirconia and 80% of alumina and has a thickness of 90 mu m.
In order to better realize the transition from the circuit layer to the protective layer, the transition layer is distributed in a mode that a partial aluminum layer, a middle layer and a partial zirconium layer are sequentially arranged from the circuit layer to the protective layer.
The protective layer was a substrate formed by laminating 6 layers of 100 μm zirconia sheets by isostatic pressing.
The circuit layer of the present invention is peculiar in that the circuit layer has two layers, and the heating circuit is printed on opposite faces of one of the two layers, and both substrates of the circuit layer are 50 μm 100% alumina substrates.
The heating circuit forming method of the circuit layer comprises the steps that the heating circuit of the circuit layer is formed by printing through a screen printing technology, all the substrates are laminated together through an isostatic pressing technology by the circuit layer, the transition layer and the protective layer, and the heating circuit is completely wrapped in zirconia to form the chip body.
In the aspect of a forming process, the shrinkage rate of chip sintering is controlled by the particle size of slurry and the ball milling time, the average particle size of aluminum powder in the slurry is required to be 1.21 mu m, superfine talcum powder is used as a sintering aid in the slurry besides the aluminum powder, toluene and n-butyl alcohol are used as a mixed solvent, polyvinyl butyral is used as an adhesive, polyethylene glycol is used as a plasticizer, and fish oil is used as a dispersant; the ball milling time is controlled to be 3-24 hours, and the standard of sieving with a 250-mesh sieve is adopted.
The invention has the beneficial effects that 1. the transition layer is added between the circuit layer and the protective layer, then the three layers are tightly laminated together, the transition layer can completely wrap the heating circuit on the circuit layer, thereby having good insulation effect.
2. The invention improves the integral qualification rate of the product manufacturing process, and the invention is characterized in that a layer of pure alumina material is mixed in the zirconia layer, and the problem of crosstalk of the signal layer by heating voltage can be thoroughly solved by utilizing the high insulation characteristic of the alumina material.
Drawings
FIG. 1 is an exploded view of a substrate of layers according to the present invention;
Detailed Description
The invention relates to a heat control component of an oxygen sensor, which is used for heating the oxygen sensor so as to realize the normal operation of the oxygen sensor, and the traditional heating circuit insulation is to print an insulating layer on a zirconia substrate printed with the heating circuit by a screen printing technology. The method has high requirements on a printing process, if the defects occur in the printing process, the performance of the oxygen sensor chip is greatly influenced, and meanwhile, the insulation requirement between a chip heating layer and a signal layer is increasingly improved based on the material characteristics of the change of the conductivity of the zirconia after the temperature is increased and the development trend of miniaturization of the current chip, so that the development of a new insulation mode is imperative.
Therefore, the same effect as that of the heating circuit insulating layer is achieved by changing the structure of the traditional oxygen sensor and adopting a structure with lower process requirements (the traditional insulating layer corresponds to the transition layer in the structure of the invention, and is distinguished by different names in order to avoid confusion with the traditional product structure).
Compared with the traditional oxygen sensor, the oxygen sensor has the advantages that functionally, the transition layer and the insulating layer can play the same role of protecting the heating circuit and maintaining the insulation; in the aspect of process manufacturing difficulty, the process requirement of the insulating layer is high, the technical requirement on a manufacturer is high, the process requirement of the transition layer is low, and the process technology which is common in the industry is adopted, so that the technical requirement is reduced, more manufacturers can participate in production, the technical threshold of the product is reduced, and the production scale of the product is enlarged.
The specific structure and principle for achieving the above advantages will be described in detail with reference to fig. 1:
the invention is formed by laminating 10 layers of substrates, and for convenience of description, the right side of each layer of substrate is marked with a serial number in the attached figure 1.
In the present invention, there are 10 layers of substrates, wherein the upper 5 layers of substrates and the lower 5 layers of substrates are symmetrical, i.e., the nth layer of substrates and the (11-n) th layer of substrates are the same.
For the sake of simplicity, the substrate of the nth layer is referred to as the n layer. The 1 layer and the 10 layers are protective layers, the 2 layer, the 3 layer, the 4 layer, the 7 layer, the 8 layer and the 9 layer are transition layers, and the 5 layer and the 6 layer are circuit layers.
Wherein the wiring layers are printed with heating wiring by a screen printing technique, and the heating wiring is printed on a surface of one of the layers, which is a face opposite to the other, and 5 and 6 layers each of which is a 50 μm 100% alumina matrix.
The protective layers were 1 and 10 layers, and each of the two substrates was laminated by isostatic pressing of 6 100 μm sheets of zirconia.
The 6 layers of the transition layer are further divided into a partial aluminum layer, an intermediate layer and a partial zirconium layer from near to far according to the distance from the circuit layer. The 4 layers and the 7 layers are aluminum partial layers, and the aluminum partial layers are prepared by mixing 20 percent of zirconia and 80 percent of alumina and casting into a matrix with the thickness of 90 mu m; 3 layers and 8 layers are intermediate layers, and the intermediate layers are prepared by mixing and casting 50% of zirconia and 50% of alumina into a matrix with the thickness of 70 mu m; the 2 and 9 layers are zirconium oxide layers, and the zirconium oxide layer is a matrix which is mixed and cast into a thickness of 50 μm by 80% of zirconium oxide and 20% of aluminum oxide.
The heating circuit of the circuit layer is printed by a screen printing technology, all the substrates (all 1-10 layers of substrates) are laminated together by the circuit layer, the transition layer and the protective layer through an isostatic pressing technology, and the heating circuit is completely wrapped in the zirconium oxide to form the chip body. Obviously, the heating circuit is protected by printing an insulating layer by using a screen printing technology in the conventional process, and the structural design is realized by completely wrapping the heating circuit in zirconia by laminating a plurality of layers of matrixes through an isostatic pressing technology, so that the protection is realized, and the isostatic pressing technology has lower requirements (the screen printing technology is not difficult per se, but the insulation of the circuit is not easy to realize by using the printing technology) and is easier to realize than the screen printing technology.
In order to ensure the determination of the size of the chip during sintering, the shrinkage rate of the chip sintering is controlled by the particle size of slurry and the ball milling time, so that the size of the chip is controlled within a tolerance range, the volume change caused by the difference of thermal expansion coefficients is reduced by a pressure sintering mode in the binder removal sintering process, the average particle size of aluminum powder in the slurry is required to be 1.21 mu m, superfine talcum powder is also adopted as a sintering aid in the slurry besides the aluminum powder, toluene and n-butyl alcohol are adopted as a mixed solvent, polyvinyl butyral is adopted as an adhesive, polyethylene glycol is adopted as a plasticizer, fish oil is adopted as a dispersant, the 250-mesh sieve is adopted as a standard after ball milling, and the specific ball milling time can be referred as:
1 layer and 10 layers are 100% zirconia matrix, and the ball milling time is controlled to be 24 h;
5 layers and 6 layers are 100% alumina matrix, and the ball milling time is controlled to be 3 h;
the transition layers (including 2 layers, 3 layers, 4 layers, 7 layers, 8 layers and 9 layers) can be used for setting the ball milling time according to the proportion of the slurry, and the time is controlled to be between 3 and 24 hours, and an example is provided below for reference;
the 2 layers and the 9 layers are mixed matrixes of 80 percent of zirconia and 20 percent of alumina, and the ball milling time is 19 hours;
3 layers and 8 layers are mixed matrixes of 50 percent of zirconium oxide and 50 percent of aluminum oxide, and the ball milling time is 14 hours;
the 4 layers and 7 layers are mixed matrix of 20 percent zirconia and 80 percent alumina, and the casting time is 9 h.
The slurry after ball milling of each matrix needs to be kept still for defoaming and then is subjected to tape casting, wherein the tape casting thickness is the thickness of each layer of matrix mentioned above. The specific operation process is well known in the industry and will not be described herein.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications to some parts of the technical solutions by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (8)
1. The utility model provides an oxygen sensor chip with curtain coating alumina parcel heating line, is including the circuit layer that the printing has the heating line, its characterized in that, the upper and lower both sides on circuit layer cover has the protective layer of its parcel, circuit layer with it has the transition layer to fold between the protective layer, the transition layer is the base member that zirconia and alumina mix the curtain coating according to different proportions and make.
2. The oxygen sensor chip of claim 1, wherein the transition layer is formed by laminating three layers of substrates, namely a meta-zirconium layer, an intermediate layer and a meta-aluminum layer,
the zirconium layer is a matrix which is formed by mixing and casting 80% of zirconium oxide and 20% of aluminum oxide into a thickness of 50 mu m;
the middle layer is a matrix which is formed by mixing and casting 50% of zirconia and 50% of alumina into a thickness of 70 mu m;
the aluminum-containing layer is a matrix which is prepared by mixing and casting 20% of zirconia and 80% of alumina and has a thickness of 90 mu m.
3. The oxygen sensor chip with heating wire wrapped in cast alumina as claimed in claim 2, wherein the transition layer is distributed in the order of partial aluminum layer, intermediate layer, partial zirconium layer from wire layer to protective layer.
4. The oxygen sensor chip with heating wire wrapped in cast alumina as claimed in claim 1, wherein the protective layer is 6 layers of 100 μm zirconia sheets, a matrix laminated by isostatic pressing.
5. An oxygen sensor chip having a heating wire wrapped in a cast alumina as claimed in claim 1, wherein said wire layer has two layers and the heating wire is printed on one of the opposite faces, and both substrates of said wire layer are 50 μm 100% alumina substrates.
6. An oxygen sensor chip with heating wire wrapped in cast alumina as claimed in claim 1, wherein the heating wire of the wire layer is printed by screen printing technique, the wire layer, transition layer and protective layer are laminated together by isostatic pressing technique, and the heating wire is wrapped completely in zirconia to form the chip body.
7. The oxygen sensor chip with heating wire wrapped with cast alumina as claimed in claim 6, wherein the shrinkage of the chip sintering is controlled by the particle size of the slurry and the ball milling time, the average particle size of the aluminum powder in the slurry is required to be 1.21 μm, besides the aluminum powder, the slurry also uses ultra-fine talc powder as sintering aid, toluene and n-butanol as mixed solvent, polyvinyl butyral as binder, polyethylene glycol as plasticizer, fish oil as dispersant.
8. The oxygen sensor chip with heating wire wrapped in cast alumina of claim 7, wherein the ball milling time is controlled in 3-24 hours, standard of 250 mesh sieve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010366339.9A CN111521648A (en) | 2020-04-30 | 2020-04-30 | Oxygen sensor chip with heating circuit wrapped by cast alumina |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010366339.9A CN111521648A (en) | 2020-04-30 | 2020-04-30 | Oxygen sensor chip with heating circuit wrapped by cast alumina |
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| Publication Number | Publication Date |
|---|---|
| CN111521648A true CN111521648A (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010366339.9A Pending CN111521648A (en) | 2020-04-30 | 2020-04-30 | Oxygen sensor chip with heating circuit wrapped by cast alumina |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117309961A (en) * | 2023-10-11 | 2023-12-29 | 苏州工业园区福特斯汽车电子有限公司 | Symmetrical structure type oxygen sensor chip and manufacturing method thereof |
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2020
- 2020-04-30 CN CN202010366339.9A patent/CN111521648A/en active Pending
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|---|---|---|---|---|
| CN102608182A (en) * | 2012-02-20 | 2012-07-25 | 曾咏平 | Oxygen sensor chip and manufacturing method thereof |
| CN102608193A (en) * | 2012-04-10 | 2012-07-25 | 无锡隆盛科技有限公司 | Flat oxygen sensor and preparation method thereof |
| CN104880500A (en) * | 2014-07-08 | 2015-09-02 | 广东风华高新科技股份有限公司 | Flake-type oxygen sensor and preparation method thereof |
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| CN117309961A (en) * | 2023-10-11 | 2023-12-29 | 苏州工业园区福特斯汽车电子有限公司 | Symmetrical structure type oxygen sensor chip and manufacturing method thereof |
| CN117309961B (en) * | 2023-10-11 | 2024-02-06 | 苏州工业园区福特斯汽车电子有限公司 | Symmetrical structure type oxygen sensor chip and manufacturing method thereof |
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Application publication date: 20200811 |