CN111518487A - Special PID (potential induced degradation) -resistant POE (polyolefin elastomer) adhesive film for photovoltaic dual-glass assembly packaging and preparation method thereof - Google Patents
Special PID (potential induced degradation) -resistant POE (polyolefin elastomer) adhesive film for photovoltaic dual-glass assembly packaging and preparation method thereof Download PDFInfo
- Publication number
- CN111518487A CN111518487A CN202010468997.9A CN202010468997A CN111518487A CN 111518487 A CN111518487 A CN 111518487A CN 202010468997 A CN202010468997 A CN 202010468997A CN 111518487 A CN111518487 A CN 111518487A
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- China
- Prior art keywords
- poe
- adhesive film
- pid
- tert
- resistant
- Prior art date
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- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 98
- 239000011521 glass Substances 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 229920006124 polyolefin elastomer Polymers 0.000 title abstract description 154
- 230000015556 catabolic process Effects 0.000 title abstract description 8
- 238000006731 degradation reaction Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 74
- 239000011347 resin Substances 0.000 claims abstract description 74
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 64
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 64
- 238000004132 cross linking Methods 0.000 claims abstract description 30
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 23
- 239000007822 coupling agent Substances 0.000 claims abstract description 22
- 239000004611 light stabiliser Substances 0.000 claims abstract description 22
- 239000002250 absorbent Substances 0.000 claims abstract description 21
- 230000002745 absorbent Effects 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims description 91
- 238000003756 stirring Methods 0.000 claims description 27
- SAJFQHPVIYPPEY-UHFFFAOYSA-N 2,6-ditert-butyl-4-(dioctadecoxyphosphorylmethyl)phenol Chemical group CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SAJFQHPVIYPPEY-UHFFFAOYSA-N 0.000 claims description 22
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 22
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 claims description 22
- 229940116351 sebacate Drugs 0.000 claims description 22
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 claims description 22
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 21
- 239000000155 melt Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 238000001125 extrusion Methods 0.000 claims description 12
- SYXTYIFRUXOUQP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)C SYXTYIFRUXOUQP-UHFFFAOYSA-N 0.000 claims description 11
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 claims description 11
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 11
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 11
- CARSMBZECAABMO-UHFFFAOYSA-N 3-chloro-2,6-dimethylbenzoic acid Chemical compound CC1=CC=C(Cl)C(C)=C1C(O)=O CARSMBZECAABMO-UHFFFAOYSA-N 0.000 claims description 11
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 claims description 11
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 11
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 230000009977 dual effect Effects 0.000 claims description 10
- 238000004049 embossing Methods 0.000 claims description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 10
- 238000001291 vacuum drying Methods 0.000 claims description 10
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 9
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229910052681 coesite Inorganic materials 0.000 claims description 9
- 229910052593 corundum Inorganic materials 0.000 claims description 9
- 229910052906 cristobalite Inorganic materials 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 229910052682 stishovite Inorganic materials 0.000 claims description 9
- 229910052905 tridymite Inorganic materials 0.000 claims description 9
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 9
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000005303 weighing Methods 0.000 claims description 8
- 229910052693 Europium Inorganic materials 0.000 claims description 3
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 claims description 2
- OXGOEZHUKDEEKS-UHFFFAOYSA-N 3-tert-butylperoxy-1,1,5-trimethylcyclohexane Chemical compound CC1CC(OOC(C)(C)C)CC(C)(C)C1 OXGOEZHUKDEEKS-UHFFFAOYSA-N 0.000 claims description 2
- 230000032683 aging Effects 0.000 abstract description 14
- 239000003292 glue Substances 0.000 abstract description 5
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 11
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 10
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 10
- 239000011259 mixed solution Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000012153 distilled water Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 235000006408 oxalic acid Nutrition 0.000 description 7
- 239000002244 precipitate Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 6
- 210000004027 cell Anatomy 0.000 description 6
- 238000007865 diluting Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000000536 complexating effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 1
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 1
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium oxide Inorganic materials [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 1
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to the technical field of solar cell packaging adhesive films, in particular to a special PID (potential induced degradation) resistant POE (polyolefin elastomer) adhesive film for packaging a photovoltaic dual-glass assembly and a preparation method thereof, wherein the POE adhesive film comprises the following raw materials in parts by weight: 1-30 parts of POE graft modified resin, 90-95 parts of first POE resin, 0.01-0.5 part of ultraviolet absorbent, 0.1-0.5 part of PID regulator, 0.01-0.5 part of light stabilizer, 0.5-5 parts of crosslinking assistant, 0.1-0.5 part of coupling agent, 0.01-0.5 part of antioxidant and 0.5-5 parts of crosslinking agent. Compared with the glue film used in the existing industry, the POE glue film has better PID resistance and aging resistance, and can ensure that the power attenuation of the PID after 192 hours is controlled within 3.0%.
Description
Technical Field
The invention relates to the technical field of solar cell packaging adhesive films, in particular to a special PID (potential induced degradation) -resistant POE (polyolefin elastomer) adhesive film for packaging a photovoltaic dual-glass assembly and a preparation method thereof.
Background
With the increasing exhaustion of fossil energy and the continuous and serious pollution of the global environment, renewable energy and various green energy are paid more and more attention. Solar power generation is also increasingly popular, and a solar photovoltaic module is a device for converting solar energy into electric energy. With the use of solar modules in different environments, it has been found that the photovoltaic modules applied under high temperature and high humidity conditions exhibit ion migration between the encapsulation material and the upper glass of the module cell under the action of high voltage for a long time, which deteriorates the passivation effect on the cell surface and causes the power attenuation of the module. At present, the packaging adhesive film for the photovoltaic module on the industry mainly adopts ethylene-vinyl acetate (EVA) resin as a base material, but the EVA adhesive film has poor weather resistance, is easy to degrade and discolor after long-term use, influences the light transmittance and the adhesion, and reduces the output efficiency of the module. In addition, the EVA adhesive film is easy to separate acetic acid molecules, corrode parts such as an aluminum alloy frame and the like, and the service life of the assembly is shortened.
Polyolefin elastomer (POE) is an ethylene-octene copolymer produced by metallocene catalysis technology, has a saturated aliphatic chain structure, has numerous short branched chains on the molecular chain, does not have active polar groups, and has low crystallinity, so that POE resin has physical and mechanical properties including high light transmittance, high toughness and high strength. Compared with the EVA packaging adhesive film widely used at present, the POE adhesive film has the advantages of equivalent light transmittance indexes, volume resistivity, water vapor barrier rate, ultraviolet aging yellowing resistance, service life and other performance indexes, so that the POE adhesive film is an ideal base material of the photovoltaic module packaging adhesive film.
With the continuous innovation of the cell technology, on the premise of pursuing the electricity cost, it is one of effective methods to continuously increase the power of the assembly, such as the release of the dual-sided PERC cell in kangwei, aixu, and the dual-sided N-type cell in the forest, the aerospace machinery, so that the photoelectric efficiency of the photovoltaic assembly is further increased, and the assembly manufacturer has released the high-efficiency dual-glass assembly. At present, the packaging adhesive film for the dual-glass assembly is mainly an EVA adhesive film and a POE adhesive film, but the EVA adhesive film has the defects of low mechanical strength, high water vapor transmittance, high water absorption rate and poor weather resistance, so that the anti-PID effect of the front and back surfaces of the dual-glass assembly packaged is poor. And the POE adhesive film as a non-polar material has the advantages of low water vapor permeability and high volume resistivity, so that the POE adhesive film is more suitable for packaging the double-glass assembly, the anti-PID effect of the assembly is obviously improved compared with the EVA adhesive film, but in the aging test and long-term use of the assembly, the risk of PID failure of the POE adhesive film on the back of the double-sided battery is found, and the power attenuation is controlled within 5.0% after the PID 192h on the back of the double-glass assembly battery is required by the general industry.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide the special PID-resistant POE adhesive film for packaging the photovoltaic double-glass assembly, wherein the POE adhesive film has better PID resistance compared with the adhesive film used in the existing industry, and the power attenuation of the PID after 192 hours can be controlled within 3.0%.
The invention aims to provide a preparation method of a special PID (potential induced degradation) -resistant POE (polyolefin elastomer) adhesive film for photovoltaic dual-glass assembly packaging, which has the characteristics of simple process flow, high production efficiency and low production cost.
The purpose of the invention is realized by the following technical scheme: the utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
preferably, the preparation method of the PID regulator comprises the following steps: mixing nanometer rare earth oxide Re2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 0.8-1.2:0.6-1.0, dispersing the mixture by adopting a ball mill, then placing the mixture in a vacuum drying box at the temperature of 110-; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO according to the weight ratio of 0.8-1.2:0.6-1.0:0.1-0.5:0.4-0.8, wherein the nano rare earth oxide Re2O3In the formula, Re is La, Pr, Nd, Sm, Eu, Gd。
The POE adhesive film with the PID resistance is characterized in that a PID regulator is added in the production and processing process of the POE adhesive film according to the existing battery technology and a PID attenuation mechanism, the PID regulator regulates the insulation effect of the adhesive film in the packaging process, and free radicals generated in the assembly after aging achieve an excellent PID resistance effect in a complexing mode; the nanometer rare earth oxide has the characteristic of low dielectric loss, and the PID regulator prepared from the nanometer rare earth oxide can obviously improve the electrical insulation performance of the POE adhesive film. In the preparation process of the PID regulator, the temperature of the vacuum drying oven needs to be strictly controlled at 110-130 ℃, if the temperature is too high, part of substances in the sample can be solidified, so that the pretreatment is not favorable, if the temperature is too low, the pretreatment can be prolonged, resources are wasted, and the production cost is increased.
Preferably, the POE graft modification resin comprises the following raw materials in parts by weight:
90-110 parts of second POE resin
Dicumyl peroxide 0.05-1.0 weight portions
1.6-2.0 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at the temperature of 180-190 ℃ according to the parts by weight.
The second POE resin adopted by the POE graft modified resin has excellent ultraviolet resistance, good mechanical property and rheological property, not only has thermoplasticity of plastics, but also has the crosslinkability and good elasticity of rubber, but because of the non-polarity of the POE, if the POE is directly blended with polar resin, the compatibility between the POE and the polar resin is extremely poor, so that the POE needs to be functionalized, namely polar groups or groups capable of reacting with polymers are introduced on the POE, and the toughening effect is achieved.
Preferably, the content of octene in the first POE resin is 25-33%, the melt flow rate is 3-40g/10min, the coupling agent is at least one of vinyltrimethoxysilane, vinyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane and gamma-methacryloxypropyltrimethoxysilane, the light transmittance is more than 80%, and the volume resistivity is more than 1.0 × 1015Omega cm; more preferably, the coupling agent is a mixture of vinyltrimethoxysilane, vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane in a weight ratio of 0.1-0.5:0.6-1.0: 0.4-0.8.
The gamma-glycidol ether oxypropyl trimethoxy silane adopted by the coupling agent can improve water resistance and improve dry and wet adhesion; the gamma-methacryloxypropyltrimethoxysilane improves the mechanical strength of products, the electrical property, the weather resistance and the corrosion resistance of the composite material, and is suitable for POE resin.
Preferably, the crosslinking agent is at least one of tert-butyl peroxy-2-ethylhexanoate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate, 1-di (tert-butylperoxy) -3,3, 5-trimethylcyclohexane and 1, 1-di (tert-butylperoxy) cyclohexane; more preferably, the crosslinking agent is a mixture of tert-butyl peroxy-2-ethylhexanoate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 0.8-1.2:0.1-0.5:0.6-1.0: 0.4-0.8. The crosslinking assistant is at least one of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate; more preferably, the crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate in a weight ratio of 0.8-1.2:0.6-1.0: 0.1-0.5.
The cross-linking agent can convert linear or slightly branched POE grafting modified resin molecules into a three-dimensional network structure, so that the strength, heat resistance, wear resistance, solvent resistance and other properties of the prepared adhesive film are improved.
Preferably, the antioxidant comprises a primary antioxidant and a secondary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is at least one of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite; more preferably, the auxiliary antioxidant is a mixture of tris (2, 4-di-tert-butylphenyl) phosphite, dioctadecyl 3, 5-di-tert-butyl-4-hydroxybenzylphosphonate and tris (2, 4-di-tert-butylphenyl) phosphite in a weight ratio of 0.8-1.2:0.1-0.5: 0.6-1.0.
The main antioxidant 3, 5-di-tert-butyl-4-hydroxybenzyl phosphonic acid dioctadecyl ester adopted by the invention has excellent oxidation resistance on POE graft modified resin and first POE resin, can effectively prevent thermal oxidation degradation of a glue film in a long-term aging process, further prolongs the service life of the glue film in the invention, can be used together with an auxiliary antioxidant to have a synergistic effect, and can effectively prevent thermal degradation of the POE graft modified resin and the first POE resin in basic injection molding and provide extra long-term protection for the glue film.
Preferably, the ultraviolet absorber is at least one of 2'- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -di-tert-amylphenyl) benzotriazole and 2-hydroxy-4-n-octyloxybenzophenone; more preferably, the ultraviolet absorber is a mixture of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -di-tert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.1-0.5:0.6-1.0: 0.8-1.2. The light stabilizer is at least one of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, N' -bis- (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate; more preferably, the light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate in a weight ratio of 0.8-1.2:0.6-1.0: 0.1-0.5.
The ultraviolet absorbent adopted in the invention overcomes the defects of high use cost, low visible light transmittance and high visible light reflectance of the existing ultraviolet barrier material, and the arranged heat shrinkage layer further improves the heat shrinkage performance of the protective film.
The invention also provides a preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging, which comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 40-50 ℃ according to parts by weight, and stirring for 2-10h to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature to be 65-105 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling sections.
The POE adhesive film with the PID resistance is prepared by the method, the insulation effect of the adhesive film in the packaging process is adjusted by the POE adhesive film with the PID resistance prepared by the method, and the free groups generated in the assembly after aging achieve the excellent PID resistance effect in a complexing mode, so that the enterprise competitiveness of POE adhesive film products is improved, the use range of the POE adhesive film is expanded, the packaging reliability of a client assembly is ensured, and the electrical cost of the assembly is reduced. The extrusion temperature in the step 2) needs to be strictly controlled to be 65-105 ℃, if the temperature is too high, part of the mixture A is sintered or yellowed, so that the POE adhesive film is not favorably prepared, and if the temperature is too low, the effect of melting the mixture A cannot be achieved, so that the extrusion and subsequent processes are not favorably carried out, and the quality of the prepared POE adhesive film is finally influenced.
The invention has the beneficial effects that: according to the invention, the PID regulator is added in the production and processing process of the POE adhesive film, the PID regulator regulates the insulation effect of the adhesive film in the packaging process, and the free groups generated in the assembly after aging achieve an excellent PID resistance effect in a complexing mode; the nanometer rare earth oxide has the characteristic of low dielectric loss, and the PID regulator prepared from the nanometer rare earth oxide can obviously improve the electrical insulation performance of the POE adhesive film.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic double-glass assembly packaging has the characteristics of simple process flow, high production efficiency and low production cost.
Detailed Description
The present invention will be further described with reference to the following examples for facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the present invention.
Example 1
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: mixing nanometer rare earth oxide Re2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 0.8:0.6, dispersing by a ball mill, placing in a vacuum drying oven at 110 ℃ for pretreatment for 6h, taking out, dissolving a sample in hydrochloric acid at the ratio of 1:1 under the conditions of stirring speed of 750r/min and nitrogen flow rate of 0.9L/min,diluting the mixed solution with distilled water until no white precipitate exists, heating and co-precipitating the mixed solution with oxalic acid according to the weight ratio of 1:1, standing the mixed solution for 22 hours, filtering, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 0.8:0.6:0.1: 0.4.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
90 parts of second POE resin
Dicumyl peroxide 0.05 part
1.6 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at the temperature of 180 ℃ according to the parts by weight.
The content of octene in the first POE resin is 25%, and the melt flow rate is 3g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.1:0.6: 0.4.
The cross-linking agent is a mixture of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 0.8:0.1:0.6: 0.4.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 0.8:0.6: 0.1.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 0.8:0.1: 0.6.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.1:0.6: 0.8.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 0.8:0.6: 0.1.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 40 ℃ according to the parts by weight, and stirring for 2 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 65 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling.
Example 2
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: mixing nano rare earth oxide La2O3(wherein Re ═ La, Pr, Nd, Sm, Eu and Gd) and analytically pure oxide are weighed and proportioned according to the weight ratio of 0.9:0.7, dispersed by a ball mill and then placed in a 115 ℃ vacuum drying oven for pretreatment for 6.5h, taken out, a sample is dissolved in 1:1 hydrochloric acid under the conditions that the stirring speed is 775r/min and the nitrogen flow rate is 0.95L/min, diluted by distilled water until no white precipitate exists, and then heated and co-precipitated with oxalic acid according to the weight ratio of 1:1, and then the mixed solution is placed for 23h for filtration, washing and drying to obtain the PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 0.9:0.7:0.2: 0.5.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
second POE resin 95 parts
Dicumyl peroxide 0.25 part
1.7 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting the melt grafting method at the temperature of 183 ℃ according to the parts by weight.
The content of octene in the first POE resin is 27%, and the melt flow rate is 10g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.2:0.7: 0.5.
The cross-linking agent is a mixture of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 0.9:0.2:0.7: 0.5.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 0.9:0.7: 0.2.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 0.9:0.2: 0.7.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.2:0.7: 0.9.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 0.9:0.7: 0.2.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking assistant, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 43 ℃ according to the parts by weight, and stirring for 4 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 75 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling.
Example 3
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: adding nanometer rare earth oxide Pr2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 1.0.2:0.8, dispersing the mixture by a ball mill, then placing the mixture in a vacuum drying oven at 120 ℃ for pretreatment for 7 hours, taking out the pretreated product, dissolving a sample in hydrochloric acid at the ratio of 1:1 under the conditions of stirring speed of 800r/min and nitrogen flow rate of 1L/min, diluting the sample with distilled water until no white precipitate exists, then heating and coprecipitating the sample and oxalic acid according to the weight ratio of 1:1, and then placing the mixed solution for 24 hours for filtering, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 1.0:0.8:0.3: 0.6.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
second POE resin 100 parts
Dicumyl peroxide 0.5 part
1.8 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting the melt grafting method at 185 ℃ according to the parts by weight.
The content of octene in the first POE resin is 29%, and the melt flow rate is 20g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.3:0.8: 0.6.
The cross-linking agent is a mixture of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 1.02:0.3:0.8: 0.6.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 1.0.2:0.8: 0.3.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 1.0:0.3: 0.8.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.3:0.8: 1.0.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 1.0:0.8: 0.3.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 45 ℃ according to the parts by weight, and stirring for 6 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 85 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling.
Example 4
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: nano rare earth oxide Nd2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 1.1:0.9, dispersing the mixture by a ball mill, then placing the mixture in a 125 ℃ vacuum drying oven for pretreatment for 7.5h, taking out the pretreated product, dissolving a sample in 1:1 hydrochloric acid under the conditions of stirring speed of 825r/min and nitrogen flow rate of 1L/min, diluting the sample with distilled water until no white precipitate exists, heating and coprecipitating the sample and oxalic acid according to the weight ratio of 1:1, then placing the mixed solution for 25h for filtration, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 1.1:0.9:0.4: 0.7.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
second POE resin 100 parts
Dicumyl peroxide 0.75 part
1.9 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at 188 ℃ according to the parts by weight.
The content of octene in the first POE resin is 31%, and the melt flow rate is 30g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.4:0.9: 0.7.
The cross-linking agent is a mixture consisting of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 1.1:0.4:0.9: 0.7.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 1.1:0.9: 0.4.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 1.1:0.4: 0.9.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.4:0.9: 1.1.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 1.1:0.9: 0.4.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 48 ℃ according to the parts by weight, and stirring for 8 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 95 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling.
Example 5
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: mixing nanometer rare earth oxide Sm2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 1.2:1.0, dispersing the mixture by a ball mill, then placing the mixture in a vacuum drying oven at 130 ℃ for pretreatment for 8 hours, taking out the pretreated product, dissolving a sample in 1:1 hydrochloric acid under the conditions of stirring speed of 850r/min and nitrogen flow rate of 1.05L/min, diluting the sample with distilled water until no white precipitate exists, then heating and coprecipitating the sample and oxalic acid according to the weight ratio of 1:1, and then placing the mixed solution for 26 hours for filtration, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 1.2:1.0:0.5: 0.8.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
110 parts of second POE resin
Dicumyl peroxide 1.0 part
2.0 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at the temperature of 190 ℃ according to the parts by weight.
The content of octene in the first POE resin is 33%, and the melt flow rate is 40g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.5:1.0: 0.8.
The cross-linking agent is a mixture consisting of tert-butyl peroxy-2-ethylhexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 1.2:0.5:1.0: 0.8.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 1.2:1.0: 0.5.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 1.2:0.5: 1.0.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.5:1.0: 1.2.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 1.2:1.0: 0.5.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 50 ℃ according to the parts by weight, and stirring for 10 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 105 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling.
Comparative example 1
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: mixing nanometer rare earth oxide Re2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 0.8:0.6, dispersing the mixture by a ball mill, then placing the mixture in a vacuum drying oven at 110 ℃ for pretreatment for 6 hours, taking out the pretreated product, dissolving a sample in hydrochloric acid at the ratio of 1:1 under the conditions of stirring speed of 750r/min and nitrogen flow rate of 0.9L/min, diluting the sample with distilled water until no white precipitate exists, heating and coprecipitating the sample and oxalic acid according to the weight ratio of 1:1, then placing the mixed solution for 22 hours for filtration, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 0.8:0.6:0.1: 0.4.
The content of octene in the POE resin is 25%, and the melt flow rate is 3g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.1:0.6: 0.4.
The cross-linking agent is a mixture of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 0.8:0.1:0.6: 0.4.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 0.8:0.6: 0.1.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 0.8:0.1: 0.6.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.1:0.6: 0.8.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 0.8:0.6: 0.1.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting POE resin, a cross-linking agent, a cross-linking assistant, a coupling agent, an antioxidant, an ultraviolet absorbent, a light stabilizer and a PID (proportion integration differentiation) regulator into a constant-temperature stirring device at 40 ℃ according to parts by weight, and stirring for 2 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature to be 65 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling sections.
Comparative example 2
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the preparation method of the PID regulator comprises the following steps: mixing nano rare earth oxide La2O3Weighing and proportioning the pure compound and analytically pure oxide according to the weight ratio of 1.0.2:0.8, dispersing the mixture by a ball mill, then placing the mixture in a vacuum drying oven at 120 ℃ for pretreatment for 7 hours, taking out the pretreated product, dissolving a sample in hydrochloric acid at the ratio of 1:1 under the conditions of stirring speed of 800r/min and nitrogen flow rate of 1L/min, diluting the sample with distilled water until no white precipitate exists, heating and coprecipitating the sample and oxalic acid according to the weight ratio of 1:1, and then mixing the mixture and the oxalic acidStanding the mixed solution for 24h, filtering, washing and drying to obtain a PID regulator; more preferably, the analytically pure oxidation is from Bi2O3、SiO2、Al2O3And MIO in a weight ratio of 1.0:0.8:0.3: 0.6.
The POE grafted and modified resin comprises the following raw materials in parts by weight:
second POE resin 100 parts
Dicumyl peroxide 0.5 part
1.8 parts of phthalic anhydride;
the POE graft modified resin is prepared by adopting the melt grafting method at 185 ℃ according to the parts by weight.
The content of octene in the first POE resin is 29%, and the melt flow rate is 20g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.3:0.8: 0.6.
The cross-linking agent is a mixture of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 1.02:0.3:0.8: 0.6.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 1.0.2:0.8: 0.3.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 1.0:0.3: 0.8.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.3:0.8: 1.0.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 1.0:0.8: 0.3.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device at 45 ℃ according to the parts by weight, and stirring for 6 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature to be 85 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling sections.
Comparative example 3
The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane, includes the raw materials of following part by weight:
the POE grafted and modified resin comprises the following raw materials in parts by weight:
110 parts of second POE resin
Dicumyl peroxide 1.0 part
2.0 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at the temperature of 190 ℃ according to the parts by weight.
The content of octene in the first POE resin is 33%, and the melt flow rate is 40g/10 min; the coupling agent is a mixture of vinyl trimethoxy silane, vinyl triethoxy silane and gamma-methacryloxypropyl trimethoxy silane according to the weight ratio of 0.5:1.0: 0.8.
The cross-linking agent is a mixture consisting of tert-butyl peroxy-2-ethylhexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate and 1, 1-di (tert-butylperoxy) cyclohexane in a weight ratio of 1.2:0.5:1.0: 0.8.
The crosslinking assistant is a mixture of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate according to the weight ratio of 1.2:1.0: 0.5.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is a mixture consisting of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite according to the weight ratio of 1.2:0.5: 1.0.
The ultraviolet absorbent is a mixture consisting of 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-butylphenyl) -5-chlorobenzotriazole and 2-hydroxy-4-n-octoxybenzophenone in a weight ratio of 0.5:1.0: 1.2.
The light stabilizer is a mixture of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate according to the weight ratio of 1.2:1.0: 0.5.
The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking assistant, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the anti-PID assistant into a constant-temperature stirring device at 50 ℃ according to the parts by weight, and stirring for 10 hours to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature at 105 ℃, and preparing the extruded melt into a POE adhesive film with certain thickness, gram weight and breadth through embossing, cooling, molding, traction, slitting and rolling
The POE adhesive films prepared in the steps 1-5 and the comparative examples 1-3 are laminated by a laminating machine to prepare samples for testing, the crosslinking degree (GB/T36965-:
from the above results, the POE adhesive films prepared in embodiments 1 to 5 of the present invention have excellent properties, and the POE adhesive films have good crosslinking degree, peel strength, volume resistivity, PID resistance and aging resistance, and are suitable for mass production.
Compared with the embodiment 1, in the comparative example 1, no POE graft modified resin is added during the preparation of the POE adhesive film, and the prepared POE adhesive film is subjected to various physical property tests, and the analysis shows that the crosslinking degree, the peeling strength, the volume resistivity, the PID resistance and the aging resistance of the POE adhesive film are obviously reduced; the POE grafted and modified resin is added when the POE adhesive film is prepared, so that various properties of the POE adhesive film can be effectively improved, the prepared POE has good crosslinking degree, peeling strength, volume resistivity, PID (potential induced degradation) resistance and aging resistance, and the POE adhesive film is suitable for large-scale production.
Compared with the example 3, in the comparative example 2, phthalic anhydride is used for replacing maleic anhydride when POE graft modified resin used for preparing the POE adhesive film, and various physical property tests are carried out on the POE adhesive film prepared by using the raw materials, and the analysis shows that the crosslinking degree, the peeling strength, the volume resistivity, the PID resistance and the aging resistance of the POE adhesive film are relatively reduced; the maleic anhydride is added when the POE graft modified resin used for preparing the POE adhesive film, so that various properties of the POE adhesive film can be effectively improved, and the prepared POE has good crosslinking degree, peeling strength, volume resistivity, PID resistance and aging resistance, and is suitable for large-scale production.
Compared with the embodiment 5, in the comparative example 3, the PID regulator is replaced by the PID resistant auxiliary agent when the POE adhesive film is prepared, and the physical property tests of the prepared POE adhesive film are carried out, and the analysis shows that the crosslinking degree, the peeling strength, the volume resistivity, the PID resistance and the aging resistance effect of the POE adhesive film are relatively reduced; the PID regulator is added when the POE adhesive film is prepared, so that various performances of the POE adhesive film can be effectively improved, the prepared POE has good crosslinking degree, peeling strength, volume resistivity, PID resistance and aging resistance, and the POE adhesive film is suitable for large-scale production.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (10)
1. The utility model provides a special anti PID's of photovoltaic dual glass assembly encapsulation POE glued membrane which characterized in that: the feed comprises the following raw materials in parts by weight:
2. the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: the preparation method of each part of the PID regulator comprises the following steps: mixing nanometer rare earth oxide Re2O3Weighing and proportioning the pure compound and an analytically pure oxide according to the weight ratio of 0.8-1.2:0.6-1.0, dispersing the mixture by adopting a ball mill, then placing the mixture in a vacuum drying box at the temperature of 110-; the analytically pure oxidation is Bi2O3、SiO2、Al2O3And MIOIn which the nano rare earth oxide Re2O3In the formula, Re is La, Pr, Nd, Sm, Eu or Gd.
3. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: each part of POE grafted modified resin comprises the following raw materials in parts by weight:
90-110 parts of second POE resin
Dicumyl peroxide 0.05-1.0 weight portions
1.6-2.0 parts of maleic anhydride;
the POE graft modified resin is prepared by adopting a melt grafting method at the temperature of 180-190 ℃ according to the parts by weight.
4. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: the content of octene in each part of the first POE resin is 25-33%, and the melt flow rate is 3-40g/10 min.
5. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: each part of the cross-linking agent is at least one of tert-butyl peroxy-2-ethyl hexyl carbonate, ethyl 3, 3-di (tert-butylperoxy) butyrate, tert-butyl peroxy-3, 5, 5-trimethylhexanoate, 1-di (tert-butylperoxy) -3,3, 5-trimethylcyclohexane and 1, 1-di (tert-butylperoxy) cyclohexane.
6. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: each part of the crosslinking assistant is at least one of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate.
7. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: each part of the antioxidant comprises a main antioxidant and an auxiliary antioxidant; the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester, and the auxiliary antioxidant is at least one of tris (2, 4-di-tert-butylphenyl) phosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid dioctadecyl ester and tris (2, 4-di-tert-butylphenyl) phosphite.
8. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: the ultraviolet absorbent is at least one of 2'- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3', 5 '-ditert-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -ditert-pentylphenyl) benzotriazole and 2-hydroxy-4-n-octyloxybenzophenone per part.
9. The special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to claim 1, wherein the special PID-resistant POE adhesive film comprises: each part of the light stabilizer is at least one of bis-2, 2,6, 6-tetramethylpiperidyl sebacate, N' -bis- (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine, 2,4, 6-trichloro-1, 3, 5-triazine and bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate.
10. The preparation method of the special PID-resistant POE adhesive film for photovoltaic dual-glass assembly packaging according to any one of claims 1-9, wherein the method comprises the following steps: the method comprises the following steps:
1) putting the first POE resin, the POE grafted modified resin, the cross-linking agent, the cross-linking auxiliary agent, the coupling agent, the antioxidant, the ultraviolet absorbent, the light stabilizer and the PID regulator into a constant-temperature stirring device according to the parts by weight, and stirring for 2-10h to obtain a uniform mixture A.
2) Uniformly mixing and extruding the mixture A obtained in the step 1) by an extruder, controlling the extrusion temperature to be 65-105 ℃, and preparing the POE adhesive film with certain thickness, gram weight and breadth from the extruded melt through embossing, cooling, molding, traction, slitting and rolling sections.
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| PCT/CN2020/131553 WO2021238116A1 (en) | 2020-05-28 | 2020-11-25 | Anti-pid poe adhesive film specifically for photovoltaic double-glass assembly packaging and preparation method therefor |
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| WO2021238116A1 (en) * | 2020-05-28 | 2021-12-02 | 明冠新材料股份有限公司 | Anti-pid poe adhesive film specifically for photovoltaic double-glass assembly packaging and preparation method therefor |
| CN113234402A (en) * | 2021-05-07 | 2021-08-10 | 浙江祥邦科技股份有限公司 | High-resistance PID composite packaging adhesive film and preparation method thereof |
| CN113675286A (en) * | 2021-07-28 | 2021-11-19 | 江苏东鋆光伏科技有限公司 | Double-sided battery grid backboard glass assembly and preparation method thereof |
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| CN114806457A (en) * | 2022-04-24 | 2022-07-29 | 浙江祥隆科技有限公司 | Special packaging adhesive film for TOPCon battery and preparation method thereof |
| CN115851146A (en) * | 2022-11-09 | 2023-03-28 | 江苏东鋆光伏科技有限公司 | Packaging adhesive film for double-glass photovoltaic module and preparation method thereof |
| CN115851146B (en) * | 2022-11-09 | 2024-04-19 | 江苏东鋆光伏科技有限公司 | Packaging adhesive film for double-glass photovoltaic module and preparation method thereof |
| CN117467367A (en) * | 2023-12-27 | 2024-01-30 | 浙江祥邦永晟新能源有限公司 | Thermoplastic POE packaging adhesive film, preparation method thereof and photovoltaic module |
| CN117467366A (en) * | 2023-12-27 | 2024-01-30 | 浙江祥邦永晟新能源有限公司 | POE packaging adhesive film for photovoltaic module, preparation method of POE packaging adhesive film and photovoltaic module |
| CN117467366B (en) * | 2023-12-27 | 2024-03-19 | 浙江祥邦永晟新能源有限公司 | POE packaging adhesive film for photovoltaic module, preparation method of POE packaging adhesive film and photovoltaic module |
| CN117467367B (en) * | 2023-12-27 | 2024-03-19 | 浙江祥邦永晟新能源有限公司 | Thermoplastic POE packaging adhesive film, preparation method thereof and photovoltaic module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111518487B (en) | 2021-10-26 |
| WO2021238116A1 (en) | 2021-12-02 |
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