CN111515518B - Copper alloy micro-channel heat exchanger diffusion welding fixture and method - Google Patents
Copper alloy micro-channel heat exchanger diffusion welding fixture and method Download PDFInfo
- Publication number
- CN111515518B CN111515518B CN202010237195.7A CN202010237195A CN111515518B CN 111515518 B CN111515518 B CN 111515518B CN 202010237195 A CN202010237195 A CN 202010237195A CN 111515518 B CN111515518 B CN 111515518B
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- copper alloy
- cover plate
- diffusion welding
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
- B23K20/026—Thermo-compression bonding with diffusion of soldering material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a diffusion welding fixture and a method for a copper alloy micro-channel heat exchanger, wherein the fixture consists of a lower base and an upper cover plate, and the welding method comprises the following steps: polishing the surface to be connected of the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate by using abrasive paper; ultrasonically cleaning a copper alloy micro-channel heat exchanger cover plate and a heat exchanger bottom plate, and then drying for later use; placing the polished copper alloy micro-channel heat exchanger cover plate and the polished heat exchanger bottom plate on an assembly fixture base, adjusting the height of the limiting column, and covering the assembly fixture cover plate; placing the assembled piece to be welded in a vacuum diffusion welding furnace, and heating and pressurizing to weld; and (4) cooling the weldment to room temperature after heating and pressure welding, taking out the weldment from the fixture, and cleaning the surface of the weldment. The invention can realize the diffusion welding preparation of the copper alloy micro-channel heat exchanger, ensure that the deformation of the micro-channel heat exchanger is controlled within a certain range and improve the connection quality.
Description
Technical Field
The invention belongs to the technical field of production of micro-channel heat exchangers, and particularly relates to a diffusion welding clamp and method for a copper alloy micro-channel heat exchanger.
Background
Electronic devices such as phased array radars are developing towards high performance, high speed and high density integration, the heat productivity and relative heat flux of electronic components are increasing, and the heat dissipation problem gradually becomes one of the key technologies to be solved by the high performance phased array radars. The channel structure, the fluid characteristic and the heat transfer characteristic under the microscale are utilized to achieve the effect of efficient heat dissipation, and a new way is opened for efficient heat dissipation of electronic equipment. At present, a micro-channel heat exchanger which is commonly used is made of a silicon-based material, but the silicon-based heat exchanger has poor working reliability under a high-pressure condition, and the application of the micro-channel heat exchanger is limited. Copper alloys have good thermal conductivity and microchannel heat exchangers made from copper alloys have found significant use in many critical applications. However, the preparation of the copper alloy microchannel heat exchanger has great difficulty, and the core problem is that a plurality of fine microchannel structures are arranged in the copper alloy microchannel heat exchanger, the width of the microchannel is 50-100 mu m, the depth-to-width ratio is more than or equal to 5, the verticality of the side wall is more than or equal to 85 degrees, the shape precision of the microchannel is more than 5 mu m, the heat exchange surface area per unit volume is more than or equal to 3000m2/m3, and the heat dissipation capacity is more than or equal to 250W/cm 2. Brazing and general fusion welding may cause clogging of the micro flow channel and may be unusable.
Diffusion welding is a solid-phase welding method for realizing the connection of base materials at two sides through mutual diffusion between the base materials or between the base materials and an intermediate layer under certain pressure and temperature (not higher than the melting point of a welded material). Because the welding temperature is lower than the melting point of the joint material, no liquid phase is generated in the welding process, the integral deformation of the joint is small, and the welding method is very suitable for welding a large-connection-area flat plate structure which needs to strictly control the deformation of the joint, such as a micro-channel heat exchanger.
Liquid with certain pressure is generally introduced into a micro flow channel of the copper alloy micro-channel heat exchanger in the service process, so that the diffusion welding joint of the micro-channel heat exchanger needs to have good sealing property. However, since the deformation of the microchannel heat exchanger needs to be controlled within a certain range, the welding reliability cannot be improved by improving the welding parameters, otherwise, the deformation of the microchannel is too large, the performance precision of the assembly is reduced, and even the microchannel heat exchanger cannot be used. When the diffusion welding parameters are too low, the tightness of the micro-channel heat exchanger cannot be ensured. When the diffusion welding of the micro-channel heat exchanger is realized, the type variable of the micro-channel structure needs to be strictly controlled by using a proper fixture, and the sealing performance of the joint is ensured by adopting optimized process parameters.
Disclosure of Invention
The invention aims to provide a technology for realizing reliable and flawless connection of a copper alloy microchannel heat exchanger, which utilizes a proper fixture to strictly control the type variable of a microchannel structure and adopts optimized process parameters to ensure the sealing performance of a joint.
The diffusion welding fixture is characterized by comprising a lower base and an upper cover plate, wherein the lower base comprises a bottom plate, a limiting column and a positioning pin;
the upper surface and the lower surface of the bottom plate are horizontal planes;
the limiting column is arranged on the upper surface of the bottom plate and used for limiting the minimum distance between the lower base and the upper cover plate in diffusion welding;
the positioning pins are arranged on the upper surface of the bottom plate and used for preventing the lower base and the upper cover plate from horizontally moving in diffusion welding;
the size of the upper cover plate is the same as that of the bottom plate, and a positioning through hole matched with the positioning pin in size and position is formed in the lower surface of the upper cover plate.
Furthermore, the lower base and the upper cover plate are both made of graphite.
Furthermore, the bottom plate is respectively provided with a threaded hole at the inner position close to the middle point of the three edges; and the lower end of the limiting column is processed with an external thread, and the external thread is matched with the threaded hole.
Furthermore, the distance from the top end of the limit column to the upper surface of the bottom plate is as follows:
wherein alpha isGraIs the thermal expansion coefficient, alpha, of the material of the limit postCuThe heat expansion coefficient of copper alloy in the copper alloy microchannel heat exchanger is shown, T is diffusion welding temperature, x is the integral variable of the copper alloy microchannel heat exchanger after the required diffusion welding, and h is the sum of the heights of the copper alloy microchannel heat exchanger cover plate and the heat exchanger base plate before the diffusion welding.
The diffusion welding method for the copper alloy micro-channel heat exchanger is characterized by comprising the following steps of:
step S1: polishing two to-be-connected surfaces of the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate by using abrasive paper to remove a surface oxidation film;
step S2: cleaning and drying the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate, and taking the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate as a to-be-welded part for later use;
step S3: placing the polished copper alloy microchannel heat exchanger cover plate and the polished copper alloy microchannel heat exchanger bottom plate on a lower base of a welding fixture, adjusting the height of a limiting column, and covering the welding fixture cover plate;
step S4: placing the adjusted welding fixture and the to-be-welded piece in a vacuum diffusion welding furnace, and heating and pressurizing to weld;
step S5: and cooling the welded micro-channel heat exchanger to room temperature, taking out the welded micro-channel heat exchanger from the welding fixture, and cleaning the surface of the welded micro-channel heat exchanger.
Further, in step S1, the two surfaces to be connected of the copper alloy micro-channel heat exchanger cover plate and the heat exchanger base plate are polished with a plurality of pieces of sandpaper, and the last piece of sandpaper is not lower than # 1200.
Further, in step S3, the height of the limiting pillars is adjusted so that the distance between the top ends of the limiting pillars and the upper surface of the bottom plate is:
wherein alpha isGraIs the thermal expansion coefficient, alpha, of the material of the limit postCuThe method is characterized in that the method comprises the following steps of calculating the thermal expansion coefficient of copper alloy in a copper alloy micro-channel heat exchanger, wherein T is diffusion welding temperature, x is the required integral variable of the copper alloy micro-channel heat exchanger after diffusion welding, and h is the sum of the heights of a cover plate and a heat exchanger bottom plate of the copper alloy micro-channel heat exchanger before diffusion welding.
Further, in step S4, the vacuum degree in the vacuum diffusion welding furnace is less than 5 × 10-2Pa, controlling the heating speedThe rate is 10-25 ℃/min, diffusion welding is carried out at the diffusion welding temperature of 700-900 ℃ and the pressure of 3-15MPa, the temperature is kept for 20-60 min, then the temperature is reduced to below 200 ℃ at the cooling rate of 5-20 ℃/min, and finally the temperature is cooled to the room temperature along with the furnace.
Further, in step S4, the contact surface of the soldering jig and the part to be soldered is coated with a thin layer of vacuum solder resist, which is composed of yttrium oxide.
Further, in step S5, the cleaning process first polishes the oxide skin on the surface of the welded microchannel heat exchanger with sand paper, and then ultrasonically cleans the welded microchannel heat exchanger in an acetone solution for 10-15 min.
The invention has the beneficial effects that:
the invention controls the deformation of the diffusion connection joint through the height of the limiting column of the diffusion welding fixture, and realizes the high-precision control of deformation adjustment through the threads of the lower half part of the limiting column; the diffusion welding fixture is simple in overall structure, convenient to operate, safe and stable.
The invention adopts a vacuum diffusion welding method, can realize the diffusion welding preparation of the copper alloy micro-channel heat exchanger at lower temperature, effectively controls the deformation generated in welding, ensures that the deformation of the micro-channel heat exchanger is controlled in a certain range, and improves the connection quality.
Drawings
FIG. 1 is a schematic view of an assembly of a diffusion welding fixture for a copper alloy micro-channel heat exchanger and a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 2 is a top view of a lower base of a diffusion welding fixture for a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 3 is a side view of a lower base of a diffusion welding fixture for a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 4 is a top view of an upper cover plate of a diffusion welding fixture for a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 5 is a side view of an upper cover plate in a diffusion welding fixture of a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 6 is a schematic view of a diffusion welding method for a copper alloy micro-channel heat exchanger according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional microstructure of a welded joint obtained by welding a copper alloy microchannel heat exchanger according to a diffusion welding method for a copper alloy microchannel heat exchanger provided by an embodiment of the invention.
The heat exchanger comprises a base plate 1, a positioning pin 2, a threaded hole 3, a limiting column 4, an upper cover plate 5, a positioning through hole 6, a heat exchanger cover plate 7 and a heat exchanger base plate 8.
Detailed Description
The technical solution of the present invention is further described in detail by the following embodiments with reference to fig. 1 to 7.
As shown in fig. 1-5, a diffusion welding fixture for a copper alloy micro-channel heat exchanger comprises a lower base and an upper cover plate 5.
The lower base is composed of a bottom plate 1, a limiting column 4 and a positioning pin 2; bottom plate 1 is the cuboid, and the upper and lower surface is the horizontal plane, is made by graphite, leans on interior position to be equipped with screw hole 3 respectively at three edges center for installation spacing post 4, spacing post 4 is made by graphite material, and the lower extreme processing has the external screw thread to cooperate with screw hole 3 of bottom plate 1. The positioning pins 2 are made of graphite and are arranged at two opposite angles of the upper surface of the bottom plate 1.
The upper and lower surfaces of the upper cover plate 5 are horizontal planes, are made of graphite and are rectangular, and the size of the upper cover plate is the same as that of the lower base. Two positioning through holes 6 are respectively arranged at two opposite angles of the lower surface of the upper cover plate 5 and are matched with the two positioning pins 2 of the lower base.
A specific example of a welding fixture is given below.
In this example, the basic structure of the fixture is the same as that described above, and the fixture is composed of a lower base and an upper cover plate 5; the lower base is composed of a bottom plate 1, a limiting column 4 and a positioning pin 2.
The bottom plate 1 is rectangle, and the size is 70mm 100mm 20mm, and it has screw hole 3 to process in the limit one side midpoint of one of them 70mm, and the distance that 3 centres of screw hole apart from 1 limit of bottom plate is 10mm, and the diameter of screw hole 3 is 5mm, and two other screw holes 3 are located two 100mm limit medial medians, and the distance that 3 centres of screw hole apart from 1 limit of bottom plate is 7 mm. The three limiting columns 4 are 5mm in diameter and 60mm in height, threads are machined on the lower half portions of the three limiting columns to be matched with the threaded holes 3 of the bottom plate 1, the two positioning pins 2 are located at two ends of one group of opposite angles of the bottom plate 1, the two positioning pins are 5mm in diameter and 70mm in height, and the distance between the circle center and two adjacent edges is 5 mm; the size of the upper cover plate 5 is 70mm multiplied by 100mm multiplied by 20mm, the two positioning through holes 6 are positioned at two ends of a group of opposite angles of the upper cover plate 5, the diameter is 5mm, and the distance between the circle center and two adjacent edges is 5 mm.
During the process of preparing the copper alloy microchannel heat exchanger by diffusion welding, a polished and cleaned copper alloy microchannel heat exchanger cover plate 7 and a heat exchanger bottom plate 8 are placed on the base of the assembly fixture, and the distances from the top ends of the three limiting columns 4 to the upper surface of the bottom plate 1 are measured by vernier calipers to ensure that the distances are
In the formula of alphaGraCoefficient of thermal expansion, alpha, of the graphite used for the fabrication of the restraining post 4CuThe heat expansion coefficient of copper alloy in the copper alloy microchannel heat exchanger is shown, T is diffusion welding temperature, x is the integral variable of the copper alloy microchannel heat exchanger after the required diffusion welding, and h is the sum of the heights of the copper alloy microchannel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 before the diffusion welding.
As shown in fig. 6, the invention also provides a diffusion welding method for the copper alloy micro-channel heat exchanger, which comprises the following steps:
step S1: polishing two surfaces to be connected of the copper alloy micro-channel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 by using sand paper to remove surface oxidation films;
step S2: selecting an acetone solution to ultrasonically clean a copper alloy micro-channel heat exchanger cover plate 7 and a heat exchanger bottom plate 8, and drying the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate after cleaning for 15-25 min to be used as a to-be-welded part for later use;
step S3: placing the polished copper alloy micro-channel heat exchanger cover plate 7 and the polished heat exchanger bottom plate 8 on a lower base of a welding fixture, adjusting the height of the limiting column 4, and covering the welding fixture cover plate 5;
step S4: placing the adjusted welding fixture and the to-be-welded piece in a vacuum diffusion welding furnace, and heating and pressurizing to weld;
step S5: and cooling the welded microchannel heat exchanger to room temperature, taking out the welded microchannel heat exchanger from the fixture, and cleaning the surface of the welded microchannel heat exchanger.
In step S1, two surfaces to be connected of the copper alloy micro-channel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 are ground by abrasive paper, in order to ensure the diffusion welding quality, a plurality of pieces of abrasive paper are used for grinding, and the last piece of abrasive paper is not lower than # 1200.
In step S3, the height of the limiting posts 4 is adjusted, and the distance between the top ends of the three limiting posts 4 and the upper surface of the bottom plate 1 is measured by a vernier caliper to make the distance equal to
In the formula of alphaGraCoefficient of thermal expansion, alpha, of the graphite used for the fabrication of the restraining post 4CuThe heat expansion coefficient of copper alloy in the copper alloy microchannel heat exchanger is shown, T is diffusion welding temperature, x is the integral variable of the copper alloy microchannel heat exchanger after the required diffusion welding, and h is the sum of the heights of the copper alloy microchannel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 before the diffusion welding.
In step S4 of the present invention, a thin layer of vacuum solder resist is further applied to the contact surface between the soldering fixture and the to-be-soldered copper alloy microchannel heat exchanger, where the vacuum solder resist is composed of yttrium oxide.
After the welding fixture is placed in a vacuum diffusion welding furnace, the vacuum degree is pumped to be less than 5 multiplied by 10-2Pa, controlling the heating rate to be 10-25 ℃/min, carrying out diffusion welding at the diffusion welding temperature of 700-900 ℃ and the pressure of 3-15MPa, keeping the temperature for 20-60 min, reducing the temperature to be below 200 ℃ at the cooling rate of 5-20 ℃/min, and then cooling to the room temperature along with the furnace.
In step S5, the surface of the welded microchannel heat exchanger is cleaned, the oxide skin on the surface of the welded microchannel heat exchanger is polished by sand paper, and then the welded microchannel heat exchanger is ultrasonically cleaned in an acetone solution for 10-15 min, so that the perfect microchannel heat exchanger can be obtained.
In one embodiment, step S1: the sizes of the copper alloy micro-channel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 are 50mm multiplied by 25 mm. And (3) polishing two surfaces to be connected of the copper alloy microchannel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 by using sand paper, and polishing by using a plurality of sand papers of No. 400, No. 600, No. 800, No. 1000 and No. 1200 in order to ensure the diffusion welding quality.
Step S2: and ultrasonically cleaning the copper alloy micro-channel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 by using an acetone solution, and drying the copper alloy micro-channel heat exchanger cover plate and the heat exchanger bottom plate for standby after cleaning for 15-25 min.
Step S3: the height of the limit posts 4 is adjusted, and the distance between the top ends of the three limit posts 4 and the upper surface of the bottom plate 1 is measured by a vernier caliper to ensure that the distance is 48.93mm, wherein alpha isGraValue of 6X 10-6K-1，αCuCoefficient of thermal expansion 16 x 10 taking the value of pure copper-6K-1And T is the diffusion welding temperature of 700-900 ℃, h is the sum of the heights of the copper alloy micro-channel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 before diffusion welding is 50mm, and the deformation amount of a joint obtained by diffusion welding is controlled within 3%.
Step S4: and coating a vacuum solder mask thin layer on the contact surface of the welding fixture and the to-be-welded copper alloy microchannel heat exchanger, wherein the vacuum solder mask is composed of yttrium oxide.
After the welding fixture is placed in a vacuum diffusion welding furnace, the vacuum degree is pumped to be less than 5 multiplied by 10-2Pa, controlling the heating rate to be 10-25 ℃/min, carrying out diffusion welding at the diffusion welding temperature of 700-900 ℃ and the pressure of 3-15MPa, keeping the temperature for 20-60 min, reducing the temperature to be below 200 ℃ at the cooling rate of 5-20 ℃/min, and then cooling to the room temperature along with the furnace.
Step S5: cleaning the surface of the welded microchannel heat exchanger, firstly polishing the oxide skin on the surface of the welded microchannel heat exchanger by using sand paper, and then ultrasonically cleaning in an acetone solution for 10-15 min to obtain the perfect microchannel heat exchanger.
As shown in fig. 7, after the diffusion welding method of the embodiment is adopted to perform diffusion welding on the copper alloy microchannel heat exchanger, the microstructure connection of the cross section of the joint is tight, and the problem of weak welding does not exist. The upper copper alloy microchannel heat exchanger cover plate 7 and the lower copper alloy microchannel heat exchanger bottom plate 8 are subjected to interface microstructure analysis, and the results show that the interface combination of the copper alloy microchannel heat exchanger cover plate 7 and the heat exchanger bottom plate 8 is good, no unwelded cavity is generated, the welding method is obviously superior to products welded by the existing welding method, and the use requirements can be met.
Although the present invention has been described in terms of the preferred embodiment, it is not intended that the invention be limited to the embodiment. Any equivalent changes or modifications made without departing from the spirit and scope of the present invention also belong to the protection scope of the present invention. The scope of the invention should therefore be determined with reference to the appended claims.
Claims (8)
1. The diffusion welding fixture for the copper alloy micro-channel heat exchanger is characterized by comprising a lower base and an upper cover plate (5), wherein the lower base comprises a bottom plate (1), a limiting column (4) and a positioning pin (2);
the upper surface and the lower surface of the bottom plate (1) are horizontal planes;
the limiting column (4) is arranged on the upper surface of the bottom plate (1) and used for limiting the minimum distance between the lower base and the upper cover plate (5) in diffusion welding;
the positioning pins (2) are arranged on the upper surface of the bottom plate (1) and are used for preventing the lower base and the upper cover plate (5) from horizontally moving in diffusion welding;
the size of the upper cover plate (5) is the same as that of the bottom plate (1), and a positioning through hole (6) matched with the positioning pin (2) in size and position is formed in the lower surface of the upper cover plate (5);
the distance from the top end of the limiting column (4) to the upper surface of the bottom plate (1) is as follows:
wherein the content of the first and second substances,
the thermal expansion coefficient of the material of the limit column (4),
is the thermal expansion coefficient of the copper alloy in the copper alloy micro-channel heat exchanger,
in order to achieve a diffusion welding temperature,
for the desired bulk type variables of the diffusion welded copper alloy microchannel heat exchanger,
the height sum of the copper alloy micro-channel heat exchanger cover plate (7) and the heat exchanger bottom plate (8) before diffusion welding.
2. Diffusion welding fixture according to claim 1, characterized in that the lower base and the upper cover plate (5) are made of graphite.
3. The diffusion welding fixture of claim 1, characterized in that the base plate (1) is provided with threaded holes (3) at positions close to the inner positions of the middle points of the three edges, respectively; and the lower end of the limiting column (4) is processed with an external thread, and the external thread is matched with the threaded hole (3).
4. A diffusion welding method for a copper alloy micro-channel heat exchanger is characterized by comprising the following steps:
step S1: polishing two surfaces to be connected of the copper alloy micro-channel heat exchanger cover plate (7) and the heat exchanger bottom plate (8) by using abrasive paper to remove surface oxidation films;
step S2: cleaning and drying the copper alloy micro-channel heat exchanger cover plate (7) and the heat exchanger bottom plate (8) to be used as a to-be-welded part for later use;
step S3: placing the polished copper alloy micro-channel heat exchanger cover plate (7) and the polished heat exchanger bottom plate (8) on a lower base of a welding fixture, adjusting the height of a limiting column (4), and covering an upper cover plate (5);
step S4: placing the adjusted welding fixture and the to-be-welded piece in a vacuum diffusion welding furnace, and heating and pressurizing to weld;
step S5: cooling the welded microchannel heat exchanger to room temperature, taking out the welded microchannel heat exchanger from the welding fixture, and cleaning the surface of the welded microchannel heat exchanger;
in step S3, the height of the position-limiting post (4) is adjusted so that the distance from the top end of the position-limiting post (4) to the upper surface of the bottom plate (1) is:
wherein the content of the first and second substances,
the thermal expansion coefficient of the material of the limit column (4),
is the thermal expansion coefficient of the copper alloy in the copper alloy micro-channel heat exchanger,
in order to achieve a diffusion welding temperature,
for the desired bulk type variables of the diffusion welded copper alloy microchannel heat exchanger,
is the sum of the heights of the copper alloy micro-channel heat exchanger cover plate (7) and the heat exchanger bottom plate (8) before diffusion welding.
5. The diffusion welding method of claim 4, characterized in that in step S1, two surfaces to be connected of the copper alloy micro-channel heat exchanger cover plate (7) and the heat exchanger bottom plate (8) are ground by using a plurality of pieces of sandpaper, and the last piece of sandpaper is not lower than # 1200.
6. The diffusion bonding method of claim 4 wherein in step S4, the vacuum degree in the vacuum diffusion furnace is less than 5 x 10-2Pa, controlling the heating rate to be 10-25 ℃/min, carrying out diffusion welding at the diffusion welding temperature of 700-900 ℃ and the pressure of 3-15MPa, keeping the temperature for 20-60 min, reducing the temperature to be below 200 ℃ at the cooling rate of 5-20 ℃/min, and then cooling to the room temperature along with the furnace.
7. The diffusion soldering method according to claim 4, wherein in step S4, the contact surfaces of the soldering jig and the member to be soldered are coated with a thin layer of vacuum solder resist, and the vacuum solder resist is composed of yttrium oxide.
8. The diffusion welding method of claim 4, wherein in step S5, the cleaning process is performed by sanding the oxide skin on the surface of the post-welding micro-channel heat exchanger, and then ultrasonically cleaning the surface in an acetone solution for 10-15 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010237195.7A CN111515518B (en) | 2020-03-30 | 2020-03-30 | Copper alloy micro-channel heat exchanger diffusion welding fixture and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010237195.7A CN111515518B (en) | 2020-03-30 | 2020-03-30 | Copper alloy micro-channel heat exchanger diffusion welding fixture and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111515518A CN111515518A (en) | 2020-08-11 |
| CN111515518B true CN111515518B (en) | 2022-01-28 |
Family
ID=71901039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010237195.7A Active CN111515518B (en) | 2020-03-30 | 2020-03-30 | Copper alloy micro-channel heat exchanger diffusion welding fixture and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111515518B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112705913B (en) * | 2020-12-21 | 2021-11-26 | 西安天力金属复合材料股份有限公司 | Method for processing large-size copper or copper alloy cooling plate |
| CN114012235A (en) * | 2021-11-02 | 2022-02-08 | 贵州永红航空机械有限责任公司 | Diffusion welding method for TA2 material microchannel radiator |
| CN114406400A (en) * | 2022-02-24 | 2022-04-29 | 中国科学院上海技术物理研究所 | Titanium alloy core column and invar cold head combining piece brazing clamp and method |
| CN115326005B (en) * | 2022-10-14 | 2022-12-13 | 中国核动力研究设计院 | Method, device, equipment and medium for measuring heat exchange pellet micro-channel deformation value |
| CN117548999B (en) * | 2023-11-21 | 2024-05-03 | 华钛空天(北京)技术有限责任公司 | Diffusion welding method, device, equipment and medium for airfoil |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3473210A (en) * | 1967-01-19 | 1969-10-21 | United Aircraft Prod | Method of making a heat exchanger |
| JP2004181518A (en) * | 2002-12-06 | 2004-07-02 | Calsonic Kansei Corp | Tool for diffusion bonding, and diffusion bonding method using the same |
| CN104972234A (en) * | 2015-07-17 | 2015-10-14 | 上海科凌能源科技有限公司 | Tool for laser welding of printed circuit heat exchanger |
| CN105149720A (en) * | 2015-07-15 | 2015-12-16 | 哈尔滨工业大学（威海） | Fixture used for braze welding of TZM alloy/ceramic sealing alloy butt-sealing structure for electronic vacuum tube and braze welding method |
| CN106839831A (en) * | 2017-01-18 | 2017-06-13 | 中国石油大学(华东) | A kind of compact efficient heat exchanger core body and its welding tooling |
| CN106825894A (en) * | 2017-01-18 | 2017-06-13 | 中国石油大学(华东) | A kind of diffusion welding craft of heat exchanger core body |
-
2020
- 2020-03-30 CN CN202010237195.7A patent/CN111515518B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3473210A (en) * | 1967-01-19 | 1969-10-21 | United Aircraft Prod | Method of making a heat exchanger |
| JP2004181518A (en) * | 2002-12-06 | 2004-07-02 | Calsonic Kansei Corp | Tool for diffusion bonding, and diffusion bonding method using the same |
| CN105149720A (en) * | 2015-07-15 | 2015-12-16 | 哈尔滨工业大学（威海） | Fixture used for braze welding of TZM alloy/ceramic sealing alloy butt-sealing structure for electronic vacuum tube and braze welding method |
| CN104972234A (en) * | 2015-07-17 | 2015-10-14 | 上海科凌能源科技有限公司 | Tool for laser welding of printed circuit heat exchanger |
| CN106839831A (en) * | 2017-01-18 | 2017-06-13 | 中国石油大学(华东) | A kind of compact efficient heat exchanger core body and its welding tooling |
| CN106825894A (en) * | 2017-01-18 | 2017-06-13 | 中国石油大学(华东) | A kind of diffusion welding craft of heat exchanger core body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111515518A (en) | 2020-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111515518B (en) | Copper alloy micro-channel heat exchanger diffusion welding fixture and method | |
| US8698049B2 (en) | Rapid thermal processing lamphead with improved cooling | |
| JP4493251B2 (en) | Electrostatic chuck module and substrate processing apparatus | |
| KR20020051857A (en) | Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof | |
| WO2007022471A2 (en) | Substrate support having brazed plates and heater | |
| CN111775073B (en) | Polishing pad dresser and manufacturing method thereof | |
| WO2017010293A1 (en) | Backing plate, sputtering target, and method for manufacturing same | |
| CN104874932A (en) | Silver copper diffusion welding method and device | |
| CN111843165B (en) | Diffusion connection method for diamond micro-channel | |
| JPH06268115A (en) | Manufacture of heat radiating substrate for semiconductor device | |
| WO2022267268A1 (en) | Microchannel heat sink and manufacturing method therefor | |
| US7163053B2 (en) | Heat exchanger | |
| Rheingans et al. | Fast and reliable Ag–Sn transient liquid phase bonding by combining rapid heating with low-power ultrasound | |
| US20130248114A1 (en) | Chip bonding apparatus | |
| CN107833870B (en) | Heat dissipation device for high-power chip and heat dissipation plate preparation method thereof | |
| US7621046B2 (en) | Moulding process of composite material including high-thermal conductor and room-temperature magnetic refrigerant | |
| TW202206767A (en) | Thin vapor chamber wick structure element and manufacturing method thereof | |
| CN208370093U (en) | Radiator and control cabinet | |
| CN110756979B (en) | Clamping tool and method for liquid cooling heat dissipation cold plate | |
| JP2003324095A (en) | Substrate cooling circuit for semiconductor manufacturing device and semiconductor manufacturing device provided with cooling circuit | |
| CN112582330A (en) | Semiconductor processing equipment and electrostatic chuck assembly thereof | |
| CN219106112U (en) | Electrostatic chuck base | |
| JP2008270400A (en) | Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device mounting the same | |
| EP3871477A1 (en) | Conduction cooling for circuit boards | |
| US20220208592A1 (en) | Electrostatic chuck prepared by additive manufacturing, and related methods and structures |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |