CN111509394A - Liquid metal-based frequency selection device with reconfigurable heat dissipation frequency - Google Patents
Liquid metal-based frequency selection device with reconfigurable heat dissipation frequency Download PDFInfo
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- CN111509394A CN111509394A CN202010208670.8A CN202010208670A CN111509394A CN 111509394 A CN111509394 A CN 111509394A CN 202010208670 A CN202010208670 A CN 202010208670A CN 111509394 A CN111509394 A CN 111509394A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/002—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices being reconfigurable or tunable, e.g. using switches or diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
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Abstract
The invention discloses a frequency selection device capable of reconstructing heat dissipation frequency based on liquid metal, which relates to the technical field of electronic products and comprises a top layer frequency selection array, a bottom layer frequency selection array, a wall plate, a liquid metal inlet and outlet, a cover plate, a middle isolation layer and a bottom plate, wherein top layer frequency selection units of each line of the top layer frequency selection array are aligned in the horizontal direction, bottom layer frequency selection units of each line of the bottom layer frequency selection array are aligned in the horizontal direction, top layer frequency selection units of each column of the top layer frequency selection array are aligned in the vertical direction, bottom layer frequency selection units of each column of the bottom layer frequency selection array are aligned in the vertical direction, the wall plate is fixed around the top layer frequency selection array and the bottom layer frequency selection array, so that the heat accumulation on the surface of an antenna housing is reduced, the heat dissipation effect is improved, and the device can normally work under the requirements of various different working frequencies.
Description
Technical Field
The invention relates to the technical field of electronic products, in particular to a frequency selection device capable of reconstructing heat dissipation frequency based on liquid metal.
Background
With the development of technology, the integration level of electronic devices in antenna systems is higher and higher, and especially with the emergence of active antennas, the heat dissipation problem of antenna systems with larger power is attracting more and more attention. Meanwhile, when the airplane enters the troposphere, the heat generated by friction is very large, and the heat flow density can reach 1000W/cm2In the above, in order to ensure the normal operation of the internal electronic device, a strong heat dissipation capability is also required. In addition, the frequency selective surface has wide application in the aspects of aircraft stealth, airborne antenna protection and the like.
The frequency selective surface is typically a periodic structure consisting of conductive sheets or hole elements, the main purpose of which is to reflect, transmit or absorb electromagnetic waves. With the continuous development of modern communication, the performance requirements of the antenna system on the frequency selection surface are further improved, and the traditional frequency selection surface can not meet the practical use indexes gradually.
The existing frequency selection model is generally to print a copper patch on the surface of a medium in a laser engraving or 3D printing mode, or etch a frequency selection unit pattern on an existing single-sided copper-clad plate, and then add the frequency selection unit pattern on the surface of the high-speed aircraft radome, so that only frequency selection is performed singly without a heat dissipation effect. The object of the filtering action of the frequency selective surface is space electromagnetic waves, and attention needs to be paid to the problems of amplitude and phase changes of transmitted and reflected electromagnetic waves, cross polarization, heat loss and the like, so that the heat accumulation on the surface of the antenna cover is aggravated while the frequency is selected, and the heat dissipation effect is reduced. For example, the invention patent with patent number 201510200529.2 discloses a frequency selective surface formed by periodically arranging square thin sheet units with square holes in the centers, the frequency selective surface can well cover 2-18GHz frequency bands, and the parameter value of a band-pass part S11 is less than-15 dB, so that ultra-wideband range wave absorption can be realized, but the negative effects are that heat accumulation on the surface of the radome is intensified, the heat dissipation effect is reduced, and the normal operation of the frequency selective surface is affected. Meanwhile, a single-layer frequency selective surface can only work at a certain single frequency generally, and cannot meet the requirement when the frequency is needed to be reconfigurable.
Disclosure of Invention
In order to solve the defects of the prior art, an embodiment of the present invention provides a frequency selection device capable of reconstructing heat dissipation frequency based on liquid metal, including a top frequency selection array, a bottom frequency selection array, a wall plate and a liquid metal inlet/outlet, wherein:
the top layer frequency selection array is arranged in M rows and N columns, the bottom layer frequency selection array is arranged in 2M rows and 2N columns, wherein M, N is an integer, M is more than or equal to 1, and N is more than or equal to 1;
the top frequency selection units of each row of the top frequency selection array are aligned in the horizontal direction, and the bottom frequency selection units of each row of the bottom frequency selection array are aligned in the horizontal direction;
the top frequency selection units of each column of the top frequency selection array are aligned in the vertical direction, and the bottom frequency selection units of each column of the bottom frequency selection array are aligned in the vertical direction;
the four bottom layer frequency selection units correspond to one top layer frequency selection unit, the center of each bottom layer frequency selection unit is positioned in the center of the top layer frequency selection unit with the size of 1/4, and the wall plates are fixed on the periphery of the top layer frequency selection array and the bottom layer frequency selection array;
each top layer frequency selection unit comprises an upper cover, a cross-shaped strut and a middle isolation plate, each bottom layer frequency selection unit comprises a middle isolation plate, a Y-shaped strut and a base, the cross-shaped strut is positioned between the upper cover and the middle isolation plate, the Y-shaped strut is positioned between the middle isolation plate and the base, and liquid metal is distributed around the cross-shaped strut or the Y-shaped strut;
the liquid metal inlet and outlet are positioned on the wall plate parallel to any branch in the Y-shaped support;
the upper covers of all the top-layer frequency selection units are tightly connected to form a cover plate of the top-layer frequency selection array;
the bases of the bottom layer frequency selection units are tightly connected to form a bottom plate of the bottom layer frequency selection array;
the middle isolation plates of the top layer frequency selection units or the bottom layer frequency selection units are tightly connected to form a middle isolation layer of the frequency selection device capable of reconstructing heat dissipation frequency.
Preferably, the cross-shaped pillar comprises two branches, and the centers of the two branches are overlapped and form a connection type structure with an included angle of 90 degrees.
Preferably, the "Y" shaped strut comprises three branches in a central connecting type structure distributed in a circular array.
Preferably, the upper cover and the middle isolation plate of each top layer frequency selection unit are square plates with the same size;
the middle isolation plate and the base of each bottom layer frequency selection unit are square plates with the same size;
the upper cover and the middle isolation plate of each top-layer frequency selection unit are arranged in parallel;
the middle isolation plates and the bases of the bottom layer frequency selection units are arranged in parallel;
the centers of the upper cover and the middle isolation plate of each top-layer frequency selection unit are positioned on the connecting axis of the two branches of the cross-shaped strut;
the centers of the middle isolation plate and the base of each bottom layer frequency selection unit are positioned on the connecting axes of the three branches of the Y-shaped support.
Preferably, the liquid metal is a metal that is liquid at room temperature, and the metal fluid includes at least one of gallium, indium, tin, bismuth, and zinc.
Preferably, the liquid metal comprises an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.
Preferably, the height of the cross-shaped support, the length and the width of the two branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 parameter of the heat-dissipating frequency reconfigurable frequency selection device is less than-20 dB.
Preferably, the height of the Y-shaped support, the length and the width of the three branches and the included angle between the adjacent branches can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the frequency selection device capable of reconstructing heat dissipation frequency is smaller than-20 dB.
Preferably, the side lengths and the thicknesses of the upper cover and the middle isolation plate of each top-layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipatable frequency reconfigurable frequency selection device is smaller than-20 dB.
Preferably, the side length and the thickness of the base of each bottom layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipatable frequency reconfigurable frequency selection device is less than-20 dB.
The frequency selection device capable of reconstructing heat dissipation frequency based on liquid metal provided by the embodiment of the invention has the following beneficial effects:
the heat accumulation on the surface of the antenna housing is reduced, the heat dissipation effect is improved, the normal work of the frequency selection surface can be ensured, and the antenna housing can normally work under the requirements of various different working frequencies.
Drawings
Fig. 1 is a schematic overall structural diagram of a frequency selection apparatus reconfigurable in heat dissipation frequency based on liquid metal according to an embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a right side view of FIG. 1;
fig. 4 is a schematic structural diagram of a top-layer frequency selection unit of a frequency selection device reconfigurable on the basis of a heat-dissipatable frequency based on a liquid metal according to an embodiment of the present invention;
FIG. 5 is a front view of FIG. 4;
FIG. 6 is a top view of FIG. 4;
fig. 7 is a schematic structural diagram of a bottom-layer frequency selection unit of a frequency selection device reconfigurable on the basis of a liquid metal and capable of dissipating heat according to an embodiment of the present invention;
FIG. 8 is a front view of FIG. 4;
FIG. 9 is a top view of FIG. 4;
fig. 10 is a temperature cloud chart obtained by a natural convection heat dissipation manner after a constant temperature 1000 ℃ heat source is uniformly added to the bottom surface of the frequency selection device reconfigurable on the basis of the heat-dissipatable frequency of the liquid metal when the liquid metal is only arranged in the top-layer frequency selection unit according to the embodiment of the present invention;
fig. 11 is a temperature cloud chart obtained by uniformly adding a heat source with a constant temperature of 1000 ℃ to the bottom surface of the frequency selection device with reconfigurable heat dissipation frequency based on liquid metal and driving the liquid metal to circularly flow for heat dissipation by using an electromagnetic pump when the liquid metal is only arranged in the top frequency selection unit according to the embodiment of the present invention;
fig. 12 is a temperature cloud chart obtained by a natural convection heat dissipation manner after a constant temperature 1000 ℃ heat source is uniformly added to the bottom surface of the frequency selection device reconfigurable on the basis of the heat-dissipatable frequency of the liquid metal when the liquid metal is disposed in both the top-layer frequency selection unit and the bottom-layer frequency selection unit according to the embodiment of the present invention;
fig. 13 is a temperature cloud diagram obtained by uniformly adding a heat source of a constant temperature of 1000 ℃ to the bottom surface of the frequency selection device reconfigurable on the basis of the heat-dissipatable frequency of liquid metal and then driving the liquid metal to circularly flow by using an electromagnetic pump to dissipate heat when liquid metal is disposed in both the top-layer frequency selection unit and the bottom-layer frequency selection unit according to the embodiment of the present invention;
FIG. 14 is a graph of the parameters of the band pass section S11 when only the top frequency selective element is filled with liquid metal according to the embodiment of the present invention;
fig. 15 is a graph of parameters of the band pass section S11 when liquid metal is provided only to the bottom frequency selective element according to the embodiment of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and the embodiments.
As shown in fig. 1, a frequency selection device capable of dissipating heat based on liquid metal and reconfigurable frequency includes a top frequency selection array 1, a bottom frequency selection array 2, a wall plate 5, a liquid metal access 3, a liquid metal access 4, a liquid metal 8, a cover plate 9, a middle isolation layer 10, and a bottom plate 11, where:
the top frequency selective array 1 is arranged in M rows and N columns, and the bottom frequency selective array 2 is arranged in 2M rows and 2N columns, wherein M, N is an integer, M is greater than or equal to 1, and N is greater than or equal to 1.
The top frequency selection units of each row in the top frequency selection array 1 are aligned in the horizontal direction, and the bottom frequency selection units of each row in the bottom frequency selection array 2 are aligned in the horizontal direction.
The top frequency selective elements of each column of the top frequency selective array 1 are aligned in the vertical direction, and the bottom frequency selective elements of each column of the bottom frequency selective array 2 are aligned in the vertical direction.
As shown in fig. 4, the top-layer frequency selection unit 6 includes an upper cover 61, a cross-shaped pillar 62 and a middle isolation plate 63, wherein the cross-shaped pillar 62 is located between the upper cover 61 and the middle isolation plate 63, and the liquid metal 8 is distributed around the cross-shaped pillar 62.
As shown in fig. 7, the bottom frequency selection unit includes a middle isolation plate 63, a Y-shaped pillar 72 and a base 73, the Y-shaped pillar is located between the middle isolation plate 63 and the base 73, and the liquid metal 8 is distributed around the Y-shaped pillar 72.
The four bottom frequency selection units 7 correspond to one top frequency selection unit 6, the center of each bottom frequency selection unit 7 is located at the center of the top frequency selection unit 6 with the size of 1/4, and the wall plate 5 is fixed around the top frequency selection array and the bottom frequency selection array.
The liquid metal inlet and outlet 3 and the liquid metal inlet and outlet 4 are positioned on the wall plate parallel to any branch in the Y-shaped support;
the upper covers 61 of the top frequency selection units 6 are tightly connected to form a cover plate 9 of the frequency selection device with reconfigurable heat dissipation frequency;
the bases 73 of the bottom frequency selection units 7 are closely connected to form a bottom plate 11 of the bottom frequency selection array;
the intermediate isolation plates 63 of the top frequency selection unit 6 or the bottom frequency selection unit 7 are closely connected to form the intermediate isolation layer 10 of the frequency selection device capable of reconstructing heat dissipation frequency.
Alternatively, the cross-shaped strut 62 includes two branches, the centers of which are overlapped and form a connection-type structure with an included angle of 90 degrees.
Alternatively, the "Y" shaped strut 72 includes three branches in a central connecting configuration distributed in a circular array.
Optionally, the upper cover 61 and the middle isolation plate 63 of each top-layer frequency selection unit 6 are square plates with the same size;
the middle isolation plate 63 and the base 73 of each bottom layer frequency selection unit 7 are square plates with the same size;
the upper cover 61 and the middle isolation plate 63 of each top-layer frequency selection unit 6 are arranged in parallel;
the middle isolation plate 63 and the base 73 of each bottom layer frequency selection unit 7 are arranged in parallel;
the centers of the upper cover of each top-layer frequency selection unit 6 and the middle isolation plate 63 are all positioned on the connecting axis of the two branches of the cross-shaped strut 62;
the centers of the middle partition plate 63 and the base 73 of each bottom layer frequency selection unit 7 are located on the connecting axes of the three branches of the Y-shaped pillar 72.
Optionally, the liquid metal 8 is a metal that is liquid at room temperature, a metal fluid comprising at least one of gallium, indium, tin, bismuth, and zinc.
Optionally, the liquid metal 8 comprises an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.
The liquid metal 8 can be selected according to the actual working conditions, so that the liquid metal has good fluidity, thermal conductivity and electrical conductivity.
As a specific example, the material selected for the liquid metal 8 is Ga68In20Sn 12. When the device works, according to the requirements of different working frequencies, liquid metal is arranged in the top layer frequency selection unit or the bottom layer frequency selection unit, and the flow rate of the liquid metal is adjusted and controlled by an external electromagnetic pump, a throttle valve and a speed regulator.
Optionally, the height of the cross-shaped strut, the length and the width of the two branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 parameter of the heat-dissipating frequency reconfigurable frequency selection device is less than-20 dB.
Optionally, the height of the "Y" shaped pillar, the length and width of the three branches, and the included angle between adjacent branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 of the band-pass part of the frequency selection device capable of reconstructing heat dissipation frequency is less than-20 dB.
Optionally, the side lengths and thicknesses of the upper cover and the middle isolation plate of each top-layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipatable frequency reconfigurable frequency selection device is smaller than-20 dB.
Optionally, the side length and the thickness of the base of each bottom layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipatable frequency reconfigurable frequency selection device is smaller than-20 dB.
As a specific example, the cross-shaped support posts 62, the Y-shaped support posts 72, the cover plate 9, the intermediate isolation layer 10, the bottom plate 11 and the wall plate 5 are made of materials with good corrosion resistance and wave permeability, such as organic glass or Al2O3 ceramic.
The size of the frequency selection device capable of dissipating heat based on liquid metal provided by the embodiment of the invention depends on the row number M and the column number N of the top layer frequency selection unit, the thickness of the wall plate, the sizes of each top layer frequency selection unit and the bottom layer frequency selection unit, namely the height of the frequency selection device capable of dissipating heat based on liquid metal provided by the embodiment of the invention is equal to the sum of the heights of the top layer frequency selection unit and the bottom layer frequency selection unit, the length of the frequency selection device capable of dissipating heat based on liquid metal provided by the embodiment of the invention is equal to the sum of the side length of the N top layer frequency selection units and the thicknesses of the two wall plates, the width of the frequency selection device capable of dissipating heat based on liquid metal provided by the embodiment of the invention is equal to the sum of the side length of the M top layer frequency selection units and the thicknesses of the two wall, in order to reduce the impact force of the liquid metal on the cavity structure, the diameter of each liquid metal inlet and outlet is smaller than or equal to the height of the cross-shaped support or the Y-shaped support.
As a specific example, as shown in fig. 2 and 3, when M is 10 and N is 10, the thickness of the wall plate 5 is 2mm, the liquid metal inlet/outlet 3 and the liquid metal inlet/outlet 4 are circular through holes with a diameter of 4mm and are both located on the wall plate parallel to any branch of the Y-shaped pillar 72, one group of the circular through holes is located at the center of one side wall plate of the top frequency selective array, and the other group is located at the center of one side wall plate of the bottom frequency selective array. The liquid metal-based frequency selection device capable of reconstructing heat dissipation frequency provided by the embodiment of the invention has the advantages of 258mm in length, 258mm in width and 16mm in height.
In order to illustrate the superiority of the device, the device for reconfigurable frequency of heat-dissipating based on liquid metal, which is provided by the embodiment of the invention and is heated by the same heat source, simulates the heat-dissipating effect of the device for reconfigurable frequency of heat-dissipating based on liquid metal, which is disclosed by the invention, by using commercial simulation software Ansys Icepak19.0 and commercial simulation software HFSS19.2 in two different ways of taking away heat by natural convection and driving the liquid metal to circularly flow by using an electromagnetic pump.
(1) Simulation parameters:
set up "ten" font pillar 62 height and be 5mm, two straight line unit length are 8.6mm, the width is 2.4mm, the contained angle of two adjacent straight line units is 90, upper cover 61 and middle division board 63 are long 25.4mm, the width is 25.4mm, the height is 2mm, M10, N10, the thickness of wallboard 5 is 2mm, liquid metal is imported and exported 3 diameters and is 4mm, whole top layer frequency selection device's length is 258mm, the width is 258mm, the height is 9 mm.
Set up "Y" font pillar 72 height and be 5mm, three branch length is 3.1mm, the width is 2.3mm, the contained angle of two adjacent branches is 120, middle division board 63 and base 73 length are 12.7mm, the width is 12.7mm, the height is 2mm, 2M 20, 2N 20, the thickness of wallboard 5 is 2mm, liquid metal is imported and exported 4 diameters and is 4mm, whole bottom frequency selective device's length is 258mm, the width is 258mm, the height is 9 mm.
The liquid metal 8 is Ga68In20Sn12 material, the density is 6363kg/m3, the specific heat capacity is 366J/kg.k, the viscosity is 0.00222 kg/m.s, the thermal conductivity is 16.5 w/m.k, and the thermal conductivity is far higher than that of water.
The cover plate 9, the cross-shaped support posts 62, the middle isolation layer 10, the Y-shaped support posts 72, the base 11 and the wall plate 5 are all made of organic glass materials, the density of the glass materials is 3970kg/m3, the specific heat capacity is 840J/kg.k, and the thermal conductivity is 27 w/m.k.
Thermal contact resistances do not exist between the cross-shaped support posts 62 and the cover plate 9 and the middle isolation layer 10, between the Y-shaped support posts 72 and the middle isolation layer 10 and the base 11, and between the wall plate 5 and the cover plate 9, the middle isolation layer 10 and the base 11.
In order to make the two experiments contrast, when natural convection heat dissipation is performed, the speed of the inlet of the liquid metal 8 is set to be 0, that is, the liquid metal 8 is set to be in a static state, and when the liquid metal 8 is driven to circularly flow by the electromagnetic pump to perform heat dissipation, the speed of the inlet of the liquid metal 8 is respectively set to be 10 m/s.
In order to unify other variables of the two experiments, the initial temperature and the ambient temperature are both 20 ℃, the initial pressure value is both standard atmospheric pressure, and meanwhile, radiation heat exchange is not considered in simulation.
(2) Simulation content and results:
As shown in fig. 10, only when liquid metal is disposed in the bottom frequency selection unit, after a constant temperature 1000 ℃ heat source is uniformly added to the bottom surface of the liquid metal-based frequency selection device with reconfigurable heat dissipation capability, the heat selection device with reconfigurable heat dissipation capability is cooled in a natural convection manner, so as to obtain a temperature cloud chart of the bottom surface of the liquid metal-based frequency selection device with reconfigurable heat dissipation capability.
As can be seen from fig. 10, the temperature is uniformly distributed and higher, and gradually decreases toward the two walls where no liquid metal inlet and outlet is provided, the highest temperature of the lower surface of the device reaches 932.79 ℃, and the lowest temperature is about 14.96 ℃, which indicates that the natural convection cannot dissipate heat, and in this case, the antenna system may malfunction.
Similarly, after a constant-temperature 1000 ℃ heat source is uniformly added to the bottom surface of the liquid metal-based frequency reconfigurable frequency selection device, an electromagnetic pump is used to drive the liquid metal to circularly flow for heat dissipation, so as to obtain a temperature cloud chart of the lower surface of the liquid metal-based frequency reconfigurable frequency selection device as shown in fig. 11.
As can be seen from fig. 11, the liquid metal rapidly flows over the high temperature surface of the device, and takes away heat, the temperature gradually increases from the center to both sides along the inlet and outlet of the liquid metal, and also gradually increases from the inlet to the outlet, the temperature at the inlet is the lowest, the highest temperature of the lower surface of the device reaches 724.18 ℃, and the lowest temperature is about 19.69 ℃, which indicates that the circulating kinetic energy dissipates heat to a certain extent, and the antenna system can work normally.
Under the condition that both the top layer frequency selection unit and the bottom layer frequency selection unit are provided with liquid metal, after a constant-temperature 1000 ℃ heat source is uniformly added to the bottom surface of the liquid metal-based heat-dissipatable frequency reconfigurable frequency selection device disclosed by the invention, the heat-dissipatable frequency reconfigurable frequency selection device is dissipated by adopting a natural convection mode, so that a temperature cloud chart of the lower surface of the liquid metal-based heat-dissipatable frequency reconfigurable frequency selection device shown in fig. 12 is obtained.
As can be seen from fig. 12, the temperature distribution is relatively uniform, the temperature is gradually reduced from the inlet to the outlet, the highest temperature of the lower surface of the frequency selection device with reconfigurable heat-dissipating frequency reaches 858.59 ℃, and the lowest temperature is about 19.98 ℃.
Similarly, after a constant-temperature 1000 ℃ heat source is uniformly added to the bottom surface of the device of the present embodiment, an electromagnetic pump is used to drive the liquid metal to circularly flow for heat dissipation, so as to obtain a temperature cloud chart of the lower surface of the frequency-reconfigurable heat-dissipation device shown in fig. 13.
As can be seen from fig. 13, by driving the liquid metal to flow circularly, the liquid metal flows through the high-temperature surface of the frequency selection device with reconfigurable heat dissipation frequency quickly, so as to take away heat, the highest temperature of the lower surface of the frequency selection device with reconfigurable heat dissipation frequency is only 720.56 ℃, so that the heat dissipation effect is achieved, and the antenna system can work normally.
Comparing the results of fig. 10 to fig. 13, it is shown that the frequency selection device capable of reconstructing heat dissipation frequency disclosed by the present invention can reduce the temperature of the antenna system, and perform efficient heat dissipation on the antenna system.
Assuming that the liquid metal 8 is an ideal metal electrical conductor, the organic glass has a relative dielectric constant of 2.57 and a dielectric loss tangent of 0.0078, and the electrical performance of the device of this example is simulated by using commercial simulation software HFSS19.2, a parameter curve of the band pass portion S11 is obtained when only the top layer is filled with the liquid metal or the bottom layer is filled with the liquid metal, and the results are shown in fig. 14 and 15, respectively.
As can be seen from fig. 14, in the case where only the top-layer frequency selective unit is provided with the liquid metal, when the resonance frequency f is 4.98GHz, S11 is-23.05 dB, that is, S11 reaches-20 dB or less; as can be seen from fig. 15, when the liquid metal is passed through only the bottom layer, S11 is-20.84 dB when the resonance frequency f is 12.98GHz, that is, S11 is less than-20 dB. Therefore, the liquid metal is arranged on the top layer frequency selection unit or the liquid metal is arranged on the bottom layer frequency selection unit, so that the high-frequency-band-pass filter has good electrical performance and can meet the practical use requirement.
The heat-dissipating frequency reconfigurable frequency selection device based on the liquid metal comprises a top layer frequency selection array, a bottom layer frequency selection array, a wall plate, a liquid metal inlet/outlet, a cover plate, a middle isolation layer and a bottom plate, wherein top layer frequency selection units of each line of the top layer frequency selection array are aligned in the horizontal direction, bottom layer frequency selection units of each line of the bottom layer frequency selection array are aligned in the horizontal direction, top layer frequency selection units of each column of the top layer frequency selection array are aligned in the vertical direction, bottom layer frequency selection units of each column of the bottom layer frequency selection array are aligned in the vertical direction, four bottom layer frequency selection units correspond to one top layer frequency selection unit, the center of each bottom layer frequency selection unit is positioned in the center of the top layer frequency selection unit with the size of 1/4, and the wall plate is fixed around the top layer frequency selection array and the, the heat accumulation on the surface of the antenna housing is reduced, the heat dissipation effect is improved, the normal work of the frequency selection surface can be ensured, and the antenna housing can normally work under the requirements of various different working frequencies.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
It will be appreciated that the relevant features of the method and apparatus described above are referred to one another.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The utility model provides a frequency selection device is restructured to frequency of can dispelling heat based on liquid metal which characterized in that, includes top layer frequency selective array, bottom layer frequency selective array, wallboard and liquid metal import and export, wherein:
the top layer frequency selection array is arranged in M rows and N columns, the bottom layer frequency selection array is arranged in 2M rows and 2N columns, wherein M, N is an integer, M is more than or equal to 1, and N is more than or equal to 1;
the top frequency selection units of each row of the top frequency selection array are aligned in the horizontal direction, and the bottom frequency selection units of each row of the bottom frequency selection array are aligned in the horizontal direction;
the top frequency selection units of each column of the top frequency selection array are aligned in the vertical direction, and the bottom frequency selection units of each column of the bottom frequency selection array are aligned in the vertical direction;
the four bottom layer frequency selection units correspond to one top layer frequency selection unit, the center of each bottom layer frequency selection unit is positioned in the center of the top layer frequency selection unit with the size of 1/4, and the wall plates are fixed on the periphery of the top layer frequency selection array and the bottom layer frequency selection array;
each top layer frequency selection unit comprises an upper cover, a cross-shaped strut and a middle isolation plate, each bottom layer frequency selection unit comprises a middle isolation plate, a Y-shaped strut and a base, the cross-shaped strut is positioned between the upper cover and the middle isolation plate, the Y-shaped strut is positioned between the middle isolation plate and the base, and liquid metal is distributed around the cross-shaped strut or the Y-shaped strut;
the liquid metal inlet and outlet are positioned on the wall plate parallel to any branch in the Y-shaped support;
the upper covers of all the top-layer frequency selection units are tightly connected to form a cover plate of the top-layer frequency selection array;
the bases of the bottom layer frequency selection units are tightly connected to form a bottom plate of the bottom layer frequency selection array;
the middle isolation plates of the top layer frequency selection units or the bottom layer frequency selection units are tightly connected to form a middle isolation layer of the frequency selection device capable of reconstructing heat dissipation frequency.
2. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the cross-shaped support column comprises two branches, wherein the centers of the two branches are overlapped and form a connection type structure with an included angle of 90 degrees.
3. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the Y-shaped support column comprises three branches, and the three branches are of a central connection type structure distributed in a circular array.
4. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the upper cover and the middle isolation plate of each top-layer frequency selection unit are square plates with the same size;
the middle isolation plate and the base of each bottom layer frequency selection unit are square plates with the same size;
the upper cover and the middle isolation plate of each top-layer frequency selection unit are arranged in parallel;
the middle isolation plates and the bases of the bottom layer frequency selection units are arranged in parallel;
the centers of the upper cover and the middle isolation plate of each top-layer frequency selection unit are positioned on the connecting axis of the two branches of the cross-shaped strut;
the centers of the middle isolation plate and the base of each bottom layer frequency selection unit are positioned on the connecting axes of the three branches of the Y-shaped support.
5. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the liquid metal is a metal which is liquid at room temperature and comprises at least one metal fluid of gallium, indium, tin, bismuth and zinc.
6. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the liquid metal includes an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.
7. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the height of the cross-shaped support, the length and the width of the two branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 parameter of the band-pass part of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.
8. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the height of the Y-shaped support, the lengths and the widths of the three branches and the included angles of the adjacent branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 of the band-pass part of the frequency selection device capable of reconstructing the heat dissipation frequency is smaller than-20 dB.
9. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the side lengths and the thicknesses of the upper cover of each top-layer frequency selection unit and the middle isolation plate can be adjusted according to the actual working frequency, so that the parameter value of the S11 of the band-pass part of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.
10. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,
the side length and the thickness of the base of each bottom layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.
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