CN111509394A - Liquid metal-based frequency selection device with reconfigurable heat dissipation frequency - Google Patents

Abstract

The invention discloses a frequency selection device capable of reconstructing heat dissipation frequency based on liquid metal, which relates to the technical field of electronic products and comprises a top layer frequency selection array, a bottom layer frequency selection array, a wall plate, a liquid metal inlet and outlet, a cover plate, a middle isolation layer and a bottom plate, wherein top layer frequency selection units of each line of the top layer frequency selection array are aligned in the horizontal direction, bottom layer frequency selection units of each line of the bottom layer frequency selection array are aligned in the horizontal direction, top layer frequency selection units of each column of the top layer frequency selection array are aligned in the vertical direction, bottom layer frequency selection units of each column of the bottom layer frequency selection array are aligned in the vertical direction, the wall plate is fixed around the top layer frequency selection array and the bottom layer frequency selection array, so that the heat accumulation on the surface of an antenna housing is reduced, the heat dissipation effect is improved, and the device can normally work under the requirements of various different working frequencies.

Description

A liquid metal-based reconfigurable frequency selection device that can dissipate heat

technical field

The invention relates to the field of electronic product technology, in particular to a liquid metal-based frequency reconfigurable frequency selection device that can dissipate heat.

Background technique

With the development of science and technology, the integration of electronic devices in antenna systems is getting higher and higher, especially the emergence of active antennas, and the heat dissipation problem of higher power antenna systems has attracted more and more attention. At the same time, when the aircraft enters the troposphere, the heat generated by friction is huge, and the heat flux density can reach more than 1000W/ ^cm2 . In order to ensure the normal operation of the internal electronic equipment, a strong heat dissipation capacity is also required. In addition, frequency selective surfaces are widely used in aircraft stealth and protection of airborne antennas.

Frequency selective surfaces are usually periodic structures consisting of conductive sheets or hole elements whose main purpose is to reflect, transmit or absorb electromagnetic waves. With the continuous development of modern communications, the performance requirements of the antenna system for the frequency selective surface have been further improved, and the traditional frequency selective surface has gradually been unable to meet the actual use indicators.

The existing frequency selection model usually uses laser engraving or 3D printing to print copper patches on the surface of the medium, or etch the frequency selection unit pattern on the existing single-sided copper clad laminate, and then add the frequency selection unit pattern to the surface. The surface of the radome of the high-speed aircraft only performs frequency selection alone and does not have the effect of heat dissipation. The filtering effect of the frequency selective surface is aimed at space electromagnetic waves. What needs to be paid attention to is not only the amplitude and phase changes of the transmitted and reflected electromagnetic waves, but also the problems of cross-polarization and heat loss. Therefore, the frequency selection will intensify the Heat accumulation on the surface of the radome reduces the heat dissipation effect. For example, the invention patent No. 201510200529.2 discloses a frequency selective surface formed by periodic arrangement of square sheet units with square holes in the center. Although the frequency selective surface can well cover the 2-18GHz frequency band, the The S11 parameter value of the pass-through part is less than -15dB, which can achieve ultra-wideband wave absorption, but the negative effect is that the heat accumulation on the surface of the radome is aggravated, the heat dissipation effect is reduced, and the normal operation of the frequency selection surface is affected. At the same time, the single-layer frequency selective surface generally can only work at a single frequency, which cannot meet the requirements when frequency reconfiguration is required.

SUMMARY OF THE INVENTION

In order to solve the deficiencies of the prior art, an embodiment of the present invention provides a liquid metal-based heat-dissipating frequency reconfigurable frequency selection device, the device includes a top frequency selection array, a bottom frequency selection array, a wall plate, and a liquid metal inlet and outlet. ,in:

The top layer frequency selection array is arranged in the form of M rows and N columns, and the bottom layer frequency selection array is arranged in the form of 2M rows and 2N columns, wherein M and N are integers and M≥1, N≥1;

The top-level frequency selection units of each row of the top-level frequency selection array are aligned in the horizontal direction, and the bottom-level frequency selection units of each row of the bottom layer frequency selection array are aligned in the horizontal direction;

The top-level frequency selection units of each column of the top-level frequency selection array are vertically aligned, and the bottom-level frequency selection units of each column of the bottom layer frequency selection array are vertically aligned;

The four bottom frequency selection units correspond to one top frequency selection unit, the center of each bottom frequency selection unit is located at the center of the 1/4 size of the top frequency selection unit, and the wall plate is fixed around the top frequency selection array and the bottom frequency selection array;

Each top-level frequency selection unit includes an upper cover, a "cross"-shaped pillar and a middle isolation plate, and each bottom frequency selection unit includes a middle isolation plate, a "Y"-shaped pillar and a base, and the "cross"-shaped pillar is located on the upper cover and is isolated from the middle Between the plates, the "Y"-shaped pillars are located between the intermediate isolation plate and the base, and liquid metal is distributed around the "cross"-shaped pillars or the "Y"-shaped pillars;

The liquid metal inlet and outlet are located on the wall parallel to any branch of the "Y"-shaped strut;

The upper covers of each top-level frequency selection unit are closely connected to form the cover plate of the top-level frequency selection array;

The bases of each bottom frequency selection unit are closely connected to form the bottom plate of the bottom frequency selection array;

The intermediate isolation plates of each top frequency selection unit or bottom frequency selection unit are closely connected to form an intermediate isolation layer of the frequency reconfigurable frequency selection device that can dissipate heat.

Preferably, the "cross"-shaped pillar includes two branches, and the centers of the two branches overlap and form a connection-type structure with an included angle of 90 degrees.

Preferably, the "Y"-shaped strut includes three branches, and the three branches are in a center-connected structure distributed in a circular array.

Preferably, the upper cover and the middle isolation plate of each top-level frequency selection unit are square plates of the same size;

The middle isolation plate and base of each bottom frequency selection unit are square plates of the same size;

The upper cover of each top frequency selection unit and the middle isolation plate are arranged in parallel;

The middle isolation plate and the base of each bottom frequency selection unit are arranged in parallel;

The upper cover of each top-level frequency selection unit and the center of the middle isolation plate are located on the connection axis of the two branches of the "cross"-shaped pillar;

The center of the middle isolation plate and the base of each bottom frequency selection unit are located on the connection axis of the three branches of the "Y"-shaped support.

Preferably, the liquid metal is a metal that is liquid at room temperature, and includes a metal fluid of at least one of gallium, indium, tin, bismuth and zinc.

Preferably, the liquid metal includes an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.

Preferably, the height of the "cross"-shaped pillar, the length and width of the two branches can be adjusted according to the actual operating frequency, so that the S11 parameter value of the bandpass portion of the reconfigurable frequency selection device that can dissipate heat is less than -20dB.

Preferably, the height of the "Y"-shaped pillar, the length and width of the three branches, the included angle of the adjacent branches, can be adjusted according to the actual operating frequency, so that the frequency can be dissipated and the band pass of the frequency selection device can be reconfigured. Some S11 parameter values are less than -20dB.

Preferably, the side length and thickness of the upper cover and the middle isolation plate of each top-level frequency selection unit can be adjusted according to the actual operating frequency, so that the S11 parameter value of the bandpass portion of the reconfigurable frequency selection device that can dissipate heat is less than -20dB.

Preferably, the side length and thickness of the base of each underlying frequency selection unit can be adjusted according to the actual operating frequency, so that the S11 parameter value of the bandpass portion of the reconfigurable frequency selection device that can dissipate heat is less than -20dB.

The liquid metal-based heat-dissipating frequency reconfigurable frequency selection device provided by the embodiment of the present invention has the following beneficial effects:

The heat accumulation on the surface of the radome is reduced, the heat dissipation effect is improved, the normal operation of the frequency selection surface can be ensured, and it can work normally under a variety of different operating frequency requirements.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure of a liquid metal-based heat-dissipating frequency reconfigurable frequency selection device according to an embodiment of the present invention;

Fig. 2 is the top view of Fig. 1;

Fig. 3 is the right side view of Fig. 1;

4 is a schematic structural diagram of a top-level frequency selection unit of a liquid metal-based heat-dissipating frequency reconfigurable frequency selection device according to an embodiment of the present invention;

Fig. 5 is the front view of Fig. 4;

Fig. 6 is the top view of Fig. 4;

7 is a schematic structural diagram of a bottom frequency selection unit of a liquid metal-based heat-dissipating frequency reconfigurable frequency selection device according to an embodiment of the present invention;

Fig. 8 is the front view of Fig. 4;

Fig. 9 is the top view of Fig. 4;

FIG. 10 is a diagram showing the use of natural convection after uniformly adding a constant temperature 1000°C heat source to the bottom surface of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device when only liquid metal is provided in the top-level frequency selection unit provided by the embodiment of the present invention. The temperature cloud map obtained by the heat dissipation method;

FIG. 11 shows that when only the liquid metal is set in the top-level frequency selection unit provided by the embodiment of the present invention, the bottom surface of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device is uniformly added with a constant temperature 1000°C heat source, and an electromagnetic pump is used. The temperature cloud map obtained by driving the circulating flow of liquid metal to dissipate heat;

12 shows the bottom surface of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device provided by an embodiment of the present invention when liquid metal is set in both the top-level frequency selection unit and the bottom-level frequency selection unit, after uniformly adding a constant temperature 1000°C heat source , the temperature cloud map obtained by natural convection heat dissipation;

13 shows the bottom surface of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device provided by an embodiment of the present invention when liquid metal is provided in both the top-level frequency selection unit and the bottom-level frequency selection unit, after uniformly adding a constant temperature 1000°C heat source , the temperature cloud map obtained by using the electromagnetic pump to drive the liquid metal circulating flow to dissipate heat;

14 is a graph showing the S11 parameter curve of the band-pass part when only the top-level frequency selection unit is set with liquid metal according to an embodiment of the present invention;

FIG. 15 is a curve diagram of the S11 parameter of the band pass part when only the bottom frequency selection unit is set with liquid metal according to an embodiment of the present invention.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

As shown in FIG. 1 , the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device provided by the embodiment of the present invention includes a top frequency selection array 1 , a bottom frequency selection array 2 , a wall plate 5 , a liquid metal inlet and outlet 3 and a liquid metal The inlet and outlet 4, the liquid metal 8, the cover plate 9, the intermediate isolation layer 10 and the bottom plate 11, wherein:

The top frequency selection array 1 is arranged in the form of M rows and N columns, and the bottom frequency selection array 2 is arranged in the form of 2M rows and 2N columns, wherein M and N are integers and M≥1, N≥1.

The top-level frequency selection units of each row of the top-level frequency selection array 1 are aligned in the horizontal direction, and the bottom-level frequency selection units of each row of the bottom layer frequency selection array 2 are aligned in the horizontal direction.

The top-level frequency selection units of each column of the top-level frequency selection array 1 are aligned in the vertical direction, and the bottom-level frequency selection units of each column of the bottom layer frequency selection array 2 are aligned in the vertical direction.

As shown in FIG. 4 , the top-level frequency selection unit 6 includes an upper cover 61 , a “cross”-shaped pillar 62 and a middle isolation plate 63 , and the “cross”-shaped pillar 62 is located between the upper cover 61 and the intermediate isolation plate 63 and has a “cross” shape. Liquid metal 8 is distributed around the pillar 62 .

As shown in FIG. 7 , the bottom frequency selection unit includes an intermediate isolation plate 63 , a “Y”-shaped pillar 72 and a base 73 . The “Y” shaped pillar is located between the intermediate isolation plate 63 and the base 73 and is distributed around the “Y” shaped pillar 72 There is Liquid Metal 8.

The four bottom frequency selection units 7 correspond to one top frequency selection unit 6, the center of each bottom frequency selection unit 7 is located at the center of the 1/4 size of the top frequency selection unit 6, and the wall plate 5 is fixed on the top frequency selection array and the bottom frequency selection unit 6. Select around the array.

The liquid metal inlet and outlet 3 and the liquid metal inlet and outlet 4 are located on the wall plate parallel to any branch in the "Y"-shaped pillar;

The upper covers 61 of each top-level frequency selection unit 6 are closely connected to form a cover plate 9 of the frequency-reconfigurable frequency selection device that can dissipate heat;

The bases 73 of each bottom frequency selection unit 7 are closely connected to form the bottom plate 11 of the bottom frequency selection array;

The middle isolation plates 63 of each top frequency selection unit 6 or bottom frequency selection unit 7 are closely connected to form the middle isolation layer 10 of the frequency reconfigurable frequency selection device that can dissipate heat.

Optionally, the "cross"-shaped pillar 62 includes two branches, and the centers of the two branches overlap and form a connection-type structure with an included angle of 90 degrees.

Optionally, the "Y"-shaped strut 72 includes three branches, and the three branches form a center-connected structure distributed in a circular array.

Optionally, the upper cover 61 and the middle isolation plate 63 of each top-level frequency selection unit 6 are square plates of the same size;

The middle isolation plate 63 and the base 73 of each bottom frequency selection unit 7 are square plates of the same size;

The upper cover 61 and the middle isolation plate 63 of each top-level frequency selection unit 6 are arranged in parallel;

The middle isolation plate 63 and the base 73 of each bottom frequency selection unit 7 are arranged in parallel;

The upper cover of each top-level frequency selection unit 6 and the center of the middle isolation plate 63 are all located on the connection axis of the two branches of the "cross"-shaped pillar 62;

The center of the middle isolation plate 63 and the base 73 of each bottom frequency selection unit 7 are located on the connection axis of the three branches of the "Y"-shaped support 72 .

Optionally, the liquid metal 8 is a metal that is liquid at room temperature, and includes a metal fluid of at least one of gallium, indium, tin, bismuth and zinc.

Optionally, the liquid metal 8 includes an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.

Among them, the liquid metal 8 can be selected according to the actual working conditions, so that it has good fluidity, thermal conductivity and electrical conductivity.

As a specific embodiment, the material selected for the liquid metal 8 is Ga68In20Sn12. When working, according to the requirements of different working frequencies, only set the liquid metal in the top frequency selection unit or set the liquid metal in the bottom frequency selection unit, and the flow rate of the liquid metal is adjusted by the external electromagnetic pump, throttle valve and governor. control.

Optionally, the height of the "cross"-shaped pillar, the length and width of the two branches can be adjusted according to the actual operating frequency, so that the S11 parameter value of the bandpass portion of the reconfigurable frequency selection device that can dissipate heat is less than -20dB.

Optionally, the height of the "Y"-shaped strut, the length and width of the three branches, the included angle of the adjacent branches, can be adjusted according to the actual operating frequency, so that the frequency can be dissipated and the frequency can be reconfigured. The band-pass part of the frequency selection device The S11 parameter value is less than -20dB.

Optionally, the side length and thickness of the upper cover and the middle isolation plate of each top-level frequency selection unit can be adjusted according to the actual operating frequency, so that the S11 parameter value of the band-pass part of the reconfigurable frequency selection device that can dissipate heat is less than -20dB. .

Optionally, the side length and thickness of the base of each underlying frequency selection unit can be adjusted according to the actual operating frequency, so that the S11 parameter value of the bandpass portion of the reconfigurable frequency selection device that can dissipate heat is less than -20dB.

As a specific example, the "cross"-shaped pillars 62, the "Y"-shaped pillars 72, the cover plate 9, the intermediate isolation layer 10, the bottom plate 11 and the wall plate 5 are all made of plexiglass or Al2O3 ceramics, which have good corrosion resistance and Wave-transmitting material.

Wherein, the size of the liquid metal-based frequency reconfigurable frequency selection device with heat dissipation provided by the embodiment of the present invention depends on the number of rows M and the number of columns N of the top frequency selection unit, the thickness of the wall plate, each top frequency selection unit and the bottom layer. The size of the frequency selection unit, that is, the height of the liquid metal-based frequency reconfigurable frequency selection device provided by the embodiment of the present invention is equal to the sum of the heights of the top frequency selection unit and the bottom frequency selection unit. The length of the liquid metal heat-dissipating frequency reconfigurable frequency selection device is equal to the sum of the side length of the N top-level frequency selection units and the thickness of the two wall plates. The width of the frequency selection device is equal to the sum of the side length of the M top frequency selection units and the thickness of the two wall plates, wherein, in order to reduce the impact force of the liquid metal on the cavity structure, the diameter of each liquid metal inlet and outlet is less than Equal to the height of a "cross" pillar or "Y" pillar.

As a specific example, as shown in Figures 2 and 3, when M=10 and N=10, the thickness of the wall plate 5 is 2mm, and the liquid metal inlet and outlet 3 and the liquid metal inlet and outlet 4 are both 4mm in diameter and are located on the wall parallel to any branch of the "Y"-shaped pillar 72, one group of circular holes is located in the center of one side wall of the top frequency selective array, and the other group is located on the bottom layer. The exact center of one side wall of the frequency selective array. The liquid metal-based heat-dissipating frequency reconfigurable frequency selection device provided by the embodiment of the present invention has a length of 258 mm, a width of 258 mm, and a height of 16 mm.

In order to illustrate the advantages of the present invention, the same heat source is used to heat the liquid metal-based reconfigurable frequency selection device with heat dissipation frequency provided by the embodiment of the present invention, and two kinds of heat are taken away by natural convection and by using an electromagnetic pump to drive the liquid metal circulating flow. In different ways, the commercial simulation software Ansys Icepak19.0 is used to simulate the heat dissipation effect of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device disclosed in the present invention, and the commercial simulation software HFSS19.2 is used to simulate the electrical performance of the device of the present invention. .

(1) Simulation parameters:

The height of the "cross"-shaped pillar 62 is set to 5mm, the length of the two linear units is 8.6mm, and the width is 2.4mm. The angle between the two adjacent linear units is 90°. 25.4mm in width, 25.4mm in width, 2mm in height, M=10, N=10, the thickness of the wall plate 5 is 2mm, the diameter of the liquid metal inlet and outlet 3 is Φ=4mm, the length of the entire top frequency selection device 258mm, 258mm wide and 9mm high.

The height of the "Y"-shaped pillar 72 is set to 5mm, the length of the three branches is 3.1mm, the width is 2.3mm, the angle between the two adjacent branches is 120°, and the length of the middle isolation plate 63 and the base 73 are both 12.7mm , the width is 12.7mm, the height is 2mm, 2M=20, 2N=20, the thickness of the wall plate 5 is 2mm, the diameter of the liquid metal inlet and outlet 4 is 4mm, the length of the entire bottom frequency selection device is 258mm, the width is 258mm, 9mm high.

Liquid metal 8 is made of Ga68In20Sn12 material with a density of 6363kg/m3, a specific heat capacity of 366J/kg·k, a viscosity of 0.00222kg/m·s, and a thermal conductivity of 16.5w/m·k, which is far higher. the thermal conductivity of water.

The cover plate 9, the "cross"-shaped pillars 62, the intermediate isolation layer 10, the "Y"-shaped pillars 72, the base 11 and the wall plate 5 are all made of plexiglass material, the density of the glass material is 3970kg/m3, and the specific heat capacity is 840J/kg ·k, the thermal conductivity is 27w/m·k.

There is no contact thermal resistance between the "cross"-shaped pillars 62 and the cover plate 9 and the intermediate isolation layer 10 respectively, and there is no contact thermal resistance between the "Y"-shaped pillars 72 and the intermediate isolation layer 10 and the base 11 respectively. There is also no contact thermal resistance between the plate 5 and the cover plate 9, the intermediate isolation layer 10 and the base 11, respectively.

In order to make a comparison between the two experiments, during natural convection heat dissipation, the speed of the liquid metal 8 inlet is set to 0, that is, the liquid metal 8 is set to be in a static state, and the liquid metal 8 is driven by an electromagnetic pump to circulate and dissipate heat. The velocities were set to 10m/s.

In order to unify other variables of the two experiments, the initial temperature and ambient temperature are both 20 °C, and the initial pressure values are standard atmospheric pressure. At the same time, radiation heat transfer is not considered in the simulation.

(2) Simulation content and results:

Simulation 1

As shown in FIG. 10 , only in the case where liquid metal is arranged in the bottom frequency selection unit, after the bottom surface of the liquid metal-based reconfigurable frequency selection device with heat dissipation is uniformly added with a constant temperature 1000°C heat source , using natural convection to dissipate heat from the reconfigurable frequency selection device that can dissipate heat and obtain a temperature cloud diagram of the lower surface of the reconfigurable frequency selection device based on liquid metal that can dissipate heat.

It can be seen from Figure 10 that the temperature is evenly distributed and relatively high, and gradually decreases towards the two walls where the liquid metal inlet and outlet are not installed. The highest temperature on the lower surface of the device is 932.79°C, and the lowest temperature is around 14.96°C, indicating that natural convection cannot dissipate heat. Go out, in which case the antenna system will fail.

Similarly, after uniformly adding a constant temperature 1000°C heat source to the bottom surface of the liquid metal-based heat-dissipating frequency reconfigurable frequency selection device disclosed in the present invention, an electromagnetic pump is used to drive the liquid metal to circulate and dissipate heat, as shown in FIG. 11 . Temperature nephogram of the lower surface of a liquid metal-based heatsinkable frequency-reconfigurable frequency-selective device.

It can be seen from Figure 11 that the liquid metal quickly flows through the high-temperature surface of the device, taking away heat, and the temperature gradually increases from the center to both sides along the liquid metal inlet and outlet, and the temperature also gradually increases from the inlet to the outlet. The temperature at the inlet is the lowest, the highest temperature on the lower surface of the device is 724.18°C, and the lowest temperature is about 19.69°C, indicating that the circulating flow energy dissipates the heat to a certain extent, and the antenna system can work normally.

Simulation 2

In the case that the top frequency selection unit and the bottom frequency selection unit are both provided with liquid metal, after the bottom surface of the liquid metal-based heat dissipation frequency reconfigurable frequency selection device disclosed in the present invention is uniformly added with a constant temperature 1000°C heat source, the The heat-dissipating frequency reconfigurable frequency selection device is dissipated by natural convection, and the temperature cloud diagram of the lower surface of the liquid metal-based heat dissipating frequency reconfigurable frequency selection device is obtained as shown in FIG. 12 .

As can be seen from Figure 12, the temperature distribution is relatively uniform, and the temperature gradually decreases from the inlet to the outlet. The maximum temperature of the lower surface of the reconfigurable frequency selection device with heat dissipation frequency reaches 858.59 °C, and the minimum temperature is about 19.98 °C. In this case , to achieve a certain heat dissipation effect, the antenna system can work.

Similarly, after uniformly adding a constant temperature 1000 ℃ heat source to the bottom surface of the device of this example, an electromagnetic pump is used to drive the circulating flow of liquid metal to dissipate heat, and the temperature cloud diagram of the lower surface of the reconfigurable frequency selection device with heat dissipation frequency as shown in Figure 13 is obtained. .

As can be seen from Figure 13, by driving the circulating flow of liquid metal, the liquid metal quickly flows through the high-temperature surface of the reconfigurable frequency selection device that can dissipate heat, and the heat is taken away. The lower surface of the reconfigurable frequency selection device is the most The high temperature is only 720.56 ℃, which has a heat dissipation effect, and the antenna system can work normally.

Comparing the results in FIGS. 10 to 13 , it is shown that the heat-dissipating frequency reconfigurable frequency selection device disclosed in the present invention can reduce the temperature of the antenna system and efficiently dissipate heat for the antenna system.

Simulation 3

Assuming that liquid metal 8 is an ideal metal electrical conductor, the relative permittivity of plexiglass is 2.57, and the dielectric loss tangent is 0.0078. The commercial simulation software HFSS19.2 is used to simulate the electrical performance of the device in this example. Only the top layer is connected to liquid metal. Or when the liquid metal is passed through the bottom layer, the S11 parameter curve of the band-pass part is obtained, and the results are shown in Figures 14 and 15, respectively.

It can be seen from Figure 14 that only when the top-level frequency selection unit is set with liquid metal, when the resonant frequency f=4.98GHz, S11=-23.05dB, that is, S11 reaches below -20dB; it can be seen from Figure 15 that only When the bottom layer is connected to liquid metal, when the resonant frequency f=12.98GHz, S11=-20.84dB, that is, S11 reaches below -20dB. Therefore, when only the top frequency selection unit is set with liquid metal or the bottom frequency selection unit is set with liquid metal, both show good electrical performance and can meet the actual use requirements.

The liquid metal-based heat dissipation frequency reconfigurable frequency selection device provided by the embodiment of the present invention includes a top frequency selection array, a bottom frequency selection array, a wall plate, a liquid metal inlet and outlet, a cover plate, a middle isolation layer and a bottom plate. The top frequency selection The top frequency selection elements of each row of the array are aligned in the horizontal direction, the bottom frequency selection elements of each row in the bottom frequency selection array are horizontally aligned, the top frequency selection elements of each column of the top frequency selection array are vertically aligned, and the bottom frequency selection array The bottom frequency selection units of each column are aligned in the vertical direction, and the four bottom frequency selection units correspond to one top frequency selection unit. The top frequency selection array and the bottom frequency selection array are around, which reduces the heat accumulation on the surface of the radome, improves the heat dissipation effect, can ensure the normal operation of the frequency selection surface, and enables it to work normally under a variety of different operating frequency requirements.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

It can be understood that the relevant features in the above-mentioned methods and apparatuses may refer to each other.

Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above may refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

It should also be noted that the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, but also Other elements not expressly listed or inherent to such a process, method, article of manufacture or apparatus are also included. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article of manufacture or apparatus that includes the element.

The above are only examples of the present application, and are not intended to limit the present application. Various modifications and variations of this application are possible for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims (10)

1. The utility model provides a frequency selection device is restructured to frequency of can dispelling heat based on liquid metal which characterized in that, includes top layer frequency selective array, bottom layer frequency selective array, wallboard and liquid metal import and export, wherein:

the top layer frequency selection array is arranged in M rows and N columns, the bottom layer frequency selection array is arranged in 2M rows and 2N columns, wherein M, N is an integer, M is more than or equal to 1, and N is more than or equal to 1;

the top frequency selection units of each row of the top frequency selection array are aligned in the horizontal direction, and the bottom frequency selection units of each row of the bottom frequency selection array are aligned in the horizontal direction;

the top frequency selection units of each column of the top frequency selection array are aligned in the vertical direction, and the bottom frequency selection units of each column of the bottom frequency selection array are aligned in the vertical direction;

the four bottom layer frequency selection units correspond to one top layer frequency selection unit, the center of each bottom layer frequency selection unit is positioned in the center of the top layer frequency selection unit with the size of 1/4, and the wall plates are fixed on the periphery of the top layer frequency selection array and the bottom layer frequency selection array;

each top layer frequency selection unit comprises an upper cover, a cross-shaped strut and a middle isolation plate, each bottom layer frequency selection unit comprises a middle isolation plate, a Y-shaped strut and a base, the cross-shaped strut is positioned between the upper cover and the middle isolation plate, the Y-shaped strut is positioned between the middle isolation plate and the base, and liquid metal is distributed around the cross-shaped strut or the Y-shaped strut;

the liquid metal inlet and outlet are positioned on the wall plate parallel to any branch in the Y-shaped support;

the upper covers of all the top-layer frequency selection units are tightly connected to form a cover plate of the top-layer frequency selection array;

the bases of the bottom layer frequency selection units are tightly connected to form a bottom plate of the bottom layer frequency selection array;

the middle isolation plates of the top layer frequency selection units or the bottom layer frequency selection units are tightly connected to form a middle isolation layer of the frequency selection device capable of reconstructing heat dissipation frequency.

2. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the cross-shaped support column comprises two branches, wherein the centers of the two branches are overlapped and form a connection type structure with an included angle of 90 degrees.

3. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the Y-shaped support column comprises three branches, and the three branches are of a central connection type structure distributed in a circular array.

4. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the upper cover and the middle isolation plate of each top-layer frequency selection unit are square plates with the same size;

the middle isolation plate and the base of each bottom layer frequency selection unit are square plates with the same size;

the upper cover and the middle isolation plate of each top-layer frequency selection unit are arranged in parallel;

the middle isolation plates and the bases of the bottom layer frequency selection units are arranged in parallel;

the centers of the upper cover and the middle isolation plate of each top-layer frequency selection unit are positioned on the connecting axis of the two branches of the cross-shaped strut;

the centers of the middle isolation plate and the base of each bottom layer frequency selection unit are positioned on the connecting axes of the three branches of the Y-shaped support.

5. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the liquid metal is a metal which is liquid at room temperature and comprises at least one metal fluid of gallium, indium, tin, bismuth and zinc.

6. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the liquid metal includes an alloy fluid of at least two of gallium, indium, tin, bismuth and zinc.

7. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the height of the cross-shaped support, the length and the width of the two branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 parameter of the band-pass part of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.

8. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the height of the Y-shaped support, the lengths and the widths of the three branches and the included angles of the adjacent branches can be adjusted according to the actual working frequency, so that the parameter value of the S11 of the band-pass part of the frequency selection device capable of reconstructing the heat dissipation frequency is smaller than-20 dB.

9. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the side lengths and the thicknesses of the upper cover of each top-layer frequency selection unit and the middle isolation plate can be adjusted according to the actual working frequency, so that the parameter value of the S11 of the band-pass part of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.

10. A liquid metal-based heat dissipatable frequency reconfigurable frequency selective device according to claim 1,

the side length and the thickness of the base of each bottom layer frequency selection unit can be adjusted according to the actual working frequency, so that the parameter value of the band-pass part S11 of the heat-dissipating frequency reconfigurable frequency selection device is smaller than-20 dB.

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