CN111508887A - Semiconductor manufacturing equipment and protection ring thereof - Google Patents
Semiconductor manufacturing equipment and protection ring thereof Download PDFInfo
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- CN111508887A CN111508887A CN202010300871.0A CN202010300871A CN111508887A CN 111508887 A CN111508887 A CN 111508887A CN 202010300871 A CN202010300871 A CN 202010300871A CN 111508887 A CN111508887 A CN 111508887A
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- annular body
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- notch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides semiconductor manufacturing equipment and a protection ring thereof. The protection ring is arranged on a bearing device in semiconductor manufacturing equipment and used for preventing process byproducts from entering the bearing device, and comprises: an annular body and a joint; the annular body comprises an outer periphery and an inner periphery, the inner periphery comprises an arc edge and a straight edge, the arc edge and the outer periphery are concentrically arranged, and the straight edge extends along the tangential direction of the annular body and is internally connected with the arc edge; the annular body area corresponding to the straight edge is provided with a release notch along the radial direction, and the release notch is used for releasing the stress of the annular body; the joint is embedded in the release notch and is in clearance fit with the release notch; when the engaging piece is matched with the releasing notch, the outer surface of the engaging piece is coplanar with the outer surface of the annular body. The release notch and the joint piece are matched to play a role in releasing stress, and the problem that the protection ring is cracked due to long-time high temperature is solved, so that the service life of the protection ring is effectively prolonged.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to semiconductor manufacturing equipment and a protection ring thereof.
Background
Currently, there are two ways of fixing a wafer in a semiconductor manufacturing apparatus, namely, an electrostatic chuck (ESC) and a mechanical chuck. The electrostatic chuck adsorbs the wafer by virtue of adsorption force generated by static electricity, and the mechanical chuck compresses the edge of the wafer loaded on the top surface of the mechanical chuck by virtue of the pressure ring to fix the wafer.
When the silicon carbide (SiC) back hole etching process is executed, the wafer is generally adsorbed by adopting the adsorption force of an electrostatic chuck, but because the silicon carbide (SiC) back hole etching process adopts metal nickel as a mask, a nickel byproduct can be attached to the periphery of the wafer in the process, considering that the silicon carbide (SiC) back hole etching process has the characteristics of high depth and long-time process, a pressure ring is required to press the edge of the wafer to prevent the nickel byproduct from entering a gap between the electrostatic chuck (ESC) and a focusing ring, and meanwhile, in order to prolong the Process (PM) time, the pressure ring is required to be protected, the thickness of the pressure ring is quickly changed to prevent the byproduct from being accumulated on the pressure ring, but in the prior art, the protection ring is thinner, and the phenomenon of breakage is easily caused by the concentration of the stress of the protection ring due to overlong process time and overhigh temperature.
Disclosure of Invention
The application provides semiconductor manufacturing equipment and a protection ring thereof aiming at the defects of the prior art, and aims to solve the technical problem that the protection ring is easy to break in the prior art.
In a first aspect, embodiments of the present application provide a guard ring disposed on a carrier in a semiconductor manufacturing apparatus for preventing process byproducts from entering the carrier, the guard ring comprising: an annular body and a joint; the annular body comprises an outer periphery and an inner periphery, the inner periphery comprises an arc edge and a straight edge, the arc edge and the outer periphery are concentrically arranged, and the straight edge extends along the tangential direction of the annular body and is internally connected with the arc edge; the annular body area corresponding to the straight edge is provided with a release notch along the radial direction, and the release notch is used for releasing the stress of the annular body; the joint is embedded in the release notch and is in clearance fit with the release notch; when the joint is matched with the release notch, the outer surface of the joint is coplanar with the outer surface of the annular body.
In an embodiment of the present application, a limiting groove is further disposed on a top surface of the annular body corresponding to the release notch, and the limiting groove is disposed near the outer periphery; the release notch radially breaks the annular body and the limit groove.
In an embodiment of the present application, the limiting groove has a first inner diameter along a circumferential direction of the annular body, the release notch has a second inner diameter along the circumferential direction of the annular body, and the first inner diameter is larger than the second inner diameter.
In an embodiment of the present application, the joint includes a limiting plate and a joint block integrally disposed, and the limiting plate and the limiting groove cooperate to limit; the joint block is embedded in the release notch, and the joint block is in clearance fit with the release notch.
In an embodiment of the present application, a first engaging groove is further disposed on a bottom surface of the limiting groove, and the first engaging groove is disposed near the outer periphery; the limiting plate is provided with a first clamping block in a protruding mode on one face, facing the limiting groove, of the limiting plate, and the first clamping block is matched with the first clamping groove for limiting.
In an embodiment of the present application, a second engaging groove is further disposed on the top surface of the annular body corresponding to the release notch, and the second engaging groove is disposed near the straight edge; the joint block is also provided with a second clamping block, and the second clamping block is matched with the second clamping groove for limiting.
In an embodiment of the present application, the first engaging groove and the second engaging groove are arranged in parallel in a radial direction of the annular body, and the first engaging groove and the second engaging groove are both located at two sides of the release notch.
In an embodiment of the present application, the release notch is located at a middle position of the annular body region corresponding to the straight edge.
In an embodiment of the present application, the annular body is a ceramic structural member, and the joint is a ceramic structural member.
In a second aspect, embodiments of the present application provide a semiconductor manufacturing apparatus, which includes a process chamber and a carrier disposed in the process chamber for carrying a workpiece to be processed, wherein the carrier has a guard ring as provided in the first aspect.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
the embodiment of the present application provides a guard ring, which is disposed on a carrier in a semiconductor manufacturing apparatus, and is used for preventing a process byproduct from entering the carrier, and the guard ring includes: an annular body and a joint; the annular body comprises an outer periphery and an inner periphery, the inner periphery comprises an arc edge and a straight edge, the arc edge and the outer periphery are concentrically arranged, and the straight edge extends along the tangential direction of the annular body and is internally connected with the arc edge; the annular body area corresponding to the straight edge is provided with a release notch along the radial direction, and the release notch is used for releasing the stress of the annular body; the joint is embedded in the release notch and is in clearance fit with the release notch; when the engaging piece is matched with the releasing notch, the outer surface of the engaging piece is coplanar with the outer surface of the annular body. The release notch and the joint piece are matched to play a role in releasing stress, and the problem that the protection ring is cracked due to long-time high temperature is solved, so that the service life of the protection ring is effectively prolonged.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1A is a schematic front view of an annular body of a protection ring according to an embodiment of the present disclosure;
fig. 1B is a schematic front view of a protection ring according to an embodiment of the present disclosure;
fig. 2A is a schematic top view of an annular body according to an embodiment of the present disclosure;
FIG. 2B is an enlarged view of the portion A of the ring body shown in FIG. 2A;
fig. 3A is a schematic front view of a joint according to an embodiment of the present disclosure;
FIG. 3B is a schematic side view of a joint according to an embodiment of the present disclosure;
fig. 3C is a perspective view of a joint according to an embodiment of the present disclosure;
fig. 4A is an exploded schematic view of an annular body and a joint according to an embodiment of the present disclosure;
fig. 4B is a schematic view illustrating a matching state of the annular body and the engaging member according to an embodiment of the present disclosure;
fig. 5 is a schematic view illustrating a stress-relieved state of a guard ring according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
For convenience of explaining the technical solution of the present application, specific applications and design principles of the guard ring will now be described.
When the process is actually executed, the processing workpiece is specifically a wafer, the processing workpiece is positioned on the bearing surface of the bearing device, the base ring and the focusing ring are arranged on the periphery of the processing workpiece, the pressing ring is directly pressed at the edge of the wafer, and byproducts of the process are prevented from falling between the bearing device and the base ring and the focusing ring. The protection ring is placed on the pressure ring, the protection ring is used for protecting the pressure ring, and by means of the quick replacement of the protection ring, accumulation of byproducts on the pressure ring is prevented, so that the process time can be improved, and the maintenance time can be reduced. Since the 5 "wafer has a small flat edge, the guard ring has a corresponding straight edge for completely pressing the wafer, as shown in fig. 5. The straight edge arranged on the protective ring can press the wafer and can not cover too much of the wafer to avoid influencing the process performance, so that the protective ring needs to be made very thin, and the thickness can be about 1mm generally. The protection ring temperature is accumulated greatly due to the process time being 1.5-2 hours, the temperature of the protection ring reaches 300 ℃ through testing, the inner diameter of the protection ring is 90 mm, the radial variation is 0.22 mm, the arc part of the protection ring expands outwards by about 0.11mm along the radial direction, but the straight edge is difficult to bend and deform, so that stress concentration is caused at the transition part of the arc and the straight edge, specifically, the stress direction shown in figure 5 can be referred to, and the phenomenon of cracking is easily caused at the transition part of the straight edge to the arc due to the fact that the process time is too long and the temperature is too high.
In order to solve the above technical problems, the technical solutions of the present application and how to solve the above technical problems are described in detail below with specific embodiments.
An embodiment of the present application provides a guard ring disposed on a carrier in a semiconductor manufacturing apparatus for preventing a process byproduct from entering the carrier, where a schematic structural diagram of the guard ring is shown in fig. 1A to 2B, and the guard ring includes: an annular body 1 and a joint 2; the annular body 1 comprises an outer periphery 11 and an inner periphery 12, the inner periphery 12 comprises an arc edge 13 and a straight edge 14, the arc edge 13 is concentric with the outer periphery 11, and the straight edge 14 extends along the tangential direction of the annular body 1 and is internally connected with the arc edge 13;
the area of the annular body 1 corresponding to the straight edge 14 is provided with a release notch 15, and the release notch 15 is used for releasing the stress of the annular body 1; the joint 2 is embedded in the release notch 15 and is in clearance fit with the release notch 15; when the engaging piece 2 is disposed to fit the release notch 15, the outer surface of the engaging piece 2 is disposed coplanar with the outer surface of the ring body 1.
As shown in fig. 1A to 2B, the ring body 1 may be made of a ceramic material and have a ring-shaped structure. The annular body 1 comprises an outer peripheral edge 11 on the outside and an inner edge 12 on the inside, the outer peripheral edge 11 being of a right circular configuration. The inner edge 12 may include two portions, namely an arc edge 13 and a straight edge 14, wherein the arc edge 13 is configured to be concentric with the outer peripheral edge 11, the straight edge 14 extends in a tangential direction of the ring body 1 and is inscribed in the arc edge 13, and the straight edge 14 is configured to correspond to a flat edge of a wafer (not shown in the figure). The release notch 15 is located in the corresponding area of the straight edge 14 and the annular body 1, and the release notch 15 extends from the outer peripheral edge 11 to the direction of the straight edge 14, so that the release notch 15 can release the stress of the protection ring when the process is executed, and the protection ring is prevented from being broken due to stress concentration. The engaging member 2 is also made of ceramic material and can be shaped to correspond to the relief notch 15. The fastener 2 is embedded in the release notch 15, the fastener 2 is in clearance fit with the release notch 15, stress concentration caused by the fact that the annular body 1 extrudes the fastener 2 is avoided when the process is executed, and the fastener 2 is matched with the annular body 1 to protect the compression ring. In addition, when the joint 2 is assembled on the annular body 1, the surface of the joint 2 exposed outside may be coplanar with the outer surface of the annular body 1, so as to improve the convenience of assembly in the embodiment of the present application.
The release notch is arranged on the annular body, the joint is arranged in the release interface in a matching mode, the release notch and the joint are matched to play a role in releasing stress, the problem that the protection ring is cracked due to long-time high temperature is solved, and the service life of the protection ring is effectively prolonged. The protection ring is matched with the pressing ring, so that byproducts generated by the process can be prevented from entering gaps between the bearing device and the focusing ring, the service life of the pressing ring can be prolonged, the process efficiency can be effectively improved, and the maintenance time can be reduced.
In the present embodiment, the specific material and shape of the ring body 1 and the joint 2 are not limited, and the ring body 1 and the joint 2 may be made of an insulating material, for example, both may be made of graphite. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, a limiting groove 151 is further disposed on the top surface of the annular body 1 corresponding to the release notch 15, and the limiting groove 151 is disposed near the outer peripheral edge 11; the release notch 15 radially separates the annular body 1 and the stopper groove 151.
As shown in fig. 1A to 2B and fig. 4A, a limiting groove 151 is recessed in the top surface of the ring-shaped body 1, the limiting groove 151 is disposed near the outer periphery 11, and the limiting groove 151 may extend from the outer periphery 11 to a position where the straight edge 14 is located, and the limiting groove 151 is used for limiting the position of the engaging member 2. The release notch 15 may be partially located in the middle of the bottom surface of the limiting groove 151, and the release notch 15 specifically is a notch that radially penetrates through the annular body 1 and the limiting groove 151 along the annular body 1, that is, the release notch 15 may extend from the outer peripheral edge 11 to the straight edge 14. By adopting the design, the annular body 1 forms a non-closed ring body due to the existence of the release notch 15, and the stress concentrated at the straight edge 14 can be released, so that the problem of cracks of the protection ring caused by overlong process time and overhigh temperature is solved, in addition, the structure of the protection ring can be simple, and the manufacturing and application cost of the protection ring is effectively reduced.
In an embodiment of the present application, as shown in fig. 1A to 2B, the limiting groove 151 has a first inner diameter along the circumferential direction of the annular body, and the release notch 15 has a second inner diameter along the circumferential direction of the annular body, wherein the first inner diameter is larger than the second inner diameter. The first inner diameter of the stopper groove 151 may be a width of the annular body thereof in a circumferential extension direction, and a specific value of the first inner diameter may be less than 5 mm; the second inner diameter of the release notch 15 may be a width along the circumferential extension direction of the annular body, and a specific value of the second inner diameter may be greater than 2 mm, and the limiting groove 151 and the release notch 15 are combined to form a "T" shaped structure, which may be specifically referred to as shown in fig. 1A and 1B. By adopting the design, the position of the joint 2 is convenient to limit, and the assembling structure of the annular body 1 and the joint 2 is more reasonable and convenient.
In the embodiment of the present invention, the size and shape of the limiting groove 151 and the releasing notch 15 are not limited, but both can be set according to different process requirements, for example, the shape of the combination of both can be selected to be a "Y" shape structure. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, the joint 2 includes a limiting plate 21 and a joint block 22 integrally disposed, and the limiting plate 21 cooperates with the limiting groove 151 for limiting; the engagement block 22 is embedded in the release notch 15, and the engagement block 22 is clearance-fitted with the release notch 15.
As shown in fig. 2A to 4B, the limit plate 21 is a plate-shaped structure and is configured to match with the structure of the limit groove 151. The top surface of the limiting plate 21 is flush with the top surface of the annular body 1, the bottom surface of the limiting plate can be extended with a joint block 22, the shape of the joint block 22 can be matched with the shapes of the release notch 15 and the annular body 1, that is, the exposed outer surface of the joint block 22 can be flush with the top surface and the bottom surface of the annular body 1. The engagement blocks 22 are a clearance fit with the relief notches 15 so that the protective ring does not interfere with the relief of stresses during thermal expansion and contraction. Alternatively, the joint block 22 and the limiting plate 21 may be formed by an integral molding process, and of course, the joint block and the limiting plate may also be formed by a separate structure and by bonding. By adopting the design, the position of the joint 2 is convenient to limit, and the assembling structure of the annular body 1 and the joint 2 is more reasonable and convenient.
In an embodiment of the present application, as shown in fig. 2A to 4B, a first engaging groove 153 is further disposed on a bottom surface of the limiting groove 151, and the first engaging groove 153 is disposed near the outer periphery 11; the limiting plate 21 is further provided with a first engaging block 23 on a surface facing the limiting groove 151, and the first engaging block 23 is engaged with the first engaging groove 153 for limiting. The first engaging groove 153 may be a rectangular groove, which may be formed on the bottom surface of the limiting groove 151 in a recessed manner and should be disposed to avoid the release notch 15; the bottom surface of the limiting plate 21 may be convexly provided with a first engaging block 23, and the first engaging block 23 may be disposed as a rectangular protrusion corresponding to the first engaging groove 153. In the actual assembly process, the bottom surface of the limiting plate 21 contacts the bottom surface of the limiting groove 151, and the first engaging groove 153 accommodates the first engaging block 23 to cooperate with the engaging member 2 to position the annular body 1, so as to further improve the stability of the protection ring and the convenience of assembly.
In an embodiment of the present application, the top surface of the annular body 1 corresponding to the release notch 15 is further provided with a second engaging groove 154, and the second engaging groove 154 is disposed near the straight edge 14; the engaging block 22 is further provided with a second engaging block 24, and the second engaging block 24 is engaged with the second engaging groove 154 for limiting.
As shown in fig. 2A to 4B, the second engaging groove 154 is disposed near the straight edge 14, and may be a rectangular groove formed on the top surface of the ring body 1, which should be disposed to avoid the release notch 15; the engaging block 22 may be correspondingly provided with a second engaging block 24, and the second engaging block 24 may be a rectangular projection corresponding to the second engaging groove 154. In the actual assembly process, the engaging block 22 can be accommodated in the releasing notch 15, the second engaging groove 154 accommodates the second engaging block 24 to cooperate with the engaging member 2 and the annular body 1 for positioning, and due to the arrangement of the second engaging groove 154 and the second engaging block 24, the end of the engaging block 22 close to the straight edge 14 can be prevented from being sunk into the releasing notch 15, thereby further improving the stability of the protection ring and the convenience of assembly.
In an embodiment of the present application, as shown in fig. 2A to 4B, the first engaging groove 153 and the second engaging groove 154 are arranged in parallel in a radial direction of the annular body, and the first engaging groove 153 and the second engaging groove 154 are located on both sides of the release notch 15. By adopting the design, the manufacturing efficiency of the protection ring can be improved, and the manufacturing and application cost can be effectively reduced.
In an embodiment of the present application, as shown in fig. 2A, the release notch 15 is located at a middle position of the region of the annular body 1 corresponding to the straight edge 14. The release notch 15 can be located at the symmetrical center of the area of the annular body 1 corresponding to the straight edge 14, under a high-temperature condition of the protection ring, the thermal stress generated by the expansion of the arc edge 13 can be symmetrically transferred to the release notch 15, and the release notch 15 can release the stress concentrated at the position of the straight edge 14, so that the stability of the protection ring is further improved, and the service life of the protection ring is further effectively prolonged.
In an embodiment of the present application, the annular body 1 is a ceramic structural member, and the connecting member 2 is a ceramic structural member.
Based on the same inventive concept, an embodiment of the present application provides a semiconductor manufacturing apparatus, which includes a process chamber and a carrying device disposed in the process chamber for carrying a processing workpiece, wherein the carrying device has the protection ring provided in the above embodiments.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
the release notch is arranged on the annular body, the joint is arranged in the release interface in a matching mode, the release notch and the joint are matched to play a role in releasing stress, the problem that the protection ring is cracked due to long-time high temperature is solved, and the service life of the protection ring is effectively prolonged. The protection ring is matched with the pressing ring, so that byproducts generated by the process can be prevented from entering gaps between the bearing device and the focusing ring, the service life of the pressing ring can be prolonged, the process efficiency can be effectively improved, and the maintenance time can be reduced.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. A guard ring disposed on a carrier in a semiconductor manufacturing facility for preventing process byproducts from entering the carrier, the guard ring comprising: an annular body and a joint;
the annular body comprises an outer periphery and an inner periphery, the inner periphery comprises an arc edge and a straight edge, the arc edge and the outer periphery are concentrically arranged, and the straight edge extends along the tangential direction of the annular body and is internally connected with the arc edge; the annular body area corresponding to the straight edge is provided with a release notch along the radial direction, and the release notch is used for releasing the stress of the annular body;
the joint is embedded in the release notch and is in clearance fit with the release notch; when the joint is matched with the release notch, the outer surface of the joint is coplanar with the outer surface of the annular body.
2. The protective ring of claim 1, wherein a retaining groove is further disposed on a top surface of the annular body corresponding to the relief notch, and the retaining groove is disposed adjacent to the outer periphery; the release notch radially breaks the annular body and the limit groove.
3. The protective ring of claim 2, wherein the retaining groove has a first inner diameter along a circumferential direction of the annular body, and the relief notch has a second inner diameter along the circumferential direction of the annular body, the first inner diameter being greater than the second inner diameter.
4. The protective ring of claim 3, wherein the engagement member comprises a stop plate and an engagement block integrally disposed, the stop plate cooperating with the stop groove to stop; the joint block is embedded in the release notch, and the joint block is in clearance fit with the release notch.
5. The protective ring of claim 4, wherein a first engaging groove is further formed on a bottom surface of the limiting groove, and the first engaging groove is disposed near the outer periphery; the limiting plate is provided with a first clamping block in a protruding mode on one face, facing the limiting groove, of the limiting plate, and the first clamping block is matched with the first clamping groove for limiting.
6. The protection ring of claim 5, wherein a second engaging groove is further disposed on a top surface of the annular body corresponding to the release notch, the second engaging groove being disposed near the straight edge; the joint block is also provided with a second clamping block, and the second clamping block is matched with the second clamping groove for limiting.
7. The protection ring of claim 6, wherein the first engagement groove and the second engagement groove are juxtaposed in a radial direction of the annular body, and the first engagement groove and the second engagement groove are located on both sides of the relief notch.
8. The guard ring of any of claims 1-7, wherein the relief notch is located at a central location of the annular body region corresponding to the straight edge.
9. The protective ring of any of claims 1-7, wherein the annular body is a ceramic structural member and the joint is a ceramic structural member.
10. A semiconductor manufacturing apparatus comprising a process chamber and a carrier disposed within the process chamber for carrying a workpiece to be processed, wherein the carrier has a guard ring as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010300871.0A CN111508887B (en) | 2020-04-16 | 2020-04-16 | Semiconductor manufacturing equipment and protection ring thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113192876A (en) * | 2021-04-30 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Semiconductor equipment and bearing device thereof |
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| JPH06163444A (en) * | 1992-11-27 | 1994-06-10 | Oki Electric Ind Co Ltd | Wafer thermal treatment method and guard ring structure used therefor |
| KR20060110555A (en) * | 2005-04-20 | 2006-10-25 | 삼성전자주식회사 | Rapid thermal process apparature having an edge ring |
| CN101919041A (en) * | 2008-01-16 | 2010-12-15 | 索绍股份有限公司 | Substrate holder, substrate supporting apparatus, substrate processing apparatus, and substrate processing method using the same |
| CN110890289A (en) * | 2018-09-10 | 2020-03-17 | 东芝存储器株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163444A (en) * | 1992-11-27 | 1994-06-10 | Oki Electric Ind Co Ltd | Wafer thermal treatment method and guard ring structure used therefor |
| KR20060110555A (en) * | 2005-04-20 | 2006-10-25 | 삼성전자주식회사 | Rapid thermal process apparature having an edge ring |
| CN101919041A (en) * | 2008-01-16 | 2010-12-15 | 索绍股份有限公司 | Substrate holder, substrate supporting apparatus, substrate processing apparatus, and substrate processing method using the same |
| CN110890289A (en) * | 2018-09-10 | 2020-03-17 | 东芝存储器株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113192876A (en) * | 2021-04-30 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Semiconductor equipment and bearing device thereof |
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| CN111508887B (en) | 2023-10-13 |
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