CN111506172A - Heat dissipation computer motherboard with temperature regulation subassembly - Google Patents
Heat dissipation computer motherboard with temperature regulation subassembly Download PDFInfo
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- CN111506172A CN111506172A CN202010607122.2A CN202010607122A CN111506172A CN 111506172 A CN111506172 A CN 111506172A CN 202010607122 A CN202010607122 A CN 202010607122A CN 111506172 A CN111506172 A CN 111506172A
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- heat dissipation
- fan
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a heat dissipation computer mainboard with a temperature adjusting assembly, which comprises a bottom plate, wherein a chip is installed on the bottom plate, a heat dissipation mechanism is installed above the bottom plate, a blowing mechanism is arranged on one side of the heat dissipation mechanism, the heat dissipation mechanism is connected with the blowing mechanism through a transmission mechanism, the blowing mechanism is installed on the bottom plate, the heat dissipation mechanism can directly conduct self heat dissipation through a first copper sheet, a second copper sheet and a third copper sheet, and can also conduct auxiliary heat dissipation on the heat dissipation mechanism through wind energy generated by the transmission mechanism, so that heat in the first copper sheet, the second copper sheet and the third copper sheet can be quickly dispersed, the computer mainboard can be quickly cooled in a short time, and kinetic energy generated by a transmission rod can be stably transmitted through a set stabilizing block. Kinetic energy generated by the blowing mechanism can be transmitted to the inside of the heat dissipation mechanism through the spiral blades to form wind energy through the arranged transmission mechanism, and air cooling heat dissipation is achieved.
Description
Technical Field
The invention relates to the technical field of radiating computer mainboards, in particular to a radiating computer mainboard with a temperature adjusting assembly.
Background
The computer motherboard is installed in the chassis and is one of the most basic and important components in the computer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
But because more components run on the mainboard, will make the temperature on the mainboard rise, the temperature can not reduce can influence the speed of computer and the use of computer, can make the component damage on the mainboard under the serious condition, and it is the cooling mode commonly used to reduce the temperature on the computer commentaries on classics board, but current cooling mode can not be faster more excellent adjust the computer heat dissipation.
Disclosure of Invention
The invention aims to provide a radiating computer mainboard with a temperature adjusting component, which can solve the problems that the temperature on the mainboard rises when more elements run on the mainboard, the temperature cannot be reduced, the speed of a computer and the use of the computer are influenced, the elements on the mainboard can be damaged under serious conditions, and the reduction of the temperature on a computer rotating plate is a common cooling mode, but the existing cooling mode cannot adjust the heat radiation of the computer more quickly and optimally. Through the blowing mechanism who sets up and heat dissipation mechanism can be high-efficient swift carry out temperature regulation to the mainboard to can realize automatically controlled function, thereby the computer mainboard that adjusts through the control by temperature change that sets up can reach the operation of control blowing mechanism through the rotation of control motor, and blowing mechanism assists the heat dissipation to heat dissipation mechanism, thereby reaches the inside temperature of regulation computer.
The purpose of the invention can be realized by the following technical scheme:
a heat dissipation computer motherboard with a temperature regulating component comprises a bottom plate, a chip is arranged on the bottom plate, a heat dissipation mechanism is arranged above the bottom plate, a blowing mechanism is arranged on one side of the heat dissipation mechanism, the heat dissipation mechanism is connected with the blowing mechanism through a transmission mechanism, the blowing mechanism is arranged on the bottom plate, the heat dissipation mechanism can directly dissipate heat by the first copper sheet, the second copper sheet and the third copper sheet, and can also dissipate heat by the wind energy generated by the transmission mechanism in an auxiliary way, thereby rapidly dispersing the heat in the first copper sheet, the second copper sheet and the third copper sheet to achieve the purpose of rapidly cooling the computer mainboard in a short time, kinetic energy generated by the blowing mechanism can be transmitted to the inside of the heat dissipation mechanism through the spiral blades to form wind energy through the arranged transmission mechanism, and air cooling heat dissipation is achieved.
Preferably, the blowing mechanism comprises a fan cover arranged on the bottom plate, a transmission inner cavity is arranged in the fan cover, a fan is arranged above the fan cover, fan blades are connected to the side wall of the fan, two support rods are connected to the bottom of the fan, the two ends of each support rod are fixed to the inner wall of the fan cover, a transmission rod connected with the fan is arranged at the bottom of the fan, a stabilizing block of a cylindrical structure is arranged on the surface of the transmission rod, a guide block is arranged on the outer circumference of the stabilizing block and wound on the surface of the stabilizing block in a spiral structure, the guide block is meshed with the transmission mechanism, dust on the inward bottom plate of the computer can be filtered through the arranged fan cover, the stable operation of the blowing mechanism can be supported, and the function of stably connecting the fan can be achieved through the arranged support rods, still reduced the function that hinders the fan air supply, the transfer line through setting up can transmit the kinetic energy of fan transmission for drive mechanism, thereby drive mechanism's operation, the kinetic energy that can produce the transfer line through the stable piece that sets up stably transmits, and the diameter of stable piece is greater than the diameter of transfer line, can reduce the condition of rocking that appears among the transfer line transmission process in the transmission course, can be with the quick transmission of kinetic energy for the rack on helical gear surface through the guide block that sets up, thereby drive helical gear rotates, because the diameter of helical gear is great, the diameter of stable piece is less, thereby make the transmission realize speed reduction transmission's function, transmission efficiency has been increased, and make the transmission more stable, transmission mechanism's life has been increased.
Preferably, the transmission mechanism comprises a support plate arranged in the inner cavity, a bearing is arranged at the bottom of the support plate, the support plate is fixedly connected with the bearing, a connecting rod is connected in the bearing, and the connecting rod penetrates through the bearing; the fixed bearing can be stabilized through the supporting plate arranged, so that the connecting rod can rotate in the bearing, and the rotating process of the connecting rod can be stable.
Preferably, the transmission mechanism further comprises a rotating rod fixed with one end of the connecting rod close to the bearing, the end of the rotating rod is provided with an integrally formed connector, the outer circumference of the connector is provided with a plurality of stabilizing rods which are uniformly distributed, the number of the stabilizing rods is three, the end parts of the stabilizing rods far away from the connector are all fixed on the inner side wall of the helical gear, the helical gear is provided with a plurality of racks, and the racks are meshed with the guide block; the connecting rod is driven to rotate synchronously by the connecting head driving rotating rod, the rotating rod rotates to drive the connecting rod to rotate, and the connecting rod drives the spiral blade to rotate, so that wind energy is generated.
Preferably, the transmission mechanism further comprises an air collecting groove formed in the side wall of the fan housing, a spiral blade is arranged inside the air collecting groove, the end portion of the spiral blade is fixed to one end of the connecting rod, and one side of the air collecting groove is connected with the heat dissipation mechanism. Wind energy generated by rotation of the spiral blades can be conveyed to the interior of the heat dissipation mechanism communicated with the wind collecting groove through the wind collecting groove, so that the heat dissipation mechanism can dissipate heat quickly.
Preferably, the heat dissipation mechanism comprises a first copper sheet, a second copper sheet and a third copper sheet which are fixed on the bottom plate, the first copper sheet is close to the air collection groove, the bottoms of the first copper sheet, the second copper sheet and the third copper sheet are respectively provided with a blowing pipe with a flat structure, a plurality of air outlet grooves are formed above the blowing pipe, and the top of the blowing pipe is communicated with the air outlet grooves; the first copper sheet, the second copper sheet and the third copper sheet can be cooled through the cooling mechanism, and meanwhile the cooling mechanism can be assisted by wind energy generated by the transmission mechanism to cool, so that the cooling efficiency of the cooling mechanism is improved. The air collecting groove is formed between the first copper sheet and the second copper sheet, and the air collecting groove is also formed between the third copper sheet and the second copper sheet. When the wind moves upwards from the blowpipe, the heat among the first copper sheet, the second copper sheet and the third copper sheet can be rapidly taken away.
Preferably, the heat dissipation mechanism further comprises a plurality of shunting holes connected with the air collection groove, and a triangular block with a triangular structure is arranged between every two shunting holes. The inside of inputing each blowpipe through the reposition of redundant personnel hole that sets up can be quick, and the blowpipe is given the wind groove with wind energy transport to when the blowpipe is blowing, the inside heat that produces of first copper sheet, second copper sheet and third copper sheet also can be followed the inside of blowpipe and discharged, and the heat extraction is efficient.
Preferably, the cross section of the diversion hole is a hollow circular truncated cone structure with a trapezoidal structure, and the diameter size of one side of the diversion hole, which is close to the wind collecting groove, is larger than the diameter size of one side of the diversion hole, which is far away from the wind collecting groove. The air flow rate entering the interior of the shunting hole can be increased, so that the cooling efficiency is accelerated.
A use method of a heat dissipation computer mainboard with a temperature adjusting assembly specifically comprises the following steps:
when the temperature in the computer rises, the temperature detection component can transmit the detected temperature to the P L C controller, when the fan rotates, the fan blade on the side wall of the fan can be driven to rotate to generate upward wind, so that the interior of the computer host is cooled by wind, and when the fan rotates, the transmission mechanism fixed with a rotating shaft at the bottom of the fan transmits the wind;
step two: the kinetic energy is transmitted to the transmission rod through the rotating shaft fixed at the bottom of the fan, so that the transmission rod can synchronously rotate, the transmission rod can drive the stabilizing block fixed at the bottom of the transmission rod when rotating, the guide block which is arranged on the stabilizing block and protrudes outwards and is in threaded arrangement is in transmission with the helical gear, the helical gear is arranged on one side of the stabilizing block, the helical gear and the transmission rod are vertically arranged in the air cover, a rack on the surface of the helical gear is meshed with the guide block, so that the helical gear rotates, the helical gear rotates to drive the stabilizing rod fixed on the inner side wall of the helical gear to rotate, the stabilizer rod rotates to drive the connecting head to rotate, the rotating rod connected with the connecting head can be driven to rotate when the connecting head rotates, the rotating rod can drive the connecting rod connected at the end part of the rotating rod, the connecting rod can, when the connecting rod rotates, air can be input into the air collecting groove through the spiral blade at the end part of the connecting rod, so that the air in the air collecting groove quickly flows into the heat dissipation mechanism, and the air cooling and heat dissipation of the heat dissipation mechanism are accelerated;
step three: when the air in the air collecting groove is input into the blowpipe through the spiral blades, the flow rate of the air entering the blowpipe from the flow dividing holes is increased due to the fact that the flow dividing holes are of the round platform type structure, the connection part of the blowpipe and the air outlet groove is enabled to reach the maximum communicated area, and therefore the air outlet of the blowpipe is enabled to be the maximum;
the invention has the beneficial effects that:
1. can directly carry out self heat dissipation through the first copper sheet through the heat dissipation mechanism that sets up, second copper sheet and third copper sheet, the wind energy that can also produce through drive mechanism assists the heat dissipation to heat dissipation mechanism, thereby with first copper sheet, the quick scattering of the inside heat of second copper sheet and third copper sheet, reach computer motherboard rapid cooling in the short time, drive mechanism through setting up can form the inside that wind energy transmitted for heat dissipation mechanism through the spiral leaf with the kinetic energy that the mechanism of blowing produced, reach the forced air cooling heat dissipation. Can filter the dust on the inward bottom plate of computer through the fan housing that sets up, can also play the steady operation that supports the mechanism of blowing, can play the function of stable connection fan through the branch that sets up, still reduced the function that hinders the fan air supply, can transmit the kinetic energy of fan transmission for drive mechanism through the transfer line that sets up to drive mechanism's operation.
2. The kinetic energy that can produce the transfer line through the piece of stabilizing that sets up stably transmits, and the diameter of stabilizing the piece is greater than the diameter of transfer line, can reduce the condition of rocking that appears among the transfer line transmission process in the transmission course, the guide block through setting up can be with the quick rack that transmits for helical gear surface of kinetic energy, thereby the drive helical gear rotates, because the diameter of helical gear is great, the diameter of stabilizing the piece is less, thereby make the transmission realize speed reduction's function, transmission efficiency has been increased, and make the transmission more stable, transmission mechanism's life has been increased. The fixed bearing can be stabilized through the supporting plate arranged, so that the connecting rod can rotate in the bearing, and the rotating process of the connecting rod can be stable. The connecting rod is driven to rotate synchronously by the connecting head driving rotating rod, the rotating rod rotates to drive the connecting rod to rotate, and the connecting rod drives the spiral blade to rotate, so that wind energy is generated.
3. Wind energy generated by rotation of the spiral blades can be conveyed to the interior of the heat dissipation mechanism communicated with the wind collecting groove through the wind collecting groove, so that the heat dissipation mechanism can dissipate heat quickly. The first copper sheet, the second copper sheet and the third copper sheet can be cooled through the cooling mechanism, and meanwhile the cooling mechanism can be assisted by wind energy generated by the transmission mechanism to cool, so that the cooling efficiency of the cooling mechanism is improved. The air collecting groove is formed between the first copper sheet and the second copper sheet, and the air collecting groove is also formed between the third copper sheet and the second copper sheet. When the wind moves upwards from the blowpipe, the heat among the first copper sheet, the second copper sheet and the third copper sheet can be rapidly taken away. The inside of inputing each blowpipe through the reposition of redundant personnel hole that sets up can be quick, and the blowpipe is given the wind groove with wind energy transport to when the blowpipe is blowing, the inside heat that produces of first copper sheet, second copper sheet and third copper sheet also can be followed the inside of blowpipe and discharged, and the heat extraction is efficient. The cross-section of the shunting hole is of a hollow round table body structure with a trapezoidal structure, so that the air flow rate entering the shunting hole is increased, and the cooling efficiency is accelerated.
4. Thereby the computer motherboard of control by temperature change regulation through setting up can reach the operation of control mechanism of blowing through the rotation of control motor, and the mechanism of blowing is to heat dissipation mechanism supplementary heat dissipation to reach the inside temperature of regulation computer.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a second schematic view of the overall structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the present invention;
FIG. 4 is an enlarged view of the structure at A in FIG. 3 according to the present invention;
FIG. 5 is a schematic view of a connection structure of a guide block and a rack according to the present invention;
fig. 6 is a schematic view of a blowpipe installation structure of the present invention;
in the figure: 1. a base plate; 2. a chip; 3. a heat dissipation mechanism; 31. a first copper sheet; 32. a second copper sheet; 33. a third copper sheet; 34. an air outlet groove; 35. a blowpipe; 36. a shunt hole; 37. a triangular block; 4. a blowing mechanism; 41. a fan housing; 42. a fan blade; 43. a fan; 44. a strut; 45. an inner cavity; 46. a transmission rod; 47. a guide block; 48. a stabilizing block; 5. a transmission mechanism; 51. a helical gear; 52. a rotating rod; 53. a bearing; 54. a connecting rod; 55. a support plate; 56. helical leaves; 57. a wind collecting groove; 58. a connector; 59. a stabilizer bar; 510. a rack.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, a heat dissipation computer motherboard with a temperature adjusting assembly includes a base plate 1, a chip 2 is mounted on the base plate 1, a heat dissipation mechanism 3 is mounted above the base plate 1, a blowing mechanism 4 is disposed on one side of the heat dissipation mechanism 3, the heat dissipation mechanism 3 is connected to the blowing mechanism 4 through a transmission mechanism 5, the blowing mechanism 4 is mounted on the base plate 1, the heat dissipation mechanism 3 can directly perform self heat dissipation through a first copper sheet 31, a second copper sheet 32 and a third copper sheet 33, and can also perform auxiliary heat dissipation on the heat dissipation mechanism 3 through wind energy generated by the transmission mechanism 5, so that heat inside the first copper sheet 31, the second copper sheet 32 and the third copper sheet 33 can be rapidly dissipated, the computer motherboard can be rapidly cooled in a short time, and kinetic energy generated by the blowing mechanism 4 can be transferred to the inside of the heat dissipation mechanism 3 through the spiral blade 56 through the transmission mechanism 5 So as to achieve air cooling and heat dissipation.
Specifically, the blowing mechanism 4 includes a fan housing 41 installed on the base plate 1, an inner cavity 45 for transmission is provided inside the fan housing 41, a fan 43 is installed above the inside of the fan housing 41, a fan blade 42 is connected to a side wall of the fan 43, two support rods 44 are connected to a bottom of the fan 43, two ends of each support rod 44 are fixed to an inner wall of the fan housing 41, a transmission rod 46 connected to the bottom of the fan 43 is provided at the bottom of the fan 43, a stabilizing block 48 with a cylindrical structure is provided on a surface of the transmission rod 46, a guide block 47 is provided on an outer circumference of the stabilizing block 48, the guide block 47 is wound on a surface of the stabilizing block 48 in a spiral structure, the guide block 47 is engaged with the transmission mechanism 5, dust on the inward base plate 1 of the computer can be filtered through the installed fan housing 41, and stable operation of the blowing mechanism 4 can be supported, the supporting rod 44 can play the role of stably connecting the fan 43, and also reduces the function of obstructing the air supply of the fan 43, the kinetic energy transmitted by the fan 43 can be transmitted to the transmission mechanism 5 by means of the transmission rod 46, thereby driving the transmission mechanism 5 to run, the kinetic energy generated by the transmission rod 46 can be stably transmitted through the arranged stabilizing block 48, and the diameter of the stabilizing block 48 is greater than the diameter of the drive rod 46, the transmission will reduce the play of the drive rod 46 during transmission, the guide block 47 is arranged to rapidly transmit kinetic energy to the rack 510 on the surface of the helical gear 51, so as to drive the helical gear 51 to rotate, the diameter of the bevel gear 51 is larger, and the diameter of the stabilizing block 48 is smaller, so that the function of speed reduction transmission is realized, the transmission efficiency is increased, the transmission is more stable, and the service life of the transmission mechanism 5 is prolonged.
Specifically, the transmission mechanism 5 includes a support plate 55 disposed inside the inner cavity 45, a bearing 53 is disposed at the bottom of the support plate 55, the support plate 55 and the bearing 53 are fixedly connected, a connecting rod 54 is connected inside the bearing 53, and the connecting rod 54 penetrates through the inside of the bearing 53; the fixed bearing 53 can be stabilized through the arranged support plate 55, so that the connecting rod 54 rotates in the bearing 53, and the rotating process of the connecting rod 54 is stable.
Specifically, the transmission mechanism 5 further includes a rotating rod 52 fixed to one end of the connecting rod 54 close to the bearing 53, an integrally formed connector 58 is disposed at an end of the rotating rod 52, a plurality of stabilizing bars 59 are uniformly distributed on an outer circumference of the connector 58, three stabilizing bars 59 are disposed, ends of the stabilizing bars 59 far away from the connector 58 are fixed to an inner side wall of the helical gear 51, the helical gear 51 is provided with a plurality of racks 510, and the racks 510 are engaged with the guide blocks 47; when the helical gear 51 rotates, the connecting head 58 can be driven to rotate by the three stabilizing rods 59 through the arranged rotating rod 52, the connecting head 58 drives the rotating rod 52 to synchronously rotate, the rotating rod 52 rotates to drive the connecting rod 54 to rotate, and the connecting rod 54 drives the helical blade 56 to rotate, so that wind energy is generated.
Specifically, the transmission mechanism 5 further includes an air collecting groove 57 disposed on the side wall of the air cover 41, a spiral blade 56 is disposed inside the air collecting groove 57, the end of the spiral blade 56 is fixed to one end of the connecting rod 54, and one side of the air collecting groove 57 is connected to the heat dissipation mechanism 3. The wind energy generated by the rotation of the spiral blades 56 can be conveyed to the inside of the heat dissipation mechanism 3 communicated with the wind collecting groove 57 through the wind collecting groove 57, so that the heat dissipation mechanism 3 can dissipate heat quickly.
Specifically, the heat dissipation mechanism 3 comprises a first copper sheet 31, a second copper sheet 32 and a third copper sheet 33 which are fixed on the bottom plate 1, the first copper sheet 31 is close to the air collection groove 57, air blowing pipes 35 with flat structures are arranged at the bottoms of the first copper sheet 31, the second copper sheet 32 and the third copper sheet 33, a plurality of air outlet grooves 34 are arranged above the air blowing pipes 35, and the tops of the air blowing pipes 35 are communicated with the air outlet grooves 34; the first copper sheets 31, the second copper sheets 32 and the third copper sheets 33 can be cooled through the arranged cooling mechanism 3, and meanwhile, the cooling mechanism 3 can be cooled by wind energy generated by the transmission mechanism 5 in an auxiliary mode, so that the cooling efficiency of the cooling mechanism 3 is improved. The first copper sheets 31, the second copper sheets 32, the third copper sheets 33, the second copper sheets 32 and the first copper sheets 31 are sequentially arranged from one side of the wind collecting groove 57, the wind outlet groove 34 is formed between the first copper sheets 31 and the second copper sheets 32, and the wind collecting groove 57 is also formed between the third copper sheets 33 and the second copper sheets 32. When the wind moves upwards from the blowpipe 35, the heat among the first copper sheets 31, the second copper sheets 32 and the third copper sheets 33 can be rapidly taken away.
Specifically, the heat dissipation mechanism 3 further includes a plurality of branch holes 36 connected to the air collection groove 57, and a triangular block 37 having a triangular structure is disposed between every two branch holes 36. The wind can be rapidly input into the interior of each blowpipe 35 through the arranged shunting holes 36, the blowpipes 35 transmit wind energy to the wind supplying grooves 34, and when the blowpipes 35 blow, heat generated inside the first copper sheets 31, the second copper sheets 32 and the third copper sheets 33 can be discharged from the interior of the blowpipes 35, so that the heat discharging efficiency is high.
Specifically, the cross section of the diversion hole 36 is a hollow circular truncated cone structure with a trapezoidal structure, and the diameter of the diversion hole 36 close to the wind collecting groove 57 is larger than the diameter of the diversion hole 36 far from the wind collecting groove 57. The flow rate of air entering the inside of the diversion holes 36 can be increased, thereby accelerating the cooling efficiency.
When the fan 43 rotates, the transmission mechanism 5 fixed with the rotating shaft at the bottom of the fan 43 transmits the kinetic energy to the transmission rod 46 through the rotating shaft fixed at the bottom of the fan 43, so that the transmission rod 46 rotates synchronously, the transmission rod 46 drives the stabilizing block 48 fixed at the bottom of the transmission rod 46 when rotating, the helical gear 51 rotates to drive the guide block 47 which protrudes outwards and is in threaded arrangement and the helical gear 51 transmits, the helical gear 51 is arranged at one side of the stabilizing block 48, the stabilizing block 51 and the transmission rod 46 are both vertically arranged inside the fan housing 41, the rack 510 on the surface of the helical gear 51 is meshed with the guide block 47, so that the helical gear 51 rotates to drive the bevel gear 59 fixed on the inner side wall of the helical gear 51 to rotate, the stabilizing rod 59 rotates to drive the stabilizing rod 58 to rotate, the stabilizing rod 59 rotates, the stabilizing rod 58 rotates to drive the helical gear 54 when the helical gear 58 rotates, the helical gear drives the helical gear 54 to rotate, the helical gear 54 to drive the air outlet air collecting duct 35 to rotate, and the air collecting duct 35 to enter the air outlet duct 35, and the air collecting duct 35 is connected to the air collecting duct 35, and the air collecting duct 35, the fan is connected to the fan outlet duct 35, the fan outlet duct 35, the fan is connected to the fan outlet duct 35, the fan.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A heat dissipation computer mainboard with a temperature adjusting assembly comprises a bottom plate (1) and is characterized in that a chip (2) is mounted on the bottom plate (1), a heat dissipation mechanism (3) is mounted above the bottom plate (1), a blowing mechanism (4) is arranged on one side of the heat dissipation mechanism (3), the heat dissipation mechanism (3) is connected with the blowing mechanism (4) through a transmission mechanism (5), and the blowing mechanism (4) is mounted on the bottom plate (1);
the blowing mechanism (4) comprises a fan cover (41) arranged on the bottom plate (1), an inner cavity (45) for transmission is arranged inside the fan cover (41), a fan (43) is arranged above the inside of the fan cover (41), the side wall of the fan (43) is connected with fan blades (42), the bottom of the fan (43) is connected with two support rods (44), two ends of the supporting rod (44) are fixed on the inner wall of the fan cover (41), the bottom of the fan (43) is provided with a transmission rod (46) connected with the fan, a stabilizing block (48) with a cylindrical structure is arranged on the surface of the transmission rod (46), a guide block (47) is arranged on the outer circumference of the stabilizing block (48), and the guide block (47) is wound on the surface of the stabilizing block (48) in a spiral structure, and the guide block (47) is meshed with the transmission mechanism (5).
2. The heat dissipation computer motherboard with a temperature regulation assembly according to claim 1, characterized in that the transmission mechanism (5) comprises a support plate (55) disposed inside the internal cavity (45), a bearing (53) is disposed at the bottom of the support plate (55), the support plate (55) and the bearing (53) are fixedly connected, a connecting rod (54) is connected inside the bearing (53), and the connecting rod (54) penetrates through the inside of the bearing (53).
3. The heat dissipation computer motherboard with temperature regulation subassembly of claim 2, characterized in that, drive mechanism (5) still includes with connecting rod (54) is close to pivot lever (52) that one end is fixed mutually of bearing (53), the tip of pivot lever (52) is provided with integrated into one piece's connector (58), be provided with a plurality of evenly distributed's stabilizer bar (59) on the outer circumference of connector (58), and stabilizer bar (59) are provided with three, the stabilizer bar (59) are kept away from the tip of connector (58) and are all fixed on the inside wall of helical gear (51), be provided with a plurality of rack (510) on helical gear (51), rack (510) and guide block (47) mesh mutually.
4. The computer motherboard with the temperature adjusting component for dissipating heat according to claim 3, wherein the transmission mechanism (5) further comprises an air collecting groove (57) disposed on the side wall of the fan housing (41), a spiral blade (56) is disposed inside the air collecting groove (57), the end of the spiral blade (56) is fixed at one end of the connecting rod (54), and one side of the air collecting groove (57) is connected with the heat dissipating mechanism (3).
5. The heat dissipation computer motherboard with temperature regulation subassembly of claim 4, characterized in that, heat dissipation mechanism (3) is including fixing first copper sheet (31), second copper sheet (32) and third copper sheet (33) on bottom plate (1), first copper sheet (31) are close to wind collection groove (57), and the bottom of first copper sheet (31), second copper sheet (32) and third copper sheet (33) all is provided with blowing pipe (35) of flat structure, be provided with a plurality of air-out grooves (34) above blowing pipe (35), the top of blowing pipe (35) and air-out groove (34) are linked together.
6. The computer motherboard with a temperature regulation component of claim 5, wherein the heat dissipation mechanism (3) further comprises a plurality of branch holes (36) connected to the air collection groove (57), and a triangular block (37) with a triangular structure is arranged between every two branch holes (36).
7. The computer motherboard with the temperature regulating assembly function as claimed in claim 6, wherein the cross section of the branch holes (36) is a hollow truncated cone structure with a trapezoidal structure, and the diameter of the side of the branch holes (36) close to the wind collecting groove (57) is larger than the diameter of the side of the branch holes (36) far away from the wind collecting groove (57).
8. The use method of the heat dissipation computer motherboard with temperature regulation component of claim 7, characterized in that, the use method of the computer motherboard specifically includes the following steps:
when the temperature in the computer rises, the temperature detection component can transmit the detected temperature to the P L C controller, when the fan (43) rotates, the fan blade (42) on the side wall of the fan can be driven to rotate to generate upward wind, so that the interior of the computer host can be cooled by wind, and when the fan (43) rotates, the transmission mechanism (5) fixed with a rotating shaft at the bottom of the fan (43) transmits the wind;
step two: kinetic energy is transmitted to the transmission rod (46) through a rotating shaft fixed at the bottom of the fan (43), the transmission rod (46) can synchronously rotate, the transmission rod (46) can drive a stabilizing block (48) fixed at the bottom of the transmission rod when rotating, guide blocks (47) which are outwards protruded and arranged in a thread form and arranged on the stabilizing block (48) are in transmission with helical gears (51), the helical gears (51) are arranged on one side of the stabilizing block (48), the helical gears (51) and the transmission rod (46) are vertically arranged inside the fan cover (41), racks (510) on the surfaces of the helical gears (51) are meshed with the guide blocks (47), so that the helical gears (51) rotate, the helical gears (51) can drive stabilizing rods (59) fixed on the inner side walls of the helical gears (51) to rotate, when the connecting rods (59) rotate, the rotating rods (52) connected with the connecting heads (58) can be driven to rotate when the connecting heads (58) rotate, the rotating rod (52) can drive the connecting rod (54) connected to the end portion of the rotating rod to rotate, the connecting rod (54) can rotate inside the bearing (53), the support plate (55) plays a role in stable rotation of the connecting rod (54), when the connecting rod (54) rotates, air can be input into the air collecting groove (57) through the spiral blade (56) at the end portion of the connecting rod (54), so that the air inside the air collecting groove (57) can rapidly flow into the heat dissipation mechanism (3), and air cooling and heat dissipation of the heat dissipation mechanism (3) are accelerated;
step three: when the flowing air is blown into the plurality of blowpipes (35) at one side of the wind collecting groove (57) from the spiral blade (56), the blowpipes (35) are flat, the blowpipes (35) can quickly input the air into the wind outlet groove (34) for exhausting, in the process of air exhaust, the first copper sheets (31), the second copper sheets (32) and the third copper sheets (33) can take away heat, and the heat dissipation efficiency is increased by air exhaust while passing through the air outlet groove (34), when the wind in the wind collecting groove (57) is input into the blowpipe (35) through the spiral blade (56), because the shunting holes (36) are of the circular truncated cone structure, the flow rate of the air entering the blowpipe (35) from the shunting holes (36) is fast, the connection part of the blowpipe (35) and the air outlet groove (34) reaches the maximum communication area, so that the air outlet of the blowpipe (35) is maximum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010607122.2A CN111506172B (en) | 2020-06-30 | 2020-06-30 | Heat dissipation computer motherboard with temperature regulation subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010607122.2A CN111506172B (en) | 2020-06-30 | 2020-06-30 | Heat dissipation computer motherboard with temperature regulation subassembly |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208521238U (en) * | 2018-08-13 | 2019-02-19 | 常州信息职业技术学院 | A kind of computer host box of perfect heat-dissipating |
| CN110221665A (en) * | 2018-09-30 | 2019-09-10 | 腾讯科技（深圳）有限公司 | Radiator, server and spare fans control method |
| WO2020051904A1 (en) * | 2018-09-14 | 2020-03-19 | 深圳市柔宇科技有限公司 | Electronic device |
| CN110989811A (en) * | 2020-03-03 | 2020-04-10 | 北京中航科电测控技术股份有限公司 | Rapid heat dissipation computer motherboard based on godson 3A3000 treater |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208521238U (en) * | 2018-08-13 | 2019-02-19 | 常州信息职业技术学院 | A kind of computer host box of perfect heat-dissipating |
| WO2020051904A1 (en) * | 2018-09-14 | 2020-03-19 | 深圳市柔宇科技有限公司 | Electronic device |
| CN110221665A (en) * | 2018-09-30 | 2019-09-10 | 腾讯科技（深圳）有限公司 | Radiator, server and spare fans control method |
| CN110989811A (en) * | 2020-03-03 | 2020-04-10 | 北京中航科电测控技术股份有限公司 | Rapid heat dissipation computer motherboard based on godson 3A3000 treater |
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