CN111505893A - Wavelength conversion device, projector, and method for manufacturing wavelength conversion device - Google Patents
Wavelength conversion device, projector, and method for manufacturing wavelength conversion device Download PDFInfo
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- CN111505893A CN111505893A CN201910098639.0A CN201910098639A CN111505893A CN 111505893 A CN111505893 A CN 111505893A CN 201910098639 A CN201910098639 A CN 201910098639A CN 111505893 A CN111505893 A CN 111505893A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
- G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
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Abstract
A wavelength conversion device comprises a substrate, a wavelength conversion layer and a plurality of protruding structures. The substrate has a first surface and a second surface opposite to each other. The wavelength conversion layer is arranged on the first surface of the substrate and is positioned in the first area of the substrate. The protruding structures protrude from at least one of the first surface and the second surface and are located in the second region of the substrate, wherein the protruding structures are made of a material different from that of the substrate. The present disclosure also provides a projector and a method for manufacturing a wavelength conversion device, the projector includes an excitation light source device, the wavelength conversion device, a light valve, and a projection lens. By using the wavelength conversion device, the projector and the manufacturing method of the wavelength conversion device disclosed by the disclosure, a good heat dissipation effect can be achieved.
Description
Technical Field
The present disclosure relates to a wavelength conversion device, a projector and a method for manufacturing the wavelength conversion device, and more particularly, to a wavelength conversion device with a good heat dissipation effect, a projector and a method for manufacturing the wavelength conversion device.
Background
The wavelength conversion wheel of the laser projector can assist in heat dissipation by manufacturing the salient points on the surface of the aluminum substrate of the wavelength conversion wheel. The raised points may help transfer heat generated by the wavelength conversion wheel to the air as the wavelength conversion wheel rotates. However, the conventional stamping process is limited, the height of the bumps protruding from the surface of the aluminum substrate is only 1 mm to 2 mm, which has a limited auxiliary effect on heat dissipation, and the shape of the bumps has many limitations, so that it is difficult to manufacture sufficient strong convection airflow, which makes the heat dissipation efficiency of the conventional wavelength conversion wheel difficult to break through. On the other hand, if the spoiler structure with a larger height is punched out by a punching process, an opening must be punched out and bent on the substrate, but the opening on the substrate can cause a great noise to be generated during the operation of the wavelength conversion wheel.
If the wavelength conversion wheel is manufactured by a casting process, the substrate and the turbulent flow structure thereof are complicated and the manufacturing cost is high, so the commercial competitiveness of the aluminum substrate manufactured by the casting process is still weaker than that of the stamping process. In addition, the aluminum substrate manufactured by the casting process and the metal turbulence structure thereon can significantly increase the overall weight of the aluminum substrate, thereby increasing the inertia moment and causing the burden of the motor. Therefore, the casting process is more suitable for small-sized wavelength conversion wheels.
Disclosure of Invention
The present disclosure provides a wavelength conversion device that may have high heat dissipation efficiency, be light in weight, and be free from size limitations.
The present disclosure provides a projector, which may have the wavelength conversion device.
The present disclosure provides a method of manufacturing a wavelength conversion device, which can manufacture the wavelength conversion device.
Other objects and at least one advantage of the present disclosure can be further understood from the technical features disclosed in the present disclosure.
To achieve one or a part of or all of the above or other objects, an embodiment of the present disclosure provides a wavelength conversion device including a substrate, a wavelength conversion layer, and a plurality of protruding structures. The substrate has a first surface and a second surface opposite to each other. The wavelength conversion layer is arranged on the first surface of the substrate and is positioned in the first area of the substrate. The protruding structures protrude from at least one of the first surface and the second surface and are located in the second region of the substrate, wherein the protruding structures are made of a material different from that of the substrate.
An embodiment of the present disclosure provides a projector, which includes an excitation light source device, a wavelength conversion device, a light valve, and a projection lens. The excitation light source device is used for providing an excitation light beam. The wavelength conversion device is configured on an optical path of the excitation beam and is used for converting the excitation beam into a conversion beam, wherein the wavelength conversion device comprises a substrate, a wavelength conversion layer and a plurality of convex structures. The substrate has a first surface and a second surface opposite to each other. The wavelength conversion layer is arranged on the first surface of the substrate and is positioned in the first area of the substrate. The protruding structures protrude from at least one of the first surface and the second surface and are located in the second region of the substrate, wherein the protruding structures are made of a material different from that of the substrate. The light valve is disposed on the light path of the converted light beam and converts the converted light beam into an image light beam. The projection lens is disposed on the light path of the image beam and converts the image beam into a projection beam.
An embodiment of the present disclosure provides a method for manufacturing a wavelength conversion device, including: providing a substrate, wherein the substrate is provided with a first surface, a second surface and a plurality of through holes penetrating through the first surface and the second surface which are opposite; by means of the embedding and ejecting mode, the protruding structures respectively penetrate through the through holes and protrude out of at least one of the first surface and the second surface of the substrate; and configuring a wavelength conversion layer on the first surface of the substrate, wherein the protruding structures and the wavelength conversion layer are respectively located at different regions of the substrate.
Based on the above, the wavelength conversion device of the present disclosure provides the protruding structure of the material different from the substrate to protrude from at least one of the two opposite surfaces of the substrate, and does not cover the wavelength conversion layer. Therefore, the protruding structures do not affect the wavelength conversion effect of the wavelength conversion device, and can disturb the gas to generate convection or/and turbulence when the wavelength conversion device rotates, thereby improving the heat dissipation effect of the wavelength conversion device. The wavelength conversion device of the present disclosure can be fabricated in a variety of sizes without generating significant noise.
In order to make the aforementioned and at least one other feature of the disclosure more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of a projector according to an embodiment of the present disclosure.
Fig. 2 to 4 are schematic diagrams of a method of manufacturing a wavelength conversion device according to an embodiment of the present disclosure.
Fig. 5 is a schematic cross-sectional view of the wavelength conversion device of fig. 4 along line AA.
Fig. 6 is a schematic view of the projection structure of fig. 4.
Fig. 7 to 9 are schematic diagrams of a method of manufacturing a wavelength conversion device according to another embodiment of the present disclosure.
Fig. 10 illustrates a method for manufacturing a wavelength conversion device according to an embodiment of the present invention.
Description of the reference numerals
θ: included angle
AA: thread
H1, H2: height
S1-S3: step (ii) of
10: projector with a light source
100. 100 a: wavelength conversion device
110. 110 a: substrate
112: first side
114: second surface
116: rotating shaft hole
117: light-transmitting window
118. 118 a: through hole
120. 122: wavelength conversion layer
130. 130 a: projecting structure
132. 132 a: projecting part
134. 134 a: fixing part
136. 136 a: connecting part
140: motor shaft
150: light transmission piece
160: cover body
200: excitation light source device
300: light valve
500: and a projection lens.
Detailed Description
The foregoing and other technical and scientific aspects, features and utilities of the present disclosure will be apparent from the following detailed description of a preferred embodiment when read in conjunction with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology used is intended to be in the nature of words of description rather than of limitation. In the following embodiments, the same or similar elements will be given the same or similar reference numerals.
Referring to fig. 1, a projector 10 according to an embodiment of the disclosure includes an excitation light source device 200, a wavelength conversion device 100, a light valve 300, and a projection lens 500, the excitation light source device 200 may provide an excitation light beam I1. in this embodiment, the excitation light source device 200 may be, for example, a laser light source, but in other embodiments, the excitation light source device 200 may also be a light emitting diode or other light sources, the light emitted by the excitation light source device 200 may be, for example, blue light or other color light beams, which is not limited herein, for example, the excitation light source device 200 may include a plurality of laser elements (not shown), which are, for example, arranged in an array, and are, for example, laser diodes (L D), in other embodiments, the excitation light source device 200 may also be a plurality of laser light sources, in other embodiments, the light sources may be, for example, solid-state light sources (solid-state light sources) of light emitting diodes (light emitting diodes).
The excitation light source device 200 emits an excitation light beam I1 to irradiate the wavelength conversion device 100 disposed on the optical path of the excitation light beam I1, and the wavelength conversion device 100 can convert the excitation light beam I1 to generate a converted light beam I2 with different wavelengths, wherein the wavelength conversion device 100 can be, for example, a phosphor wheel (phosphor wheel). For example, the wavelength conversion device 100 can convert the blue excitation light beam I1 into the converted light beam I2 of other colors, which is not limited by the disclosure.
The converted light beam I2 emitted from the wavelength conversion device 100 may further be irradiated to the light valve 300, the light valve 300 may convert the converted light beam I2 into an image light beam I3, and the projection lens 500 is located on the transmission path of the image light beam I3 and may convert the image light beam I3 into a projection light beam I4 and project the projection light beam I4 out of the projector 10, so as to display a picture on a screen, a wall surface, or other projection target.
In the present embodiment, the light valve 300 is used for converting the converted light beam I2 from the wavelength conversion Device 100 into the image light beam I3. for example, the light valve 300 is a reflective light Modulator such as a Digital Micro-mirror Device (DMD) or a liquid Crystal On Silicon Panel (L I Crystal On Silicon Panel, L CoS Panel). in some embodiments, the light valve 300 may be a transmissive liquid Crystal Panel (L I Crystal Display Panel), an Electro-Optic Modulator (Electro-Optic Modulator), a magneto-Optic Modulator (magnetic-Optical Modulator), an Acousto-Optic Modulator (AOM), etc.
In the present embodiment, the projection lens 500 includes, for example, a combination of one or more non-planar optical lenses having diopter, including, for example, various combinations of non-planar lenses such as a biconcave lens, a biconvex lens, a meniscus lens, a convex-concave lens, a plano-convex lens, and a plano-concave lens. In an embodiment, the projection lens 500 may also include a plane optical lens, which projects the image beam I3 from the light valve 300 out of the projector 10 in a reflective or transmissive manner. The present disclosure is not limited to the type and kind of the projection lens 500.
In the projector 10 of the present embodiment, the wavelength conversion device 100 has a good heat dissipation effect, which not only improves the heat dissipation efficiency of the wavelength conversion device 100 itself, but also brings strong wind flow to other components in the projector, so that the whole projector has a good heat dissipation performance. The following illustrates the manufacturing method and structure of the wavelength conversion device 100.
Fig. 2 to 4 are schematic diagrams of a method of manufacturing a wavelength conversion device according to an embodiment of the present disclosure. In this embodiment, the method for manufacturing the wavelength conversion device 100 includes the following steps: first, as shown in fig. 2, a substrate 110 is provided, wherein the substrate 110 has a first surface 112 and a second surface 114 opposite to each other, a plurality of through holes 118 penetrating the first surface 112 and the second surface 114, two light windows 117, and a rotation axis hole 116 located at the center. In the embodiment, the substrate 110 may be made of metal, such as aluminum, but not limited thereto.
Next, as shown in fig. 3, the protrusion structures 130 are disposed such that one or more protrusion structures 130 respectively penetrate through the through holes 118 and protrude from at least one of the first surface 112 and the second surface 114 of the substrate 110. In the embodiment, the protruding structures 130 include a plurality of fan blades, and the cross-sectional area of the protruding structures 130 in the form of fan blades perpendicular to the rotation direction is larger than the cross-sectional area of the protruding structures 130 parallel to the rotation direction, so that the protruding structures can generate a direct pushing airflow, and thus a stronger airflow can be generated, thereby improving the heat dissipation efficiency of the wavelength conversion device 100 itself. Of course, the form of the projection structure 130 is not limited thereto. In other embodiments, the protrusion 130 may be in the form of a pillar or other shapes.
In the present embodiment, the protrusion structures 130 are formed through the through holes 118 of the substrate 110 by insert molding (insert molding). Of course, the way in which the protruding structure 130 is fixed on the substrate 110 is not limited thereto. In other embodiments, the protruding structure 130 can be fixed to the substrate 110 by adhesion, clamping, screwing, riveting, etc.
In the present embodiment, the material of the protrusion structures 130 includes engineering plastics, such as semi-crystalline high temperature resistant thermoplastic (e.g. PPS, PEEK, PEKK, PPA, TPI, HTN, etc.), amorphous high temperature resistant thermoplastic (e.g. PES, PEI, PSU, etc.), thermotropic liquid crystal polymer (e.g. L CP, etc.), or a combination of at least two of the above.
Taking the common PEEK as an example, the long-term operating temperature can reach 250 ℃, the density is only 1.05 (grams per cubic centimeter (cm)), and compared with the density of 2.7 (grams per cubic centimeter) of aluminum, the density of PEEK is less than half of that of aluminum. The other material TPI (Extem) can work at the temperature of 260-280 ℃ for a long time and has the density of 1.33 (grams per cubic centimeter). In the embodiment, the temperature resistance range of the protruding structures 130 can reach more than 250 ℃, even more than 260 ℃, the density is mostly about half of that of aluminum, and the protruding structures can work in a high-temperature environment and have small weight. Of course, the material of the protruding structure 130 is not limited thereto.
In addition, in order to increase the heat conduction effect of the protruding structures 130, in the embodiment, the material of the protruding structures 130 optionally further includes metal powder, glass fiber, carbon fiber, mineral powder, or a combination of at least two of the foregoing, so as to enhance the heat conduction coefficient of the protruding structures 130, and the enhanced heat conduction coefficient can reach 2(W/m × K) or more. Of course, the material of the protruding structure 130 is not limited thereto.
Finally, as shown in fig. 4, wavelength conversion layers 120 and 122 are disposed on the first surface 112 of the substrate 110. Additionally or alternatively, the light-transmitting member 150 is mounted in the light-transmitting window 117, and the motor shaft 140 and the cover 160 are disposed, thereby completing the fabrication of the wavelength conversion device 100. In the present embodiment, the wavelength conversion layers 120 and 122 are, for example, phosphor layers or phosphor layers, but the types of the wavelength conversion layers 120 and 122 are not limited thereto. In addition, in the present embodiment, the protruding structures 130 and the wavelength conversion layers 120 and 122 are respectively located at different regions of the substrate 110, for example, the wavelength conversion layers 120 and 122 can be disposed in the first region on the first surface 112 of the substrate 110. In the present embodiment, the motor shaft 140 is located at the center of the substrate 110, and the first area on the first surface 112 of the substrate 110 and a part of the light-transmitting window 117 are located at the same radial position.
The protrusion structure 130 is located in the second region of the substrate 110. The second region of the substrate 110 includes a region extending from the spindle hole 116 to the wavelength-converting layers 120, 122, and a region extending from the wavelength-converting layers 120, 122 to the edge of the substrate 110. In the present embodiment, these projection structures 130 are arranged in the region extending from the rotation axis hole 116 to the wavelength conversion layers 120, 122.
Since the protruding structure 130 of the wavelength conversion device 100 does not cover the wavelength converting layers 120, 122. Therefore, the protruding structures 130 can disturb the gas to generate convection and/or turbulence when the wavelength conversion device 100 rotates without affecting the wavelength conversion effect of the wavelength conversion device 100, so as to improve the heat dissipation effect of the wavelength conversion device 100.
Fig. 5 is a schematic cross-sectional view of the wavelength conversion device of fig. 4. Fig. 6 is a schematic view of the projection structure of fig. 4. As shown in fig. 6, in the present embodiment, the protruding structure 130 includes a connecting portion 136, two fixing portions 134 located at opposite sides of the connecting portion 136, and two protruding portions 132 protruding from the two fixing portions 134. As shown in fig. 5, in the embodiment, the connecting portion 136 of the protruding structure 130 penetrates through the through hole 118 of the substrate 110, the two fixing portions 134 have widths larger than the width of the through hole 118 and are respectively located on the first surface 112 and the second surface 114 of the substrate 110, and the two protruding portions 132 of the protruding structure 130 protrude from the first surface 112 and the second surface 114 of the substrate 110 respectively. Of course, in other embodiments, the protrusion structures 130 may protrude from the first surface 112 of the substrate 110 only, or the protrusion structures 130 may protrude from the second surface 114 of the substrate 110 only. The form of the projection 130 is not limited thereto.
In addition, as shown in fig. 5, the motor shaft 140 is inserted into the shaft hole 116 of the base plate 110 and fixed by the cover 160. In the embodiment, the height of the protrusion structure 130 protruding from the first surface 112 of the substrate 110 is close to the height of the cover 160, but not limited thereto. In the embodiment, the heights H1, H2 of the protrusion 130 protruding from the first surface 112 and the second surface 114 of the substrate 110 are about 1 millimeter (mm) to 15 mm. In addition, in the embodiment, the heights H1 and H2 of the protrusion structure 130 protruding from the first surface 112 and the second surface 114 of the substrate 110 are the same, but the heights H1 and H2 of the protrusion structure 130 protruding from the first surface 112 and the second surface 114 of the substrate 110 may also be different, and the heights H1 and H2 of the protrusion structure 130 protruding from the substrate 110 are not limited thereto.
In the wavelength conversion device 100 of the embodiment, the substrate 110 is pre-formed with the through hole 118 for forming the protruding structure 130, and after the substrate 110 is formed by stamping, the protruding structure 130 is formed or assembled on the substrate 110, so that the protruding structure 130 can stably operate with the substrate 110 after being formed. Then, the wavelength conversion layers 120 and 122 are disposed, and finally, the components such as the motor and the cover 160 are assembled according to the conventional assembly process. Since the wavelength conversion device 100 does not need to be manufactured by mold opening in a casting manner, the manufacturing process and the cost advantage are provided, and the heat dissipation efficiency of the wavelength conversion device 100 can be improved on the premise of not changing the conventional assembly process, and the light emitting efficiency of the wavelength conversion device 100 can be indirectly improved. In addition, the strong wind flow generated by the wavelength conversion device 100 not only can improve the heat dissipation efficiency of the wavelength conversion device 100 itself, but also can bring stronger wind flow to other elements in the optical module (the projector 10), and if the design is proper, the heat dissipation efficiency of other elements can be enhanced at the same time.
Another form of the wavelength conversion device 100a is described below. It should be noted that, in the following embodiments, the same or similar elements as those in the previous embodiment are denoted by the same or similar symbols, and further description is omitted. Only the main differences will be described below.
Fig. 7 to 9 are schematic diagrams of a method of manufacturing a wavelength conversion device according to another embodiment of the present disclosure. Referring to fig. 7, in the present embodiment, the through hole 118a of the substrate 110a is disposed at the outer edge of the substrate 110 a. Referring to fig. 7 and 8, the protrusion 130a is disposed on the through hole 118a (fig. 7) located at the outer edge of the substrate 110a and formed at the outer edge of the substrate 110 a. The material of the protruding structure 130a is different from that of the substrate 110 a.
Specifically, in the embodiment, the connecting portion 136a (labeled in fig. 9) of the protruding structure 130a is located in the through hole 118a of the substrate 110a, and the fixing portion 134a can surround the outer edge of the substrate 110a in a complete circle. That is, in the embodiment, in addition to the connection portion 136a passing through the through hole 118a to fix the protrusion structure 130a to the substrate 110a, the protrusion structure 130a is further surrounded and attached to the outer edge of the substrate 110a (i.e., the annular outer wall surface of the substrate 110a, the region of the first surface 112 close to the outer edge, and the region of the second surface 114 close to the outer edge) by the fixing portion 134a, so that the protrusion structure 130a is tightly formed on the outer edge of the substrate 110 a. In addition, in the present embodiment, the protruding portions 132 of the protruding structure 130 protrude from the first surface 112 (fig. 7) and the second surface 114 (fig. 7) of the substrate 110a, respectively. In the embodiment, the protrusion 130a is shaped as a fan blade, and an angle θ (as shown in fig. 8) is formed between the extending direction of the fan blade and the radial direction of the base plate 110a (i.e. the radial direction taking the rotation axis hole 116 as the center), the angle θ is about 15 degrees to 75 degrees, but the shape and the angle of the protrusion 130a are not limited thereto.
Finally, referring to fig. 9, the wavelength conversion layers 120 and 122 are disposed on the substrate 110a, the light-transmitting member 150 is mounted in the light-transmitting window 117, and the motor shaft 140 and the cover 160 are disposed, thereby completing the fabrication of the wavelength conversion device 100 a. As can be seen from fig. 9, these protruding structures 130a are arranged in the regions extending from the wavelength-converting layers 120, 122 to the edges of the substrate 110a, without covering the wavelength-converting layers 120, 122. Therefore, the protruding structures 130a can disturb the gas when the wavelength conversion device 100a rotates without affecting the wavelength conversion effect of the wavelength conversion device 100a, so as to improve the heat dissipation effect of the wavelength conversion device 100 a.
Fig. 10 illustrates a method for manufacturing a wavelength conversion device according to an embodiment of the present invention. First, referring to fig. 2 and 10, in step S1, a substrate 100 is provided, wherein the substrate 100 has a first surface 112 and a second surface 114 opposite to each other, and a plurality of through holes 118 penetrating through the first surface 112 and the second surface 114. Next, referring to fig. 3 and 10, in step S2, the protruding structures 130 are respectively disposed through the through holes 118 and protrude from at least one of the first surface 112 and the second surface 114 of the substrate 110 by an insert-injection method. Referring to fig. 4 and 10, in step S3, the wavelength conversion layer 120 is disposed on the first surface 112 of the substrate 110, and the plurality of protruding structures 130 and the wavelength conversion layer 120 are respectively located at different regions of the substrate 110.
In summary, the wavelength conversion device of the present disclosure has the protruding structure made of a different material from the substrate disposed on at least one of the two opposite surfaces of the substrate, and does not cover the wavelength conversion layer. Therefore, the protruding structures can disturb the gas to produce convection or/and turbulence when the wavelength conversion device rotates on the premise of not influencing the wavelength conversion effect of the wavelength conversion device, so as to improve the heat dissipation effect of the wavelength conversion device, prevent the wavelength conversion device from being too heavy, not limited by size and not generate large noise.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. It is not necessary for any embodiment or claim of the present disclosure to address or achieve all or at least one of the objects or advantages or features disclosed in the present disclosure. In addition, the abstract and the title of the invention are provided for assisting the retrieval of patent documents and are not intended to limit the scope of the claims of the disclosure.
Claims (29)
1. A wavelength conversion device is characterized by comprising a substrate, a wavelength conversion layer and a plurality of protruding structures, wherein:
the substrate is provided with a first surface and a second surface which are opposite;
the wavelength conversion layer is configured on the first surface of the substrate and is positioned in a first area of the substrate; and
the plurality of protruding structures protrude from at least one of the first surface and the second surface and are located in the second area of the substrate, wherein the material of the plurality of protruding structures is different from that of the substrate.
2. The wavelength conversion device according to claim 1, wherein the second region of the substrate includes a plurality of through holes penetrating through the first surface and the second surface, and the protruding structures are respectively disposed through the through holes.
3. The wavelength conversion device according to claim 2, wherein the protruding structures are formed by insert-injection through the through holes of the substrate to form the wavelength conversion device.
4. The wavelength conversion device of claim 1, wherein the substrate has a centrally located spindle hole, and the second region of the substrate comprises a region extending from the spindle hole to the wavelength converting layer and/or a region extending from the wavelength converting layer to an edge of the substrate.
5. The wavelength conversion device according to claim 4, wherein the plurality of projection structures are arranged in a region extending from the rotation axis hole to the wavelength conversion layer.
6. The wavelength conversion device according to claim 4, wherein the plurality of projection structures are arranged in a region extending from the wavelength conversion layer to an edge of the substrate.
7. The wavelength conversion device according to claim 1, wherein the plurality of projection structures are disposed at an outer edge of the substrate.
8. The wavelength conversion device according to claim 1, wherein the plurality of protruding structures comprise a plurality of leaves or a plurality of posts.
9. The wavelength conversion device of claim 1, wherein a height of the plurality of protruding structures protruding from at least one of the first face and the second face is between 1 millimeter and 15 millimeters.
10. The wavelength conversion device according to claim 1, wherein the substrate comprises a metal, and the plurality of protruding structures comprises a semi-crystalline high temperature resistant thermoplastic, a non-crystalline high temperature resistant thermoplastic, a thermotropic liquid crystal polymer, or a combination thereof.
11. The wavelength conversion device according to claim 1, wherein the plurality of protruding structures are made of a material comprising metal powder, glass fiber, carbon fiber, mineral powder, or a combination of at least two of the foregoing.
12. The wavelength conversion device of claim 1, a cross-sectional area of the plurality of protruding structures perpendicular to the direction of rotation is larger than a cross-sectional area of the plurality of protruding structures parallel to the direction of rotation.
13. A projector is characterized by comprising an excitation light source device, a wavelength conversion device, a light valve and a projection lens, wherein:
the excitation light source device is used for providing an excitation light beam;
the wavelength conversion device is disposed on an optical path of the excitation beam, and the wavelength conversion device is configured to convert the excitation beam into a converted beam, wherein the wavelength conversion device includes a substrate, a wavelength conversion layer, and a plurality of protruding structures, and wherein:
the substrate is provided with a first surface and a second surface which are opposite;
the wavelength conversion layer is configured on the first surface of the substrate and is positioned in a first area of the substrate; and
the plurality of protruding structures protrude from at least one of the first surface and the second surface and are located in a second area of the substrate, wherein the second area is different from the first area, and the plurality of protruding structures are made of a material different from that of the substrate;
the light valve is configured on the light path of the conversion light beam and converts the conversion light beam into an image light beam; and
the projection lens is configured on the light path of the image light beam and converts the image light beam into a projection light beam.
14. The projector as claimed in claim 13, wherein the second region of the substrate includes a plurality of through holes passing through the first surface and the second surface, and the protruding structures are respectively disposed in the through holes.
15. The projector as claimed in claim 14, wherein the protruding structures are formed by insert-injection through the through holes of the substrate to form the wavelength conversion device.
16. The projector as defined in claim 13 wherein the substrate has a centrally located pivot hole, the second region of the substrate including a region extending from the pivot hole to the wavelength conversion layer and/or a region extending from the wavelength conversion layer to an edge of the substrate.
17. The projector as defined in claim 16 wherein the plurality of projection structures are disposed in a region extending from the pivot hole to the wavelength conversion layer.
18. The projector as defined in claim 16 wherein the plurality of projection structures are disposed in a region extending from the wavelength conversion layer to an edge of the substrate.
19. The projector as defined in claim 13 wherein the plurality of protruding structures comprise a plurality of vanes or a plurality of posts.
20. The projector as defined in claim 13 wherein the height of the plurality of protruding structures protruding from at least one of the first face and the second face is between 1 mm and 15 mm.
21. The projector as defined in claim 13 wherein the cross-sectional area of the plurality of protruding structures perpendicular to the direction of rotation is greater than the cross-sectional area of the plurality of protruding structures parallel to the direction of rotation.
22. A method of fabricating a wavelength conversion device, comprising:
providing a substrate, wherein the substrate is provided with a first surface, a second surface and a plurality of through holes penetrating through the first surface and the second surface which are opposite;
by means of the embedding and ejecting mode, a plurality of protruding structures respectively penetrate through the through holes and protrude out of at least one of the first surface and the second surface of the substrate; and
and configuring a wavelength conversion layer on the first surface of the substrate, wherein the plurality of protruding structures and the wavelength conversion layer are respectively positioned at different areas of the substrate.
23. The method of claim 22, wherein the substrate has a rotation axis hole, and the plurality of protruding structures are embedded and emitted in a region extending from the rotation axis hole to the wavelength conversion layer.
24. The method of claim 22, wherein the plurality of protrusion structures are buried into a region extending from the wavelength conversion layer to an edge of the substrate.
25. The method of claim 22, wherein the plurality of protruding structures comprise a plurality of fins or a plurality of posts.
26. The method of claim 22, wherein a height of the plurality of protruding structures protruding from at least one of the first face and the second face is between 1 mm and 15 mm.
27. The method of claim 22, wherein the substrate comprises a metal, and the plurality of protruding structures comprises a semi-crystalline high temperature resistant thermoplastic, a non-crystalline high temperature resistant thermoplastic, a thermotropic liquid crystal polymer, or a combination thereof.
28. The method of claim 22, wherein the plurality of protruding structures are made of metal powder, glass fiber, carbon fiber, mineral powder, or a combination of at least two of the foregoing.
29. The method of claim 22, wherein a cross-sectional area of the plurality of protruding structures perpendicular to the rotation direction is larger than a cross-sectional area of the plurality of protruding structures parallel to the rotation direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910098639.0A CN111505893B (en) | 2019-01-31 | 2019-01-31 | Wavelength conversion device, projector, and method for manufacturing wavelength conversion device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910098639.0A CN111505893B (en) | 2019-01-31 | 2019-01-31 | Wavelength conversion device, projector, and method for manufacturing wavelength conversion device |
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| Publication Number | Publication Date |
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| CN111505893A true CN111505893A (en) | 2020-08-07 |
| CN111505893B CN111505893B (en) | 2021-10-29 |
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| CN201910098639.0A Active CN111505893B (en) | 2019-01-31 | 2019-01-31 | Wavelength conversion device, projector, and method for manufacturing wavelength conversion device |
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| CN208188568U (en) * | 2018-05-17 | 2018-12-04 | 中强光电股份有限公司 | Wavelength convert wheel and projection arrangement |
| CN208239781U (en) * | 2018-04-28 | 2018-12-14 | 中强光电股份有限公司 | Wavelength convert module and projection arrangement |
| CN209624966U (en) * | 2019-01-31 | 2019-11-12 | 中强光电股份有限公司 | Wavelength converter and projector |
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| CN208239781U (en) * | 2018-04-28 | 2018-12-14 | 中强光电股份有限公司 | Wavelength convert module and projection arrangement |
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