CN111498580B - Chip winding tape feeding device - Google Patents
Chip winding tape feeding device Download PDFInfo
- Publication number
- CN111498580B CN111498580B CN202010316661.0A CN202010316661A CN111498580B CN 111498580 B CN111498580 B CN 111498580B CN 202010316661 A CN202010316661 A CN 202010316661A CN 111498580 B CN111498580 B CN 111498580B
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- Prior art keywords
- wheel
- tape
- winding
- discharging
- guide wheel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H16/00—Unwinding, paying-out webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/26—Registering, tensioning, smoothing or guiding webs longitudinally by transverse stationary or adjustable bars or rollers
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Abstract
The invention discloses a chip tape feeding device which comprises a machine shell, a feeding end mounting cabinet, a receiving end mounting cabinet and a connecting seat, wherein the feeding end mounting cabinet, the receiving end mounting cabinet and the connecting seat are arranged at intervals. The discharging winding wheel is arranged on the discharging end mounting cabinet and used for winding the semiconductor packaging winding tape; the protective belt winding wheel is arranged on the material receiving installation cabinet, and a protective belt is wound on the protective belt winding wheel; the receiving winding wheel is arranged on the receiving end mounting cabinet and is used for winding the semiconductor packaging winding belt released from the material discharging winding wheel and winding the protective belt released from the protective belt winding wheel; the delivery track is arranged on the connecting seat and used for supporting the semiconductor packaging tape in the delivery process between the discharging roller and the receiving roller; and the dustproof film rolling wheel is arranged on the discharging end mounting cabinet and used for rolling the dustproof film torn off from the semiconductor packaging rolling belt. The invention can automatically remove the dustproof film on the semiconductor packaging tape so as to conveniently realize the release of the semiconductor packaging tape from the discharging coil stock and the collection to the receiving coil wheel.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip tape feeding device.
Background
The chip packaging technology is to put the integrated circuit spiral slice on the base plate which plays a bearing role, lead out the pins, and then fix and package the integrated circuit spiral slice into a whole. Impurities and bad gases in the air, even water vapor, corrode the precise circuit on the chip in the packaging process, and further cause the electrical performance to be reduced. Different packaging technologies have great differences in manufacturing processes and technologies, and play a crucial role in the performance of the chip after packaging. With the rapid development of photoelectric and micro-electrical manufacturing technology, electronic products are always developed toward smaller, lighter and cheaper products, and therefore, the packaging form of chip components is continuously improved.
In recent years, tape automated bonding technology is often used for packaging chips. The tape automated bonding technique connects a chip to a metal circuit disposed on a flexible chip carrier tape. Existing tape-wound chip package assemblies, for example: tape Carrier Package (TCP), flip Chip Film Package (COF Package), and the like.
When packaging chips on a tape, a semiconductor packaging tape, which is generally composed of a tape and chips thereon, is often transported to a packaging factory for packaging in a package. Before packaging, a protective film is required to cover the chips on the tape, and the tape loading device re-adheres a protective film to the semiconductor packaging tape which does not have the protective film originally in the process of transferring the semiconductor packaging tape from the discharging reel to the winding reel.
The semiconductor packaging tape in the prior art has no protection measures before moving to the protective film packaging area, so that dust is easily accumulated in the tape in the transferring process, and when the tape is fed on a reel, the adjacent tapes are mutually adhered due to the existence of viscosity and are not beneficial to feeding and transferring of the semiconductor packaging tape, so that a stacking alarm is easily caused, and the yield and product abnormity are influenced. This patent designs the one deck dust-proof membrane to the one side at its chip place before semiconductor package winding leaves the factory to prior art's defect, and this dust-proof membrane not only can avoid the dust to fall on the winding tape, and avoids gluing each other between the adjacent winding tape. However, the provision of a dust-proof film over the tape results in the need to remove the film when packaging is performed.
In view of the above, it is desirable to provide a feeding device capable of removing a dustproof film during feeding.
Disclosure of Invention
The invention aims to provide a chip tape feeding device, which can be used for solving the defects in the prior art and can automatically remove a dustproof film on a semiconductor packaging tape so as to conveniently release the semiconductor packaging tape from a discharged tape and gather the semiconductor packaging tape to a receiving tape wheel.
The invention provides a chip tape feeding device, which comprises,
the machine shell comprises a discharging end mounting cabinet and a receiving end mounting cabinet which are arranged at a distance;
the connecting seat is connected between the discharging end mounting cabinet and the receiving end mounting cabinet;
the discharging winding wheel is arranged on the discharging end mounting cabinet and used for winding the semiconductor packaging winding tape;
the protective tape winding wheel is arranged on the material receiving installation cabinet, and a protective tape used for protecting the semiconductor packaging winding tape is wound on the protective tape winding wheel;
the material receiving rolling wheel is arranged on the material receiving end mounting cabinet and used for rolling the semiconductor packaging rolling belt released from the material discharging rolling wheel and rolling the protective belt released from the protective belt rolling wheel;
the delivery track is arranged on the connecting seat and used for supporting the semiconductor packaging tape in the delivery process between the discharging roller and the receiving roller;
and the dustproof film rolling wheel is arranged on the discharging end mounting cabinet and used for rolling the dustproof film torn off from the semiconductor packaging rolling belt.
Furthermore, the dustproof film rolling wheel is arranged on the lower side of the discharging rolling wheel, and the transmission rail is located between the discharging rolling wheel and the dustproof film rolling wheel in the height direction.
Furthermore, one end of the transfer track is provided with an arc-shaped part bent towards the direction back to the discharge winding wheel.
Further, the chip winding belt feeding device further comprises a guide wheel assembly; the guide wheel assembly comprises a first guide wheel arranged on the connecting seat and positioned on the upper side of the transmission rail, and a second guide wheel and a third guide wheel arranged on the upper side of the discharging rolling wheel;
the second guide wheel and the third guide wheel are positioned on the same horizontal plane, and the distance between the second guide wheel and the third guide wheel is larger than the diameter of the discharging winding wheel.
Further, the guide wheel assembly further comprises a fourth guide wheel, and the upper end of the first guide wheel and the lower end of the fourth guide wheel are located on the same horizontal plane.
Further, the first guide wheel is provided with a base, a rotating shaft fixed on the base and a rotating wheel rotatably installed on the rotating shaft;
the swiveling wheel has be used for with the laminating portion of dust mask contact is in with the setting the both sides of laminating portion are used for limiting the spacing portion of first spacing portion and the spacing portion of second of dust mask axial float.
Further, be provided with a plurality of laminating portions on the swiveling wheel, and it is a plurality of laminating portion is step-like and arranges.
Furthermore, a static dissipation instrument is arranged between the first guide wheel and the material receiving installation cabinet.
Further, the transmission track is provided with a first slide rail, a second slide rail and a supporting piece, wherein the first slide rail and the second slide rail are arranged in parallel, and the supporting piece is arranged between the first slide rail and the second slide rail;
and sliding chutes in sliding fit with the semiconductor packaging tape are respectively arranged on the side walls opposite to each other on the first sliding rail and the second sliding rail.
Furthermore, the supporting piece comprises a supporting rod and a plurality of bearings which are rotatably arranged on two sides of the supporting rod; and round chamfers are respectively arranged on two sides of the bearing, and the bearing is made of an antistatic material.
Compared with the prior art, the dustproof film is arranged on the semiconductor packaging tape on the discharging reel, so that the phenomenon that dust exists on the collecting tape in the transferring process is avoided, and the false alarm caused by the accumulation of the semiconductor packaging tape due to the viscosity effect between adjacent tapes in the discharging process of the discharged coil materials is avoided. The dustproof film is automatically rolled through the dustproof film rolling wheel so as to conveniently realize the release of the semiconductor packaging rolling belt from the discharging rolling belt and the collection of the semiconductor packaging rolling belt to the receiving rolling wheel.
Drawings
Fig. 1 is a schematic structural diagram of a chip tape loading device disclosed in an embodiment of the present invention;
fig. 2 is a front view of the chip tape loading device disclosed in the embodiment of the present invention;
fig. 3 is a schematic structural view of a discharge end mounting cabinet in the chip tape loading device disclosed in the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a transfer track in the chip tape loading device disclosed in the embodiment of the invention;
fig. 5 is a schematic structural diagram of a support member in the chip tape loading apparatus according to the embodiment of the present invention;
fig. 6 is a schematic structural view of a first guide wheel in the chip tape loading device disclosed in the embodiment of the invention;
fig. 7 is a front view of a first guide wheel in the chip tape loading device disclosed in the embodiment of the invention;
description of reference numerals: 1-cabinet, 11-discharge end mounting cabinet, 12-receiving end mounting cabinet, 13-connecting seat, 2-discharge reel, 3-protective tape reel, 4-receiving reel, 5-transfer rail, 50-arc, 51-first slide, 510-slide, 52-second slide, 53-support, 531-support bar, 532-bearing,
6-dustproof film rolling wheel, 7-guide wheel assembly, 71-first guide wheel, 711-base, 712-rotating shaft, 713-rotating wheel, 7131-first limiting part, 7132-second limiting part, 7133-attaching part, 72-second guide wheel, 73-third guide wheel, 74-fourth guide wheel, 8-static dissipater, 100-semiconductor packaging tape and 101-dustproof film.
Detailed Description
The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
The embodiment of the invention comprises the following steps: as shown in fig. 1-3, a chip tape feeding device is disclosed, which comprises a casing 1 having a feeding end mounting cabinet 11 and a receiving end mounting cabinet 12 arranged at a distance;
and the connecting seat 13 is connected between the discharging end mounting cabinet 11 and the receiving end mounting cabinet 12.
And the discharging winding wheel 2 is arranged on the discharging end mounting cabinet 11 and used for winding the semiconductor packaging winding tape 100. The semiconductor packaging tape 100 on the discharging reel 2 has a tape and a chip disposed on the tape, and the tape is electrically connected with the chip.
And a protective tape winding wheel 3 arranged on the material receiving mounting cabinet 12 and wound with a protective tape for protecting the semiconductor packaging tape 100. The protective tape is used for packaging on the semiconductor package tape 100 to protect the chips on the tape.
And the material receiving rolling wheel 4 is arranged on the material receiving end mounting cabinet 12 and used for rolling the semiconductor packaging rolling belt 100 released from the material discharging rolling wheel 2 and the protective belt released from the protective belt rolling wheel 4. The discharge reel 2 releases the semiconductor package tape 100 without the protective tape, and the receiving reel 4 simultaneously winds the protective tape from the protective tape reel 3 when collecting the semiconductor package tape 100 released from the discharge reel 2, thereby realizing packaging of the protective tape on the semiconductor package tape 100.
The protection belt winding wheel 3 is arranged at the lower side of the material receiving winding wheel 4, the material receiving winding wheel 4 receives the semiconductor packaging winding belt 100 from the material discharging winding wheel 2 at one time and receives the protection belt from the protection belt winding wheel 3 at the same time, and in the process that the semiconductor packaging winding belt 100 is wound into the material receiving winding wheel 4, the protection belt is attached to the semiconductor packaging winding belt 100 released by the material discharging automatic winding wheel 2 after being released from the protection belt winding wheel 3 so as to realize the sealing protection of chips on the protection belt. It should be noted that the receiving winding wheel 4 plays a role in pulling the semiconductor packaging tape 100 on the discharging winding wheel 2, and the receiving winding wheel 4 pulls the semiconductor packaging tape 100 on the discharging winding wheel 2 to release.
And a transmission rail 5 arranged on the connecting seat 13 for supporting the semiconductor packaging tape 100 in the transmission process between the discharging roller 2 and the receiving roller 4. Since the semiconductor package tape 100 is provided with the chip thereon. Therefore, in the transmission process of the semiconductor packaging tape 100 released from the discharging reel 2, the semiconductor packaging tape 100 in transmission between the receiving reel 4 and the discharging reel 2 can drop, and the semiconductor packaging tape 100 in transmission between the receiving reel 4 and the discharging reel 2 can be supported by the transmission rail 5, so that the semiconductor packaging tape 100 can be conveniently wound by the receiving reel 4.
And the dustproof film rolling wheel 6 is arranged on the discharging end mounting cabinet 11 and is used for rolling the dustproof film 101 torn off from the semiconductor packaging rolling tape 100.
Because the semiconductor package tape 100 needs to be transported to the packaging station before the protection tape is packaged, in order to avoid dust generation on the tape 100 and accumulation of the tape in the feeding process due to adhesion between the tapes in the transporting process, a layer of dust-proof film 101 is arranged on one surface, on which the chip is fixed, of the semiconductor package tape 100 on the feeding reel 2. The dust-proof film 101 can completely cover the surface of the semiconductor package tape 100 on which the chip is disposed. Therefore, it is necessary to remove the dust-proof film 101 of the layer before the protective tape is packaged on the semiconductor package tape 100, so that the packaging of the protective tape can be easily achieved. The dust-proof film 101 is wound by the dust-proof film winding wheel 6 so as to conveniently remove the dust-proof film 101.
Further, in the present embodiment, the dustproof film winding wheel 6 is disposed at the lower side of the material placing winding wheel 2, and the transmission rail 5 is located between the material placing winding wheel 2 and the dustproof film winding wheel 6 in the height direction. In the process of rolling the dustproof film 101, the dustproof film rolling wheel 6 also comprises a guide wheel assembly 7 for conveniently realizing the rolling of the dustproof film 101 and collecting the chip rolling belt feeding device; the guide wheel assembly 7 comprises a first guide wheel 71 arranged on the connecting seat 13 and positioned at the upper side of the transmission rail 5, and a second guide wheel 72 and a third guide wheel 73 arranged at the upper side of the discharging roller 2. The second guide wheel 72 and the third guide wheel 73 are positioned on the same horizontal plane, and the distance between the second guide wheel 72 and the third guide wheel 73 is larger than the diameter of the discharging winding wheel 2.
The side of the semiconductor package tape 100 where the chips are disposed faces upward during the transfer on the transfer rail 5, so that the first guide wheel 71 is disposed on the connection seat 13, and the dustproof film 101 bypasses the first guide wheel 71, then bypasses the upper side of the discharge reel 2, and finally retracts into the dustproof film reel 6.
In order to save space more effectively, the dustproof film winding wheel 6 is arranged right below the discharging winding wheel 2. Such an arrangement also requires that the dustproof film 101 needs to bypass the feeding roller 2 in the recycling process, and in order to prevent the dustproof film 101 from being wound into the feeding roller 2 in the recycling process, the second guide wheel 72 and the third guide wheel 73 are arranged above the feeding roller 2, and the distance between the second guide wheel 72 and the third guide wheel 73 is larger than the maximum diameter of the feeding roller 2, so that the dustproof film 101 can be prevented from being wound into the feeding roller 2 in the winding process.
Further, the guide wheel assembly 7 further includes a fourth guide wheel 74, and the first guide wheel 71, the second guide wheel 72, and the fourth guide wheel 74 are arranged in a triangular shape. The upper end of the first guide wheel 71 and the lower end of the fourth guide wheel 74 are located on the same horizontal plane, and the right end of the second guide wheel 72 and the left end of the fourth guide wheel 74 are located on the same vertical direction. The tension of the dustproof film 101 in the winding process can be improved due to the arrangement of the fourth guide wheel 74, and the winding effect is prevented from being affected due to looseness caused by long-distance transmission.
In this embodiment, as shown in fig. 6 to 7, the first guide pulley 71 has a base 711, a rotating shaft 712 fixed to the base 711, and a rotating wheel 713 rotatably mounted on the rotating shaft 712.
The rotation wheel 713 has a fitting portion 7133 for contacting the dust-proof film 101, and a first stopper portion 7131 and a second stopper portion 7132 provided on both sides of the fitting portion 7133 for restricting axial movement of the dust-proof film 101.
The distance between the first limiting portion 7131 and the second limiting portion 7132 is slightly larger than the width of the dustproof film 101, so that the dustproof film 101 attached to the rotating wheel 713 is driven, and the dustproof film 101 is attached to the attaching portion 7133 and driven along with the rotation of the rotating wheel 713.
In the actual use process, the tape has multiple specifications, that is, the tape has multiple widths, and the tape with multiple widths needs dustproof films with multiple widths for protection, so that the rotating wheel 713 in the embodiment is provided with multiple attaching portions 7133 for being suitable for transmission of more tapes, and the attaching portions 7133 are arranged in a step shape.
In the present embodiment, the first guide wheel 71, the second guide wheel 72, the third guide wheel 73 and the fourth guide wheel 74 have the same structure, and the detailed description of the rest of the guide wheels is omitted.
Further, in order to avoid static electricity generated between the torn dustproof film 101 and the winding belt, a static electricity dissipation instrument 8 is further arranged between the first guide wheel 71 and the material receiving installation cabinet 12. The static dissipater 8 is arranged at the position where the dustproof film 101 is firstly torn, and the first guide wheel 71 is the starting point of the tearing of the dustproof film 101, so the static dissipater 8 is arranged between the first guide wheel 71 and the material receiving mounting cabinet 12 and is close to the first guide wheel 71.
After the semiconductor package tape 100 is released from the discharge reel 2, the semiconductor package tape 100 is allowed to naturally sag and then upwardly enter the transfer rail 5. The arrangement of the structure avoids that the discharge winding material 2 is directly placed on the transmission track 5, and after the discharge winding wheel 2 completely releases the semiconductor packaging winding tape 100, the semiconductor packaging winding tape 100 is rapidly pulled under the action of the material receiving winding wheel 4 due to the fact that the dragging force of the discharge winding wheel 2 to the semiconductor packaging winding tape 100 is cancelled. The semiconductor packaging tape 100 can be released from the discharging roll material 2 and then droop by a distance to detect whether the discharging roll wheel 2 is released or not in time. Can set up detection device in the position of the flagging minimum of semiconductor package winding tape 100 below ground, after semiconductor package winding tape 100 on blowing reel 2 releases completely, owing to do not have the effect of the tractive effort of blowing coil stock 2, semiconductor package winding tape 100 can be to the tenesmus and fall to the detection device position, can in time confirm after the detection device detects that semiconductor package winding tape 100 on blowing reel 2 has released completely and finishes.
Since the semiconductor package tape 100 hangs down by a distance before rising up to the transfer rail 5 during the transfer process to the transfer rail 5, in order to more smoothly realize the transition of the semiconductor package tape 100 to the transfer rail 5, an arc portion 50 bent in a direction away from the discharge reel 2 is provided at one end of the transfer rail 5 near the discharge-end mounting cabinet 11.
Specifically, as shown in fig. 4 to 5, the transfer rail 5 has a first slide rail 51, a second slide rail 52 and a support 53 disposed between the first slide rail 51 and the second slide rail 52;
the side walls of the first slide rail 51 and the second slide rail 52 opposite to each other are respectively provided with a slide groove 510 which is slidably matched with the semiconductor packaging tape 100.
Further, the occurrence of scratches on the semiconductor packaging tape 100 during its transfer on the transfer rail 5 is prevented. The supporting member 53 comprises a supporting rod 531 and a plurality of bearings 532 rotatably mounted on two sides of the supporting rod 531; both sides of the bearing 532 are respectively provided with a round chamfer to prevent both ends of the semiconductor package tape 100 from being scratched.
The bearing is adopted for supporting and sliding, the rolling is generated along with the movement of the semiconductor packaging tape 100 during the transmission, and the friction force is small; the bad influence of scratch and the like on the semiconductor packaging tape 100 in the transmission process can be avoided.
The bearing 532 is made of antistatic material, so that static electricity generated by material belt transmission can be avoided, and foreign matters can be adsorbed. The bearing is lubricated in an oil-free and self-lubricating manner, so that the influence of oil stains on the semiconductor packaging tape 100 can be avoided. The size of the space between the two bearings oppositely disposed on the support 53 is set according to the size of the semiconductor packaging tape 100, and can be applied to products of 35mm, 48mm and 70 mm.
The construction, features and functions of the present invention are described in detail in the embodiments illustrated in the drawings, which are only preferred embodiments of the present invention, but the present invention is not limited by the drawings, and all equivalent embodiments modified or changed according to the idea of the present invention should fall within the protection scope of the present invention without departing from the spirit of the present invention covered by the description and the drawings.
Claims (10)
1. A chip tape feeding device is characterized by comprising,
the machine shell comprises a discharging end mounting cabinet and a receiving end mounting cabinet which are arranged at a distance;
the connecting seat is connected between the discharging end mounting cabinet and the receiving end mounting cabinet;
the discharging winding wheel is arranged on the discharging end mounting cabinet and used for winding the semiconductor packaging winding tape;
the protective tape winding wheel is arranged on the material receiving installation cabinet, and a protective tape used for protecting the semiconductor packaging winding tape is wound on the protective tape winding wheel;
the material receiving rolling wheel is arranged on the material receiving end mounting cabinet and used for rolling the semiconductor packaging rolling belt released from the material discharging rolling wheel and rolling the protective belt released from the protective belt rolling wheel;
the delivery track is arranged on the connecting seat and used for supporting the semiconductor packaging tape in the delivery process between the discharging roller and the receiving roller;
and the dustproof film rolling wheel is arranged on the discharging end mounting cabinet and used for rolling the dustproof film torn off from the semiconductor packaging rolling belt.
2. The chip tape feeding device according to claim 1, wherein: the dustproof film rolling wheel is arranged on the lower side of the discharging rolling wheel, and the transmission rail is located between the discharging rolling wheel and the dustproof film rolling wheel in the height direction.
3. The chip tape feeding device according to claim 2, wherein: one end of the transfer track is provided with an arc-shaped part bent towards the direction back to the discharging winding wheel.
4. The chip tape feeding device according to claim 2, wherein: the chip winding belt feeding device further comprises a guide wheel assembly; the guide wheel assembly comprises a first guide wheel arranged on the connecting seat and positioned on the upper side of the transmission rail, and a second guide wheel and a third guide wheel arranged on the upper side of the discharging rolling wheel;
the second guide wheel and the third guide wheel are positioned on the same horizontal plane, and the distance between the second guide wheel and the third guide wheel is larger than the diameter of the discharging winding wheel.
5. The chip tape feeding device according to claim 4, wherein: the guide wheel assembly further comprises a fourth guide wheel, and the upper end of the first guide wheel and the lower end of the fourth guide wheel are located on the same horizontal plane.
6. The chip tape feeding device according to claim 4, wherein: the first guide wheel is provided with a base, a rotating shaft fixed on the base and a rotating wheel rotatably arranged on the rotating shaft;
the swiveling wheel has be used for with the laminating portion of dust mask contact is in with the setting the both sides of laminating portion are used for limiting the spacing portion of first spacing portion and the spacing portion of second of dust mask axial float.
7. The chip tape feeding device according to claim 6, wherein: be provided with a plurality of laminating portions on the swiveling wheel, and it is a plurality of laminating portion is the step form and arranges.
8. The chip tape feeding device according to claim 4, wherein: and a static dissipation instrument is also arranged between the first guide wheel and the material receiving installation cabinet.
9. The chip tape feeding device according to claim 1, wherein: the transmission track is provided with a first slide rail, a second slide rail and a supporting piece, wherein the first slide rail and the second slide rail are arranged in parallel, and the supporting piece is arranged between the first slide rail and the second slide rail;
and sliding chutes in sliding fit with the semiconductor packaging tape are respectively arranged on the side walls opposite to each other on the first sliding rail and the second sliding rail.
10. The chip tape feeding device according to claim 9, wherein: the supporting piece comprises a supporting rod and a plurality of bearings which are rotatably arranged on two sides of the supporting rod; and round chamfers are respectively arranged on two sides of the bearing, and the bearing is made of an antistatic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010316661.0A CN111498580B (en) | 2020-04-21 | 2020-04-21 | Chip winding tape feeding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010316661.0A CN111498580B (en) | 2020-04-21 | 2020-04-21 | Chip winding tape feeding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111498580A CN111498580A (en) | 2020-08-07 |
| CN111498580B true CN111498580B (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010316661.0A Active CN111498580B (en) | 2020-04-21 | 2020-04-21 | Chip winding tape feeding device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08143218A (en) * | 1994-11-24 | 1996-06-04 | Sanyo Electric Co Ltd | Protection sheet peeling device |
| CN1841657A (en) * | 2005-03-31 | 2006-10-04 | 日东电工株式会社 | Protective tape separating method and apparatus using the same |
| JP2008201515A (en) * | 2007-02-19 | 2008-09-04 | Yokohama Rubber Co Ltd:The | Feeding device for band-like material |
| CN203006608U (en) * | 2012-11-27 | 2013-06-19 | 汉达精密电子(昆山)有限公司 | Automatic feeding and stripping mechanism |
| CN110371762A (en) * | 2019-08-16 | 2019-10-25 | 深圳市欣中大自动化技术有限公司 | A kind of material stripping device, material stripping method and charging and discharging mechanism |
-
2020
- 2020-04-21 CN CN202010316661.0A patent/CN111498580B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08143218A (en) * | 1994-11-24 | 1996-06-04 | Sanyo Electric Co Ltd | Protection sheet peeling device |
| CN1841657A (en) * | 2005-03-31 | 2006-10-04 | 日东电工株式会社 | Protective tape separating method and apparatus using the same |
| JP2008201515A (en) * | 2007-02-19 | 2008-09-04 | Yokohama Rubber Co Ltd:The | Feeding device for band-like material |
| CN203006608U (en) * | 2012-11-27 | 2013-06-19 | 汉达精密电子(昆山)有限公司 | Automatic feeding and stripping mechanism |
| CN110371762A (en) * | 2019-08-16 | 2019-10-25 | 深圳市欣中大自动化技术有限公司 | A kind of material stripping device, material stripping method and charging and discharging mechanism |
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| Publication number | Publication date |
|---|---|
| CN111498580A (en) | 2020-08-07 |
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Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Material Technology Co.,Ltd. Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Beijing yisiwei Material Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Technology Co.,Ltd. |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20210624 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Hefei Qizhong Sealing Technology Co.,Ltd. |