CN111383969A - Flip-chip paster produces line circuit board buffer memory equipment - Google Patents
Flip-chip paster produces line circuit board buffer memory equipment Download PDFInfo
- Publication number
- CN111383969A CN111383969A CN201811616756.3A CN201811616756A CN111383969A CN 111383969 A CN111383969 A CN 111383969A CN 201811616756 A CN201811616756 A CN 201811616756A CN 111383969 A CN111383969 A CN 111383969A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- buffer memory
- caching
- memory region
- line circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a circuit board caching device for a flip chip mounting production line, which comprises a rack, wherein a caching device consisting of a first caching area, a second caching area and a third caching area which are sequentially connected end to end is arranged in the rack, a conveying device and a photoelectric sensor are arranged in the caching device, a lifting stopper is arranged on one side, close to the second caching area, of the first caching area, a material box is arranged below the second caching area, the material box rises from a gap of the second caching area through a motor at the bottom, and photoelectric sensors are uniformly arranged in the first caching area and the third caching area. The invention automatically receives the circuit boards transmitted by the reflow soldering equipment, caches the circuit boards, and after the maintenance of the unloading equipment is completed and started, the cache equipment transmits the stored circuit boards to the unloading equipment, thereby avoiding the occurrence of quality abnormity such as stacking impact of the circuit boards.
Description
Technical Field
The invention mainly relates to the field of flip chip mounting, in particular to a circuit board caching device of a flip chip mounting production line.
Background
At flip-chip paster production line, what reflow soldering equipment connected at the back is circuit board unloading equipment, when this unloading equipment trouble-free alarm, this equipment can be shut down and receive the circuit board that reflow soldering came out, but the guipure conveying circuit board of reflow soldering equipment can not stop, can lead to circuit board chip welding bad if stopping, the circuit board that conveys out in succession will pile up the kneck at reflow soldering equipment and unloading equipment, lead to the circuit board to pile up, the collision, drop even, thereby lead to the product quality unusual, if damaged, the welding point damages, circuit board pollution etc.. In view of this, a circuit board buffer device is needed to be added in front of the unloading device, so that when the unloading device fails and stops working, the buffer device can automatically receive the circuit boards sent by the reflow soldering device, buffer and place the circuit boards, and when the unloading device is repaired and started, the buffer device can send the stored circuit boards to the unloading device again, thereby avoiding the occurrence of quality abnormality such as stacking impact of the circuit boards.
Published chinese utility model patent, application No. CN201621425111.8, patent name: chip flip-chip paster equipment, application date: 20161223, the invention relates to a chip flip chip device, which comprises a chip storage area and a chip patch area, wherein the chip storage area and the chip patch area are arranged oppositely, a first rotary table and a second rotary table are arranged between the chip storage area and the chip patch area along the direction from the chip storage area to the chip patch area, the first rotary table and the second rotary table both comprise a rotating shaft and a plurality of chip suction devices arranged around the circumference of the rotating shaft, the first rotary table sucks the chip in the chip storage area, the contact surface of the chip suction devices of the first rotary table and the chip is the surface of the chip with a bonding pad, the second rotary table sucks the chip adsorbed by the first rotary table and places the chip in the chip patch area, and the surface of the chip with the bonding pad faces the chip patch area, thereby realizing the chip flip chip. The invention has the advantages that the two rotary tables alternately adsorb the chip, so that the chip can be just inversely mounted when the chip is mounted in the chip mounting area, the preorder process of inversely mounting the chip is simplified, and the chip mounting efficiency is improved.
Disclosure of Invention
The invention provides a circuit board cache device of a flip chip production line, which aims at the defects of the prior art and comprises a rack 1, wherein a cache device formed by sequentially connecting a first cache region 2, a second cache region 3 and a third cache region 4 end to end is arranged in the rack 1, a conveying device and a photoelectric sensor 5 are arranged in the cache device, a lifting stopper 6 is arranged on one side, close to the second cache region 3, of the first cache region 2, a material box 7 is arranged below the second cache region 3, the material box 7 rises from a gap of the second cache region 3 through a motor at the bottom, and the photoelectric sensors 5 are uniformly arranged in the first cache region 2 and the third cache region 4.
Preferably, the conveying device is composed of conveying rollers 8 arranged in an array shape, and the conveying rollers 8 arranged in the first buffer area 2 and the second buffer area 3 are respectively controlled by respective motors.
Preferably, photoelectric sensors 5 are arranged at the entrance and the exit of the circuit board of one section of the buffer area 2 and on the path.
Preferably, a photoelectric sensor 5 is arranged at the entrance and the exit of the circuit board of the second buffer area 3, and the photoelectric sensor 5 is arranged below one side of the magazine 7 close to the exit of the circuit board.
Preferably, the conveyor is provided with photosensors 5 on both sides of the dam 6.
Preferably, the inlet end of the buffer device is connected to the circuit board outlet of the reflow soldering device, and the outlet end of the buffer device is connected to the inlet of the circuit board discharging device.
Preferably, the bottom of the frame 1 is provided with a moving roller.
The invention has the beneficial effects that: the buffer device can automatically receive the circuit boards transmitted by the reflow soldering device, the circuit boards are stored in the buffer device, and when the unloading device finishes maintenance and starts, the buffer device transmits the stored circuit boards to the unloading device, so that quality abnormity such as stacking impact of the circuit boards is avoided.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a top view of the present invention;
in the figure, the position of the upper end of the main shaft,
1. a frame; 2. a section of cache area; 3. a second segment of cache area; 4. a segment cache region; 5. a photosensor; 6. a blocker; 7. a magazine; 8. and (5) conveying the roller.
Detailed Description
As shown in fig. 1-2, the present invention includes: the buffer device comprises a frame 1, a buffer device which is formed by sequentially connecting a first buffer area 2, a second buffer area 3 and a third buffer area 4 end to end is arranged in the frame 1, a conveying device and a photoelectric sensor 5 are arranged in the buffer device, one side, close to the second buffer area 3, of the first buffer area 2 is provided with a lifting type stopper 6, a material box 7 is arranged below the second buffer area 3, the material box 7 rises from a gap of the second buffer area 3 through a motor at the bottom, and the photoelectric sensor 5 is uniformly arranged in the first buffer area 2 and the third buffer area 4.
In use, when the unloading device is in fault shutdown, a fault shutdown signal is transmitted to the circuit board caching device through a cable, the arrester 6 at the tail part of the transmission track of one section of the caching area 2 of the caching device is lifted to stop the circuit board at a stopping position, then the material box 7 sinking between the rollers is lifted for one grid to contain the circuit board, the circuit board is continuously transmitted at the back, then the metal material box 7 of the receiving platform is lifted for one grid, and so on, and at most 8 circuit boards are received and stored.
In this embodiment, the conveying device is preferably composed of conveying rollers 8 arranged in an array, and the conveying rollers 8 arranged in the first buffer area 2 and the second buffer area 3 are controlled by respective motors.
Set up above-mentioned structure, utilize the conveying gyro wheel 8 of array form to accomplish the conveying to the circuit board, guarantee to play stable effect to a plurality of circuit boards.
In this embodiment, preferably, the photoelectric sensors 5 are disposed at the entrance and exit of the circuit board in the buffer area 2 and on the path.
By means of the structure, the running state of the circuit board can be monitored in real time, and the phenomena that the circuit board is stacked, collided and even dropped are avoided.
In this embodiment, preferably, a photoelectric sensor 5 is disposed at the circuit board inlet and outlet of the second buffer area 3, and the photoelectric sensor 5 is disposed below one side of the magazine 7 close to the circuit board outlet.
The photoelectric sensor 5 of the inlet and outlet is provided to detect whether the circuit board is in or out, and the photoelectric sensor 5 near the magazine 7 is provided to detect whether the circuit board is on the magazine 7.
In this embodiment, the conveyor is preferably provided with photosensors 5 on both sides of the dam 6.
With the above structure, the photoelectric sensors 5 are located on both sides of the blocker 6 for detecting the position condition of the circuit board in real time.
In this embodiment, preferably, an inlet end of the buffer device is connected to an outlet of the circuit board of the reflow soldering apparatus, and an outlet end of the buffer device is connected to an inlet of the circuit board discharging apparatus.
The structure is arranged, the circuit board caching device is additionally arranged in front of the discharging device, so that when the discharging device is in fault shutdown, the caching device can automatically receive the circuit boards transmitted by the reflow soldering device, the circuit boards are cached and placed, and when the discharging device is repaired and started, the caching device transmits the stored circuit boards to the discharging device, so that the circuit boards are prevented from being stacked and impacted, and other quality abnormalities are avoided.
In the present embodiment, it is preferable that the bottom of the frame 1 is provided with a moving roller.
By adopting the structure, the movable roller is convenient to move the rack 1, so that the position between the reflow soldering equipment and the circuit board unloading equipment is adapted.
After the unloading equipment is maintained and started, a signal is sent to the cache equipment, the cache equipment descends the metal material box of the receiving platform lattice by lattice, the circuit board contained in the metal material box is released to the conveying roller, then the roller rotates to convey the circuit board to the unloading equipment, the receiving platform sinks below the roller after the releasing is completed, and the equipment operates normally.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.
Claims (7)
1. The utility model provides a flip-chip paster produces line circuit board buffer memory equipment, a serial communication port, including frame (1), be provided with the buffer memory device who comprises one section buffer memory region (2), two-stage buffer memory region (3) and three-section buffer memory region (4) end to end connection in proper order in frame (1), install conveyer and photoelectric sensor (5) in the buffer memory device, the blocker (6) of over-and-under type are installed to one side that one section buffer memory region (2) are close to two-stage buffer memory region (3), two-stage buffer memory region (3) below is provided with magazine (7), motor through the bottom of magazine (7) rises from the gap of two-stage buffer memory region (3), evenly be provided with photoelectric sensor (5) in one section buffer memory region (2) and three-stage buffer memory region (4).
2. The flip chip production line circuit board caching device of claim 1, wherein: the conveying device is composed of conveying rollers (8) arranged in an array shape, and the conveying rollers (8) arranged in the first-section cache region (2) and the second-section cache region (3) are respectively controlled by respective motors.
3. The flip chip production line circuit board caching apparatus of claim 2, wherein: photoelectric sensors (5) are arranged at the entrance and the exit of the circuit board of the buffer area (2) and on the path of the line.
4. The flip chip production line circuit board caching apparatus of claim 3, wherein: photoelectric sensors (5) are arranged at the circuit board entrance and exit of the second buffer area (3), and the photoelectric sensors (5) are arranged below one side, close to the circuit board exit, of the material box (7).
5. The flip chip production line circuit board caching apparatus of claim 4, wherein: photoelectric sensors (5) are arranged on two sides of the conveyor, which are positioned on the interceptor (6).
6. The flip chip production line circuit board caching apparatus of claim 5, wherein: the inlet end of the buffer device is connected to the circuit board outlet of the reflow soldering device, and the outlet end of the buffer device is connected to the inlet of the circuit board discharging device.
7. The flip chip mounting line circuit board caching apparatus of claim 6, wherein: the bottom of the frame (1) is provided with a movable roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811616756.3A CN111383969A (en) | 2018-12-28 | 2018-12-28 | Flip-chip paster produces line circuit board buffer memory equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811616756.3A CN111383969A (en) | 2018-12-28 | 2018-12-28 | Flip-chip paster produces line circuit board buffer memory equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111383969A true CN111383969A (en) | 2020-07-07 |
Family
ID=71216569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811616756.3A Pending CN111383969A (en) | 2018-12-28 | 2018-12-28 | Flip-chip paster produces line circuit board buffer memory equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111383969A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113879593A (en) * | 2021-12-06 | 2022-01-04 | 常州铭赛机器人科技股份有限公司 | Paste dress carousel buffer memory device |
-
2018
- 2018-12-28 CN CN201811616756.3A patent/CN111383969A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113879593A (en) * | 2021-12-06 | 2022-01-04 | 常州铭赛机器人科技股份有限公司 | Paste dress carousel buffer memory device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207861360U (en) | NG/OK automatic plate collecting machines | |
| CN109230517A (en) | Full-automatic loading and unloading test equipment | |
| JP2015168456A (en) | Method and apparatus for supplying bag | |
| CN106743739B (en) | A kind of feeding device | |
| CN108791999B (en) | braiding and packaging equipment capable of automatically identifying direction | |
| CN109205260A (en) | Capacitor appearance detecting device | |
| CN111383969A (en) | Flip-chip paster produces line circuit board buffer memory equipment | |
| CN111112131A (en) | Wafer type detection equipment for food packaging and working method thereof | |
| CN109018915B (en) | Movable belt conveyor broken belt protection and catching system | |
| CN204713966U (en) | The safety protection mechanism in machine on cantilever sent out by layer backing plate collection | |
| WO2018072378A1 (en) | Cache mechanism prior to battery coding and boxing | |
| CN205574877U (en) | Trigger on PCB board | |
| CN104860027A (en) | Safety protection mechanism on cantilever in laminated base plate centralized transferring machine | |
| KR100478597B1 (en) | battery cell automatic provide machine | |
| CN109533848B (en) | Online multilayer circuit board buffer memory equipment | |
| CN207289584U (en) | Determine intercept material path with testing agency | |
| CN209312736U (en) | A kind of upside-down mounting patch producing line circuit board buffer memory device | |
| CN207516770U (en) | It is a kind of that there is the machine tool control system of automatic charging | |
| CN206481500U (en) | The sandblasting pipeline system and its blanking equipment of a kind of flexible PCB | |
| CN109178952A (en) | Polyurethane laminboard automatic stacking equipment | |
| CN209306448U (en) | Capacitor appearance detecting device | |
| CN107826740A (en) | A kind of quick-feeding device of extra quality position | |
| CN210548916U (en) | Flexible circuit board laser cutting equipment | |
| CN205221769U (en) | Automatic dispensing device of kir package | |
| CN219791366U (en) | Elevator entry tobacco bale links package detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |