CN111496108A - Stamping die's cooling system and stamping die - Google Patents

Stamping die's cooling system and stamping die Download PDF

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Publication number
CN111496108A
CN111496108A CN202010359455.8A CN202010359455A CN111496108A CN 111496108 A CN111496108 A CN 111496108A CN 202010359455 A CN202010359455 A CN 202010359455A CN 111496108 A CN111496108 A CN 111496108A
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CN
China
Prior art keywords
heat
die
heat conducting
cooling system
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010359455.8A
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Chinese (zh)
Inventor
廖勇
韦旺华
覃存君
吴秀桃
王义基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongfeng Liuzhou Motor Co Ltd
Original Assignee
Dongfeng Liuzhou Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongfeng Liuzhou Motor Co Ltd filed Critical Dongfeng Liuzhou Motor Co Ltd
Priority to CN202010359455.8A priority Critical patent/CN111496108A/en
Publication of CN111496108A publication Critical patent/CN111496108A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/16Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/10Die sets; Pillar guides

Abstract

The invention discloses a cooling system of a stamping die and the stamping die, wherein the cooling system of the stamping die comprises a heat conducting rod structure, a heat radiating plate and a blowing assembly, the heat conducting rod structure is provided with a heat collecting part used for being installed in an installation die and a heat conducting part extending out of the installation die, the heat radiating plate is used for being installed on the installation die and is positioned at the outer side of the installation die, the heat radiating plate is in thermal contact with the heat conducting part, the blowing assembly is used for being installed on the installation die, and the blowing assembly comprises an air nozzle corresponding to the heat radiating plate and used for blowing air to the heat radiating plate, so that the effect of rapidly reducing the temperature of the installation die is achieved.

Description

Stamping die's cooling system and stamping die
Technical Field
The invention relates to the technical field of stamping dies, in particular to a cooling system of a stamping die and the stamping die.
Background
After the stamping die is subjected to continuous stamping operation, the temperature of the die is high, the forming quality of a sheet metal part is influenced, and the cooling effect of the traditional die is not ideal and needs to be optimized.
Disclosure of Invention
The invention mainly aims to provide a cooling system of a stamping die and the stamping die, and aims to optimize the cooling system of the stamping die so as to reduce the operation temperature of the die and improve the quality of a stamped product.
In order to achieve the above object, the present invention provides a cooling system for a stamping die, which is used for the stamping die, the stamping die has an upper die and a lower die, the upper die or the lower die is a mounting die, and the cooling system for the stamping die includes:
the heat conducting rod structure is provided with a heat collecting part installed in the installation die and a heat conducting part extending out of the installation die;
a heat dissipation plate mounted to the mounting die and located outside the mounting die, the heat dissipation plate being in thermal contact with the heat conduction portion; and the number of the first and second groups,
and the blowing assembly is used for being installed on the installation die and comprises an air nozzle which is arranged corresponding to the heat dissipation plate and used for blowing air to the heat dissipation plate.
Optionally, the installation mold forms a heat collecting space, and the heat conducting rod structure includes:
the primary heat conducting rod extends up and down, and the lower end of the primary heat conducting rod forms the heat collecting part and is used for extending into the heat collecting space; and the number of the first and second groups,
and the second-stage heat conducting rod extends along the horizontal direction, one end of the second-stage heat conducting rod is in thermal contact with the upper end of the first-stage heat conducting rod, and the other end of the second-stage heat conducting rod forms the heat conducting part.
Optionally, the heat conducting rod structure further comprises:
the heat conduction mounting plate extends along the horizontal direction, is arranged in the mounting die and is arranged at the upper end of the primary heat conduction rod; and the number of the first and second groups,
and the heat conduction pressing plate is arranged at the upper end of the heat conduction mounting plate and is used for pressing and fixing the secondary heat conduction rod onto the heat conduction mounting plate.
Optionally, the heat conducting pressing plates are arranged in plurality and are arranged at intervals along the extending direction of the secondary heat conducting rods.
Optionally, a heat transfer plane is formed on the outer side surface of the secondary heat conducting rod, and the heat transfer plane is attached to the heat conducting plate.
Optionally, the heat dissipation plate has a heating surface in thermal contact with the heat conducting portion and a heat dissipation surface opposite to the heating surface, and the heat dissipation surface is provided with a plurality of heat dissipation grooves;
the air tap is used for blowing air to the heat dissipation groove.
Optionally, the air-blowing assembly further comprises:
the air inlet joint is arranged on the outer side surface of the mounting die, and high-pressure heat exchange gas is introduced into the air inlet joint; and the number of the first and second groups,
and one end of the connecting pipeline is communicated to the air inlet joint, and the other end of the connecting pipeline is communicated to the air nozzle.
Optionally, the air faucet and the connecting pipeline are provided in plurality.
Optionally, the blowing assembly further comprises a concentrator, an air inlet and a plurality of air outlets are formed in the concentrator, the air inlet is communicated with the air inlet joint, and the air outlets are respectively communicated with the connecting pipelines correspondingly.
The invention also provides a stamping die, which comprises:
the heat conducting rod structure is provided with a heat collecting part installed in the installation die and a heat conducting part extending out of the installation die;
a heat dissipation plate mounted to the mounting die and located outside the mounting die, the heat dissipation plate being in thermal contact with the heat conduction portion; and the number of the first and second groups,
and the blowing assembly is used for being installed on the installation die and comprises an air nozzle which is arranged corresponding to the heat dissipation plate and used for blowing air to the heat dissipation plate.
In the technical scheme provided by the invention, the heat collecting part of the heat conducting rod structure is positioned in the mounting die, the heat conducting part extends out of the mounting die, so that heat can be conveniently conducted to the outer side of the mounting die from the inside of the mounting die, and meanwhile, the heat conducted out can be more quickly dispersed into the surrounding air by adopting the mode of combining the heat radiating plate and the air blowing assembly, so that the effect of quickly reducing the temperature of the mounting die is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of a cooling system of a stamping die according to the present invention;
FIG. 2 is a schematic view, partly in section, of a stamping die incorporating the cooling system (partial structure) of the stamping die of FIG. 1;
fig. 3 is a front view of a press die incorporating the cooling system of the press die of fig. 1.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Cooling system of stamping die 21 Heat dissipation groove
1 Heat conducting bar structure 3 Air blowing assembly
11 First-level heat conducting rod 31 Air tap
11a Heat collecting part 32 Air inlet joint
12 Second grade heat conduction stick 33 Connecting pipeline
12a Heat conducting part 34 Concentrator
121 Plane of heat transfer 1000 Stamping die
13 Heat conduction mounting plate 200 Upper die
14 Heat-conducting pressure plate 300 Lower die
2 Heat radiation plate
The object of the present invention, its functional characteristics and advantageous effects will be further described with reference to the following embodiments and drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indication is involved in the embodiment of the present invention, the directional indication is only used for explaining the relative positional relationship, the motion situation, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
After the stamping die is subjected to continuous stamping operation, the temperature of the die is high, the forming quality of a sheet metal part is influenced, and the cooling effect of the traditional die is not ideal and needs to be optimized.
In view of this, the present invention provides a stamping die, where the stamping die includes a cooling system of the stamping die, and any stamping die including the cooling system of the stamping die belongs to the protection scope of the present invention, where fig. 1 is a schematic structural diagram of an embodiment of the cooling system of the stamping die provided by the present invention, and fig. 2 to fig. 3 are schematic structural diagrams of an embodiment of the stamping die provided by the present invention.
Referring to fig. 3, the stamping die 1000 has an upper die 200 and a lower die 300, during the operation of the press mold 1000, high temperature is generated between the upper mold 200 and the lower mold 300, and therefore, it is conceivable to arrange the cooling system 100 of the stamping die on the upper die 200 or the lower die 300, of course, it is also considered that the cooling system 100 of the stamping die is arranged on the upper die 200 or the lower die 300 at the same time, the cooling effect is better, the cooling system 100 of the stamping die is arranged on the upper die 200 preferentially considering that the upper die 200 is influenced by the stamping force, the heating value of the die is obvious, the temperature rises too fast, the local softening and deformation affect the stability of the sheet metal part production, for simplicity, the cooling system 100 of the press mold is disposed on the upper mold 200 for the following description.
Referring to fig. 1 and 2, the cooling system 100 of the stamping die includes a heat conducting rod structure 1, a heat dissipating plate 2 and a blowing assembly 3, wherein the heat conducting rod structure 1 has a heat collecting portion 11a for being mounted in the mounting die and a heat conducting portion 12a extending out of the mounting die, the heat dissipating plate 2 is mounted to the mounting die and located outside the mounting die, the heat dissipating plate 2 is in thermal contact with the heat conducting portion 12a, the blowing assembly 3 is mounted to the mounting die, and the blowing assembly 3 includes air nozzles 31 corresponding to the heat dissipating plate 2 for blowing air toward the heat dissipating plate 2.
In the technical scheme provided by the invention, the heat collecting part 11a of the heat conducting rod structure 1 is positioned in the installation mould, the heat conducting part 12a extends out of the installation mould, so that heat can be conveniently conducted to the outer side of the installation mould from the inside of the installation mould, and meanwhile, the heat dissipation plate 2 and the air blowing assembly 3 are combined, so that the led-out heat can be more quickly dispersed into the surrounding air, and the effect of quickly reducing the temperature of the installation mould is achieved.
The installation mold is provided with a heat collecting space which can be analyzed through thermal simulation, different heat collecting spaces exist for different molds, and mainly the heat in the heat collecting spaces is conducted and dissipated, in addition, the heat conducting rod structure 1 can be a bent integrated heat conducting rod or a split heat conducting rod, the material of the heat conducting rod can be a metal material with higher heat conductivity, and the like, in one embodiment, the heat conducting rod structure 1 comprises a first-stage heat conducting rod 11 and a second-stage heat conducting rod 12, the first-stage heat conducting rod 11 extends along the vertical direction, the lower end of the first-stage heat conducting rod 11 forms the heat collecting part 11a and is used for extending into the heat collecting spaces, the second-stage heat conducting rod 12 extends along the horizontal direction, and one end of the second-stage heat conducting rod 12 is in thermal contact with the upper end of the first-stage heat conducting rod 11, the other end of the heat conducting portion 12a is formed, and it should be noted that the heat conducting portion is limited by the limitation of the installation space, the first-stage heat conducting rod 11 cannot directly extend to the upper end of the installation mold, and the heat dissipating plate 2 cannot be installed at the upper end of the installation mold, so that the heat dissipating plate 2 can only be arranged at the side end of the installation mold, and the heat conducting manner of the second-stage heat conducting rod is adopted, so that the path of heat circulation is changed, the arrangement of the heat conducting structure is facilitated, and a better effect is achieved.
In addition, the primary heat conduction rod 11 is provided in plurality, so that the heat collection area of the heat collection portion 11a is increased to perform heat exchange more sufficiently.
In order to facilitate the installation between the first-stage heat conducting rod 11 and the second-stage heat conducting rod 12, in an embodiment, the heat conducting rod structure 1 further includes a heat conducting mounting plate 13 and a heat conducting pressing plate 14, the heat conducting mounting plate 13 extends along a horizontal direction, the heat conducting mounting plate 13 is used for being disposed in the mounting mold and disposed at the upper end of the first-stage heat conducting rod 11, the heat conducting pressing plate 14 is disposed at the upper end of the heat conducting mounting plate 13 and used for pressing and fixing the second-stage heat conducting rod 12 to the heat conducting mounting plate 13, heat is conducted to the heat conducting mounting plate 13 through the first-stage heat conducting rod 11 and then conducted to the second-stage heat conducting rod 12, so that the change of the heat conducting direction is achieved, in addition, the heat conducting pressing plate 14 fixes the second-stage heat conducting rod 12 to the heat conducting mounting plate.
In an embodiment, the plurality of heat conducting pressing plates 14 are arranged at intervals along the extending direction of the secondary heat conducting rod 12, and by arranging the plurality of heat conducting pressing plates 14, the stability of the secondary heat conducting rod 12 is better, and meanwhile, the secondary heat conducting rod 12 is in closer contact with the heat conducting mounting plate 13, which is more beneficial to heat exchange between the secondary heat conducting rod 12 and the heat conducting mounting plate 13.
The heat dissipation plate 2 is in thermal contact with the secondary heat conduction rod 12, in an embodiment, a heat transfer plane 121 is formed on an outer side surface of the secondary heat conduction rod 12, the heat transfer plane 121 is attached to the heat conduction plate, and the outer side surface of the secondary heat conduction rod 12 is set as the heat transfer plane 121, so that a contact area between the secondary heat conduction rod 12 and the heat dissipation plate 2 is increased, and heat exchange between the secondary heat conduction rod 12 and the heat dissipation plate 2 is facilitated.
The fixing method between the secondary heat conduction rod 12 and the heat dissipation plate 2 may be welding, bonding, or fastening with bolts.
Further, in an embodiment, the heat dissipation plate 2 has a heated surface in thermal contact with the heat conducting portion 12a and a heat dissipation surface opposite to the heated surface, the heat dissipation surface is provided with a plurality of heat dissipation grooves 21, and the air nozzles 31 are configured to blow air into the heat dissipation grooves 21, so that the contact area between the heat dissipation surface and air is increased, heat exchange between the heat dissipation plate 2 and air is facilitated, and a good effect is achieved.
The blowing assembly 3 mainly accelerates heat exchange between the heat dissipation plate 2 and air, in order to avoid interference between the mold and the outside during use, the blowing assembly 3 is hidden inside the mold as much as possible, in an embodiment, the blowing assembly 3 further includes an air inlet connector 32 and a connecting pipeline 33, the air inlet connector 32 is arranged on the outer side surface of the installation mold, high-pressure heat exchange gas is introduced into the air inlet connector 32, one end of the connecting pipeline 33 is communicated with the air inlet connector 32, the other end of the connecting pipeline is communicated with the air nozzle 31, the air inlet connector 32 serves as a gas inlet, and high-pressure gas is introduced into the installation mold by connecting an air compressor and other vent pipelines, so that the setting of the blowing assembly 3 is facilitated.
Further, in an embodiment, the air nozzles 31 and the connecting pipes 33 are provided in plurality, so that the heat exchange efficiency between the heat dissipation plate 2 and the air is further increased, and the heat dissipation efficiency is further improved.
In the case of multiple connecting pipelines 33 and nozzles, in order to facilitate the layout of the pipelines, in an embodiment, the air blowing assembly 3 further includes a hub 34, the hub 34 is formed with an air inlet and multiple air outlets, the air inlet is communicated with the air inlet joint 32, and the multiple air outlets are respectively communicated with the multiple connecting pipelines 33, so that the layout of the pipelines of the air blowing assembly 3 is facilitated.
The specific heat dissipation process of the cooling system 100 of the stamping die is explained below in terms of the conduction of heat in the mounting die:
the mold is produced in a high-speed batch mode, so that the mold is locally heated, the heating temperature is higher than the first-stage heat conducting rod 11, the temperature of the first-stage heat conducting rod 11 is increased and is higher than the temperature of the heat conducting mounting plate 13, heat conduction occurs, heat is conducted to the heat conducting mounting plate 13, the temperature of the heat conducting mounting plate 13 is increased and is higher than the temperature of the second-stage heat conducting rod 12, heat conduction occurs, heat is conducted to the second-stage heat conducting rod 12, the temperature of the second-stage heat conducting rod 12 is increased and is higher than the temperature of the heat dissipation plate 2, heat conduction occurs, and heat is;
compressed air passes through in air inlet connector 32, concentrator 34 and connecting tube 33 trachea transmission to air cock 31, air pressure is higher than ambient atmospheric pressure in the air cock 31, air cock 31 with compressed gas jet to on the heating panel 2, with heat dissipation panel 2 takes place convection heat transfer, 2 heat convection of heating panel are to the ambient air in to realize the cooling.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a stamping die's cooling system for stamping die, stamping die has last mould and lower mould, go up mould or lower mould for the installation mould, its characterized in that, stamping die's cooling system includes:
the heat conducting rod structure is provided with a heat collecting part installed in the installation die and a heat conducting part extending out of the installation die;
a heat dissipation plate mounted to the mounting die and located outside the mounting die, the heat dissipation plate being in thermal contact with the heat conduction portion; and the number of the first and second groups,
and the blowing assembly is used for being installed on the installation die and comprises an air nozzle which is arranged corresponding to the heat dissipation plate and used for blowing air to the heat dissipation plate.
2. The cooling system for a press mold according to claim 1, wherein the mounting mold forms a heat collecting space therein, and wherein the heat conducting bar structure comprises:
the primary heat conducting rod extends up and down, and the lower end of the primary heat conducting rod forms the heat collecting part and is used for extending into the heat collecting space; and the number of the first and second groups,
and the second-stage heat conducting rod extends along the horizontal direction, one end of the second-stage heat conducting rod is in thermal contact with the upper end of the first-stage heat conducting rod, and the other end of the second-stage heat conducting rod forms the heat conducting part.
3. The stamping-die cooling system of claim 2, wherein the thermally conductive bar structure further comprises:
the heat conduction mounting plate extends along the horizontal direction, is arranged in the mounting die and is arranged at the upper end of the primary heat conduction rod; and the number of the first and second groups,
and the heat conduction pressing plate is arranged at the upper end of the heat conduction mounting plate and is used for pressing and fixing the secondary heat conduction rod onto the heat conduction mounting plate.
4. The cooling system for a press mold according to claim 3, wherein the heat conductive pressure plate is provided in plurality and arranged at intervals along an extending direction of the secondary heat conductive rod.
5. The cooling system for a press mold according to claim 2, wherein the outer side surface of the secondary heat conducting bar is formed with a heat transfer plane, and the heat transfer plane is attached to the heat conducting plate.
6. The cooling system for a press die according to claim 1, wherein the heat radiating plate has a heat receiving surface in thermal contact with the heat conductive portion and a heat radiating surface opposite to the heat receiving surface, the heat radiating surface being provided with a plurality of heat radiating grooves;
the air tap is used for blowing air to the heat dissipation groove.
7. The cooling system for a press die of claim 1, wherein the blow assembly further comprises:
the air inlet joint is arranged on the outer side surface of the mounting die, and high-pressure heat exchange gas is introduced into the air inlet joint; and the number of the first and second groups,
and one end of the connecting pipeline is communicated to the air inlet joint, and the other end of the connecting pipeline is communicated to the air nozzle.
8. The cooling system for a press tool of claim 7, wherein said air nozzle and said connecting line are provided in plurality.
9. The cooling system of a stamping die as recited in claim 8, wherein the blowing assembly further includes a hub, the hub is formed with an air inlet and a plurality of air outlets, the air inlet is communicated with the air inlet joint, and the plurality of air outlets are respectively communicated with the plurality of connecting pipelines.
10. A stamping die, characterized by comprising a cooling system of a stamping die according to any of claims 1 to 9.
CN202010359455.8A 2020-04-29 2020-04-29 Stamping die's cooling system and stamping die Pending CN111496108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010359455.8A CN111496108A (en) 2020-04-29 2020-04-29 Stamping die's cooling system and stamping die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010359455.8A CN111496108A (en) 2020-04-29 2020-04-29 Stamping die's cooling system and stamping die

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Publication Number Publication Date
CN111496108A true CN111496108A (en) 2020-08-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115179364A (en) * 2022-08-05 2022-10-14 莆田市城厢区星华电子模具有限公司 Circuit board stamping process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207937A (en) * 1989-02-07 1990-08-17 Honda Motor Co Ltd Forging punch and its cooling method
JP2006198659A (en) * 2005-01-21 2006-08-03 Amada Co Ltd Method and apparatus for punching plate
CN206882766U (en) * 2017-07-03 2018-01-16 万丰奥特控股集团有限公司 A kind of fixed point cooling structure of water cooling mold
CN208960795U (en) * 2018-10-15 2019-06-11 江西端品精密模具有限公司 A kind of hardware dies die radiating device convenient for safeguarding
CN110355943A (en) * 2019-05-27 2019-10-22 滁州君越高分子新材料有限公司 A kind of press injecting type molded rubber product mold
CN209647576U (en) * 2019-03-21 2019-11-19 深圳市华星祥科技有限公司 One kind can rapid shaping precision phone mould

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207937A (en) * 1989-02-07 1990-08-17 Honda Motor Co Ltd Forging punch and its cooling method
JP2006198659A (en) * 2005-01-21 2006-08-03 Amada Co Ltd Method and apparatus for punching plate
CN206882766U (en) * 2017-07-03 2018-01-16 万丰奥特控股集团有限公司 A kind of fixed point cooling structure of water cooling mold
CN208960795U (en) * 2018-10-15 2019-06-11 江西端品精密模具有限公司 A kind of hardware dies die radiating device convenient for safeguarding
CN209647576U (en) * 2019-03-21 2019-11-19 深圳市华星祥科技有限公司 One kind can rapid shaping precision phone mould
CN110355943A (en) * 2019-05-27 2019-10-22 滁州君越高分子新材料有限公司 A kind of press injecting type molded rubber product mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115179364A (en) * 2022-08-05 2022-10-14 莆田市城厢区星华电子模具有限公司 Circuit board stamping process
CN115179364B (en) * 2022-08-05 2024-03-22 莆田市城厢区星华电子模具有限公司 Circuit board stamping process

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