CN111489975A - Method for manufacturing aluminum-nickel semiconductor lead - Google Patents

Method for manufacturing aluminum-nickel semiconductor lead Download PDF

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Publication number
CN111489975A
CN111489975A CN202010324798.0A CN202010324798A CN111489975A CN 111489975 A CN111489975 A CN 111489975A CN 202010324798 A CN202010324798 A CN 202010324798A CN 111489975 A CN111489975 A CN 111489975A
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CN
China
Prior art keywords
cutting
cutting machine
equipment
aluminum
machine
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Pending
Application number
CN202010324798.0A
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Chinese (zh)
Inventor
于忠卫
黄艳艳
张建军
陈二军
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Jiangsu Poppula Semiconductor Co ltd
Nantong University
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Jiangsu Poppula Semiconductor Co ltd
Nantong University
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Application filed by Jiangsu Poppula Semiconductor Co ltd, Nantong University filed Critical Jiangsu Poppula Semiconductor Co ltd
Priority to CN202010324798.0A priority Critical patent/CN111489975A/en
Publication of CN111489975A publication Critical patent/CN111489975A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/43Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • H01L2224/432Mechanical processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys

Abstract

The invention relates to the technical field of production of an aluminum-nickel semiconductor lead and discloses a manufacturing method of the aluminum-nickel semiconductor lead, which comprises the following steps: the first step is as follows: the method comprises the steps of preparing an aluminum-nickel alloy material, checking equipment, determining that sundries are not accumulated on production equipment, starting the equipment, determining whether the equipment is intact or not, and continuing normal work.

Description

Method for manufacturing aluminum-nickel semiconductor lead
Technical Field
The invention relates to the technical field of production of an aluminum-nickel semiconductor lead, in particular to a manufacturing method of the aluminum-nickel semiconductor lead.
Background
And the lead is led out from the component packaging body. In the surface mount component, the term refers to the outer leads such as the tab lead, the J lead, and the I lead.
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
Materials having electrical conductivity between conductors and insulators at normal temperatures, called semiconductors, exist in various forms, solid, liquid, gas, plasma, and the like. Materials with poor or poor electrical and thermal conductivity, such as diamond, intraocular lenses, amber, ceramics, and the like, are commonly referred to as insulators. And metals with good electrical and thermal conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors. The material between the conductor and the insulator may simply be referred to as a semiconductor. The discovery of semiconductor materials was the latest compared to conductors and insulators, and the existence of semiconductors was not really accepted by academia until the 30's of the 20 th century when the purification technology of the materials was improved.
The existing semiconductor lead can cause waste of leftover materials when being cut, and materials can not be completely utilized, so that the waste is caused.
Disclosure of Invention
(1) Solves the technical problem
Aiming at the defects of the prior art, the invention provides a manufacturing method of an aluminum-nickel semiconductor lead.
(II) technical scheme
A manufacturing method of an aluminum-nickel semiconductor lead comprises the following steps: the first step is as follows: firstly, preparing an aluminum-nickel alloy material, then checking equipment, determining that no sundries are accumulated on production equipment, then starting the equipment, determining whether the equipment is intact and can continue to work normally, wherein the aluminum-nickel alloy is named as Raney alloy, has high catalytic performance, can spontaneously combust in the air, and is stored in absolute ethyl alcohol. The catalyst is a catalyst for reduction or hydrogenation reaction, is mostly used in organic synthesis, is silver gray amorphous powder (nickel-aluminum alloy powder) before activation of a Raney nickel catalyst, has moderate flammability, is partially activated in the presence of water and generates hydrogen, is easy to agglomerate, and is easy to weather after being exposed in the air for a long time. The nickel-aluminum alloy powder is activated into gray black particles, attached with active hydrogen, extremely unstable, oxidized and combusted in the air, needs to be soaked in water or ethanol for storage, and is mainly applied to catalytic hydrogenation reaction of basic organic chemical industry. Can be used for hydrogenation of organic carbon-hydrogen bonds, carbon-nitrogen bonds and nitroso compounds and nitro compounds; the hydrogenation of azo and azoxy compounds, imines, amines and azinium dibenzyl can also be used for dehydration reaction, cyclization reaction, condensation reaction and the like. The most typical applications are the hydrogenation of glucose, the hydrogenation of fatty nitriles. Has wide application in the fields of medicine, dye, grease, spice, synthetic fiber and the like.
The second step is that: and (4) carrying out heat treatment, namely heating the aluminum-nickel alloy material, then cooling and forming to enable the aluminum-nickel alloy material to be in a strip shape.
The third step: and performing heat treatment twice, namely heating the aluminum-nickel alloy material, and then rolling the strip-shaped aluminum-nickel alloy material into a flat plate shape by using rolling equipment, wherein the heat treatment refers to a metal hot working process for obtaining the expected structure and performance by heating, preserving heat and cooling the material in a solid state. In the process of moving from the times of stoneware to the times of cupreous and ironware, the effect of heat treatment is gradually recognized. As early as 770 b.c. to 222 a.c., chinese has found in production practice that the properties of steel vary due to the effects of temperature and pressure distortion. Softening treatment of white cast iron is an important process for manufacturing agricultural implements.
The fourth step: the aluminum-nickel alloy material rolled into a flat plate is cut into flat filaments with the specification meeting by utilizing a cutting device, the flat filaments are cut by utilizing the cutting device, after the cutting is finished, the scraps need to be collected and then are uniformly processed, the waste is avoided, and the cutting device refers to continuous casting equipment for cutting off the continuously pulled casting blank according to the sizing requirement. The cutting equipment of the continuous casting machine is divided into a metal material cutting machine and a non-metal material cutting machine by a flame cutting machine and a shearing machine. The metal material cutting machine is divided into a flame cutting machine, a plasma cutting machine, a laser cutting machine, a water jet cutting machine and the like; the non-metal material cutting machine is mainly a cutter cutting machine. The numerical control cutting machine drives a machine tool to move by using a digital program, and a cutting tool randomly provided cuts an object when the machine tool moves. The electromechanical integrated cutting machine is called a numerical control cutting machine. The laser cutting machine has the fastest efficiency, the highest cutting precision and generally smaller cutting thickness. The plasma cutting machine has fast cutting speed and certain slope of the cut surface. The flame cutting machine mainly uses two types, namely a flame cutting machine and a shearing machine, for carbon steel materials with larger thickness in the field of ferrous metallurgy.
The fifth step: determining the length of a required lead wire according to needs, cutting the flat long-wire-shaped aluminum-nickel alloy material by using cutting equipment so as to meet the use requirement, collecting excessive leftover materials after the cutting is finished when the length of the lead wire is determined, and carrying out heat treatment on the leftover materials and the processed aluminum-nickel alloy material for secondary utilization.
And a sixth step: and then the manufactured lead is detected, during the detection, a report is required to be manufactured, then the test is performed in batches, and finally the test is accepted by engineers, wherein the test report is also called a cargo damage test report, and is an objective written certificate issued after the test organization applies for the requirements of a tester to test the damaged cargo. The degree and qualification of the damage to goods is verified and often a separate verifier with credit, authority and beyond legislation is commissioned in international trade. The quality inspection before the product is sold, and the statistics of the qualified number of the products of the company are written proofs for identifying the quality of the products to reach the standard. It is obtained by quality inspection of products and equipment, and is a standard for ensuring a product quality system.
(III) advantageous effects
Compared with the prior art, the invention provides a manufacturing method of an aluminum-nickel semiconductor lead, which has the following beneficial effects:
1. this manufacturing method of aluminium nickel semiconductor lead wire, when confirming the lead wire length, after the cutting finishes, there is the leftover bits of many plays, collect these leftover bits, then carry out thermal treatment with it together with the aluminium nickel alloy material for handling, carry out the reutilization processing, and utilize cutting equipment to cut, after the cutting finishes, need collect the piece, then unify the processing, the waste has been avoided, avoided current semiconductor lead wire when the cutting, can cause the waste of leftover bits, can not be complete utilize the material, lead to the waste.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A manufacturing method of an aluminum-nickel semiconductor lead comprises the following steps: the first step is as follows: firstly, preparing an aluminum-nickel alloy material, then checking equipment, determining that no sundries are accumulated on production equipment, then starting the equipment, determining whether the equipment is intact, and continuing normal operation.
The aluminum-nickel alloy is named as Rayleigh alloy, has high catalytic performance, can be spontaneously combusted in the air, and is stored in absolute ethyl alcohol. The catalyst is a catalyst for reduction or hydrogenation reaction, is mostly used in organic synthesis, is silver gray amorphous powder (nickel-aluminum alloy powder) before activation of a Raney nickel catalyst, has moderate flammability, is partially activated in the presence of water and generates hydrogen, is easy to agglomerate, and is easy to weather after being exposed in the air for a long time. The nickel-aluminum alloy powder is activated into gray black particles, attached with active hydrogen, extremely unstable, oxidized and combusted in the air, needs to be soaked in water or ethanol for storage, and is mainly applied to catalytic hydrogenation reaction of basic organic chemical industry. Can be used for hydrogenation of organic carbon-hydrogen bonds, carbon-nitrogen bonds and nitroso compounds and nitro compounds; the hydrogenation of azo and azoxy compounds, imines, amines and azinium dibenzyl can also be used for dehydration reaction, cyclization reaction, condensation reaction and the like. The most typical applications are the hydrogenation of glucose, the hydrogenation of fatty nitriles. Has wide application in the fields of medicine, dye, grease, spice, synthetic fiber and the like.
For example: the sorbitol produced by glucose hydrogenation is used for synthesizing vitamin C, resin surfactant and the like. The catalytic hydrogenation of phenol to produce hexanediol is used for preparing hexanediamine, paint and coating. Hydrogenation of adiponitrile to produce hexamethylene diamine is an important monomer for polyamide fibers. The catalytic hydrogenation of furan to produce tetrahydrofuran is a good solvent. The hydrogenation of fatty acid after ammoniation is widely applied to organic chemical production. The hydrogenation of aniline to prepare cyclohexylamine is used in synthesizing desulfurizing agent, corrosion inhibitor, sulfurizing promoter, emulsifier, antistatic agent, bactericide, etc.
The second step is that: and (4) carrying out heat treatment, namely heating the aluminum-nickel alloy material, then cooling and forming to enable the aluminum-nickel alloy material to be in a strip shape.
The third step: and (4) carrying out heat treatment for the second time, heating the aluminum-nickel alloy material, and rolling the strip-shaped aluminum-nickel alloy material into a flat plate by using rolling equipment.
Heat treatment refers to a hot metal working process in which a material is heated, held and cooled in the solid state to achieve a desired texture and properties. In the process of moving from the times of stoneware to the times of cupreous and ironware, the effect of heat treatment is gradually recognized. As early as 770 b.c. to 222 a.c., chinese has found in production practice that the properties of steel vary due to the effects of temperature and pressure distortion. Softening treatment of white cast iron is an important process for manufacturing agricultural implements.
The fourth step: the aluminum-nickel alloy material rolled into a flat plate is cut into flat filaments with the specification meeting by utilizing a cutting device, the flat filaments are cut by utilizing the cutting device, after the cutting is finished, the scraps need to be collected and then are uniformly processed, and the waste is avoided.
The cutting device is a continuous casting device that cuts a continuously drawn strand to a predetermined length. The cutting equipment of the continuous casting machine is divided into a metal material cutting machine and a non-metal material cutting machine by a flame cutting machine and a shearing machine. The metal material cutting machine is divided into a flame cutting machine, a plasma cutting machine, a laser cutting machine, a water jet cutting machine and the like; the non-metal material cutting machine is mainly a cutter cutting machine. The numerical control cutting machine drives a machine tool to move by using a digital program, and a cutting tool randomly provided cuts an object when the machine tool moves. The electromechanical integrated cutting machine is called a numerical control cutting machine. The laser cutting machine has the fastest efficiency, the highest cutting precision and generally smaller cutting thickness. The plasma cutting machine has fast cutting speed and certain slope of the cut surface. The flame cutting machine mainly uses two types, namely a flame cutting machine and a shearing machine, for carbon steel materials with larger thickness in the field of ferrous metallurgy.
The fifth step: determining the length of a required lead wire according to needs, cutting the flat long-wire-shaped aluminum-nickel alloy material by using cutting equipment so as to meet the use requirement, collecting excessive leftover materials after the cutting is finished when the length of the lead wire is determined, and carrying out heat treatment on the leftover materials and the processed aluminum-nickel alloy material for secondary utilization.
And a sixth step: and then detecting the manufactured lead, wherein during detection, a report is required to be manufactured, then performing batch spot check, and finally checking and accepting by an engineer.
The inspection report, also called "inspection report of damaged goods", is an objective written proof issued after the inspection organization applies for the request of the inspector to inspect the damaged goods. The degree and qualification of the damage to goods is verified and often a separate verifier with credit, authority and beyond legislation is commissioned in international trade. The quality inspection before the product is sold, and the statistics of the qualified number of the products of the company are written proofs for identifying the quality of the products to reach the standard. It is obtained by quality inspection of products and equipment, and is a standard for ensuring a product quality system.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. The manufacturing method of the aluminum-nickel semiconductor lead is characterized by comprising the following steps of: the first step is as follows: firstly, preparing an aluminum-nickel alloy material, then checking equipment, determining that sundries are not accumulated on production equipment, starting the equipment, determining whether the equipment is intact, and continuing normal work;
the second step is that: carrying out heat treatment, wherein the heat treatment refers to a metal hot working process for obtaining expected structure and performance by heating, preserving heat and cooling the material in a solid state;
the third step: carrying out heat treatment for the second time, heating the aluminum-nickel alloy material, and rolling the strip-shaped aluminum-nickel alloy material into a flat plate shape by using rolling equipment;
the fourth step: the aluminum nickel alloy material rolled into a flat plate is cut by utilizing cutting equipment, wherein the cutting equipment refers to continuous casting equipment for cutting off a continuously pulled casting blank according to a fixed length requirement, the cutting equipment of a continuous casting machine is divided into a metal material cutting machine and a non-metal material cutting machine by two types of cutting machines, namely a flame cutting machine and a shearing machine, and the metal material cutting machine is divided into the flame cutting machine, a plasma cutting machine, a laser cutting machine and a water jet cutting machine;
the non-metal material cutting machine is mainly a cutter cutting machine, the cutting machine is distinguished from a control mode and is divided into a numerical control cutting machine and a manual cutting machine, the numerical control cutting machine drives a machine tool to move by using a digital program, and when the machine tool moves, a cutting tool randomly provided with the cutting tool cuts an object, the laser cutting machine has the fastest efficiency and the highest cutting precision, the plasma cutting machine also has the fast cutting speed, a cutting surface has a certain inclination, and the flame cutting machine is mainly used for cutting carbon steel materials with larger thickness into flat filaments with the met specification in the field of ferrous metallurgy;
the fifth step: determining the length of a required lead wire according to the requirement, and cutting the flat long-wire-shaped aluminum-nickel alloy material by using cutting equipment so as to meet the use requirement;
and a sixth step: and then detecting the manufactured lead, wherein during detection, a report is required to be manufactured, then performing batch spot check, and finally checking and accepting by an engineer.
2. The method for manufacturing an alnico lead wire according to claim 1, wherein: when the length of the lead is determined, excess leftover materials are generated after cutting, the leftover materials are collected and then are subjected to heat treatment together with the processed aluminum-nickel alloy material for secondary utilization and processing.
3. The method for manufacturing an alnico lead wire according to claim 1, wherein: the cutting equipment is used for cutting, after cutting is finished, the scraps need to be collected and then processed in a unified mode, and waste is avoided.
4. The method for manufacturing an alnico lead wire according to claim 1, wherein: the heat treatment refers to the means of heating, holding and cooling the material in the solid state to obtain the desired texture and properties.
CN202010324798.0A 2020-04-23 2020-04-23 Method for manufacturing aluminum-nickel semiconductor lead Pending CN111489975A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298793A (en) * 1990-02-08 1994-03-29 Matsushita Electronics Corporation Semiconductor device including an electrode
CN1421287A (en) * 2001-11-23 2003-06-04 北京有色金属研究总院 Composite Ni-Al wire forming process and the used aluminium casing joint
CN1804080A (en) * 2006-01-08 2006-07-19 丹阳市高频焊管厂 Nickel aluminium alloy and preparation method thereof
CN103789579A (en) * 2014-02-21 2014-05-14 汕头市骏码凯撒有限公司 Large-diameter bonded aluminum wire and manufacturing method thereof
CN103789568A (en) * 2014-02-18 2014-05-14 浙江佳博科技股份有限公司 Alloy bonding wire, and preparation method and application thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298793A (en) * 1990-02-08 1994-03-29 Matsushita Electronics Corporation Semiconductor device including an electrode
CN1421287A (en) * 2001-11-23 2003-06-04 北京有色金属研究总院 Composite Ni-Al wire forming process and the used aluminium casing joint
CN1804080A (en) * 2006-01-08 2006-07-19 丹阳市高频焊管厂 Nickel aluminium alloy and preparation method thereof
CN103789568A (en) * 2014-02-18 2014-05-14 浙江佳博科技股份有限公司 Alloy bonding wire, and preparation method and application thereof
CN103789579A (en) * 2014-02-21 2014-05-14 汕头市骏码凯撒有限公司 Large-diameter bonded aluminum wire and manufacturing method thereof

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