CN111487729A - Optical device coupling UV glue dispensing method - Google Patents
Optical device coupling UV glue dispensing method Download PDFInfo
- Publication number
- CN111487729A CN111487729A CN202010280257.2A CN202010280257A CN111487729A CN 111487729 A CN111487729 A CN 111487729A CN 202010280257 A CN202010280257 A CN 202010280257A CN 111487729 A CN111487729 A CN 111487729A
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- CN
- China
- Prior art keywords
- dispensing
- point
- glue dispensing
- glue
- dispensing point
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses an optical device coupling UV glue dispensing method, wherein 4 UV glue dispensing points are dispensed on a PCB, namely a first UV glue dispensing point, a second UV glue dispensing point, a third UV glue dispensing point and a fourth UV glue dispensing point, a first short line glue dispensing point is arranged between the first UV glue dispensing point and the second UV glue dispensing point, and a second short line glue dispensing point is arranged between the third UV glue dispensing point and the fourth UV glue dispensing point; and bonding the bottom surface of the lens bottom shell on the PCB through first UV glue dispensing, second UV glue dispensing, third UV glue dispensing, fourth UV glue dispensing, first stub glue dispensing and second stub glue dispensing, and reinforcing glue between two sides of the bottom of the lens bottom shell and the PCB. The thrust of the invention meets the requirements, the performance is qualified, and almost no change is caused after UV; after the reinforcing glue is piled up, the thrust meets the requirement, and the indexes are almost unchanged after the performance of the reinforcing glue is supplemented.
Description
Technical Field
The invention belongs to the technical field of optical device connection, and particularly relates to an optical device coupling UV glue dispensing method which is applicable to the COB coupling field of optical devices.
Background
The existing optical device coupling UV glue dispensing modes comprise four-point glue dispensing, six-point glue dispensing, two-line drawing and the like, wherein the four-point glue dispensing and the wire drawing glue dispensing modes are two main glue dispensing modes at present, and because the reinforcing glue needs to be piled up for reinforcing and curing after the UV glue is dispensed, the stress of the reinforcing glue is larger than that of the UV glue, the overall stress of the lens is changed when the glue dispensing mode and the glue dispensing amount are controlled to directly influence the piling up of the reinforcing glue, and the performance of a product is further influenced.
Disclosure of Invention
The invention aims to avoid the defects in the prior art, provides a method for dispensing an optical device coupling UV glue, and solves the problem that the thrust does not meet the requirement after the UV glue is dispensed or the thrust does not meet the requirement after the reinforcement glue is stacked in the prior dispensing mode.
The aim of the invention is achieved by the following technical measures:
a method for dispensing UV glue in coupling of an optical device comprises the following steps:
and 3, reinforcing glue between the two sides of the bottom of the lens bottom shell and the PCB.
Compared with the prior art, the invention has the following advantages:
1. the thrust after UV meets the requirement, the performance is qualified, and the thrust after UV is almost unchanged;
2. after the reinforcing glue is piled up, the thrust meets the requirement, and the indexes are almost unchanged after the performance of the reinforcing glue is supplemented.
Drawings
FIG. 1 is a schematic diagram of a conventional four-point dispensing method;
FIG. 2 is a schematic diagram of a conventional two-wire dispensing method;
FIG. 3 is a schematic view of a dispensing method according to the present invention;
in the figure: 1-a lens bottom shell; 2-a PCB board; 3-UV dispensing; 301-first UV dispensing; 302-second UV dispensing; 303-third UV dispensing; 304-fourth UV dispensing; 401-first stub dispensing; 402-second stub dispensing.
Detailed Description
The present invention will be described in further detail with reference to examples for the purpose of facilitating understanding and practice of the invention by those of ordinary skill in the art, and it is to be understood that the present invention has been described in the illustrative embodiments and is not to be construed as limited thereto.
As shown in fig. 1, the existing dispensing method is as shown in fig. 1, and a four-point dispensing method is used, after the UV glue is dispensed, the performance can meet the requirement, and the pushing force cannot meet the customer requirement;
as shown in fig. 2, another existing dispensing method is as shown in fig. 2, a pull-wire dispensing method is used, the performance and the thrust can meet the requirements after the UV glue is dispensed, and the thrust of the reinforcing glue can not meet the requirements of customers;
as shown in fig. 3, a method for dispensing UV glue in coupling optical devices includes the following steps:
And 3, reinforcing glue between the two sides of the bottom of the lens bottom shell 1 and the PCB 2.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (1)
1. An optical device coupling UV glue dispensing method is characterized by comprising the following steps:
step 1, 4 UV dispensing points are dispensed on the PCB (2), namely a first UV dispensing point (301), a second UV dispensing point (302), a third UV dispensing point (303) and a fourth UV dispensing point (304), a first short line dispensing point (401) is arranged between the first UV dispensing point (301) and the second UV dispensing point (302), a second short line dispensing point (402) is arranged between the third UV dispensing point (303) and the fourth UV dispensing point (304), the first UV dispensing point (301) and the second UV dispensing point (302) are arranged at two ends of one side of the bottom surface of the lens bottom shell (1), the third UV dispensing point (303) and the fourth UV dispensing point (304) are arranged at two ends of the other opposite side of the bottom surface of the lens bottom shell (1), the first short line dispensing point (401) and the second short line dispensing point (402) are arranged at two sides of the bottom surface of the lens bottom shell (1), and the length of the first short line dispensing point (401) is 1/4-2/3 of the distance between the first UV dispensing point (301) and the second UV dispensing point (302), the length of the second short-line dispensing (402) is 1/4-2/3 of the distance between the third UV dispensing (303) and the fourth UV dispensing (304),
step 2, the bottom surface of the lens bottom case (1) is bonded on the PCB (2) through a first UV dispensing (301), a second UV dispensing (302), a third UV dispensing (303), a fourth UV dispensing (304), a first short-line dispensing (401) and a second short-line dispensing (402),
and 3, reinforcing glue between the two sides of the bottom of the lens bottom shell (1) and the PCB (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010280257.2A CN111487729A (en) | 2020-04-10 | 2020-04-10 | Optical device coupling UV glue dispensing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010280257.2A CN111487729A (en) | 2020-04-10 | 2020-04-10 | Optical device coupling UV glue dispensing method |
Publications (1)
Publication Number | Publication Date |
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CN111487729A true CN111487729A (en) | 2020-08-04 |
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CN202010280257.2A Pending CN111487729A (en) | 2020-04-10 | 2020-04-10 | Optical device coupling UV glue dispensing method |
Country Status (1)
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101981913A (en) * | 2008-02-22 | 2011-02-23 | 弗莱克斯电子有限责任公司 | Attachment of wafer level optics |
CN102486560A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
CN205066789U (en) * | 2015-08-20 | 2016-03-02 | 龙微科技无锡有限公司 | Sensor chip and sensor core |
CN107894633A (en) * | 2012-11-29 | 2018-04-10 | 深圳迈辽技术转移中心有限公司 | A kind of assemble method of photoelectric conversion device |
CN109729237A (en) * | 2017-10-27 | 2019-05-07 | 华为终端(东莞)有限公司 | Camera module and terminal |
CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
-
2020
- 2020-04-10 CN CN202010280257.2A patent/CN111487729A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101981913A (en) * | 2008-02-22 | 2011-02-23 | 弗莱克斯电子有限责任公司 | Attachment of wafer level optics |
CN102486560A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
CN107894633A (en) * | 2012-11-29 | 2018-04-10 | 深圳迈辽技术转移中心有限公司 | A kind of assemble method of photoelectric conversion device |
CN205066789U (en) * | 2015-08-20 | 2016-03-02 | 龙微科技无锡有限公司 | Sensor chip and sensor core |
CN109729237A (en) * | 2017-10-27 | 2019-05-07 | 华为终端(东莞)有限公司 | Camera module and terminal |
CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 430070 room 401-6, 4th floor, unit 2, building C2, Rongke Zhigu, 555 Wenhua Avenue, Hongshan District, Wuhan City, Hubei Province Applicant after: Wuhan Yusheng photoelectric Co.,Ltd. Address before: No.5, huashiyuan Third Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province 430223 Applicant before: WUHAN YUSHENG OPTICAL DEVICES Co.,Ltd. |
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RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200804 |