CN111478002A - Dielectric waveguide filter and communication device - Google Patents
Dielectric waveguide filter and communication device Download PDFInfo
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- CN111478002A CN111478002A CN202010477401.1A CN202010477401A CN111478002A CN 111478002 A CN111478002 A CN 111478002A CN 202010477401 A CN202010477401 A CN 202010477401A CN 111478002 A CN111478002 A CN 111478002A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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Abstract
The invention relates to a dielectric waveguide filter and a communication device. The structure formed by the port hole, the butt joint part and the first conducting layer is equivalent to a port coupling structure and is connected with a circuit board or a radio frequency connector to realize signal input and output of the dielectric waveguide filter. The first conducting layer on the butt joint part is in alignment welding connection with the first bonding pad of the circuit board or the inner conductor of the radio frequency connector, so that the dielectric waveguide filter can be connected with the circuit board or the radio frequency connector, and the alignment welding connection with the circuit board or the radio frequency connector after a pin is welded in the port metalized hole is not needed in the prior art. So, owing to need not to weld in port metallization hole and set up the pin needle, can avoid the cracked risk of medium body that the welding pin needle leads to, can also avoid because the welding pin needle leads to surperficial unevenness, avoid the pin needle to drop in the port metallization hole and reduce the reliability to and can improve production efficiency.
Description
Technical Field
The invention relates to the technical field of antenna communication, in particular to a dielectric waveguide filter and a communication device.
Background
The filter is a frequency-selective device and is an indispensable part of communication equipment. With the rapid development of a communication system entering the 5G era, the miniaturization of a device is the key of the development of communication equipment of the device, a miniaturized, high-performance and low-power-consumption filter is the key of the miniaturization of the 5G equipment, and the dielectric waveguide filter has all the characteristics of the miniaturization of the 5G equipment, so that the dielectric waveguide filter has a wide application prospect in the 5G communication equipment. The dielectric waveguide filter improves the air filling form of the traditional waveguide filter into the filling of a high-dielectric-constant ceramic material, the ceramic dielectric material is formed by die casting to play a role in transmitting signals and supporting a structure, and the metal material is attached to the surface of the ceramic dielectric material and serves as an electric wall to play an electromagnetic shielding role.
Conventionally, a communication device includes a dielectric waveguide filter and a circuit board (e.g., a multilayer PCB). The dielectric waveguide filter includes a dielectric body, and a surface of the dielectric body is metalized and treated by silver (which can be understood as an electroplating process) to form a conductive layer on an outer surface of the dielectric body. The upper surface of the medium body is provided with a frequency adjusting hole, and the lower surface is provided with a port isolating ring and a port metalized hole which is arranged corresponding to the position of the frequency adjusting hole. The port partition is arranged around the port metalized hole, so that the hole wall conductive layer of the port metalized hole is completely separated from the conductive layers of the rest areas of the medium body. The port metallization hole is provided with the pin needle in the welding, and the circuit board is equipped with the pad corresponding with the pin needle, and the pin needle corresponds the welding with the pad and links to each other.
However, in the production process, when a pin is soldered and set in a port metallization hole by using a high-temperature solder paste in an oven temperature environment of about 220 ℃ (for example, 240 ℃), attention must be paid to control of the amount of tin and control of a soldering temperature curve, and when the amount of tin and the soldering temperature curve are inappropriate, the following undesirable phenomena are caused: 1. the pin needle is heated and expanded to cause the ceramic dielectric filter to be cracked; 2. after the pin is welded into the port metalized hole, the lower surface of the dielectric waveguide filter is uneven; 3. during welding, when the working temperature curve is inappropriate, the soldering tin is easy to react with the conducting layer on the wall of the port metallized hole, so that the pin needle, the soldering tin and the conducting layer (such as a silver layer) are combined and then fall off, and the connection reliability is low; 4. after the ceramic dielectric filter is welded with the pin, the ceramic dielectric filter is welded with a welding disc of the circuit board, and the production efficiency is low due to repeated welding.
Disclosure of Invention
In view of the foregoing, there is a need to overcome the shortcomings of the prior art and to provide a dielectric waveguide filter and communication device that reduces the risk of cracking of the ceramic dielectric, improves surface flatness, enhances reliability, and improves production efficiency.
The technical scheme is as follows: a dielectric waveguide filter, the dielectric waveguide filter comprising: the dielectric body comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a butt joint part corresponding to the position of a first bonding pad of a circuit board or an inner conductor of a radio frequency connector, and the first surface is also provided with a port hole which is adjacent to the butt joint part and extends towards the second surface; the conducting layer is arranged on the surface of the medium body and comprises a first conducting layer and a second conducting layer, a partition ring is arranged on the conducting layer on the first surface, the first conducting layer is isolated from the second conducting layer through the partition ring, the butt joint part and the port hole are both located in an area surrounded by the inner contour line of the partition ring, and the first conducting layer is arranged on the hole wall of the port hole and the surface of the butt joint part.
The structure formed by the port hole, the butt joint part and the first conducting layer of the dielectric waveguide filter is equivalent to a port coupling structure and is used for being connected with a circuit board or a radio frequency connector to realize the input or output of the dielectric waveguide filter. The dielectric waveguide filter can be connected with the circuit board or the radio frequency connector by performing alignment welding connection on the first conducting layer on the butt joint part and the first bonding pad of the circuit board or the inner conductor of the radio frequency connector, so that the alignment welding connection with the first bonding pad of the circuit board or the inner conductor of the radio frequency connector is not required after a pin is welded in the port metalized hole in the prior art. So, owing to need not to weld in port metallization hole and set up the pin needle, can avoid the cracked risk of medium body that the welding pin needle leads to, can also avoid because the welding pin needle leads to surperficial unevenness, can avoid the pin needle to drop in the port metallization hole and reduce the reliability to and can improve production efficiency.
In one embodiment, the port hole is a closed annular hole or a non-closed annular hole circumferentially disposed about the docking station.
in one embodiment, the non-closed annular hole comprises a first end and a second end which are opposite, the first end and the second end are arranged at intervals, a connecting line from the first end to a center line of the butt joint part is a first boundary line, a connecting line from the second end to the center line of the butt joint part is a second boundary line, an included angle between the first boundary line and the second boundary line is β, and 0 degrees < β <360 degrees.
In one embodiment, the number of the non-closed annular holes is two or more, and the two or more non-closed annular holes are sequentially arranged at intervals around the center line of the butt joint part.
In one embodiment, the number of the non-closed annular holes is two, and the two non-closed annular holes are arranged in a central symmetry mode around the center line of the butt joint part; an included angle between the first boundary line of one of the non-closed annular holes and the second boundary line of the other non-closed annular hole is a, and a is larger than or equal to 60 degrees; the diameter of the inner contour line of the non-closed annular hole is d1, the diameter of the outer contour line of the non-closed annular hole is d2, and d2-d1 are more than or equal to 0.85 mm.
In one embodiment, two or more non-closed annular holes are arranged around the central line of the butt joint part at equal intervals in sequence; the distance between the first end of one of the non-closed annular holes and the nearest two points of the second end of the other adjacent non-closed annular hole is W1, and W1 is more than or equal to 1 mm.
In one embodiment, a frequency adjusting structure is arranged on the second surface, and the frequency adjusting structure is arranged corresponding to the position of the first conductive layer.
In one embodiment, the frequency adjusting structure is provided as a frequency adjusting hole, and the position of the frequency adjusting hole is arranged corresponding to the position of the first conductive layer.
In one embodiment, the docking location is flush or substantially flush with a location on the first surface other than the docking location.
A communication device comprises the dielectric waveguide filter and further comprises a circuit board or a radio frequency connector, wherein a first bonding pad of the circuit board or an inner conductor of the radio frequency connector corresponds to the butt joint position, and the first bonding pad of the circuit board or the inner conductor of the radio frequency connector is connected with a first conducting layer of the butt joint position in a welding mode.
In the communication device, the port hole, the butt joint part and the first conducting layer form a structure which is equivalent to a port coupling structure and is used for being connected with a circuit board or a radio frequency connector to realize the input or output of the dielectric waveguide filter. The dielectric waveguide filter can be connected with the circuit board or the radio frequency connector by performing alignment welding connection on the first conducting layer on the butt joint part and the first bonding pad of the circuit board or the inner conductor of the radio frequency connector, so that the alignment welding connection with the first bonding pad of the circuit board or the inner conductor of the radio frequency connector is not required after a pin is welded in the port metalized hole in the prior art. So, owing to need not to weld in port metallization hole and set up the pin needle, can avoid the cracked risk of medium body that the welding pin needle leads to, can also avoid because the welding pin needle leads to surperficial unevenness, can avoid the pin needle to drop in the port metallization hole and reduce the reliability to and can improve production efficiency.
In one embodiment, the butting part is a circular surface, the diameter of the butting part is d1, the diameter of the first pad is d3, d1 is not less than d3, and the first conducting layer of the butting part is connected with the first pad in a welding mode through soldering tin.
In one embodiment, a third conductive layer is arranged on the outer surface of the circuit board, and a lead electrically connected with the first pad is arranged on the middle layer of the circuit board; an opening area is arranged on the third conducting layer and corresponds to a region surrounded by the outer contour line of the partition ring; and the third conducting layer is also provided with a plurality of second bonding pads, and the second bonding pads are connected with the second conducting layer in a welding manner.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first surface of a dielectric waveguide filter according to an embodiment of the present invention;
3 FIG. 3 2 3 is 3 a 3 cross 3- 3 sectional 3 structural 3 view 3 at 3 A 3- 3 A 3 of 3 FIG. 3 1 3; 3
Fig. 3 is a schematic structural diagram of a second surface of a dielectric waveguide filter according to an embodiment of the present invention;
Fig. 4 is a schematic structural diagram of a side of a circuit board for being soldered to a dielectric waveguide filter according to an embodiment of the present invention;
FIG. 5 is a cross-sectional structural view at B-B of FIG. 4;
Fig. 6 is a cross-sectional view of a communication device according to an embodiment of the invention;
FIG. 7 is an enlarged schematic view of FIG. 6 at P;
Fig. 8 is a schematic structural view of a first surface of a dielectric waveguide filter according to another embodiment of the present invention;
Fig. 9 is a schematic structural view of a first surface of a dielectric waveguide filter according to yet another embodiment of the present invention;
Fig. 10 is a schematic structural view of a first surface of a dielectric waveguide filter according to still another embodiment of the present invention;
FIG. 11 is a cross-sectional structural view at C-C of FIG. 10;
Fig. 12 is an S parameter diagram of a conventional dielectric waveguide filter;
Fig. 13 is an S-parameter diagram of the dielectric waveguide filter according to an embodiment of the invention.
10. A dielectric waveguide filter; 11. a dielectric body; 111. a docking station; 112. a port hole; 1121. a first boundary line; 1122. a second boundary line; 113. a frequency adjustment aperture; 12. a conductive layer; 121. a first conductive layer; 122. a second conductive layer; 123. a blocking ring; 20. a circuit board; 21. metallizing the via hole; 22. a first pad; 23. a third conductive layer; 231. an open area; 24. a wire; 25. a second bonding pad.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram illustrating a first surface of a dielectric waveguide filter 10 according to an embodiment of the present invention; 3 fig. 3 2 3 is 3 a 3 schematic 3 sectional 3 view 3 at 3 a 3- 3 a 3 of 3 fig. 3 1 3. 3 In a dielectric waveguide filter 10 according to an embodiment of the present invention, the dielectric waveguide filter 10 includes a dielectric body 11 and a conductive layer 12.
Referring to fig. 1 to 3, fig. 3 is a schematic structural diagram illustrating a second surface of a dielectric waveguide filter 10 according to an embodiment of the invention. The media body 11 includes a first surface and a second surface disposed opposite each other. The first surface corresponds to the surface illustrated in fig. 1, and the upper surface illustrated in fig. 2; the second surface corresponds to the surface illustrated in fig. 3, and the lower surface illustrated in fig. 2.
Referring to fig. 4 to 6, fig. 4 is a schematic structural diagram illustrating a side of a circuit board 20 for being soldered to a dielectric waveguide filter 10 according to an embodiment of the present invention; FIG. 5 is a cross-sectional structural view at B-B of FIG. 4; fig. 6 illustrates a cross-sectional view of a communication device in accordance with an embodiment of the present invention. The first surface is provided with a docking portion 111 corresponding to the first pad 22 of the circuit board 20 or the inner conductor of the rf connector, and the first surface is further provided with a port hole 112 adjacent to the docking portion 111 and extending toward the second surface. The conductive layer 12 is disposed on the surface of the dielectric body 11, and the conductive layer 12 includes a first conductive layer 121 and a second conductive layer 122. The conductive layer 12 on the first surface is provided with a spacer ring 123, and the first conductive layer 121 is separated from the second conductive layer 122 by the spacer ring 123. The docking portion 111 and the port hole 112 are located in an area surrounded by an inner contour of the isolating ring 123, and the first conductive layer 121 is disposed on a hole wall of the port hole 112 and a surface of the docking portion 111.
The partition ring 123 includes an inner contour and an outer contour, the inner contour is located inside the outer contour, the partition ring 123 is located between the inner contour and the outer contour, the conductive layer 12 is not located between the inner contour and the outer contour, and the wall surface of the dielectric body 11 is exposed. Specifically, the conductive layer 12 in the region between the inner contour and the outer contour may be removed after the conductive layer 12 is plated on the entire surface of the dielectric body 11, or the conductive layer 12 may be directly plated on another region of the dielectric body 11 without plating the conductive layer 12 in the region between the inner contour and the outer contour of the dielectric body 11, thereby eliminating the step of removing the conductive layer 12 in the region between the inner contour and the outer contour. Alternatively, after the conductive layer 12 is plated on the entire surface of the dielectric body 11, the conductive layer 12 on the first surface of the dielectric body 11 is removed in a predetermined shape to form an outer contour of the partition ring 123, and the first conductive layer 121 is disposed in the outer contour of the partition ring 123 to form an inner contour of the partition ring 123.
Referring to fig. 6 and 7, fig. 7 is an enlarged structural view of fig. 6 at P. The structure formed by the dielectric waveguide filter 10, the port hole 112, the docking portion 111 and the first conductive layer 121 is equivalent to a port coupling structure, and is used for connecting with a circuit board 20 or a radio frequency connector to realize input or output of the dielectric waveguide filter 10. The dielectric waveguide filter 10 can be connected to the circuit board 20 or the radio frequency connector by performing alignment welding connection between the first conductive layer 121 on the butt joint portion 111 and the first pad 22 of the circuit board 20 or the inner conductor of the radio frequency connector, so that it is not necessary to perform alignment welding connection with the pin 21 of the circuit board 20 or the radio frequency connector after the pin 21 is welded in the port metalized hole as in the conventional technology. So, owing to need not to weld in port metallization hole and set up pin needle 21, can avoid the cracked risk of medium body 11 that welding pin needle 21 leads to, can also avoid because welding pin needle 21 leads to the surperficial unevenness, can avoid pin needle 21 to drop in the port metallization hole and reduce the reliability to and can improve production efficiency.
Referring to fig. 1 and 3, in one embodiment, the port hole 112 is a closed annular hole circumferentially disposed around the docking portion 111. When the port holes 112 are circumferentially arranged around the butt joint portion 111, the product performance can be made reliable. It should be explained that both ends of the closed annular hole communicate with each other, forming, for example, a closed form circular ring-shaped hole, a closed form square annular hole, or a closed form oval annular hole. The non-closed annular hole is provided with two opposite ends, and the two opposite ends of the non-closed annular hole are spaced and not communicated with each other, namely, the non-closed annular hole is a non-closed circular ring hole, a non-closed square annular hole or a non-closed elliptical annular hole.
In addition, referring to fig. 8, 9, 10 and 11, fig. 8 shows a schematic structural diagram of the first surface of the dielectric waveguide filter 10 according to another embodiment of the present invention, fig. 9 shows a schematic structural diagram of the first surface of the dielectric waveguide filter 10 according to yet another embodiment of the present invention, fig. 10 shows a schematic structural diagram of the first surface of the dielectric waveguide filter 10 according to yet another embodiment of the present invention, and fig. 11 shows a cross-sectional view of fig. 10 at C-C. In another embodiment, port hole 112 is a non-closed annular hole disposed circumferentially about docking location 111. Thus, when the port holes 112 are circumferentially arranged around the butt joint portion 111, the product performance can be made reliable.
Referring to fig. 12 and 13, fig. 12 is an S-parameter diagram of a conventional dielectric waveguide filter 10, and fig. 13 is an S-parameter diagram of the dielectric waveguide filter 10 according to an embodiment of the present invention. It can be found that the dielectric waveguide filter 10 of the present embodiment has improved far-end suppression in the case where the near-end suppression index is equivalent. In addition, the distal end suppression of the dielectric waveguide filter 10 is improved more significantly as the depth of the port hole 112 is shallower. The depth of the port hole 112 refers to the distance the port hole 112 extends from the first surface towards the second surface.
referring to fig. 9, further, the non-closed loop hole includes a first end and a second end, which are opposite to each other, the first end and the second end are disposed at an interval, a line connecting the first end to a center line of the butt joint portion 111 is a first boundary line 1121, a line connecting the second end to a center line of the butt joint portion 111 is a second boundary line 1122, an included angle between the first boundary line 1121 and the second boundary line 1122 is β, and 0 ° < β <360 °.
It should be noted that the number of the non-closed annular holes may be one, two, three, four or other numbers, which is not limited herein. When the number of the non-closed annular holes is larger, more than two non-closed annular holes are connected end to be equivalent to a closed annular hole when the number of the non-closed annular holes reaches a certain value, in addition, the depth of the non-closed annular holes can be smaller along with the increase of the number, and the electrical performance of the product can be favorably improved when the depth of the non-closed annular holes is smaller. However, as the number of the open holes of the non-closed annular hole increases, the area of the open hole area increases correspondingly, and at this time, the connection part between the butt joint part 111 and the surrounding structure thereof decreases relatively, so that the connection strength between the butt joint part 111 and the surrounding structure thereof becomes weak, and the risk of tearing and breaking of the butt joint part 111 under the action of a large external force is easy to occur.
Referring to fig. 8 and 9, in an embodiment, the number of the non-closed loop holes is two or more, and the two or more non-closed loop holes are sequentially arranged at intervals around the center line of the butt joint portion 111.
Referring to fig. 9, in the present embodiment, there are two non-closed annular holes, and the two non-closed annular holes are arranged symmetrically with respect to the center line of the butt joint portion 111. Specifically, the included angle between the first boundary line 1121 of one of the non-closed circular holes and the second boundary line 1122 of the other non-closed circular hole is a, and a is larger than or equal to 60 degrees. Further, optionally, the inner contour diameter of the non-closed annular hole is d1, the outer contour diameter of the non-closed annular hole is d2, and d2-d1 is ≧ 0.85 mm. So, on the one hand, can guarantee electric property, the reliability of structure, on the other hand, can strengthen the structural strength of butt joint portion 111, avoid butt joint portion 111 to appear cracked bad phenomenon when receiving the external force effect.
Further, the distance between the first end of one of the non-closed annular holes and the nearest two points of the second end of the other adjacent non-closed annular hole is W1, and W1 is more than or equal to 1 mm. Thus, the product has better performance and is convenient to process and produce.
In one embodiment, two or more non-enclosed annular apertures are sequentially equally spaced about the centerline of the docking station 111. As an example, referring to fig. 8 again, the number of the non-closed annular holes illustrated in fig. 8 is three, and the three non-closed annular holes are sequentially and equally spaced around the center line of the butt joint portion 111. Thus, the product has better performance and is convenient to process and produce.
In one embodiment, a frequency adjustment structure is disposed on the second surface, and the frequency adjustment structure is disposed corresponding to the first conductive layer 121.
The frequency adjustment structure is disposed corresponding to the position of the first conductive layer 121, that is, after the frequency adjustment structure is disposed on the second surface, the first conductive layer 121 is disposed in the projection region of the frequency adjustment structure on the first surface, in other words, the projection region of the frequency adjustment structure on the first surface is the surrounding region of the inner contour line of the partition ring 123.
It should be noted that the frequency adjusting structure may be configured as a slot type, a hole type, or other structures capable of adjusting the frequency of the dielectric filter.
Referring to fig. 2, 6, 7 or 11, further, the frequency adjustment structure is disposed as a frequency adjustment hole 113, and the position of the frequency adjustment hole 113 is disposed corresponding to the position of the first conductive layer 121. In this way, the frequency of the dielectric waveguide filter 10 can be adjusted accordingly by using the frequency adjusting hole 113, so that the dielectric waveguide filter 10 meets the use requirement. Note that the hole wall of the frequency adjustment hole 113 is provided with the conductive layer 12.
Referring to fig. 2, 6, 7 or 11, in one embodiment, the abutting portion 111 is flush or substantially flush with a portion of the first surface other than the abutting portion 111. The term "substantially flush" refers to a convex or concave phenomenon of the abutting portion 111 relative to the portion of the first surface other than the abutting portion 111, which may be caused by actual machining errors, and the deviation distance between the abutting portion 111 and the portion of the first surface other than the abutting portion 111 is, for example, within 1mm, and the specific deviation distance is not limited herein.
It should be noted that the number of the butt joint portions 111 on the dielectric waveguide filter 10 is not limited, and may be one, two, or another number. When the number of the port coupling structures on the dielectric waveguide filter 10 is two, correspondingly, there are two docking portions 111, and the two docking portions 111 are respectively disposed in one-to-one correspondence with the two pins 21 of the circuit board 20 or the radio frequency connector.
In an embodiment, referring to fig. 6 and 7, a communication device includes the dielectric waveguide filter 10 according to any of the above embodiments, and further includes a circuit board 20 or a radio frequency connector. The first pads 22 of the circuit board 20 or the inner conductors of the rf connector correspond in position to the docking station 111. The first pads 22 of the circuit board 20 or the inner conductors of the rf connector are soldered to the first conductive layer 121 of the docking station 111.
In the communication device, the port hole 112, the docking portion 111, and the first conductive layer 121 form a port coupling structure, which is used to connect with the circuit board 20 or the rf connector to realize the input or output of the dielectric waveguide filter 10. The dielectric waveguide filter 10 can be connected to the circuit board 20 or the radio frequency connector by performing alignment welding connection between the first conductive layer 121 on the butt joint portion 111 and the first pad 22 of the circuit board 20 or the inner conductor of the radio frequency connector, so that it is not necessary to perform alignment welding connection with the pin 21 of the circuit board 20 or the radio frequency connector after the pin 21 is welded in the port metalized hole as in the conventional technology. So, owing to need not to weld in port metallization hole and set up pin needle 21, can avoid the cracked risk of medium body 11 that welding pin needle 21 leads to, can also avoid because welding pin needle 21 leads to the surperficial unevenness, can avoid pin needle 21 to drop in the port metallization hole and reduce the reliability to and can improve production efficiency.
Referring to fig. 5, 7 and 9, in an embodiment, the butting portion 111 is a circular surface, the diameter of the butting portion 111 is d1, the diameter of the first pad 22 is d3, and d1 is not greater than d3, and the first conductive layer 121 of the butting portion 111 is connected to the first pad 22 by soldering. In this way, during soldering, the first land 22 is located right below the abutting portion 111, and the solder on the first land 22 climbs to the abutting portion 111 along the vertical direction, so that the first land 22 and the abutting portion 111 are stably soldered and fixed together. It should be noted that the inner contour inner area of the closed loop hole corresponds to the butt joint portion 111, or the inner contour inner area of the non-closed loop hole corresponds to the butt joint portion 111, that is, the diameter d1 of the butt joint portion 111 is the same as the inner contour diameter d1 of the non-closed loop hole.
Referring to fig. 4, 5 and 7, in one embodiment, a third conductive layer 23 is disposed on an outer surface of the circuit board 20. The intermediate layer of the circuit board 20 is provided with a wire 24 electrically connected to the first pad 22. Specifically, the conductive line 24 is electrically connected to the first pad 22 through the metalized via 21. The third conductive layer 23 is provided with an opening area 231. The opening 231 is disposed corresponding to a region surrounded by the outer contour of the partition ring 123. A plurality of second bonding pads 25 are further disposed on the third conductive layer 23, and the second bonding pads 25 are connected to the second conductive layer 122 by soldering.
The opening area 231 is provided corresponding to the region surrounded by the outer contour line of the partition ring 123, and means that the center position of the opening area 231 is the same as the region surrounded by the outer contour line of the partition ring 123 or has a variation in the allowable range due to a machining error. Further, the diameter d4 of the opening section 231 is the same as the diameter d5 of the outer contour line of the partition ring 123 or has a deviation of an allowable range due to a machining error. Specifically, the opening region 231 and the outer contour line of the partition ring 123 are both circular openings and are coaxially arranged.
As an alternative, the port hole 112 does not need to be circumferentially disposed around the docking portion 111, but is disposed on the adjacent side of the docking portion 111 and located in the region surrounded by the inner contour line of the partition ring 123, and the specific shape of the port hole 112 is not limited herein, and may be correspondingly disposed according to the actual product.
It should be noted that the dielectric material of the dielectric body 11 is selected from a high dielectric constant material, and can be manufactured in an integral molding manner, so as to play a role in transmitting signals and a role in structural support; preferably, a ceramic dielectric material with a high dielectric constant is used, and the dielectric waveguide filter can be manufactured by die-casting, so that the size and the weight of the whole dielectric waveguide filter 10 can be remarkably reduced. The conductive layer 12 of the dielectric body 11 may be formed by electroplating, for example, to serve as an electromagnetic shielding function, and the conductive layer 12 may be a silver plating layer or other metal layer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Claims (12)
1. A dielectric waveguide filter, comprising:
The dielectric body comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a butt joint part corresponding to the position of a first bonding pad of a circuit board or an inner conductor of a radio frequency connector, and the first surface is also provided with a port hole which is adjacent to the butt joint part and extends towards the second surface;
The conducting layer is arranged on the surface of the medium body and comprises a first conducting layer and a second conducting layer, a partition ring is arranged on the conducting layer on the first surface, the first conducting layer is isolated from the second conducting layer through the partition ring, the butt joint part and the port hole are both located in an area surrounded by the inner contour line of the partition ring, and the first conducting layer is arranged on the hole wall of the port hole and the surface of the butt joint part.
2. A dielectric waveguide filter according to claim 1, wherein the port holes are closed annular holes or non-closed annular holes circumferentially arranged around the butt joint.
3. the dielectric waveguide filter according to claim 2, wherein the non-enclosed annular aperture comprises a first end and a second end opposite to each other, the first end and the second end are spaced apart from each other, a line connecting the first end to a center line of the butt joint portion is a first boundary line, a line connecting the second end to the center line of the butt joint portion is a second boundary line, an included angle between the first boundary line and the second boundary line is β, and 0 ° < β <360 °.
4. The dielectric waveguide filter according to claim 3, wherein the number of the non-closed annular holes is two or more, and the two or more non-closed annular holes are sequentially provided at intervals around a center line of the butt joint portion.
5. The dielectric waveguide filter according to claim 4, wherein the number of the non-closed annular holes is two, and the two non-closed annular holes are arranged in a central symmetry with respect to a center line of the butt joint portion; an included angle between the first boundary line of one of the non-closed annular holes and the second boundary line of the other non-closed annular hole is a, and a is larger than or equal to 60 degrees; the diameter of the inner contour line of the non-closed annular hole is d1, the diameter of the outer contour line of the non-closed annular hole is d2, and d2-d1 are more than or equal to 0.85 mm.
6. The dielectric waveguide filter according to claim 4, wherein two or more of the non-closed annular holes are arranged in order at equal intervals around a center line of the butt joint portion; the distance between the first end of one of the non-closed annular holes and the nearest two points of the second end of the other adjacent non-closed annular hole is W1, and W1 is more than or equal to 1 mm.
7. A dielectric waveguide filter according to claim 1, wherein a frequency adjustment structure is provided on the second surface, the frequency adjustment structure being provided in correspondence with the first conductive layer.
8. The dielectric waveguide filter according to claim 7, wherein the frequency adjusting structure is provided as a frequency adjusting hole, and a position of the frequency adjusting hole is provided corresponding to a position of the first conductive layer.
9. A dielectric waveguide filter according to any one of claims 1 to 8, wherein the abutment is flush or substantially flush with the first surface except for the abutment.
10. A communication device comprising the dielectric waveguide filter according to any one of claims 1 to 9, further comprising a circuit board or a radio frequency connector, wherein the first pad of the circuit board or the inner conductor of the radio frequency connector corresponds to the position of the butt joint portion, and the first pad of the circuit board or the inner conductor of the radio frequency connector is connected to the first conductive layer of the butt joint portion by soldering.
11. The communication device as claimed in claim 10, wherein the docking portion has a circular surface, the docking portion has a diameter d1, the first pad has a diameter d3, and d1 ≦ d3, and the first conductive layer of the docking portion is soldered to the first pad by solder.
12. The communication device according to claim 10, wherein the outer surface of the circuit board is provided with a third conductive layer, and the middle layer of the circuit board is provided with a wire electrically connected with the first pad; an opening area is arranged on the third conducting layer and corresponds to a region surrounded by the outer contour line of the partition ring; and the third conducting layer is also provided with a plurality of second bonding pads, and the second bonding pads are connected with the second conducting layer in a welding manner.
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| CN202010477401.1A CN111478002B (en) | 2020-05-29 | 2020-05-29 | Dielectric waveguide filter and communication device |
| PCT/CN2020/141703 WO2021238211A1 (en) | 2020-05-29 | 2020-12-30 | Dielectric waveguide filter and communication device |
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| CN202010477401.1A CN111478002B (en) | 2020-05-29 | 2020-05-29 | Dielectric waveguide filter and communication device |
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| WO2021238211A1 (en) * | 2020-05-29 | 2021-12-02 | 京信通信技术(广州)有限公司 | Dielectric waveguide filter and communication device |
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| WO2021238211A1 (en) | 2021-12-02 |
| CN111478002B (en) | 2021-06-22 |
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