CN111477705A - Method for removing organic adhesive film on back of crystalline silicon photovoltaic module - Google Patents
Method for removing organic adhesive film on back of crystalline silicon photovoltaic module Download PDFInfo
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- CN111477705A CN111477705A CN202010294572.0A CN202010294572A CN111477705A CN 111477705 A CN111477705 A CN 111477705A CN 202010294572 A CN202010294572 A CN 202010294572A CN 111477705 A CN111477705 A CN 111477705A
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 117
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000011265 semifinished product Substances 0.000 claims description 38
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 15
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 12
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 claims description 5
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 claims description 5
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 20
- 238000011084 recovery Methods 0.000 abstract description 3
- 239000000155 melt Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
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- 239000000463 material Substances 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 239000002912 waste gas Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
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- 238000005034 decoration Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
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- 239000002904 solvent Substances 0.000 description 2
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- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module, and belongs to the technical field of recovery processing of photovoltaic modules. After the frame, the junction box and the back plate of the crystalline silicon photovoltaic module are removed, the solar cell is still bonded on the photovoltaic glass plate by the organic bonding adhesive film, and the back surface of the solar cell is still bonded with a layer of organic bonding adhesive film. And (3) carrying out irradiation treatment on the back surface of the crystalline silicon photovoltaic module with the back plate removed by adopting laser which is strongly reflected by the back surface of the solar cell and is strongly absorbed by the organic bonding adhesive film, so that the organic bonding adhesive film on the back surface of the module is heated and melted, and the formed organic bonding adhesive film melt flows and is removed from the back surface of the module. The method of the invention can not damage the solar cell in the processing process, and can simultaneously remove the organic adhesive film on the back surface of the solar cell and the organic adhesive film between the solar cells which is directly adhered on the photovoltaic glass plate.
Description
Technical Field
The invention relates to the technical field of recovery processing of photovoltaic modules, in particular to a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module.
Background
With the continuous development of new energy industry, the photovoltaic installation market is continuously expanded, and photovoltaic modules to be retired are continuously increased. The international renewable energy agency predicts that the world photovoltaic module scrap amount reaches 7800 ten thousand tons by 2050, and the crystalline silicon photovoltaic module occupies more than 90% of the world photovoltaic market share. A great deal of retired photovoltaic modules brings ecological environmental pressure to be faced, and how to treat abandoned photovoltaic modules, especially crystalline silicon photovoltaic modules, has become the focus of global attention. The photovoltaic module material contains valuable components such as glass, silicon, silver, copper, aluminum and the like, and the appropriate photovoltaic module recovery and harmless treatment can realize the recycling of the valuable materials while effectively relieving the ecological environment pressure, thereby creating considerable economic benefits.
The prior art for recycling crystalline silicon photovoltaic modules generally comprises two steps of module disassembly and component recycling. Wherein, the subassembly is disassembled and is given first in three kinds of technologies: mechanical dismantling, pyrolytic dismantling and chemical dismantling. Mechanically disassembling particles or powder of a photovoltaic module forming material obtained by mechanically crushing and grinding the crystalline silicon photovoltaic module; according to the pyrolysis method, the crystalline silicon photovoltaic module is subjected to high-temperature treatment under a certain atmosphere environment, so that the organic adhesive film for bonding the photovoltaic glass plate and the solar cell is mainly formed by pyrolyzing ethylene-vinyl acetate copolymer (EVA) into various gases, and the separation between the cell and the glass plate is realized; the chemical principle is that the separation between the cell and the glass plate is achieved by soaking the crystalline silicon photovoltaic module in some specific chemical solvents to dissolve the EVA.
However, these methods have their own drawbacks, mechanical methods do not allow to obtain complete solar cells and photovoltaic glazing components, and thermal and chemical methods are liable to generate waste gases and liquids which cause environmental pollution. For example, pyrolysis of EVA can produce many polluting gases such as acetic acid, propane, propylene, ethane, methane, and the like. Subsequent purification of the possible contamination increases costs. Stress and gas release generated by decomposition of the organic glue film in the pyrolysis process can easily cause the crystalline silicon solar cell to break. The time required for the chemical glue film dissolving process is long, usually days or even tens of days, and the required solvent has strong corrosiveness, high price and low cost performance. The interface combination between the solar cell and the organic adhesive film can be weakened by heating the cell through the absorbable laser irradiation on the back surface of the solar cell, but the laser etching damage can be generated on the back surface of the solar cell due to overhigh laser intensity or overlong irradiation time, the process tolerance is small, the actual application control difficulty is high, and the organic adhesive film directly bonded on the photovoltaic glass plate between the solar cells has no effect.
Disclosure of Invention
The invention aims to provide a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module. The method provided by the invention can effectively remove the organic adhesive film on the back of the crystalline silicon photovoltaic module, and cannot damage the solar cell.
In order to achieve the above object, the present invention provides the following technical solutions:
a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module comprises the following steps:
removing the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly to obtain a crystalline silicon photovoltaic assembly semi-finished product;
irradiating the organic adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to enable the organic adhesive film to be molten and flow so as to remove the organic adhesive film;
the laser is the laser which is reflected by the back of the solar cell strongly and absorbed by the organic adhesive film strongly.
Preferably, the solar cell is an aluminum back surface field crystal silicon solar cell, a crystal silicon heterojunction solar cell or a PERC crystal silicon solar cell.
Preferably, the organic adhesive film is made of ethylene-vinyl acetate copolymer (EVA).
Preferably, the laser is a laser of mid-infrared wavelength.
Preferably, the laser is 10.6 μm wavelength CO2And (4) laser.
Preferably, the laser irradiates perpendicular to or inclined to the back of the crystalline silicon photovoltaic module semi-finished product.
Preferably, the laser is irradiated perpendicular to the back surface of the crystalline silicon photovoltaic module semi-finished product.
Preferably, the laser irradiation mode is dynamic scanning irradiation.
Preferably, the organic adhesive film is melted to generate flow so as to be removed in a manner of being assisted by applying external force.
Preferably, the externally applied force assist comprises a gravity assist, an air flow blowing assist, a liquid flushing assist or a doctor blade assist.
The invention provides a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module, which comprises the following steps: removing the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly to obtain a crystalline silicon photovoltaic assembly semi-finished product; irradiating the organic adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to enable the organic adhesive film to be molten and flow so as to remove the organic adhesive film; the laser is the laser which can be reflected by the back surface of the solar cell and absorbed by the organic adhesive film. According to the invention, when the laser is irradiated on the organic adhesive film on the back of the crystalline silicon photovoltaic module semi-finished product with the back plate removed, the laser energy is absorbed by the organic adhesive film on the back, and meanwhile, the back of the solar cell has a strong reflection effect on the laser, so that the solar cell is effectively prevented from being etched by the laser, the reflected laser enters the organic adhesive film again and can be absorbed secondarily, and the utilization rate of the laser energy is further improved. The organic adhesive film absorbs laser irradiation, is heated and melted to become flowable fluid, and can be removed through flowing. The organic adhesive film directly adhered on the photovoltaic glass plate between the solar cells is also changed, so that the organic adhesive film on the back of the whole crystalline silicon photovoltaic module can be removed. The method only heats the organic adhesive film, does not damage the solar cell, and can re-solidify and recycle the removed organic adhesive film without generating waste gas polluting the environment.
Drawings
FIG. 1 is a schematic process diagram of a method for removing an organic adhesive film on the back surface of a crystalline silicon photovoltaic module according to the present invention; wherein, 1 is a solar cell, 2 is an organic adhesive film, 3 is a photovoltaic glass plate, and 4 is laser.
Detailed Description
The invention provides a method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module, which comprises the following steps:
removing the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly to obtain a crystalline silicon photovoltaic assembly semi-finished product;
irradiating the organic adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to enable the organic adhesive film to be molten and flow so as to remove the organic adhesive film;
the laser is the laser which is reflected by the back of the solar cell strongly and absorbed by the organic adhesive film strongly.
According to the invention, the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly are removed, and the crystalline silicon photovoltaic assembly semi-finished product is obtained.
The method for removing the frame, the junction box and the back plate of the crystalline silicon photovoltaic module is not particularly limited, and the method known by the technical personnel in the field can be adopted.
The obtained crystalline silicon photovoltaic module semi-finished product comprises a solar cell, an organic adhesive film for packaging the solar cell and a photovoltaic glass plate adhered by the organic adhesive film.
After a crystalline silicon photovoltaic module semi-finished product is obtained, the organic adhesive film on the back of the crystalline silicon photovoltaic module semi-finished product is irradiated by laser to be melted and flow so as to be removed; the laser is the laser which is reflected by the back of the solar cell strongly and absorbed by the organic adhesive film strongly.
In the invention, the solar cell is preferably an aluminum back field crystal silicon solar cell, a crystal silicon heterojunction solar cell or a PERC crystal silicon solar cell.
In the present invention, the material of the organic adhesive film is preferably ethylene-vinyl acetate copolymer (EVA).
In the present invention, the laser is preferably a laser of a mid-infrared wavelength, and more preferably CO of a wavelength of 10.6 μm2And (4) laser.
According to the invention, the wavelength of laser is controlled to enable the organic adhesive film to absorb strongly and the back of the solar cell to reflect highly, and the organic adhesive film on the back of the crystalline silicon photovoltaic module absorbs the energy of the laser and melts to generate flow after being heated so as to be removed. The laser is preferably set to CO2Laser, suitable for current commercial miningMost crystalline silicon solar cells encapsulated with EVA.
In the invention, the laser is preferably vertical to or inclined to the back of the semi-finished product of the crystalline silicon photovoltaic module for irradiation, and is further preferably vertical to the back of the semi-finished product of the crystalline silicon photovoltaic module for irradiation; the laser irradiation is preferably dynamic scanning irradiation.
The intensity and the irradiation time of the laser are not particularly limited and can be set according to specific conditions. In the invention, the intensity and the irradiation time of the laser are set according to the specific condition of the component to be processed, so long as the organic adhesive film can be melted in a reasonable time to generate flow.
In the invention, the organic adhesive film is melted to generate flow so as to be removed, and the removal mode is preferably realized by applying external force for assistance; the externally applied force assist preferably comprises a gravity assist, an air flow blow assist, a liquid rinse assist or a doctor blade assist. In the invention, the gravity is assisted by the flowing of the organic adhesive film from high to low depending on the self-weight, and the main realization mode is to vertically place or obliquely place the semi-finished product of the crystalline silicon photovoltaic module.
According to the method, the organic adhesive film on the back of the whole crystalline silicon photovoltaic module can be removed, the solar cell is not damaged, the organic adhesive film is beneficial to recycling, and waste gas polluting the environment is not generated.
FIG. 1 is a schematic diagram of a process for removing an organic adhesive film on the back surface of a crystalline silicon photovoltaic module according to the present invention; the solar cell 1 in the semi-finished product of the crystalline silicon photovoltaic module is packaged by the organic adhesive film 2 and is adhered to the photovoltaic glass plate 3, and after the method of the invention is adopted, the organic adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module is irradiated by laser 4, and then the organic adhesive film can be melted to flow so as to be removed.
The following provides a detailed description of the method for removing the organic adhesive film on the back surface of the crystalline silicon photovoltaic module according to the present invention with reference to the following examples, which should not be construed as limiting the scope of the present invention.
Example 1
A method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module comprises the following steps:
after the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly are removed, a crystalline silicon photovoltaic assembly semi-finished product is obtained; the solar cell in the semi-finished product of the crystalline silicon photovoltaic module is still bonded on the photovoltaic glass plate by the organic bonding adhesive film, and the back of the solar cell is still bonded with a layer of organic bonding adhesive film. The solar cell is a conventional aluminum back surface field crystal silicon solar cell, and the organic adhesive film is EVA. CO with the wavelength of 10.6 mu m and strongly reflected by the back surface of the solar cell and strongly absorbed by the organic adhesive film is adopted2And performing dynamic scanning irradiation treatment on the organic bonding adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to heat and melt the organic bonding adhesive film to form an organic bonding adhesive film melt, wherein the melt flows under the action of gravity and is removed from the back of the semi-finished product of the crystalline silicon photovoltaic module.
The organic adhesive film on the back surface of the whole crystalline silicon photovoltaic module can be removed through the embodiment. The organic adhesive film on the back of the solar cells is completely removed, the solar cells are not damaged, and meanwhile, the organic adhesive film directly adhered to the photovoltaic glass plate among the solar cells is also removed.
Example 2
A method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module comprises the following steps:
after the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly are removed, a crystalline silicon photovoltaic assembly semi-finished product is obtained; the solar cell in the semi-finished product of the crystalline silicon photovoltaic module is still bonded on the photovoltaic glass plate by the organic bonding adhesive film, and the back of the solar cell is still bonded with a layer of organic bonding adhesive film. The solar cell is a PERC crystal silicon solar cell, and the organic adhesive film is EVA. CO with the wavelength of 10.6 mu m and strongly reflected by the back surface of the solar cell and strongly absorbed by the organic adhesive film is adopted2Performing dynamic scanning irradiation treatment on the organic bonding adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to heat and melt the organic bonding adhesive film to form an organic bonding adhesive film melt, and blowing the melt in compressed airAnd the flow is generated under the action of the motion, and the flow is removed from the back surface of the crystalline silicon photovoltaic module semi-finished product. Through this embodiment, the same effect as that of embodiment 1 can be obtained, and the organic adhesive film on the back surface of the whole crystalline silicon photovoltaic module can be removed. The organic adhesive film on the back of the solar cells is completely removed, the solar cells are not damaged, and meanwhile, the organic adhesive film directly adhered to the photovoltaic glass plate among the solar cells is also removed.
Example 3
A method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module comprises the following steps:
after the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly are removed, a crystalline silicon photovoltaic assembly semi-finished product is obtained; the solar cell in the semi-finished product of the crystalline silicon photovoltaic module is still bonded on the photovoltaic glass plate by the organic bonding adhesive film, and the back of the solar cell is still bonded with a layer of organic bonding adhesive film. The solar cell is a crystalline silicon heterojunction solar cell, and the organic adhesive film is EVA. CO with the wavelength of 10.6 mu m and strongly reflected by the back surface of the solar cell and strongly absorbed by the organic adhesive film is adopted2The laser carries out dynamic scanning irradiation treatment on the organic bonding adhesive film on the back of the crystalline silicon photovoltaic module semi-finished product, so that the organic bonding adhesive film is heated and melted to form an organic bonding adhesive film melt, and the melt flows under the flushing action of a water gun and is removed from the back of the crystalline silicon photovoltaic module semi-finished product. Through this embodiment, the same effect as that of embodiment 1 can be obtained, and the organic adhesive film on the back surface of the whole crystalline silicon photovoltaic module can be removed. The organic adhesive film on the back of the solar cells is completely removed, the solar cells are not damaged, and meanwhile, the organic adhesive film directly adhered to the photovoltaic glass plate among the solar cells is also removed.
Example 4
A method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module comprises the following steps:
after the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly are removed, a crystalline silicon photovoltaic assembly semi-finished product is obtained; the solar cell in the semi-finished product of the crystalline silicon photovoltaic module is still bonded on the photovoltaic glass plate by the organic bonding adhesive film, and the back of the solar cell is still bonded with a layer of organic bonding adhesive film. SaidThe solar cell is a PERC crystal silicon solar cell, and the organic adhesive film is EVA. CO with the wavelength of 10.6 mu m and strongly reflected by the back surface of the solar cell and strongly absorbed by the organic adhesive film is adopted2And performing dynamic scanning irradiation treatment on the organic bonding adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to heat and melt the organic bonding adhesive film to form an organic bonding adhesive film melt, wherein the melt flows under the action of a scraper and is removed from the back of the semi-finished product of the crystalline silicon photovoltaic module. Through this embodiment, the same effect as that of embodiment 1 can be obtained, and the organic adhesive film on the back surface of the whole crystalline silicon photovoltaic module can be removed. The organic adhesive film on the back of the solar cells is completely removed, the solar cells are not damaged, and meanwhile, the organic adhesive film directly adhered to the photovoltaic glass plate among the solar cells is also removed.
The examples show that by using the method for irradiating the organic adhesive film on the back surface of the crystalline silicon photovoltaic module by using the laser, the organic adhesive film on the back surface of the photovoltaic module can be completely removed by using the melt flow of the organic adhesive film, including the organic adhesive film between the organic adhesive film on the back surface of the solar cell and the solar cell, which is directly bonded on the photovoltaic glass plate, and meanwhile, the solar cell cannot be damaged. The removed organic adhesive film can be cured and recovered again, and no waste gas polluting the environment is generated.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method for removing an organic adhesive film on the back of a crystalline silicon photovoltaic module is characterized by comprising the following steps:
removing the frame, the junction box and the back plate of the crystalline silicon photovoltaic assembly to obtain a crystalline silicon photovoltaic assembly semi-finished product;
irradiating the organic adhesive film on the back of the semi-finished product of the crystalline silicon photovoltaic module by using laser to enable the organic adhesive film to be molten and flow so as to remove the organic adhesive film;
the laser is the laser which is reflected by the back of the solar cell strongly and absorbed by the organic adhesive film strongly.
2. The method of claim 1, wherein the solar cell is an aluminum back field crystal silicon solar cell, a crystal silicon heterojunction solar cell, or a PERC crystal silicon solar cell.
3. The method according to claim 1 or 2, wherein the organic adhesive film is made of ethylene-vinyl acetate copolymer (EVA).
4. The method of claim 3, wherein the laser is a mid-infrared wavelength laser.
5. The method of claim 4, wherein the laser is 10.6 μm wavelength CO2And (4) laser.
6. The method of claim 1, wherein the laser is irradiated perpendicular to or oblique to the back surface of the crystalline silicon photovoltaic module semi-finished product.
7. The method of claim 6, wherein the laser is irradiated perpendicular to the back side of the crystalline silicon photovoltaic module semi-finished product.
8. The method according to claim 1, 6 or 7, wherein the laser irradiation is dynamic scanning irradiation.
9. The method as claimed in claim 1, wherein the organic adhesive film is melted to flow and removed by the aid of external force.
10. The method of claim 9, wherein the applying external force assistance comprises gravity assistance, air flow blowing assistance, liquid flushing assistance, or doctor blade assistance.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115446092A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Laminate irradiation treatment system and method |
| CN115503330A (en) * | 2022-06-27 | 2022-12-23 | 合复新材料科技(无锡)有限公司 | Interface separation and recovery method of EVA-Si laminating layer of solar backboard |
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| CN115446092A (en) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | Laminate irradiation treatment system and method |
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