CN111473875A - Microminiature temperature sensor for transient high temperature measurement and manufacturing method thereof - Google Patents
Microminiature temperature sensor for transient high temperature measurement and manufacturing method thereof Download PDFInfo
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- CN111473875A CN111473875A CN202010297217.9A CN202010297217A CN111473875A CN 111473875 A CN111473875 A CN 111473875A CN 202010297217 A CN202010297217 A CN 202010297217A CN 111473875 A CN111473875 A CN 111473875A
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- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
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Abstract
The invention provides a microminiature temperature sensor for transient high temperature measurement and a manufacturing method thereof, wherein the sensor comprises the following components: the temperature measuring element and the armored protective sleeve are sealed by high-temperature-resistant inorganic glue; the temperature measuring element comprises a double-hole ceramic column, a first metal wire type thermal electrode and a second metal wire type thermal electrode which are embedded into the double-hole ceramic column in parallel, a functional film which is deposited on the end face of the double-hole ceramic column and is connected with the first metal wire type thermal electrode and the second metal wire type thermal electrode to form a thermal contact film, and an insulating protective film which is deposited on the surface of the functional film. The microminiature temperature sensor provided by the invention has the advantages of simple structure, small volume, rapid dynamic response and the like, the temperature measuring range is 300-1500 ℃, and the microminiature temperature sensor is suitable for testing the surface transient high temperature of various spacecrafts and assemblies thereof such as aircrafts which come and go between the sky and the earth.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a microminiature temperature sensor for transient high temperature measurement and a manufacturing method thereof.
Background
After more than 100 years of development, modern aerospace technology has become an important component of human science and technology, and also becomes an important index for measuring the development degree of national industry. With the continuous forward progress of deep space exploration tasks, the temperature to be borne by high-temperature parts of the spacecraft is higher and higher, and the challenge is very serious.
In the ascending section and the returning section of the spacecraft, huge kinetic energy is converted into heat energy under the damping action of the atmosphere, and the instantaneous temperature of surface components reaches above 700 ℃. In the history of the development of aerospace engineering in the united states, extremely tragic accidents have also occurred, the most serious of which is the accident of the columbia space shuttle, which occurred in 2003. In the process of reducing the height of the airplane at high speed, the airplane and the atmosphere are in severe friction to generate high temperature of over 2000 ℃, the heat insulation material is difficult to bear the high temperature to cause the body to break, high-temperature gas instantly flows into the cabin, and 7 astronauts instantly melt without any precaution. At the same time, the aircraft disintegrates and explodes in the air, turning into countless high-speed falling aircraft fragments.
Therefore, in order to prolong the service life of the parts, the temperature field of the hot-end part needs to be monitored in real time so as to find out the hot spots of the hot-end part and provide data support for establishing a thermal simulation system. However, the operation speed of the spacecraft is extremely high, the temperature of the surface of the spacecraft can be changed violently by the heat converted from wind resistance, the temperature is as high as 1500 ℃, and the difficulty of temperature measurement is very large; in addition, the temperature measuring element needs to bear great impact during temperature measurement, the working environment is severe, and the difficulty of measuring the temperature in real time is increased.
Disclosure of Invention
In view of the above-mentioned technical problems, an object of the present invention is to provide a thin film sensor capable of withstanding a high temperature of 1500 ℃, having a small size, fast dynamic response and high sensitivity, and being used for surface transient high temperature testing of various spacecrafts and components thereof, such as shuttle aircrafts, and a method for manufacturing the same.
The technical means adopted by the invention are as follows:
a microminiature temperature sensor for transient pyrometry, comprising: the temperature measuring device comprises a temperature measuring element and an armored protective sleeve, wherein the temperature measuring element and the armored protective sleeve are sealed by high-temperature-resistant inorganic glue;
the temperature measuring element comprises a double-hole ceramic column, a first metal wire type thermal electrode and a second metal wire type thermal electrode which are embedded into the double-hole ceramic column in parallel, a functional film which is deposited on the end face of the double-hole ceramic column and is connected with the first metal wire type thermal electrode and the second metal wire type thermal electrode to form a hot contact film, and an insulating protective film which is deposited on the surface of the functional film.
Furthermore, ceramic dielectric layers are adopted for transition between the first metal wire type thermode and the double-hole ceramic column, and between the second metal wire type thermode and the double-hole ceramic column.
Further, the first metal wire type hot electrode and the second metal wire type hot electrode are respectively connected with the first compensation lead and the second compensation lead.
Further, the first wire type thermode and the first compensation lead are made of PtRh30 alloy materials, and the second wire type thermode and the second compensation lead are made of PtRh6 alloy materials.
Further, the armor protection sleeve is made of a nickel-based alloy material, and the high-temperature-resistant inorganic adhesive is double-bond DB5012 high-temperature-resistant inorganic adhesive.
Furthermore, the double-hole ceramic column is made of 99 alumina ceramic material.
Further, the functional film is made of PtRh6 alloy material.
Further, the insulating protective film includes Al2O3Insulating protective film and ZrO2And an insulating protective film.
The invention also provides a manufacturing method of the microminiature temperature sensor for transient high temperature measurement, which comprises the following steps:
s1, coating the first metal wire type hot electrode and the second metal wire type hot electrode with a ceramic medium layer diluted by distilled water according to a proper proportion;
s2, penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode coated with the ceramic dielectric layer into the double-hole ceramic column in parallel and then pulling out the first metal wire type thermal electrode and the second metal wire type thermal electrode, reducing the gap between the electrodes and the double-hole ceramic column by repeated operation, and then penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode into the double-hole ceramic column in parallel; the length of the lead wires of the two electrodes exceeds 1-2 mm of the double-hole ceramic column;
s3, sintering the coated first metal wire type thermal electrode, the coated second metal wire type thermal electrode and the coated double-hole ceramic column at high temperature;
s4, penetrating the high-temperature sintered double-hole ceramic column with the first metal wire type thermode and the second metal wire type thermode into an armored protective sleeve, and packaging the surface of the armored protective sleeve, which is in contact with the double-hole ceramic column, by using high-temperature-resistant inorganic glue;
s5, grinding and polishing the end faces of the packaged double-hole ceramic columns;
s6, depositing a functional film on the polished end face of the double-hole ceramic column by adopting a magnetron sputtering mode, wherein the functional film is connected with the first metal wire type hot electrode and the second metal wire type hot electrode to form a hot contact film;
and S7, depositing an insulating protective film on the surface of the deposited functional film by adopting a magnetron sputtering mode.
And S8, connecting the leads of the first wire type hot electrode and the second wire type hot electrode with a first compensation lead and a second compensation lead respectively.
Compared with the prior art, the invention has the following advantages:
the microminiature temperature sensor provided by the invention has the advantages of simple structure, small volume, rapid dynamic response and the like, the temperature measuring range is 300-1500 ℃, and the microminiature temperature sensor is suitable for testing the surface transient high temperature of various spacecrafts and assemblies thereof such as aircrafts which come and go between the sky and the earth.
For the reasons, the invention can be widely popularized in the fields of sensors and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a micro temperature sensor according to the present invention.
FIG. 2 is an enlarged view of a portion of a temperature measuring element according to the present invention.
FIG. 3 is a process diagram of the sintering temperature of the ceramic dielectric layer according to the present invention.
FIG. 4 is a graph of output voltage versus temperature for a sensor according to the present invention.
In the figure: 1. al (Al)2O3An insulating protective film; 2. ZrO (ZrO)2An insulating protective film; 3. a functional film; 4. a two-hole ceramic post; 5. a ceramic dielectric layer; 6. high temperature resistant inorganic glue; 7. armouring a protective sleeve; 8. a first wire-type thermode; 9. a second wire-type thermode; 10. a first compensation wire; 11. a second compensation wire; A. a temperature measuring element.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. Any specific values in all examples shown and discussed herein are to be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the absence of any contrary indication, these directional terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be considered as limiting the scope of the present invention: the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
As shown in fig. 1, the present invention provides a microminiature temperature sensor for transient pyrometry, comprising: the temperature measuring device comprises a temperature measuring element A and an armored protective sleeve 7, wherein the temperature measuring element A and the armored protective sleeve 7 are sealed by high-temperature-resistant inorganic glue 6;
as shown in fig. 2, the temperature measuring element a includes a dual-hole ceramic pillar 4, a first wire type hot electrode 8 and a second wire type hot electrode 9 embedded in the dual-hole ceramic pillar 4 in parallel, a functional film 3 deposited on an end surface of the dual-hole ceramic pillar 4 and connected with the first wire type hot electrode 8 and the second wire type hot electrode 9 to form a hot junction film, and an insulating protective film deposited on a surface of the functional film 3. The insulating protective film comprises Al2O3Insulating protective film 1 and ZrO2Insulating protective film 2。
Preferably, the first metal wire type hot electrode 8 and the second metal wire type hot electrode 9 are transited with the double-hole ceramic column 4 by adopting a ceramic medium layer 5.
Preferably, the first wire type hot electrode 8 and the second wire type hot electrode 9 are respectively connected with a first compensation lead 10 and a second compensation lead 11.
Preferably, the first wire type thermode and the first compensation lead are made of PtRh30 alloy materials, and the second wire type thermode and the second compensation lead are made of PtRh6 alloy materials. The armor protection sleeve is made of a nickel-based alloy material, and the high-temperature-resistant inorganic adhesive is double-bond DB5012 high-temperature-resistant inorganic adhesive. The double-hole ceramic column is made of 99 alumina ceramic material. The functional film is made of PtRh6 alloy material. The PtRh30/PtRh6 alloy can be used at 1600 ℃ for a long time, the highest temperature of short-term use can reach 1800 ℃, and the alloy has the characteristics of high melting point, considerable thermoelectromotive force, good compatibility of a plurality of insulating materials and protective materials, good manufacturability, performance reproducibility and the like.
As shown in FIG. 4, this embodiment also provides a graph of the output voltage of the sensor of the present invention as a function of temperature, and it can be seen that the maximum output voltage reaches 10.12 mV.
The invention also provides a manufacturing method of the microminiature temperature sensor for transient high temperature measurement, wherein before the sensor is prepared, an ultrasonic cleaning machine is used for sequentially cleaning the first metal wire type thermode, the second metal wire type thermode, the double-hole ceramic column, the armored protective sleeve and other devices by using acetone, alcohol and deionized water for 20 minutes respectively, removing the attached impurities on the surface, and then nitrogen is used for rapidly drying the surface; the method specifically comprises the following steps:
s1, coating the first metal wire type hot electrode and the second metal wire type hot electrode with a ceramic medium layer diluted by distilled water according to a proper proportion;
s2, penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode coated with the ceramic dielectric layer into the double-hole ceramic column in parallel and then pulling out the first metal wire type thermal electrode and the second metal wire type thermal electrode, reducing the gap between the electrodes and the double-hole ceramic column by repeated operation, and then penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode into the double-hole ceramic column in parallel; the length of the lead wires of the two electrodes exceeds 1-2 mm of the double-hole ceramic column;
s3, sintering the coated first metal wire type thermal electrode, the coated second metal wire type thermal electrode and the coated double-hole ceramic column at high temperature; the process sintering curve is shown in fig. 3.
S4, penetrating the high-temperature sintered double-hole ceramic column with the first metal wire type thermode and the second metal wire type thermode into an armored protective sleeve, and packaging the surface of the armored protective sleeve, which is in contact with the double-hole ceramic column, by using high-temperature-resistant inorganic glue;
s5, grinding and polishing the end faces of the packaged double-hole ceramic columns; preferably, sand paper with the models of 600 meshes, 800 meshes, 1000 meshes, 1200 meshes, 1500 meshes and 2000 meshes is sequentially used for grinding, and then diamond polishing paste with the models of W1.5, W1.0 and W0.5 is sequentially used for polishing on a polishing machine;
s6, depositing a functional film on the polished end face of the double-hole ceramic column by adopting a magnetron sputtering mode, wherein the thickness of the functional film is preferably 800nm, and the functional film is connected with the first metal wire type thermal electrode and the second metal wire type thermal electrode to form a hot contact film;
and S7, depositing an insulating protective film on the surface of the deposited functional film by adopting a magnetron sputtering mode. The insulating protective film comprises Al2O3Insulating protective film and ZrO2And the thickness of the insulating protective film is 400 nm.
And S8, connecting the leads of the first wire type hot electrode and the second wire type hot electrode with a first compensation lead and a second compensation lead respectively.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A microminiature temperature sensor for transient pyrometry, comprising: the temperature measuring device comprises a temperature measuring element and an armored protective sleeve, wherein the temperature measuring element and the armored protective sleeve are sealed by high-temperature-resistant inorganic glue;
the temperature measuring element comprises a double-hole ceramic column, a first metal wire type thermal electrode and a second metal wire type thermal electrode which are embedded into the double-hole ceramic column in parallel, a functional film which is deposited on the end face of the double-hole ceramic column and is connected with the first metal wire type thermal electrode and the second metal wire type thermal electrode to form a hot contact film, and an insulating protective film which is deposited on the surface of the functional film.
2. The microminiature temperature sensor for transient pyrometry according to claim 1, characterized in that ceramic dielectric layer transition is adopted between the first and second wire-type thermodes and the double-hole ceramic post.
3. The microminiature temperature sensor for transient pyrometry according to claim 1 or 2, characterized in that the first and second wire-type thermodes are connected to first and second compensation wires, respectively.
4. The microminiature temperature sensor for transient pyrometry according to claim 1, wherein said first wire-type hot electrode and first compensation lead are both made of PtRh30 alloy material, and said second wire-type hot electrode and second compensation lead are both made of PtRh6 alloy material.
5. The microminiature temperature sensor for transient pyrometry according to claim 1, wherein said armor protection sleeve is made of nickel-based alloy material, and said high temperature resistant inorganic glue is double bond DB5012 high temperature resistant inorganic glue.
6. The microminiature temperature sensor for transient pyrometry according to claim 1, characterized in that the double-hole ceramic posts are of 99 alumina ceramic material.
7. The microminiature temperature sensor for transient pyrometry according to claim 1, characterized in that the functional thin film employs PtRh6 alloy material.
8. The microminiature temperature sensor for transient pyrometry according to claim 1, characterized in that the insulating protection film comprises Al2O3Insulating protective film and ZrO2And an insulating protective film.
9. A manufacturing method of a microminiature temperature sensor for transient high temperature measurement is characterized by comprising the following steps:
s1, coating the first metal wire type hot electrode and the second metal wire type hot electrode with a ceramic medium layer diluted by distilled water according to a proper proportion;
s2, penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode coated with the ceramic dielectric layer into the double-hole ceramic column in parallel and then pulling out the first metal wire type thermal electrode and the second metal wire type thermal electrode, reducing the gap between the electrodes and the double-hole ceramic column by repeated operation, and then penetrating the first metal wire type thermal electrode and the second metal wire type thermal electrode into the double-hole ceramic column in parallel; the length of the lead wires of the two electrodes exceeds 1-2 mm of the double-hole ceramic column;
s3, sintering the coated first metal wire type thermal electrode, the coated second metal wire type thermal electrode and the coated double-hole ceramic column at high temperature;
s4, penetrating the high-temperature sintered double-hole ceramic column with the first metal wire type thermode and the second metal wire type thermode into an armored protective sleeve, and packaging the surface of the armored protective sleeve, which is in contact with the double-hole ceramic column, by using high-temperature-resistant inorganic glue;
s5, grinding and polishing the end faces of the packaged double-hole ceramic columns;
s6, depositing a functional film on the polished end face of the double-hole ceramic column by adopting a magnetron sputtering mode, wherein the functional film is connected with the first metal wire type hot electrode and the second metal wire type hot electrode to form a hot contact film;
s7, depositing an insulating protective film on the surface of the deposited functional film by adopting a magnetron sputtering mode;
and S8, connecting the leads of the first wire type hot electrode and the second wire type hot electrode with a first compensation lead and a second compensation lead respectively.
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| EP0764837A1 (en) * | 1995-09-25 | 1997-03-26 | Isuzu Ceramics Research Institute Co., Ltd. | Thermocouple structure |
| JP3952132B2 (en) * | 2001-05-30 | 2007-08-01 | いすゞ自動車株式会社 | Thermocouple for molten metal |
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