CN111470369B - Stretchable electronic device preparation method - Google Patents
Stretchable electronic device preparation method Download PDFInfo
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- CN111470369B CN111470369B CN202010297941.1A CN202010297941A CN111470369B CN 111470369 B CN111470369 B CN 111470369B CN 202010297941 A CN202010297941 A CN 202010297941A CN 111470369 B CN111470369 B CN 111470369B
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- Prior art keywords
- electric cylinder
- adhesive tape
- elastic adhesive
- motor box
- shadowless elastic
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000002390 adhesive tape Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000004513 sizing Methods 0.000 claims 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000009490 roller compaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1928—Printing plate
Abstract
The invention discloses a preparation method of a stretchable electronic device; the material grabbing device is fixed at one end of the supporting plate; the material grabbing device comprises a first motor box which is fixed on the supporting plate, two first linear rails are arranged on the first motor box side by side, and the first motor box also comprises a T-shaped first sliding block, the bottom surfaces of the cross arms of the first sliding blocks are respectively and fixedly provided with a first sliding block, the first sliding blocks are connected with the first line rail in a sliding way, the top surface of the first sliding block is provided with a first servo electric cylinder, the upper surface of the first servo electric cylinder is provided with a first chute, the invention adopts the technical proposal that the die body is provided with latticed raised grains, the die cover plate and the die body form a closed space, and the sealed space is changed into a vacuum state through the vacuum nozzle, so that the shadowless elastic adhesive tape is adsorbed on the grid-shaped raised grains, then, the piezoelectric micro-stack is used for pushing the electronic substrate film, so that the electronic substrate film is contacted with the shadowless elastic adhesive tape, and the contact part of the electronic substrate film and the shadowless elastic adhesive tape is bonded with the shadowless elastic adhesive tape.
Description
Technical Field
The invention relates to the technical field of electronic device preparation, in particular to a stretchable electronic device preparation method.
Background
With the development of the electronic industry, the stretchable electronic device gradually enters the visual field of people, and the stretchable electronic device has the characteristics of flexibility, stretchability and the like, so that the stretchable electronic device is suitable for emerging fields such as wearable devices, stretchable display devices and medical devices with biocompatibility, and has a great practical value.
However, the existing stretchable electronic device is usually prepared by roller rolling, but the stretchable electronic device is prepared by photoetching, laser ablation and the like, so that the preparation cost is high, the time is consumed, and the stretchable electronic device is not suitable for large-scale production.
Disclosure of Invention
The present invention aims to overcome the above-mentioned disadvantages and to provide a stretchable electronic device preparation machine which is efficient, low cost and suitable for mass production.
In order to achieve the purpose, the invention adopts the following specific scheme:
a stretchable electronic device manufacturing method comprises a support plate;
the material grabbing device is fixed at one end of the supporting plate; the material grabbing device comprises a first motor box which is fixed on the supporting plate, two first linear rails are arranged on the first motor box side by side, and the first motor box also comprises a T-shaped first sliding block, the bottom surfaces of the cross arms of the first sliding blocks are respectively and fixedly provided with a first sliding block, the first sliding blocks are connected with the first line rail in a sliding way, the top surface of the first sliding block is provided with a first servo electric cylinder, the upper surface of the first servo electric cylinder is provided with a first chute, the sliding device also comprises an L-shaped first electric cylinder sliding table, the bottom surface of the long arm of the first electric cylinder sliding table is provided with a first rib which is connected with the first sliding groove in a sliding manner, the front surface of the short arm of the first electric cylinder sliding table is provided with a first transmission rod, the first transmission rod is connected with the power output end of the first servo electric cylinder, and the back surface of the short arm of the first electric cylinder sliding table is provided with a material grabbing head;
the pressing device is fixed at the other end of the supporting plate; the pressing device comprises an L-shaped mounting seat, one end of the mounting seat is fixed on the supporting plate, the mounting seat is provided with a reinforcing plate, the pressing device further comprises a second motor box, the second motor box is fixed at the other end of the mounting seat, the second motor box is provided with two second linear rails side by side, the pressing device further comprises a T-shaped second sliding block, the bottom surface of a cross arm of the second sliding block is fixedly provided with a second sliding block and an L-shaped adapter block respectively, a short arm of the adapter block is fixed on the top surface of the second sliding block, a first piezoelectric micro-stack is arranged on the bottom surface of a long arm of the adapter block, a die set is arranged on the lower surface of the first piezoelectric micro-stack and comprises a die cover plate and a die body, the die body is provided with a rectangular groove, a plurality of needle holes are arranged in the groove, and the needle holes penetrate through the die body, a cavity is formed after the die cover plate is matched with the die body, latticed raised grains are arranged on the lower surface of the die body, and a vacuum nozzle is arranged on one side of the die body and communicated with the groove;
the supporting plate is also provided with a rectangular square hole, the material grabbing head is positioned on one side of the square hole, the square hole is positioned between the material grabbing device and the pressing device, and the supporting plate further comprises a bottom lifting device; the bottom lifting device comprises a second servo electric cylinder, a second sliding groove is formed in one side face of the second servo electric cylinder, an L-shaped fixing plate is arranged on the other side face of the second servo electric cylinder, the fixing plate is fixedly connected with the bottom face of the supporting plate, a reinforcing plate is further arranged on the fixing plate, an L-shaped second electric cylinder sliding table is further included, a second ridge is arranged on the back face of a long arm of the second electric cylinder sliding table, the second ridge is connected with the second sliding groove in a sliding mode, a second transmission rod is arranged on the bottom face of a short arm of the second electric cylinder sliding table, the second transmission rod is connected with a power output end of the second servo electric cylinder, a second piezoelectric micro-stack is mounted on the top face of the other end of the second electric cylinder sliding table, and the second piezoelectric micro-stack is located right below the die body;
the feeding device is positioned on the other side of the square hole and is fixed on the supporting plate; the feeding device comprises two roller supports which are arranged in parallel, the roller supports are arranged on the supporting plate, the two roller supports are connected with three groups of power rollers in a shaft mode, one group of power rollers are arranged close to the die body, and the three groups of power rollers are arranged in a triangular mode;
also comprises a conveying device; the conveying device comprises a conveying belt and two transmission rollers, the conveying belt is sleeved on the two transmission rollers, and two ends of each transmission roller are respectively connected with a bearing seat in a shaft mode.
As a preferable scheme of the present invention, first end cover plates are respectively disposed at two ends of the first motor box, and the first end cover plates are detachably connected to the first motor box.
As a preferable scheme of the present invention, two ends of the second motor box are respectively provided with a second end cover plate, and the second end cover plates are detachably connected to the second motor box.
The invention has the beneficial effects that: the invention adopts the technical scheme that latticed raised grains are arranged on a die body, a closed space is formed by a die cover plate and the die body, the closed space is changed into a vacuum state through a vacuum connecting nozzle, a shadowless elastic adhesive tape is adsorbed on the latticed raised grains, then the electronic substrate film is pushed by utilizing a piezoelectric micro-stack to be in contact with the shadowless elastic adhesive tape, the part of the electronic substrate film in contact with the shadowless elastic adhesive tape is bonded with the shadowless elastic adhesive tape, the part of the electronic substrate film not in contact with the shadowless elastic adhesive tape is not bonded with the shadowless elastic adhesive tape, when the shadowless elastic adhesive tape releases tensile strain, the shadowless elastic adhesive tape contracts, the contraction force enables the part of the electronic substrate film not bonded with the shadowless elastic adhesive tape to be bent and arched upwards to form a latticed corrugated structure, and the prepared stretchable electronic device has stronger stretchability and more reliable quality, the invention adopts the piezoelectric micro-stack for fine adjustment, so that the electronic substrate film is bonded with the shadowless elastic adhesive tape, thereby avoiding the damage of the electronic substrate film caused by roller compaction and ensuring the quality and reliability of the stretchable electronic device; the invention has the characteristics of high efficiency and low cost, and is suitable for large-scale production.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view from another perspective of the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a schematic structural view of the material grabbing device of the invention;
FIG. 5 is a schematic view of the construction of the hold-down device of the present invention;
FIG. 6 is a schematic view of another aspect of the hold-down device of the present invention;
FIG. 7 is an enlarged schematic view at I of FIG. 6;
FIG. 8 is a schematic view of an exploded structure of the die set of the present invention;
FIG. 9 is a schematic view of the bottom lift of the present invention;
description of reference numerals: 12-a support plate; 21-a first motor box; 211-a first end cover plate; 22-a first linear rail; 23-a first slider; 24-a first slider; 25-a first servo electric cylinder; 251-a first runner; 26-a first electric cylinder slide; 261-a first rib; 262-a first transfer lever; 263-material grabbing head; 31-a mounting seat; 32-a second motor case; 321-a second end cap plate; 33-a second wire track; 34-a second slider; 35-a second slide; 36-a transfer block; 37-a first piezoelectric micromovement stack; 381-mold cover plate; 382-a die body; 3821-grain; 3822-pinhole; 383-a vacuum nozzle; 41-a second servo electric cylinder; 411-a second chute; 412-a fixation plate; 42-a second electric cylinder slide; 421-second ribs; 422-second transmission rod; 43-a second piezoelectric micromovement stack; 51-a drum support; 52-a powered roller; 61-a conveyor belt; 62-driving rollers; 63-bearing seat.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 9, the stretchable electronic device manufacturing method according to the present embodiment includes a supporting plate 12;
the material grabbing device is fixed at one end of the supporting plate 12; the material grabbing device comprises a first motor box 21, the first motor box 21 is fixed on the supporting plate 12, two first tracks 22 are arranged on the first motor box 21 side by side, the material grabbing device further comprises a T-shaped first sliding block 23, a first sliding block 24 is fixedly arranged on the bottom surface of a cross arm of the first sliding block 23 respectively, the first sliding block 24 is connected with the first tracks 22 in a sliding manner, the first motor box 21 is provided with a device for driving the first sliding block 23 to move back and forth, a first servo electric cylinder 25 is arranged on the top surface of the first sliding block 23, a first sliding groove 251 is arranged on the upper surface of the first servo electric cylinder 25, the material grabbing device further comprises an L-shaped first electric cylinder sliding table 26, a first ridge 261 is arranged on the bottom surface of a long arm of the first electric cylinder sliding table 26, the first ridge 261 is connected with the first sliding groove 251 in a sliding manner, a first transmission rod 262 is arranged on the front surface of a short arm of the first electric cylinder sliding table 26, the first transmission rod 262 is connected with the power output end of the first servo electric cylinder 25, and a material grabbing head 263 is arranged on the back of the short arm of the first electric cylinder sliding table 26;
the pressing device is fixed at the other end of the supporting plate 12; the downward pressing device comprises an L-shaped mounting base 31, one end of the mounting base 31 is fixed on the supporting plate 12, the mounting base 31 is provided with a reinforcing plate and further comprises a second motor box 32, the second motor box 32 is fixed at the other end of the mounting base 31, two second line rails 33 are arranged on the second motor box 32 side by side, the downward pressing device further comprises a T-shaped second sliding block 34, a second sliding block 35 is fixedly arranged on the bottom surface of a cross arm of the second sliding block 34 respectively, the second motor box 32 is provided with a device for driving the second sliding block 34 to move back and forth, the downward pressing device further comprises an L-shaped switching block 36, a short arm of the switching block 36 is fixed on the top surface of the second sliding block 34, a first micro-motion piezoelectric stack 37 is arranged on the bottom surface of a long arm of the switching block 36, a die set is arranged on the lower surface of the first micro-motion piezoelectric stack 37, the die set comprises a die cover plate 381 and a die body 382, the mold body 382 is provided with a rectangular groove, a plurality of needle holes 3822 are arranged in the groove, the needle holes 3822 penetrate through the mold body 382, a cavity is formed after the mold cover plate 381 is matched with the mold body 382, grid-shaped raised grains 3821 are arranged on the lower surface of the mold body 382, a vacuum nozzle 383 is arranged on one side of the mold body 382, and the vacuum nozzle 383 is communicated with the groove;
the supporting plate 12 is further provided with a rectangular square hole, the material grabbing head 263 is positioned on one side of the square hole, the square hole is positioned between the material grabbing device and the pressing device, and the supporting plate further comprises a bottom lifting device; the bottom lifting device comprises a second servo electric cylinder 41, a second chute 411 is arranged on one side surface of the second servo electric cylinder 41, the other side surface of the second servo electric cylinder 41 is provided with an L-shaped fixing plate 412, the fixing plate 412 is fixedly connected with the bottom surface of the supporting plate 12, the fixing plate 412 is further provided with a reinforcing plate, and further comprises an L-shaped second electric cylinder sliding table 42, the back surface of the long arm of the second electric cylinder sliding table 42 is provided with a second rib 421, the second rib 421 is connected with the second sliding slot 411 in a sliding manner, a second transmission rod 422 is arranged on the bottom surface of the short arm of the second electric cylinder sliding table 42, the second transmission rod 422 is connected with the power output end of the second servo electric cylinder 41, a second piezoelectric micromotion stack 43 is mounted on the top surface of the short arm of the second electric cylinder sliding table 42, and the second piezoelectric micromotion stack 43 is located right below the die body 382;
the feeding device is positioned on the other side of the square hole and is fixed on the supporting plate 12; the feeding device comprises two roller supports 51 which are arranged in parallel, the roller supports 51 are arranged on the supporting plate 12, the two roller supports 51 are connected with three groups of power rollers 52 in a shaft mode, one group of power rollers 52 is arranged close to the die body 382, and the three groups of power rollers 52 are arranged in a triangular mode;
also comprises a conveying device; the conveying device comprises a conveying belt 61 and two transmission rollers 62, the conveying belt 61 is sleeved on the two transmission rollers 62, and two ends of each transmission roller 62 are respectively connected with a bearing block 63 in a shaft mode.
The working mode of the embodiment is as follows: the shadowless elastic adhesive tape is in a stretching state, the pressing device extends downwards to the position above the shadowless elastic adhesive tape, the second motor box 32 stops driving after a certain distance from the shadowless elastic adhesive tape, then the first piezoelectric micro-stack 37 works to enable the lower surface of the die body 382 to be in contact with the shadowless elastic adhesive tape, the die cover plate 381 is matched with the die body 382 to form a closed space, the closed space is vacuumized through the vacuum nozzle 383, so that the needle hole 3822 is in a negative pressure state, the shadowless elastic adhesive tape is attached and adsorbed on the grid-shaped raised grains 3821, and preliminary forming work is completed; then the bottom lifting device rises to drive the second piezoelectric micro-stack 43 to approach the electronic substrate film, after a certain distance from the electronic substrate film, the second servo electric cylinder 41 stops driving, then the second piezoelectric micro-stack 43 works to drive the electronic substrate film to move upwards, the part of the electronic substrate film, which is in contact with the shadowless elastic adhesive tape, is bonded with the shadowless elastic adhesive tape, and the part of the electronic substrate film, which is not in contact with the shadowless elastic adhesive tape, is not bonded with the shadowless elastic adhesive tape, so that the bonding and molding with the electronic substrate film are completed; after the laminating and shaping are completed, the die body 382 releases the vacuum negative pressure state, the pressing device drives the die body 382 to move upwards, meanwhile, the material grabbing device extends out, the material grabbing head 263 clamps the stretchable electronic device which is subjected to laminating and shaping, under the driving of the first motor box 21, the material grabbing head 263 drives the stretchable electronic device which is subjected to laminating and shaping to move to the upper side of the conveying device, after the stretchable electronic device which is subjected to laminating and shaping is cut off, the shadowless elastic adhesive tape releases the stretching strain, the shadowless elastic adhesive tape contracts, the contraction force enables the part which is not bonded with the shadowless elastic adhesive tape to be bent and upwards arched to form a latticed wrinkle structure, and the prepared stretchable electronic device with latticed wrinkles is transferred by the conveying belt, namely, the whole preparation process of the stretchable electronic device is completed.
In the embodiment, the die body 382 is provided with the latticed raised grains 3821, and the shadowless elastic adhesive tape is adsorbed on the latticed raised grains 3821 by utilizing the air pressure principle, so that the prepared stretchable electronic device is stronger in stretchability, more reliable in quality, more uniform in performance and better in stability; the embodiment has the characteristics of high efficiency and low cost, and is suitable for large-scale production.
On the basis of above-mentioned embodiment, furtherly, the both ends of first motor box 21 are equipped with first end cover plate 211 respectively, prevent first sliding block 23 is followed first line rail 22 drops, first end cover plate 211 with first motor box 21 can be dismantled and be connected, convenient equipment and dismantlement, and the structure is nimble.
On the basis of above-mentioned embodiment, furtherly, the both ends of second motor box 32 are equipped with end second end cover plate 321 respectively, prevent second sliding block 34 is followed drop on the second wire rail 33, second end cover plate 321 with second motor box 32 can dismantle and be connected, convenient equipment and dismantlement, and the structure is nimble.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.
Claims (4)
1. A method of making a stretchable electronic device, comprising:
firstly, a shadowless elastic adhesive tape is in a stretching state, a pressing device is downwards extended to the position above the shadowless elastic adhesive tape, a second motor box (32) stops driving after the shadowless elastic adhesive tape is away from the shadowless elastic adhesive tape by a certain distance, then a first piezoelectric micro-stack (37) works to enable the lower surface of a die body (382) to be in contact with the shadowless elastic adhesive tape, a die cover plate (381) is matched with the die body (382) to form a closed space, the closed space is vacuumized through a vacuum joint nozzle (383), so that a needle hole (3822) is in a negative pressure state, the shadowless elastic adhesive tape is attached to and adsorbed on grid-shaped raised grains (3821), and primary forming work is completed; then the bottom lifting device rises to drive the second piezoelectric micro-stack (43) to be close to the electronic substrate film, the second servo electric cylinder (41) stops driving after a certain distance from the electronic substrate film, then the second piezoelectric micro-stack (43) works to drive the electronic substrate film to move upwards, the part of the electronic substrate film, which is in contact with the shadowless elastic adhesive tape, can be bonded with the shadowless elastic adhesive tape, and the part of the electronic substrate film, which is not in contact with the shadowless elastic adhesive tape, cannot be bonded with the shadowless elastic adhesive tape, so that the bonding and molding with the electronic substrate film are completed; after the laminating and sizing are completed, the vacuum negative pressure state of the die body (382) is relieved, the pressing device drives the die body (382) to move upwards, meanwhile, the material grabbing device extends out, the material grabbing head (263) clamps the stretchable electronic device which is subjected to laminating and sizing, under the driving of the first motor box (21), the material grabbing head (263) drives the stretchable electronic device which is subjected to laminating and sizing to move to the upper part of the conveying device, after the stretchable electronic device which is subjected to laminating and sizing is cut off, the shadowless elastic adhesive tape releases stretching strain, the shadowless elastic adhesive tape contracts, the contraction force enables the part which is not bonded with the shadowless elastic adhesive tape to be bent and arched upwards to form a latticed folded structure, and the prepared stretchable electronic device with latticed folds is transferred by the conveying belt, namely the whole preparation process of the stretchable electronic device is completed.
2. A stretchable electronic device preparation method according to claim 1, wherein: the stretchable electronic device preparation apparatus includes a support plate (12);
the material grabbing device is fixed at one end of the supporting plate (12); the material grabbing device comprises a first motor box (21), wherein the first motor box (21) is fixed on the supporting plate (12), two first line rails (22) are arranged on the first motor box (21) side by side, the material grabbing device further comprises a T-shaped first sliding block (23), a first sliding block (24) is fixedly arranged on the bottom surface of a cross arm of the first sliding block (23) respectively, the first sliding block (24) is connected with the first line rails (22) in a sliding mode, a first servo electric cylinder (25) is installed on the top surface of the first sliding block (23), a first sliding groove (251) is formed in the upper surface of the first servo electric cylinder (25), the material grabbing device further comprises an L-shaped first electric cylinder sliding table (26), a first edge strip (262) is arranged on the bottom surface of a long arm of the first electric cylinder sliding table (26), the first edge strip (261) is connected with the first sliding groove (251) in a sliding mode, a first transmission rod (262) is arranged on the front surface of the short arm of the first electric cylinder sliding table (26), the first transmission rod (262) is connected with the power output end of the first servo electric cylinder (25), and a material grabbing head (263) is arranged on the back of the short arm of the first electric cylinder sliding table (26);
the pressing device is fixed at the other end of the supporting plate (12); the pressing device comprises an L-shaped mounting seat (31), one end of the mounting seat (31) is fixed on the supporting plate (12), the mounting seat (31) is provided with a reinforcing plate and further comprises a second motor box (32), the second motor box (32) is fixed at the other end of the mounting seat (31), two second linear rails (33) are arranged on the second motor box (32) side by side, the pressing device further comprises a T-shaped second sliding block (34), a second sliding block (35) is fixedly arranged on the bottom surface of a cross arm of the second sliding block (34), an L-shaped transfer block (36) is further included, a short arm of the transfer block (36) is fixed on the top surface of the second sliding block (34), a first piezoelectric stack (37) is installed on the bottom surface of a long arm of the transfer block (36), a die set is installed on the lower surface of the first piezoelectric stack (37), and comprises a die cover plate (381) and a die body (382), the mold comprises a mold body (382), and is characterized in that the mold body (382) is provided with a rectangular groove, a plurality of needle holes (3822) are arranged in the groove, the needle holes (3822) penetrate through the mold body (382), a cavity is formed after a mold cover plate (381) is matched with the mold body (382), grid-shaped raised grains (3821) are arranged on the lower surface of the mold body (382), a vacuum nozzle (383) is arranged on one side of the mold body (382), and the vacuum nozzle (383) is communicated with the groove;
the supporting plate (12) is also provided with a rectangular square hole, the material grabbing head (263) is positioned on one side of the square hole, the square hole is positioned between the material grabbing device and the pressing device, and the supporting plate further comprises a bottom lifting device; the bottom lifting device comprises a second servo electric cylinder (41), a second sliding groove (411) is arranged on one side face of the second servo electric cylinder (41), a fixing plate (412) in an L shape is arranged on the other side face of the second servo electric cylinder (41), the fixing plate (412) is fixedly connected with the bottom face of the supporting plate (12), a reinforcing plate is further arranged on the fixing plate (412), the bottom lifting device further comprises a second electric cylinder sliding table (42) in an L shape, a second edge strip (421) is arranged on the back face of a long arm of the second electric cylinder sliding table (42), the second edge strip (421) is slidably connected with the second sliding groove (411), a second transmission rod (422) is arranged on the bottom face of a short arm of the second electric cylinder sliding table (42), the second transmission rod (422) is connected with the power output end of the second servo electric cylinder (41), a second piezoelectric stack (43) is arranged on the top face of the short arm of the second electric cylinder sliding table (42), the second piezoelectric micromotion stack (43) is located directly below the die body (382);
the feeding device is positioned on the other side of the square hole and is fixed on the supporting plate (12); the feeding device comprises two roller supports (51) which are arranged in parallel, the roller supports (51) are arranged on the supporting plate (12), the two roller supports (51) are connected with three groups of power rollers (52) in a shaft mode, one group of power rollers (52) are arranged close to the die body (382), and the three groups of power rollers (52) are arranged in a triangular mode;
still include conveyer, conveyer is including conveyer (61) and two drive rolls (62), conveyer (61) cover is in two drive rolls (62) are last, the both ends of drive roll (62) have connect bearing frame (63) respectively by the axle.
3. A stretchable electronic device preparation method according to claim 1, wherein: the two ends of the first motor box (21) are respectively provided with a first end cover plate (211), and the first end cover plate (211) is detachably connected with the first motor box (21).
4. A stretchable electronic device preparation method according to claim 1, wherein: and two ends of the second motor box (32) are respectively provided with a second end cover plate (321), and the second end cover plates (321) are detachably connected with the second motor box (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010297941.1A CN111470369B (en) | 2018-05-18 | 2018-05-18 | Stretchable electronic device preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010297941.1A CN111470369B (en) | 2018-05-18 | 2018-05-18 | Stretchable electronic device preparation method |
| CN201810476665.8A CN108715038B (en) | 2018-05-18 | 2018-05-18 | Stretchable electronic device preparation structure |
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| CN201810476665.8A Division CN108715038B (en) | 2018-05-18 | 2018-05-18 | Stretchable electronic device preparation structure |
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| CN111470369A CN111470369A (en) | 2020-07-31 |
| CN111470369B true CN111470369B (en) | 2022-01-11 |
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| CN202010297941.1A Active CN111470369B (en) | 2018-05-18 | 2018-05-18 | Stretchable electronic device preparation method |
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| US4844772A (en) * | 1986-05-07 | 1989-07-04 | Somar Corporation | Laminator |
| CN1676449A (en) * | 2004-03-29 | 2005-10-05 | 海德堡印刷机械股份公司 | Device for separating printing plates |
| CN102469688A (en) * | 2010-11-10 | 2012-05-23 | 嘉联益科技股份有限公司 | Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| CN106601933A (en) * | 2016-12-12 | 2017-04-26 | 吉林大学 | Preparation method for stretchable electronic device with regular corrugated structure |
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| US6776097B2 (en) * | 2002-10-02 | 2004-08-17 | Dainippon Screen Mfg. Co., Ltd. | Plate supplying apparatus |
| US20060124705A1 (en) * | 2004-12-09 | 2006-06-15 | International Business Machines Corporation | Solder reflow system and method thereof |
| KR101227048B1 (en) * | 2011-04-25 | 2013-01-29 | (주)우리엔지니어링 | Apparatus for adhering cover-lay |
| CN102285122B (en) * | 2011-05-10 | 2013-05-22 | 浙江洁美电子科技有限公司 | Forming machine of electronic component bearing band and use method thereof |
| CN204498473U (en) * | 2015-03-26 | 2015-07-22 | 珠海元盛电子科技股份有限公司 | A kind of reinforcement steel disc pastes head group part |
| CN106304658B (en) * | 2016-11-11 | 2018-09-14 | 伟时电子股份有限公司 | FPC attaches mechanism |
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| US4844772A (en) * | 1986-05-07 | 1989-07-04 | Somar Corporation | Laminator |
| CN1676449A (en) * | 2004-03-29 | 2005-10-05 | 海德堡印刷机械股份公司 | Device for separating printing plates |
| CN102469688A (en) * | 2010-11-10 | 2012-05-23 | 嘉联益科技股份有限公司 | Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| CN106601933A (en) * | 2016-12-12 | 2017-04-26 | 吉林大学 | Preparation method for stretchable electronic device with regular corrugated structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108715038B (en) | 2020-05-15 |
| CN111470369A (en) | 2020-07-31 |
| CN108715038A (en) | 2018-10-30 |
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Inventor after: Chen Jierong Inventor after: Du Feixue Inventor after: Zhang Haigen Inventor before: Zhang Haigen |
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Effective date of registration: 20240426 Address after: Building 4, Dongyu Industrial Park, Xingdong New Area, Xingtai City, Hebei Province, 054000 Patentee after: Zhongke Rongyao (Hebei) Intelligent Electronics Co.,Ltd. Country or region after: China Address before: 518000 room a, 6 / F, jinguangxia liberal arts park, No. 3, Guangxia Road, shangmeilin, Futian District, Shenzhen, Guangdong Province Patentee before: Zhang Haigen Country or region before: China |