CN111465185A - Circuit board, inductance coil, inductor and manufacturing method of inductor - Google Patents
Circuit board, inductance coil, inductor and manufacturing method of inductor Download PDFInfo
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- CN111465185A CN111465185A CN202010258190.2A CN202010258190A CN111465185A CN 111465185 A CN111465185 A CN 111465185A CN 202010258190 A CN202010258190 A CN 202010258190A CN 111465185 A CN111465185 A CN 111465185A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000000178 monomer Substances 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 4
- 230000005426 magnetic field effect Effects 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a circuit board, an inductance coil, an inductance and a manufacturing method of the inductance, wherein the circuit board comprises a substrate, wherein a plurality of connecting through holes are arranged on the substrate, and the connecting through holes are orderly arranged on the substrate; a wire is laid between the two connecting through holes, an electroplated layer is arranged in each connecting through hole, the connecting through holes are electrically connected with the wire, the plurality of coil monomers are connected in series through the circuit board to form an inductance coil, and the inductance coil is added with a resistance-capacitance component to form an inductance. The circuit board can be used for connecting different circuits in series, particularly can be used for connecting a plurality of coils in series without influencing the magnetic field effect of the coils, and the inductance coil can flexibly adjust the number and the size of the inductance coil according to the requirement and can be adjusted into inductances with different specifications and inductance values. The position of the resistance-capacitance component relative to the inductance coil can be continuously adjusted, and the service life of the inductance coil is not influenced. The invention can save the supporting framework and save the cost.
Description
Technical Field
The invention relates to the technical field of electronic appliances and measurement auxiliary equipment, in particular to a circuit board, an inductance coil, an inductance and a manufacturing method of the inductance.
Background
In various inductors, there is an intrinsic characteristic: and (4) resonating. The inductor coil generates self-excited oscillation due to the interaction between the capacitance and the inductance between the inductor coil layers or turns, and the frequency of the self-excited oscillation is called as resonance frequency. When the inductor is used conventionally, the inductor with the resonance frequency far away from the use frequency range is selected, so that the deviation of circuit parameters caused by the resonance of an inductor device is avoided; when the frequency signal used approaches the resonance frequency, the parameters of the device change sharply, and the characteristics of the circuit network connected with the device deviate greatly from the theoretical values.
In order to solve the problem of inhibiting the resonance characteristic of the inductance coil in the production process of the artificial power supply network, the parameters of a resistance-capacitance component for inhibiting the resonance characteristic need to be adjusted repeatedly; the impedance of the EUT port of the artificial power supply network meets the national standard requirement by adjusting the resonance characteristic. In the adjusting process, the adjustment of the position of the resistance-capacitance component is the most complicated thing.
Through retrieval, based on the defects in the prior art, related solutions are disclosed, for example, in chinese patent application No. 92110738.2, an inductance coil is disclosed, which specifically discloses: the structure of the inductance coil is mainly that an annular magnetic core is arranged at a proper position on the induction coil, the annular magnetic core is composed of an annular circular magnetic core and an enameled wire wound on the circular magnetic core, and the annular magnetic core is wound and arranged on the induction coil by means of the enameled wire; the annular magnetic core is used for eliminating alternating current interference generated when radio frequency signals and alternating current signals in the induction coil are transmitted simultaneously, and the response curve of higher frequency is not influenced, so that the effect of improving the frequency bandwidth of carrier signals can be achieved, although the resonance condition is reduced to a certain extent, the scheme still cannot flexibly adjust the installation positions of the resistor and the capacitor according to the requirement, and the problem that the resistor and the capacitor are installed for many times in the conventional product coil cannot be solved.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention provides a circuit board, an inductance coil, an inductance and a manufacturing method of the inductance, aiming at solving the problem that the inductance coil is inconvenient to efficiently or repeatedly adjust the parameters of the capacitance and the resistance in the production process so as to inhibit the resonance characteristic of the inductance coil.
2. Technical scheme
In order to achieve the purpose, the invention adopts the following technical scheme:
a circuit board comprises a substrate, wherein a plurality of connecting through holes are formed in the substrate and are orderly arranged; and a lead is laid between the two connecting through holes, an electroplated layer is arranged in each connecting through hole, and each connecting through hole is electrically connected with the corresponding lead.
Preferably, in the circuit board, the wires are printed wires, and the wires are parallel to each other on the substrate.
Preferably, the two ends of the substrate are provided with connecting terminals, plating layers are also arranged in the connecting terminals, the connecting terminals are electrically connected with the leads, and the substrate is connected with other circuits through the connecting terminals.
The utility model provides an inductance coil, includes the coil monomer, still includes foretell circuit board, the coil monomer is a plurality of, and the single P1 of coil, P2 pin are connected with the connect the via hole electricity on the base plate, and each coil monomer is established ties on the base plate.
Preferably, the single coil body is a single-turn coil or a multi-turn coil.
An inductor comprises a resistance-capacitance component and the inductance coil, wherein the resistance-capacitance component is welded and fixed in a connecting through hole in a substrate.
Preferably, a plurality of the resistance-capacitance components may be soldered to the substrate.
Preferably, the two ends of the circuit board are provided with assembly holes, and the inductor is assembled on the equipment through the assembly holes.
A manufacturing method of the inductor comprises the following steps:
(1) preparing a plurality of hollow coil monomers;
(2) inserting the pins P1 and P2 of the coil monomer prepared in the step (1) into the corresponding connecting through holes of the substrate, and welding one of the pins;
(3) connecting all the coil monomers prepared in the step (1) with the substrate according to the step (2), and inserting the support framework into the coil;
(4) tightening the coil, and welding the other pin of the coil in the corresponding connecting through hole;
(5) and welding the resistance-capacitance components to the corresponding connecting through holes on the substrate.
Preferably, after the resistance-capacitance component is welded, the supporting framework is drawn out, and glue is coated on the corresponding position of the coil.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following remarkable effects:
(1) the circuit board of the invention can be used for connecting different circuits in series, particularly connecting a plurality of coils in series, and does not influence the magnetic field effect of the coils.
(2) The inductance coil can flexibly adjust the number and the size of the inductance coil according to the requirement, can be adjusted into inductances with different specifications and inductance values, and has wider application range. Each coil is fixedly connected with the circuit board, the resistor and the capacitor can be connected at the fixed connection position of the coil and the circuit board, and the efficiency of adjusting the resonance characteristic of the inductor can be improved by adjusting the positions of the resistor and the capacitor on the printed circuit board and the parameters of the resistor and the capacitor, so that the consistency of the inductance parameters is finally ensured.
(3) When the positions of the resistor and the capacitor are adjusted, the prepared coil is not required to be stripped, and after the coil, the resistor and the capacitor are installed on the circuit board, the installation interface positions are fixed, the interface positions are not required to be subjected to insulation treatment, and short circuit among the interfaces is avoided.
(4) The coil, the resistor and the capacitor are more convenient to install and fix, and the production efficiency of the inductor is further improved.
(5) The invention can omit the supporting framework, only needs to use the supporting framework in the installation process, can be directly pulled away after the coil is installed, and the supporting framework can be reused.
Drawings
Fig. 1 is a schematic diagram of a circuit board structure according to the present invention.
Fig. 2 is a schematic structural diagram of a single-turn coil inductor according to the present invention.
Fig. 3 is a schematic structural diagram of a multi-turn coil inductor according to the present invention.
Fig. 4 is a schematic structural diagram of an inductance support skeleton according to the present invention.
Fig. 5 is a schematic diagram of a single-turn inductor according to the present invention.
Fig. 6 is a schematic diagram of a multi-turn inductor according to the present invention.
Fig. 7 is a schematic diagram of inductance distribution parameters in the present invention.
The reference numerals in the schematic drawings illustrate:
100. a single turn coil; 101. a multi-turn coil 101; 102. a substrate 102; 103. a connecting through hole; 104. an assembly hole; 105. a wiring terminal; 106. a wire; 107. a support framework; 108. and a resistance-capacitance element.
Detailed Description
Example 1
As shown in fig. 1, the present invention provides a circuit board for connecting other circuits in series, the circuit board includes a substrate 102, and the substrate 102 is made of a non-conductive material, such as a PCB. A plurality of connecting through holes 103 are provided on the substrate 102, and the connecting through holes 103 are arranged in an orderly manner on the substrate 102, for example, two rows of connecting through holes 103 are provided on the substrate 102. A lead 106 is laid between every two connecting through holes 103, the connecting through holes 103 are electrically connected through the lead 106, and the inner side surfaces of the connecting through holes 103 are provided with electroplated layers for conducting electricity, and the electroplated layers are electrically connected with the lead 106. When the circuit board is connected with other circuits in series, the connecting wires of the other circuits can be directly welded in the connecting through holes 103, when a plurality of other circuits need to be connected in series, each other circuit is sequentially connected with one end of two adjacent wires 106, for example, two rows of connecting through holes 103 are arranged on the substrate 102, the first row of connecting through holes 103 are sequentially K11, K21, K31 and K41 … … Kn1, the second row of connecting through holes 103 are sequentially K12, K22, K32 and K42 … … Kn2, wherein K11 and K12 are connected through the wires 106, and K21 and K22 are connected through the wires 106, … … Kn1 and Kn2 are connected through the wires 106. When a plurality of other circuits are required to be connected in series with the circuit board of the invention, two leads of the first other circuit can be respectively connected with K11 and K22 on the substrate 102, two leads of the second other circuit are respectively connected with two leads of the (n-1) th other circuit of K21 and K32 … … and are respectively connected with K (n-1)1 and Kn2, and thus, the other circuits required to be connected in series can be all connected in series.
The wires 106 on the substrate 102 can be printed in a printed wire manner, that is, the wires 106 are directly printed on the substrate 102, the number of the connecting through holes 103 and the number of the wires 106 can be set according to the number of circuits connected in series according to actual needs, the wires 106 can be arranged in parallel with each other, the parallel arrangement is tidier when being connected with other circuits, the guide can be selected to be parallel to or inclined at a certain angle with one of the edges of the substrate 102 according to needs, the wires 106 can be arranged in parallel with each other and can be used as a plurality of coil monomers to be connected in series to form a part of a large coil, and the stability and the magnetic field. A connecting terminal 105 is further provided on the substrate 102 for connecting the circuit board in series with other circuits, and the connecting terminal 105 may be a connecting through hole 103 at one end of the two outermost wires 106 on the substrate 102, such as K11 and Kn2 on the substrate 102, or K12 and Kn1 on the substrate 102; the terminals 105 may be provided separately at both ends of the substrate 102, the terminals 105 provided separately may be through holes penetrating the substrate 102, plating layers may be provided in the through holes, and the terminals 105 may be electrically connected to the connecting through holes 103 at both ends of the substrate 102 by wires 106 provided between the terminals 106 and the connecting through holes 106. The connection terminal 105 may also be a welding point directly welded at two ends of the substrate 102, and a wire 106 is arranged between the welding point and the connection through hole 103 and electrically connected through the wire 106, and in short, any scheme that allows the circuit board to be connected in series with other circuits belongs to the protection scope of the present technical scheme.
Example 2
As shown in fig. 1, 2, 3, 5, and 6, embodiment 2 provides an inductor coil, which includes a plurality of coil units and the circuit board described in embodiment 1, where two ends of each coil unit are provided with two pins P1 and P2, the two pins of each coil unit are respectively connected to two ends of two adjacent wires 106 on the substrate 102, and two pins P1 and P2 are connected to different ends of the two adjacent wires 106, for example, two pins P1 of a first coil unit are connected to K11, then P2 is connected to K22, pin P1 of a second coil unit is connected to K21, pin P2 of the second coil unit is connected to K32, pin P1 of a (n-1) th coil unit is connected to K (n-1)1, and P2 is connected to Kn 2. Therefore, the plurality of coil units can be connected in series through the circuit board to form the inductance coil. The inductance coil is used for generating inductance, and two pins of the plurality of coil bodies are respectively connected to the connecting through holes 103 at different ends of the lead 106, so that the inductance value of the whole coil is more favorably formed and stabilized. According to different product requirements, the size of the circuit board and the number of the connecting through holes 103 on the circuit board can be flexibly adjusted. Or the inductance value of the coil can be adjusted by adjusting the number of the coil units under the condition that the circuit board is not changed.
The coil unit may be a single wire forming an open circular single-turn coil 100, and the two open ends of the single-turn coil 100 are a pin P1 and a pin P2, respectively. The single coil body can also be a multi-turn coil 101 formed by winding an electric wire, and the multi-turn coil 101 is formed by connecting a plurality of circuit boards in series to form an inductance coil.
Example 3
As shown in fig. 5, 6, and 7, embodiment 3 provides an inductor, which includes a resistance-capacitance component 108 and an inductor coil described in embodiment 2, and is used to solve the problem that in the prior art, since the inductor coil is a whole, when the resistance-capacitance component 108 is welded, a coil insulation layer needs to be stripped at a certain position of the inductor coil, after the resistance-capacitance component 108 is welded, the inductor needs to be tested, and if the national standard requirement for impedance of an EUT port of an artificial power supply network cannot be met, other positions need to be stripped again for new welding. The original position still needs to carry out insulation treatment, and after changing the position several times repeatedly, this coil just can't use, need to prepare inductance coils again.
Although the manufacturing method of the inductance coil is also provided in the artificial power network standard, the method has the following defects: (1) the resistor and the capacitor need to be bridged and connected in parallel on the segmented inductance coils, so that the short circuit of adjacent coils is prevented, inductance parameters are prevented from being influenced, the exposed devices need to be insulated, and the operation of the insulation treatment process is complex and difficult. (2) The insulating layer of the coil is stripped in advance at a fixed position for installing the resistor and the capacitor. Since the peeling position of the coil insulating layer is fixed, when the resonance characteristic of the coil needs to be adjusted or suppressed, the position of the resistance-capacitance device cannot be flexibly adjusted.
In this embodiment, the resistance-capacitance component 108 is composed of a resistor and a capacitor connected in parallel, and the resistance-capacitance component 108 is connected in parallel with a part of the coil monomers in the inductance coil to suppress the resonance characteristic of the inductance coil. Because the inductance coil is formed by connecting a plurality of coil monomers in series through the circuit board, the conducting wire 106 on the circuit board is used as a connecting wire of the coil monomers to form a part of the inductance coil, the resistance-capacitance component 108 can be welded at any position of the circuit board, and the resistance-capacitance component 108 can be connected with any number of coil monomers in parallel according to the requirement of inhibiting the resonance characteristic. When the position of the resistance-capacitance element 108 needs to be replaced, the position of the resistance-capacitance element 108 relative to the inductance coil can be changed by changing the position of the solder on the circuit board, so that the suppression effect of different resonance characteristics is achieved.
In this embodiment, in order to suppress the resonance characteristic of the inductor, a plurality of rc devices 108 may be soldered to the circuit board, and the size, number, and soldering position of the rc devices 108 may be flexibly adjusted according to the requirement of the impedance. In this embodiment, a plurality of assembly holes 104 may be further disposed at two ends of the circuit board, the assembly holes 104 may be four and are respectively disposed at four corners at two ends of the circuit board, and the assembly holes 104 may be in other numbers or in other positions of the circuit board, and the inductor may be assembled to other devices through the assembly holes 104.
Example 4
As shown in fig. 1 to 7, this example provides a method for manufacturing an inductor according to example 3, which includes the following steps:
(1) preparing a plurality of hollow coil monomers, wherein the coil monomers are used as components of an inductance coil for subsequent use;
(2) inserting the pins P1 and P2 of the coil single body prepared in the step (1) into the corresponding connecting through hole 103 of the substrate 102, wherein the position of the coil single body corresponding to the connecting through hole 103 is the same as that in the embodiment 2, and welding one pin; the other pin is only required to be inserted into the corresponding connecting through hole 103;
(3) connecting all the coil monomers prepared in the step (1) with the substrate 102 according to the step (2), and inserting the supporting framework 107 into the coil monomers;
(4) tightening the other pin of the coil monomer which is not welded, further tightening all the coil monomers on the support framework 107, closely and orderly arranging the coil monomers on the support framework 107, and welding the other pin of the coil in the corresponding connecting through hole 103;
(5) the resistance-capacitance element 108 is soldered to the corresponding connection through-hole 103 on the substrate 102 in accordance with the suppression requirement of the resonance characteristic.
For the soldered coil unit or the lead of the rc device 108, a part of the lead may protrude in the connecting through hole 103, and the protruding lead may be trimmed.
Further, after the step (5), the support framework 107 can be pulled out from the inductor, glue is coated on the inductor coil which is pulled out, the positions of the coil monomers on the inductor coil can be relatively fixed after the glue is coated, the firmness of the whole inductor coil can be improved, and the pulled inductor coil can be repeatedly used when other inductors or inductor coils are prepared.
Claims (10)
1. A circuit board comprising a substrate (102), characterized in that: the substrate (102) is provided with a plurality of connecting through holes (103), and the connecting through holes (103) are orderly arranged; a lead (106) is laid between the two connecting through holes (103), an electroplated layer is arranged in each connecting through hole (103), and the connecting through holes (103) are electrically connected with the lead (106).
2. The circuit board of claim 1, wherein: the conducting wires (106) are printed conducting wires, and the conducting wires (106) are parallel to each other on the substrate (102).
3. The circuit board according to claim 1 or 2, wherein: the two ends of the substrate (102) are provided with connecting terminals (105), an electroplated layer is also arranged in the connecting terminals (105), the connecting terminals (105) are electrically connected with the lead (106), and the substrate (102) is connected with other circuits through the connecting terminals (105).
4. An inductance coil, includes coil monomer, its characterized in that: the circuit board of any one of claims 1 to 3, wherein the number of the coil units is several, the P1 and P2 pins of the coil units are electrically connected with the connecting through holes (103) on the substrate (102), and the coil units are connected in series on the substrate (102).
5. The inductor of claim 4, wherein: the single coil body is a single-turn coil (100) or a multi-turn coil (101).
6. An inductor, characterized by: the inductor comprises a resistance-capacitance component (108) and the inductor coil as claimed in claim 4 or 5, wherein the resistance-capacitance component (108) is welded and fixed in a connecting through hole (103) on a substrate (102).
7. An inductor according to claim 6, characterized in that the resistance-capacitance component (108) is solderable in plurality on the substrate (102).
8. An inductor according to claim 7, characterized in that the circuit board is provided with mounting holes (104) at both ends, through which mounting holes (104) the inductor is mounted on a device.
9. A method of manufacturing an inductor according to any one of claims 6-8, characterized by:
(1) preparing a plurality of hollow coil monomers;
(2) inserting the pins P1 and P2 of the coil monomer prepared in the step (1) into the corresponding connecting through hole (103) of the substrate (102), and welding one pin;
(3) connecting all the coil monomers prepared in the step (1) with the substrate (102) according to the step (2), and inserting the supporting framework (107) into the coil;
(4) tightening the coil single body, and welding the other pin of the coil single body in the corresponding connecting through hole (103);
(5) and welding the resistance-capacitance components (108) to the corresponding connecting through holes (103) on the substrate (102).
10. The method of manufacturing an inductor according to claim 9, wherein: and after the resistance-capacitance component (108) is welded, the supporting framework (107) is drawn out, and glue is coated on the corresponding position of the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010258190.2A CN111465185A (en) | 2020-04-03 | 2020-04-03 | Circuit board, inductance coil, inductor and manufacturing method of inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010258190.2A CN111465185A (en) | 2020-04-03 | 2020-04-03 | Circuit board, inductance coil, inductor and manufacturing method of inductor |
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| Publication Number | Publication Date |
|---|---|
| CN111465185A true CN111465185A (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010258190.2A Pending CN111465185A (en) | 2020-04-03 | 2020-04-03 | Circuit board, inductance coil, inductor and manufacturing method of inductor |
Country Status (1)
| Country | Link |
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| CN (1) | CN111465185A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114552585A (en) * | 2022-01-18 | 2022-05-27 | 上海卫星工程研究所 | Method and system for restraining and verifying power supply current resonance of satellite-borne SAR (synthetic Aperture Radar) |
| CN118280699A (en) * | 2024-05-11 | 2024-07-02 | 季华实验室 | Printed inductor and assembly method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326291A (en) * | 1992-05-22 | 1993-12-10 | Sankyo Seiki Mfg Co Ltd | Coil |
| JPH0897036A (en) * | 1994-09-28 | 1996-04-12 | K H Electron Kk | Electronic circuit board |
| US20060176135A1 (en) * | 2005-02-07 | 2006-08-10 | Northrop Grumman Corporation | Embedded duo-planar printed inductor |
| CN101295574A (en) * | 2007-04-25 | 2008-10-29 | 财团法人工业技术研究院 | Inductive element |
| US20140176278A1 (en) * | 2012-12-24 | 2014-06-26 | Samsung Electro-Mechanics Co., Ltd. | Inductor and manufacturing method thereof |
| CN211909299U (en) * | 2020-04-03 | 2020-11-10 | 安徽白鹭电子科技有限公司 | Circuit board, inductance coil and inductance |
-
2020
- 2020-04-03 CN CN202010258190.2A patent/CN111465185A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326291A (en) * | 1992-05-22 | 1993-12-10 | Sankyo Seiki Mfg Co Ltd | Coil |
| JPH0897036A (en) * | 1994-09-28 | 1996-04-12 | K H Electron Kk | Electronic circuit board |
| US20060176135A1 (en) * | 2005-02-07 | 2006-08-10 | Northrop Grumman Corporation | Embedded duo-planar printed inductor |
| CN101295574A (en) * | 2007-04-25 | 2008-10-29 | 财团法人工业技术研究院 | Inductive element |
| US20140176278A1 (en) * | 2012-12-24 | 2014-06-26 | Samsung Electro-Mechanics Co., Ltd. | Inductor and manufacturing method thereof |
| CN211909299U (en) * | 2020-04-03 | 2020-11-10 | 安徽白鹭电子科技有限公司 | Circuit board, inductance coil and inductance |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114552585A (en) * | 2022-01-18 | 2022-05-27 | 上海卫星工程研究所 | Method and system for restraining and verifying power supply current resonance of satellite-borne SAR (synthetic Aperture Radar) |
| CN114552585B (en) * | 2022-01-18 | 2024-09-20 | 上海卫星工程研究所 | Method and system for suppressing and verifying resonance of satellite-borne SAR power supply current |
| CN118280699A (en) * | 2024-05-11 | 2024-07-02 | 季华实验室 | Printed inductor and assembly method thereof |
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