CN111465173A - Ultrasonic transducer flexible circuit board and convex array transducer - Google Patents
Ultrasonic transducer flexible circuit board and convex array transducer Download PDFInfo
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- CN111465173A CN111465173A CN202010290382.1A CN202010290382A CN111465173A CN 111465173 A CN111465173 A CN 111465173A CN 202010290382 A CN202010290382 A CN 202010290382A CN 111465173 A CN111465173 A CN 111465173A
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- 238000012360 testing method Methods 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 24
- 239000003381 stabilizer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 2
- 238000001727 in vivo Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000036285 pathological change Effects 0.000 description 2
- 231100000915 pathological change Toxicity 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 241000238413 Octopus Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses an ultrasonic transducer flexible circuit board and a convex array transducer, wherein the flexible circuit board comprises an assembly flexible circuit board and a test flexible circuit board; the assembly flexible circuit board comprises a main board, a negative connector, a plurality of support legs connected to the periphery of the main board and cable connectors arranged at the tail ends of the support legs; wherein the plurality of support legs are mutually diverged and can be independently folded around the main board. According to the flexible circuit board of the ultrasonic transducer, when the surface of the convex array transducer is bent and pasted according to a certain curvature, the flexible circuit board can be easily folded by attaching to the structure of the convex array transducer, and stress and deformation which should not occur can not be generated; meanwhile, the cable connectors can be arranged in one plane or two parallel planes in order, and welding is facilitated.
Description
Technical Field
The invention relates to the field of ultrasonic equipment, in particular to an ultrasonic transducer flexible circuit board and a convex array transducer.
Background
Compared with the traditional ultrasonic diagnosis mode, the traditional medical interventional ultrasonic transducer can transmit and receive high-frequency ultrasonic signals in a region closer to a pathological change position to obtain a real-time display in-vivo section image, more clearly display the structure and the size of in-vivo tissues, and has important significance for finding early pathological changes and accurately diagnosing.
At present, the transducer is connected with a signal by a manual welding mode, the mode has extremely high dependence on the welding technology of an operator, high temperature generated in the welding process can also have certain influence on the performance of the transducer, the qualification rate is reduced, the performance consistency is poor, and the realization is difficult. Therefore, the transducer can also adopt a planar single-layer flexible circuit board to connect the transducer with a signal, the mode avoids dependence on an operator, but for the fan-scanning convex array transducer, the volume is small, a curved surface structure is folded from a plane in the machining process, and the folding line or the tearing of the circuit board are easy to appear in the folding process by adopting the existing flexible circuit board design mode, so that the yield is low. Due to the existence of stress during the folding process, the curved geometry of the transducer is also prone to distortion, resulting in reduced imaging quality. In addition, the connector on the folded flexible plate is twisted, and cannot be aligned on the same plane, so that the welding difficulty is improved.
Disclosure of Invention
The present invention provides an ultrasonic transducer flexible circuit board and a convex array transducer, which aims to solve the above-mentioned deficiencies in the prior art.
The invention provides an ultrasonic transducer flexible circuit board, which comprises an assembly flexible circuit board and a test flexible circuit board, wherein the assembly flexible circuit board is provided with a plurality of flexible printed circuit boards;
the assembly flexible circuit board comprises a main board, a negative connector, a plurality of support legs connected to the periphery of the main board and cable connectors arranged at the tail ends of the support legs;
wherein the plurality of support legs are mutually diverged and can be independently folded around the main board.
Preferably, the mainboard is the rectangle form and can cooperate attached on the arc convex surface of convex array transducer, a plurality of stabilizer blades set up the length direction's of mainboard both sides, the negative pole connector sets up the width direction's of mainboard both sides.
Preferably, after the main board is attached to the arc-shaped convex surface of the convex array transducer, the plurality of support legs can be folded around the arc-shaped edge of the arc-shaped convex surface, and the cable connectors on all the support legs on the same side of the main board can be folded to the same plane.
Preferably, the plurality of support legs are folded around the arc-shaped edge of the arc-shaped convex surface of the convex array transducer, and the cable connectors on the support legs at two sides of the main board are respectively folded to two side surfaces of the convex array transducer.
Preferably, after the plurality of support legs are folded around the arc-shaped edge of the arc-shaped convex surface of the convex array transducer, the cable connectors on all the support legs at two sides of the main board are all folded to the back surface of the convex array transducer.
Preferably, the flexible circuit board of the ultrasonic transducer is a multilayer flexible circuit board, and comprises a first insulating layer, a positive electrode circuit layer, a second insulating layer, a negative electrode circuit layer and a third insulating layer which are sequentially stacked.
Preferably, a test connector is arranged on the test flexible circuit board.
Preferably, the negative connector comprises 2 pins arranged on two sides of the main board in the width direction, and the support pins comprise 8 pins evenly arranged on two sides of the main board in the length direction.
Preferably, the 8 support legs are sequentially a first support leg, a second support leg, a third support leg, a fourth support leg, a fifth support leg, a sixth support leg, a seventh support leg and an eighth support leg in the counterclockwise direction, wherein the first support leg, the second support leg, the third support leg and the fourth support leg are located on a first side of the main board in the length direction, and the rest of the support legs are located on a second side of the main board in the length direction;
the included angles between the perpendicular bisector of the tail end edge of the first, second, third and fourth supporting legs and the center line of the length direction of the main board in the anticlockwise direction are 54 degrees, 83 degrees, 111 degrees and 140 degrees in sequence;
the included angles between the perpendicular bisector of the tail end edge of the fifth, sixth, seventh and eighth support legs and the center line of the length direction of the main board in the clockwise direction are 54 degrees, 83 degrees, 111 degrees and 140 degrees in sequence;
the length of mainboard is 20.1mm, and the width is 5.5 mm.
The invention also provides a convex array transducer which comprises the flexible circuit board.
The invention has the beneficial effects that: according to the flexible circuit board of the ultrasonic transducer, when the surface of the convex array transducer is bent and pasted according to a certain curvature, the flexible circuit board can be easily folded by attaching to the structure of the convex array transducer, and stress and deformation which should not occur can not be generated; meanwhile, the cable connectors can be regularly arranged on one plane or two parallel planes, so that the welding is convenient;
the flexible circuit board of the invention can avoid the dependence of manual welding on operators, reduce the process difficulty, avoid the distortion and stress possibly caused by folding the flexible board with common design, and improve the consistency of the qualification rate and the performance, thereby reducing the cost of the convex array transducer and improving the use effect of the convex array transducer.
Drawings
Fig. 1 is a schematic structural diagram of an ultrasonic transducer flexible circuit board of the present invention;
FIG. 2 is a schematic diagram of the structure of the assembled flexible circuit board of the present invention;
fig. 3 is a schematic diagram showing dimensions of a flexible circuit board assembled in embodiment 1 of the present invention;
fig. 4 is a schematic structural view of a flexible circuit board assembled in cooperation with a convex array transducer in embodiment 2 of the present invention;
fig. 5 is a schematic structural view of a flexible circuit board assembled in cooperation with a convex array transducer in embodiment 3 of the present invention;
fig. 6 is a schematic view showing an assembly step of assembling a flexible circuit board and a convex array transducer in embodiment 3 of the present invention;
fig. 7 is a schematic structural view of a flexible circuit board assembled in cooperation with a convex array transducer according to embodiment 4 of the present invention;
fig. 8 is a schematic structural view of a multilayer flexible circuit board in embodiment 5 of the present invention;
fig. 9 is a schematic structural diagram of a cable connector according to embodiment 5 of the present invention.
Description of reference numerals:
the flexible printed circuit board assembly comprises a flexible printed circuit board 1, a flexible printed circuit board 2, a convex array transducer 3, a main board 10, a negative connector 11, a pin 12, a cable connector 13, a main board first side 14, a main board second side 15, an extension arm 16-L, a test connector 20, an arc convex surface 30, an arc edge 31, a back surface 32 of the convex array transducer 40, a first pin 41, a second pin 41, a third pin 42, a fourth pin 43, a fifth pin 44, a sixth pin 45, a seventh pin 46, an eighth pin 47, a first insulating layer 50, a positive circuit layer 51, a second insulating layer 52, a negative circuit layer 53, a third insulating layer 54, a positive pad 55 and a negative pad 56.
Detailed Description
The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-2, an ultrasonic transducer flexible circuit board of the present embodiment includes an assembly flexible circuit board 1 and a test flexible circuit board 2;
the assembly flexible circuit board 1 comprises a main board 10, a negative connector 11, a plurality of support legs 12 connected to the periphery of the main board 10 and cable connectors 13 arranged at the tail ends of the support legs 12;
the legs 12 diverge from each other and are independently foldable about the main panel 10.
The main board 10 is used for providing a pasting station of a plurality of groups of array elements, the array elements are sequentially and orderly pasted on the main board 10, the positive pole of the array element is connected with the cable connector 13, and the negative pole of the array element is connected with the negative pole connector 11.
Wherein the test flexible circuit board 2 is provided with a test connector 20. The testing flexible circuit board 2 is used for detecting the transducer in the probe processing process, protecting the transducer and the cable connector 13, and after the testing is finished, the testing flexible circuit board 2 is cut off before packaging, namely only the assembly flexible circuit board 1 is arranged in the transducer.
Further, the mainboard 10 is the rectangle form and can cooperate and attach on the arc convex surface 30 of convex array transducer 3, and a plurality of stabilizer blades 12 set up the length direction's of mainboard 10 both sides, and negative pole connector 11 sets up the width direction's of mainboard 10 both sides. After the main board 10 is attached to the convex surface 30 of the convex array transducer 3, the legs 12 can be folded around the arc edges 31 of the convex surface 30, and the cable connectors 13 on all the legs 12 on the same side of the main board 10 can be folded to the same plane.
That is, during the use, will assemble flexible circuit board 1 and paste on the arc convex surface 30 of convex array transducer 3, mainboard 10 is pasting along arc convex surface 30, two arc limit 31 of the arc convex surface 30 of a plurality of stabilizer blades 12 relative convex array transducer 3 separately are independently folded, from the side cladding of each angle and convex array transducer 3 paste, mutual noninterference, and make cable connector 13 on the stabilizer blade 12 fold to coplanar, perhaps cable connector 13 on the stabilizer blade 12 of mainboard 10 both sides is folded respectively to two parallel planes, make cable connector 13 arrange neatly, make things convenient for the welding to draw forth the cable. Because every stabilizer blade 12 is independent each other, and through the design of stabilizer blade 12 size, shape and the cooperation of convex array transducer 3 for every stabilizer blade 12 is folding separately round two arc limits 31 of arc convex surface 30, and assembly flexible circuit board 1 does not have obvious crease, guarantees the normal working property of ultrasonic probe, and the cladding that whole assembly flexible circuit board 1 can be fine is on convex array transducer 3, and cable connector 13 can neatly arrange, convenient welding.
The foregoing is a general idea of the invention, and specific examples are provided below for further explanation.
Example 1
In this embodiment, the negative connector 11 includes 2 disposed on both sides of the main board 10 in the width direction, and the support legs 12 include 8 disposed on both sides of the main board 10 in the length direction.
Further, referring to fig. 3, the flexible circuit board 1 has the following structural features that 8 support legs 12 are sequentially a first support leg, a second support leg, a third support leg, a fourth support leg, a fifth support leg, a sixth support leg, a seventh support leg and an eighth support leg (40-47) in the counterclockwise direction, wherein the first support leg, the second support leg, the third support leg and the fourth support leg are located on a first side 14 in the length direction of the main board 10, and the rest of the support legs 12 are located on a second side 15 in the length direction of the main board 10;
the included angles between the perpendicular bisector of the end edge of the first, second, third and fourth legs and the center line of the length direction of the main board 10 around the counterclockwise direction are 54 degrees, 83 degrees, 111 degrees and 140 degrees in sequence;
the clockwise included angles between the perpendicular bisector of the end edge of the fifth, sixth, seventh and eighth legs and the center line of the main board 10 in the length direction are 54 °, 83 °, 111 ° and 140 ° in sequence. The flexible circuit board 1 is integrally formed in an octopus shape.
The length of the main plate 10 is 20.1mm and the width is 5.5 mm.
Specific embodiments are provided below for different folding positions of the legs 12 based on the flexible circuit board 1 provided in embodiment 1.
Example 2
Referring to fig. 4, in this embodiment, after the legs 12 are folded around the arc edges 31 of the arc convex surfaces 30 of the convex array transducer 3, the cable connectors 13 on the legs 12 on both sides of the motherboard 10 are folded onto both sides of the convex array transducer 3, respectively. The cables are bundled together from the side of the convex array transducer 3 after being soldered to the cable connector 13 to facilitate channeling. This embodiment is suitable for the case where the space of the convex array transducer 3 in the thickness direction (i.e., the thickness between the arc-shaped convex surface 30 and the back surface) is small, and the convex array transducer 3 has a small protruding height and can be reduced in size.
Example 3
Referring to fig. 5, in the present embodiment, after the legs 12 are folded around the arc-shaped edge 31 of the arc-shaped convex surface 30 of the convex array transducer 3, the cable connectors 13 on all the legs 12 on both sides of the motherboard 10 are folded to the back surface 32 of the convex array transducer. It will be appreciated that the length of the legs 12 in this embodiment is longer than in embodiment 1. For easy understanding, the assembly arrangement of the flexible circuit board 1 and the convex array transducer 3 in the present embodiment is also provided, referring to fig. 6, the main board 10 is firstly pasted on the arc-shaped convex surface 30, and then each leg 12 is folded around the arc-shaped edge 31, so that the four legs 12 on both sides are tightly attached to both sides of the convex array transducer 3; and then the tail end of each support leg 12 is folded by 90 degrees, all the cable connectors 13 are folded to the back 32 of the convex array transducer, and after the cables are welded on the cable connectors 13, the cables are bundled together and are turned into a shell for packaging, so that the assembly is completed. The advantage of this embodiment lies in effectively utilizing the space, and the welding degree of difficulty is little, and the yield is high.
Example 4
Referring to fig. 7, in this embodiment, each leg 12 has an L-shaped extension arm 16 at the end, and the cable connectors 13 are disposed at the end of the L-shaped extension, after the legs 12 are folded in the same manner as in embodiment 2, the cable connectors 13 on the legs 12 on both sides of the motherboard 10 are folded to extend in the direction of both sides of the transducer 3, and the cable connectors 13 are sequentially arranged in a staggered manner, and after soldering, the L-shaped extension arms 16 are wound together and placed in the duct, which is advantageous in that the size can be further reduced.
Example 5
In the above embodiments, the flexible circuit board of the ultrasonic transducer is a single layer. In this embodiment, another scheme using a multilayer flexible circuit board is provided, that is, two conductive layers are designed to be respectively connected to the flexible circuit board main board 10 and the negative connector 11, and three insulating layers are further added to the two conductive layers, so as to implement a multilayer flexible circuit board structure. Referring to fig. 8, the flexible printed circuit board specifically includes a first insulating layer 50, a positive electrode circuit layer 51, a second insulating layer 52, a negative electrode circuit layer 53 and a third insulating layer 54, which are sequentially stacked, and the five layers are adhered together to form the flexible printed circuit board 1 in the middle.
In order to meet the requirement of the convex array transducer 3 for connecting the negative pole, each cable connector 13 also needs to be connected with a distribution pad and the negative pole connector 11 by a conducting layer, the scheme adopts the design of a multilayer flexible circuit board, and the positive pole of each transducer array element in the mainboard 10 is respectively connected with the cable connector 13 and the test connector 20 by a positive pole circuit layer 51;
the negative electrode circuit layer 53 adopts a common ground connection scheme, and the negative electrode circuit layer 53 simultaneously connects the negative electrodes of all transducer elements with the negative electrode connector 11, the cable connector 13 and the test connector 20.
In the cable connector 13, the two conductive layers respectively expose pads, such as the positive pad 55 and the negative pad 56 in fig. 9, for cable welding, so as to realize the connection between the positive electrode and the negative electrode in each array element coaxial cable.
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application of the invention, and further modifications may readily be effected by those skilled in the art, so that the invention is not limited to the specific details without departing from the general concept defined by the claims and the scope of equivalents.
Claims (10)
1. An ultrasonic transducer flexible circuit board is characterized by comprising an assembly flexible circuit board and a test flexible circuit board;
the assembly flexible circuit board comprises a main board, a negative connector, a plurality of support legs connected to the periphery of the main board and cable connectors arranged at the tail ends of the support legs;
wherein the plurality of support legs are mutually diverged and can be independently folded around the main board.
2. The flexible circuit board of ultrasonic transducer according to claim 1, wherein the main board is rectangular and can be attached to the arc convex surface of the convex array transducer in a matching manner, the plurality of support legs are disposed on two sides of the main board in the length direction, and the negative connectors are disposed on two sides of the main board in the width direction.
3. The flexible circuit board of ultrasonic transducer according to claim 2, wherein after the main board is attached to the convex arc surface of the convex array transducer, the plurality of legs can be folded around the arc edge of the convex arc surface, and the cable connectors on all legs on the same side of the main board can be folded to the same plane.
4. The flexible circuit board of ultrasonic transducer according to claim 3, wherein the plurality of legs are folded around the arc-shaped edge of the arc-shaped convex surface of the convex array transducer, and the cable connectors on the legs at both sides of the main board are folded onto both sides of the convex array transducer, respectively.
5. The ultrasonic transducer flexible circuit board of claim 3, wherein the cable connectors on all the legs on both sides of the motherboard are folded to the back of the convex array transducer after the legs are folded around the arc-shaped edges of the arc-shaped convex surfaces of the convex array transducer.
6. The ultrasonic transducer flexible circuit board according to claim 1, wherein the ultrasonic transducer flexible circuit board is a multilayer flexible circuit board, and comprises a first insulating layer, a positive electrode circuit layer, a second insulating layer, a negative electrode circuit layer, and a third insulating layer, which are sequentially stacked.
7. The ultrasonic transducer flexible circuit board of claim 1, wherein a test connector is disposed on the test flexible circuit board.
8. The ultrasonic transducer flexible circuit board of claim 3, wherein the negative connector comprises 2 pins disposed on both sides of the main board in the width direction, and the support pins comprise 8 pins uniformly disposed on both sides of the main board in the length direction.
9. The ultrasonic transducer flexible circuit board according to claim 8, wherein the 8 support legs are a first support leg, a second support leg, a third support leg, a fourth support leg, a fifth support leg, a sixth support leg, a seventh support leg and an eighth support leg in sequence in a counterclockwise direction, wherein the first support leg, the second support leg, the third support leg and the fourth support leg are located on a first side of the length direction of the main board, and the rest of the support legs are located on a second side of the length direction of the main board;
the included angles between the perpendicular bisector of the tail end edge of the first, second, third and fourth supporting legs and the center line of the length direction of the main board in the anticlockwise direction are 54 degrees, 83 degrees, 111 degrees and 140 degrees in sequence;
the included angles between the perpendicular bisector of the tail end edge of the fifth, sixth, seventh and eighth support legs and the center line of the length direction of the main board in the clockwise direction are 54 degrees, 83 degrees, 111 degrees and 140 degrees in sequence;
the length of mainboard is 20.1mm, and the width is 5.5 mm.
10. A convex array transducer comprising a flexible circuit board according to any one of claims 1 to 9.
Priority Applications (1)
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CN202010290382.1A CN111465173A (en) | 2020-04-14 | 2020-04-14 | Ultrasonic transducer flexible circuit board and convex array transducer |
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CN202010290382.1A CN111465173A (en) | 2020-04-14 | 2020-04-14 | Ultrasonic transducer flexible circuit board and convex array transducer |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103648404A (en) * | 2012-07-04 | 2014-03-19 | 奥林巴斯医疗株式会社 | Ultrasonic endoscope |
CN207820300U (en) * | 2017-11-24 | 2018-09-04 | 无锡祥生医疗科技股份有限公司 | Ultrasonic transducer flexible PCB and convex array probe |
WO2019212068A1 (en) * | 2018-04-30 | 2019-11-07 | 서강대학교 산학협력단 | Ultrasonic probe assembly using fpcb |
CN212115766U (en) * | 2020-04-14 | 2020-12-08 | 中国科学院苏州生物医学工程技术研究所 | Ultrasonic transducer flexible circuit board and convex array transducer |
-
2020
- 2020-04-14 CN CN202010290382.1A patent/CN111465173A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103648404A (en) * | 2012-07-04 | 2014-03-19 | 奥林巴斯医疗株式会社 | Ultrasonic endoscope |
CN207820300U (en) * | 2017-11-24 | 2018-09-04 | 无锡祥生医疗科技股份有限公司 | Ultrasonic transducer flexible PCB and convex array probe |
WO2019212068A1 (en) * | 2018-04-30 | 2019-11-07 | 서강대학교 산학협력단 | Ultrasonic probe assembly using fpcb |
CN212115766U (en) * | 2020-04-14 | 2020-12-08 | 中国科学院苏州生物医学工程技术研究所 | Ultrasonic transducer flexible circuit board and convex array transducer |
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