CN111463242B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN111463242B CN111463242B CN202010272534.5A CN202010272534A CN111463242B CN 111463242 B CN111463242 B CN 111463242B CN 202010272534 A CN202010272534 A CN 202010272534A CN 111463242 B CN111463242 B CN 111463242B
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 9
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Abstract
The application discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a via region, a display region surrounding the via region, and a blocking region between the via region and the display region; the blocking area includes: the insulation layer comprises at least one groove, the metal layer comprises a through hole positioned above the groove, the groove covers the through hole, and the orthographic projection area of the groove on the substrate is larger than that of the through hole on the substrate; the light-emitting layer at the bottom of the groove is disconnected from the rest of the light-emitting layer. Through forming the laminated through holes and grooves in the blocking area surrounding the through hole area, a blocking barrier with a certain depth and irregularity can be formed in the film layer below the light-emitting layer, the light-emitting layer in the display area can be blocked from being corroded by external water and oxygen, and the reliability of products is improved.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
The full-face screen is a main direction of development of an Organic Light-Emitting Diode (OLED) display technology, the full-face screen is a panel framework which adopts a design with ultra-narrow frames around and is combined with a design of digging holes in a display area to place a camera, and the full-face screen is a panel framework with the highest panel display screen occupation ratio. The existing under-screen camera technology mainly comprises two structures, namely a through hole and a blind hole, the through hole design needs to dig out all substrates in a camera area to form the through hole, a display area is easy to be corroded by water and oxygen, particularly water vapor is conducted along with a luminous layer, and the problem of poor reliability exists.
Disclosure of Invention
The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, which are used for solving the problems that in the prior art, due to the adoption of a through hole design, all substrates in a camera area are required to be hollowed out to form through holes, so that the display area is easy to be corroded by water and oxygen, and the reliability of products is affected.
An embodiment of the present application provides a display panel including: a via region, a display region surrounding the via region, and a blocking region between the via region and the display region;
the blocking region includes: the LED packaging structure comprises an insulating layer, a metal layer, a light-emitting layer and a packaging layer, wherein the insulating layer, the metal layer, the light-emitting layer and the packaging layer are sequentially laminated on a substrate, the insulating layer comprises at least one groove, the metal layer comprises a through hole positioned above the groove, and the orthographic projection area of the groove on the substrate is larger than that of the through hole on the substrate.
In one possible implementation manner, in the display panel provided by the embodiment of the application, the light-emitting layer located at the bottom of the groove is disconnected from the light-emitting layer of the rest part.
In a possible implementation manner, in the display panel provided by the embodiment of the present application, the metal layer and the source-drain metal layer of the display area belong to the same film layer, and the insulating layer is an interlayer insulating layer located between the source-drain metal layer and the gate metal layer of the display area.
In one possible implementation manner, in the display panel provided by the embodiment of the present application, the metal layer and the light emitting layer are directly contacted.
In a possible implementation manner, in the display panel provided by the embodiment of the present application, the groove completely penetrates the insulating layer along a direction in which the substrate points to the encapsulation layer.
In a possible implementation manner, in the display panel provided by the embodiment of the application, the side wall of the through hole is a plane, and the side wall of the groove is a curved surface protruding towards one side of the substrate.
In one possible implementation manner, in the display panel provided in the embodiment of the present application,the sum of the depths of the groove and the through hole is larger than
In a possible implementation manner, in the display panel provided by the embodiment of the present application, the shapes of the groove and the through hole are closed ring shapes surrounding the through hole area.
In a possible implementation manner, in the display panel provided by the embodiment of the application, the closed ring includes 1-4 circles.
In a possible implementation manner, in the display panel provided by the embodiment of the present application, the encapsulation layer covers the light emitting layer, and the encapsulation layer is continuous in the groove and the through hole.
Correspondingly, the embodiment of the application also provides a display device which comprises the display panel provided by the embodiment of the application.
Correspondingly, the embodiment of the application also provides a manufacturing method of the display panel, which comprises the following steps:
forming an insulating layer in a blocking region between the via region and the display region of the substrate;
forming a metal layer on one side of the insulating layer, which is away from the substrate;
etching the metal layer and the insulating layer by adopting a dry etching process, forming a through hole in the metal layer and forming a groove in the insulating layer; the through hole is positioned in the hole above the groove, and the orthographic projection area of the groove on the substrate is larger than that of the through hole;
evaporating a light-emitting layer on one side of the metal layer, which is away from the substrate;
and depositing an encapsulation layer on one side of the light-emitting layer, which is away from the substrate.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present application, the etching the metal layer and the insulating layer by using a dry etching process specifically includes:
coating photoresist covering the metal layer and the insulating layer on the metal layer, and exposing and developing the photoresist;
performing dry etching treatment on the metal layer by adopting mixed gas of chlorine and boron trichloride, and forming the through hole in the metal layer of the photoresist removing area;
carrying out dry etching treatment on the insulating layer by adopting mixed gas of carbon tetrafluoride and oxygen, and forming the groove in the insulating layer below the through hole;
and stripping the rest photoresist.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present application, a volume ratio of the chlorine gas to the boron trichloride is 3:1, and a volume ratio of the carbon tetrafluoride to the oxygen gas is 2:1.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present application, the metal layer of the blocking area and the source drain metal layer located in the display area are formed by a one-time patterning process.
The application has the following beneficial effects:
the embodiment of the application provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a via region, a display region surrounding the via region, and a blocking region between the via region and the display region; the blocking area includes: the insulation layer comprises at least one groove, the metal layer comprises a through hole positioned above the groove, the groove covers the through hole, and the orthographic projection area of the groove on the substrate is larger than that of the through hole on the substrate; the light-emitting layer at the bottom of the groove is disconnected from the rest of the light-emitting layer. Through forming the laminated through holes and grooves in the blocking area surrounding the through hole area, a blocking barrier with a certain depth and irregularity can be formed in the film layer below the light-emitting layer, the light-emitting layer in the display area can be blocked from being corroded by external water and oxygen, and the reliability of products is improved.
Drawings
Fig. 1 is a schematic structural diagram of a display device in the related art;
fig. 2 is a schematic top view of a display panel according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of FIG. 2 taken along line B-B';
FIG. 4 is a schematic cross-sectional view along B-B' of the recess of FIG. 2 without penetrating the insulating layer;
FIG. 5 is a schematic cross-sectional view of the display area of FIG. 2 along line C-C';
FIG. 6 is a schematic cross-sectional view of the recess of FIG. 2 through the insulating layer along line B-B';
fig. 7 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the application;
fig. 8 is a schematic flow chart of another method for manufacturing a display panel according to an embodiment of the application;
fig. 9A to fig. 9C are schematic structural diagrams of the manufacturing method of the display panel according to the embodiment of the application after each step is performed.
Detailed Description
In order to realize the full screen design of the display panel, as shown in fig. 1, a hole needs to be dug in the display area to form a through hole area, and the through hole area is correspondingly arranged with a camera or other components to realize corresponding functions. Because the through hole design needs to dig the whole substrate in the camera area to form the through hole, the display area is easy to be corroded by water and oxygen, and particularly, water vapor can be conducted along with the light-emitting layer, so that the problem of poor reliability exists.
Aiming at the problem that the display area of the display panel is easy to be corroded by water and oxygen in the related art, the embodiment of the application provides a display panel, a manufacturing method thereof and a display device. In order to make the technical solution and advantages of the present application more clear, the following describes in detail specific embodiments of a display panel, a manufacturing method thereof and a display device provided by the embodiments of the present application with reference to the accompanying drawings. It should be understood that the following description of the preferred embodiments is provided for the purpose of illustrating and explaining the application, and is not intended to limit the application. And embodiments of the application and features of the embodiments may be combined with each other without conflict.
The shapes and sizes of the various components in the drawings do not reflect true proportions and are intended to illustrate the application only.
The present application provides a display panel, as shown in fig. 2, comprising: the display device comprises a through hole area OO, a display area AA surrounding the through hole area OO and a blocking area DD positioned between the through hole area OO and the display area AA; the through hole area OO is used for installing a camera so as to realize the design of the under-screen camera; the blocking area DD is an annular structure arranged around the through hole area OO, for example, when the through hole area OO is a circular structure, the blocking area DD is a circular structure arranged around the through hole area OO, and when the through hole area OO is a square structure, the blocking area DD is a square structure arranged around the through hole area OO; the application does not limit the shape of the through hole area OO, and the shape is selected according to actual needs.
The blocking area DD isolates the boundary of the through hole area OO from the boundary of the display area AA, so that the display area AA is prevented from being corroded by water and oxygen due to the fact that the through hole is dug in the through hole area OO, and the reliability of display products is improved.
Specifically, as shown in fig. 3, the blocking area DD includes an insulating layer 2, a metal layer 3, a light emitting layer 4 and a packaging layer 5 sequentially stacked on the substrate 1, as shown in fig. 4, the insulating layer 2 includes at least one groove 21 (only one groove 21 is illustrated in fig. 2), the metal layer 3 includes a through hole 31 located above the groove 21, and the orthographic projection area of the groove 21 on the substrate 1 is larger than the orthographic projection area of the through hole 31 on the substrate 1, so that by providing the through hole 31 and the groove 21 in a film layer located below the light emitting layer 4, a barrier of a certain depth can be formed in the film layer below the light emitting layer 4, and the light emitting layer 4 of the display area AA can be blocked from being corroded by external water and oxygen.
According to the display panel provided by the embodiment of the application, through the laminated through holes and grooves formed in the blocking area surrounding the through hole area, a blocking barrier with a certain depth and irregularity can be formed in the film layer below the light-emitting layer, so that the light-emitting layer in the display area can be blocked from being corroded by external water and oxygen, and the reliability of products is improved.
In a specific implementation, in the display panel provided in the embodiment of the present application, as shown in fig. 3 and fig. 4, the light-emitting layer 4 at the bottom of the groove 21 is disconnected from the rest of the light-emitting layer 4, and because the through hole 31 and the groove 21 form a reverse cut structure, and the thickness of the light-emitting layer 4 is limited, when the light-emitting layer 4 is evaporated, a part of the light-emitting layer 4 material falls into the bottom of the groove 21 through the through hole 31, so that the light-emitting layer 4 at the bottom of the groove 21 is disconnected from the rest of the light-emitting layer 4, and further, the light-emitting layer 4 is discontinuous, that is, the light-emitting layer 4 is disconnected from the groove 21 at the through hole 31, so that the continuity of the light-emitting layer 4 at the through hole 31 and the groove 21 is blocked, and the packaging layer 5 covers the through hole 31 during subsequent packaging, so that the light-emitting layer 4 in the display area AA can be effectively prevented from being corroded by external water and oxygen, and the reliability of the product is improved.
In particular, as shown in fig. 5, the display area AA includes: the active layer 6, the gate insulating layer 7, the gate metal layer 8, the interlayer insulating layer 9, the source-drain metal layer 10, the passivation layer 11, the planarization layer 12, the anode 13 and the pixel defining layer 14 are sequentially stacked on the substrate 1, the pixel defining layer 14 defines sub-pixel regions, each sub-pixel region comprises a light emitting layer 4 above the anode 13 and a cathode 15 above the light emitting layer 4, and the anode 13 is electrically connected with the drain electrode of the source-drain metal layer 10.
In the specific implementation, the grooves and the through holes are respectively formed in the continuous insulating layer and the continuous metal layer, and the corresponding grooves and the corresponding through holes can be formed by adopting gases with different components to carry out dry etching on the insulating layer and the metal layer, for example, when the metal layer is etched, the insulating layer is not etched by adopting etching gases, when the metal layer is insulated by etching, the metal layer is not etched by adopting etching gases, the metal layer is etched in the same direction by controlling the proportion of the etching gases and the etching power, and the insulating layer is etched anisotropically, so that the inverted cutting structure consisting of the through holes and the grooves in fig. 4 can be formed, and the luminous layer formed by subsequent evaporation can be completely broken; and this method of forming the grooves and the through holes is relatively simple. The through holes are formed by etching the metal layer, and when the structures such as the grid electrode, the source electrode and the drain electrode are formed in the display area of the substrate base plate, the metal layer of the blocking area DD can be reserved, for example, when the metal layer of the blocking area DD and the grid electrode of the display area AA belong to the same film layer, the insulating layer below the metal layer can be a grid insulating layer; when the metal layer of the blocking area DD and the source and drain electrodes of the display area AA belong to the same film layer, the insulating layer below the metal layer can be an interlayer insulating layer; because the grid electrode and the grid insulating layer are closer to the substrate than the source electrode, the drain electrode and the interlayer insulating layer, the through holes and the grooves are easy to be blocked when the interlayer insulating layer, the source electrode, the drain electrode metal layer, the passivation layer, the flat layer and the pixel definition layer are deposited later on the assumption that the through holes and the grooves are formed in the grid electrode and the grid insulating layer; therefore, in the display panel provided by the embodiment of the present application, as shown in fig. 3 and 5, the metal layer 3 in fig. 3 preferably belongs to the same layer as the source-drain metal layer 10 in the display area AA in fig. 5, and the insulating layer 2 in fig. 3 is preferably the interlayer insulating layer 9 between the source-drain metal layer 10 and the gate metal layer 8 in the display area AA in fig. 5. Thus, when the passivation layer 11, the planarization layer 12 and the pixel defining layer 14 are deposited later, since these three layers are generally made of resin materials, they can be removed only by exposure and development, and the through holes and the grooves can be easily exposed, so that when the light emitting layer 4 is evaporated, the light emitting layer 4 can be ensured to be disconnected at the bottom of the grooves 21 through the through holes 31.
According to the display panel provided by the embodiment of the application, the metal layer is formed in the blocking area when the source and drain electrodes of the display area are manufactured, so that the grooves and the through holes are formed in the interlayer insulating layer and the metal layer, the method is simple, the mask process is not increased, and the success rate of blocking water and oxygen is higher.
In practical implementation, since the waterproof performance of the metal layer is far better than that of the insulating layer, in the display panel provided by the embodiment of the application, as shown in fig. 3, the metal layer 3 and the light-emitting layer 4 are in direct contact. Specifically, since the passivation layer 11, the planarization layer 12, and the pixel defining layer 14 in fig. 5 are also deposited between the metal layer 3 and the light emitting layer 4, the materials of these three layers are generally resin materials, and the waterproof property is poor, so that the light emitting layer 4 of the display area AA can be further prevented from being corroded by water oxygen by removing the passivation layer 11, the planarization layer 12, and the pixel defining layer 14 of the blocking area so that the light emitting layer 4 is directly in direct contact with the metal layer 3.
In particular, as shown in fig. 3 and 5, after the cathode 15 is formed, the display panel is generally encapsulated by using a thin film encapsulation method, i.e., TFE encapsulation, and in fig. 3, an encapsulation layer 5 is schematically shown, and in fig. 5, the encapsulation layer 5 is not shown, and in order to improve the encapsulation effect, the encapsulation layer 5 includes a first encapsulation layer 51 and a second encapsulation layer 52, and each of the encapsulation layers generally includes a first inorganic layer, an organic layer, and a second inorganic layer that are stacked.
The grooves provided in the insulating layer may not penetrate the insulating layer, but may penetrate the insulating layer, and the present application is not limited thereto.
In particular, the structures shown in fig. 3 and fig. 4 of the embodiment of the present application are illustrated by taking an example that the groove 21 does not penetrate through the insulating layer 2, and of course, in the display panel provided in the embodiment of the present application, as shown in fig. 6, the groove 21 may also completely penetrate through the insulating layer 2 in the direction of pointing the substrate 1 to the encapsulation layer 5. Compared with the structure shown in fig. 4, the grooves 21 completely penetrate through the insulating layer 2, so that the light-emitting layer 4 can be further ensured to be disconnected at the bottoms of the grooves 21, and the light-emitting layer 4 in the display area AA is effectively prevented from being corroded by water and oxygen.
In a specific implementation, in the display panel provided in the embodiment of the present application, as shown in fig. 4 and 6, the side wall of the through hole 31 is a plane, and the side wall of the groove 21 is a curved surface protruding toward the substrate 1. Specifically, after the insulating layer 2 and the metal layer 3 are formed, the metal layer 3 is subjected to dry etching treatment by using a mixed gas of chlorine and boron trichloride to form a through hole 31 in the metal layer 3, and the insulating layer 2 is subjected to dry etching treatment by using a mixed gas of carbon tetrafluoride and oxygen to form a groove 21 in the insulating layer 2 below the through hole 31; in order to form the structure of the inverted cut through hole 31 and the groove 21, the power of etching the insulating layer 2 and the metal layer 3 and the etching gas ratio, for example, the volume ratio of chlorine to boron trichloride is 3:1, and the volume ratio of carbon tetrafluoride to oxygen is 2:1, so that the physical etching is mainly performed when the metal layer 3 is etched, the etching direction is consistent, the physical etching and the chemical etching are performed when the insulating layer 3 is etched, the etching direction is anisotropic, thus the side wall of the formed through hole 31 can be a plane, the side wall of the formed groove 21 can be a curved surface protruding to one side of the substrate 1, and the structure is favorable for breaking the light-emitting layer 4 at the bottom of the groove 21.
In practice, when the sum of the depths of the grooves and the through holes is too small, the light emitting layer easily covers the grooves and the through holes without breaking, so in order to ensure breaking of the bottoms of the grooves of the light emitting layer, in the above display panel provided by the embodiment of the present application, as shown in fig. 4 and 6, the sum of the depths of the grooves 21 and the through holes 31 is larger than in the direction in which the substrate 1 is directed toward the encapsulation layer 5The sum of the actual depths is designed according to the actual needs, and is not limited herein.
In particular, in the display panel provided in the embodiment of the present application, as shown in fig. 2, the shapes of the recess 21 and the through hole 31 (only schematically illustrated by the recess 21) are closed annular shapes surrounding the through hole area OO. This corresponds to forming an annular barrier around the display area AA, which effectively blocks water oxygen from eroding the light emitting layer 4 of the display area AA.
In a specific implementation, in the display panel provided by the embodiment of the present application, under the condition of meeting space requirements, the more the number of closed annular grooves is, the better the blocking effect is, so that the closed annular shape in the embodiment of the present application may include 1-4 circles.
In particular, the annular recess may be shaped as a rectangular ring or a rounded rectangular ring, although the annular recess may be shaped as other irregular annular shapes, provided that it is disposed in the blocking region and surrounds the through-hole region.
In a specific implementation, in the display panel provided by the embodiment of the present application, as shown in fig. 3, the encapsulation layer 5 covers the light-emitting layer 4, and the encapsulation layer 5 is continuous in the groove 21 and the through hole 31, so long as the encapsulation effect can be improved, and the light-emitting layer 4 in the display area AA is further blocked from being corroded by water and oxygen.
It should be noted that the grooves and the through holes shown in fig. 3, 4 and 6 are only schematic, and the dimensions and the sizes thereof are not meant to be true to scale, and the specific dimensions and sizes are designed according to actual needs, which is not limited in the present application.
Based on the same inventive concept, the embodiment of the application further provides a manufacturing method of the display panel, as shown in fig. 7, which specifically includes:
s701, forming an insulating layer in a blocking area between a through hole area and a display area of a substrate;
s702, forming a metal layer on one side of the insulating layer, which is away from the substrate;
s703, etching the metal layer and the insulating layer by adopting a dry etching process, forming a through hole in the metal layer and forming a groove in the insulating layer; wherein the through hole is positioned in the hole above the groove, and the orthographic projection area of the groove on the substrate is larger than the orthographic projection area of the through hole on the substrate;
s704, evaporating a light-emitting layer on one side of the metal layer, which is away from the substrate;
and S705, depositing an encapsulation layer on one side of the light-emitting layer, which is away from the substrate.
According to the manufacturing method of the display panel provided by the embodiment of the application, through holes and grooves which are laminated are formed in the blocking area surrounding the through hole area, a blocking barrier which has a certain depth and is irregular can be formed in the film layer below the light-emitting layer, the light-emitting layer of the display area can be blocked from being corroded by external water and oxygen, and the reliability of products is improved.
In a specific implementation, in the above manufacturing method provided by the embodiment of the present application, as shown in fig. 8, a dry etching process is used to etch a metal layer and an insulating layer, which may specifically include:
s801, coating photoresist covering the metal layer and the insulating layer on the metal layer, and exposing and developing the photoresist;
s802, carrying out dry etching treatment on the metal layer by adopting mixed gas of chlorine and boron trichloride, and forming a through hole in the metal layer of the photoresist removing region; specifically, by controlling the etching power and the gas ratio of chlorine and boron trichloride, a through hole with a planar side wall can be formed;
s803, performing dry etching treatment on the insulating layer by adopting mixed gas of carbon tetrafluoride and oxygen, and forming a groove in the insulating layer below the through hole; specifically, by controlling the etching power and the gas ratio of carbon tetrafluoride and oxygen, a groove with a side wall being a curved surface protruding toward one layer of the substrate can be formed;
s804, stripping the residual photoresist.
In the specific implementation, the inverted cut through hole and groove structure in the embodiment of the display panel can be formed by reasonably controlling the proportion of etching gas in etching, so that in the manufacturing method provided by the embodiment of the application, the volume ratio of chlorine to boron trichloride is 3:1, and the volume ratio of carbon tetrafluoride to oxygen is 2:1.
In a specific implementation, in the above manufacturing method provided by the embodiment of the present application, the metal layer of the blocking area and the source drain metal layer located in the display area are formed by a one-time patterning process. Therefore, the original composition graph is changed when the source and drain metal layers of the display area are formed, the graph of the metal layer of the blocking area and the graph of the source and drain metal layers of the display area can be formed through one-time composition process, the process of independently preparing the metal layer of the blocking area is not needed to be added, the preparation process flow can be simplified, the production cost is saved, and the production efficiency is improved.
The method of forming the through-hole 31 and the groove 21 shown in fig. 4 in the embodiment of the present application will be described in detail.
(1) Depositing a buffer layer with the thickness of 300-500 nm on a substrate by adopting a PECVD deposition mode, wherein the material of the buffer layer can be SiNx/SiO2; depositing a semiconductor layer with the thickness of 40-80 nm, such as an a-Si material, by adopting a CVD deposition mode, and then etching and conducting the semiconductor layer to form an active layer; depositing a gate insulating layer with the thickness of 100-200 nm by adopting a PECVD deposition mode, wherein the material of the gate insulating layer can be SiO2/SiNx, and patterning according to the requirement; depositing a layer of gate electrode film with the thickness of 250-300 nm, such as Mo metal, by adopting a dispenser process, and carrying out photoetching and etching according to a required pattern to form a gate electrode;
(2) Depositing an interlayer insulating layer 9 (namely an insulating layer 2) with the thickness of 400-500 nm by adopting a PECVD (plasma enhanced chemical vapor deposition) deposition mode, wherein the material of the interlayer insulating layer can be SiO2/SiNx/SiO2, and patterning according to the requirement; preparing a source-drain electrode film with the thickness of 500-600 nm, such as Ti/Al/Ti metal, carrying out photoetching and etching according to a required pattern to form a source drain electrode in a display area, forming a metal layer 3 in a blocking area, coating a photoresist layer 01 on a substrate with the metal layer 3 formed thereon, exposing and developing the photoresist layer 01, and removing part of the photoresist layer 01 corresponding to a through hole and a groove to be formed, wherein as shown in fig. 9A, fig. 9A only shows an insulating layer 2 and the metal layer 3;
(3) Carrying out dry etching treatment on the metal layer 3 by adopting mixed gas of chlorine and boron trichloride, wherein the volume ratio of the chlorine to the boron trichloride is 3:1, and forming a through hole 31 in the metal layer 3 in the photoresist removing region, as shown in fig. 9B;
(4) Carrying out dry etching treatment on the insulating layer 2 by adopting mixed gas of carbon tetrafluoride and oxygen, wherein the volume ratio of the carbon tetrafluoride to the oxygen is 2:1, and forming a groove 21 in the insulating layer 2 in a photoresist removing region, as shown in fig. 9C;
(5) The remaining photoresist layer 01 is stripped as shown in fig. 4.
(6) Depositing a passivation layer with the thickness of 100-200 nm by utilizing a PECVD deposition mode, and patterning according to the requirement; forming a flat layer with the thickness of about 2000nm by adopting a Photo film forming process, and patterning according to requirements; preparing an anode with the thickness of about 100nm by adopting a dispenser process, wherein the material can be ITO/Ag/ITO, and carrying out photoetching and etching according to a required pattern; and forming a pixel definition layer with the thickness of 1500-1700 nm by adopting a Photo film forming process, removing the passivation layer, the flat layer and the pixel definition layer in the blocking area by adopting an exposure and development process, and then continuing evaporating the light-emitting layer and depositing the packaging layer.
It should be noted that the above-mentioned manufacturing method of the present application is only for how to form the through holes and the grooves, and other film layers are not specifically shown.
It should be noted that, in the method for manufacturing a display panel provided by the embodiment of the present application, the patterning process may include only a photolithography process, or may include a photolithography process and an etching step, and may also include other processes for forming a predetermined pattern, such as printing, ink-jetting, and the like; the photolithography process refers to a process of forming a pattern using photoresist, a mask plate, an exposure machine, etc., including processes of film formation, exposure, development, etc. In particular implementations, the corresponding patterning process may be selected in accordance with the structures formed in the present application.
Based on the same inventive concept, the embodiment of the application also provides a display device, which comprises the organic light-emitting display panel provided by the embodiment of the application. The display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device will be understood by those skilled in the art, and are not described herein in detail, nor should they be considered as limiting the application. The principle of the display device board for solving the problems is similar to that of the display panel, so that the implementation of the display device can be referred to the implementation of the display panel, and the repetition is omitted herein.
The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a via region, a display region surrounding the via region, and a blocking region between the via region and the display region; the blocking area includes: the insulation layer comprises at least one groove, the metal layer comprises a through hole positioned above the groove, the groove covers the through hole, and the orthographic projection area of the groove on the substrate is larger than that of the through hole on the substrate; the light-emitting layer at the bottom of the groove is disconnected from the rest of the light-emitting layer. Through forming the laminated through holes and grooves in the blocking area surrounding the through hole area, a blocking barrier with a certain depth and irregularity can be formed in the film layer below the light-emitting layer, the light-emitting layer in the display area can be blocked from being corroded by external water and oxygen, and the reliability of products is improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (11)
1. A display panel, comprising: a via region, a display region surrounding the via region, and a blocking region between the via region and the display region;
the blocking region includes: the light-emitting device comprises an insulating layer, a metal layer, a light-emitting layer and a packaging layer, wherein the insulating layer, the metal layer, the light-emitting layer and the packaging layer are sequentially stacked on a substrate, the insulating layer comprises at least one groove, the metal layer comprises a through hole positioned above the groove, and the orthographic projection area of the groove on the substrate is larger than that of the through hole on the substrate;
the packaging layer covers the light-emitting layer, and the packaging layer is continuous in the grooves and the through holes;
the metal layer and the source-drain metal layer of the display area belong to the same film layer, and the insulating layer is an interlayer insulating layer positioned between the source-drain metal layer and the gate metal layer of the display area;
the metal layer is in direct contact with the light emitting layer;
wherein, the luminous layer at the bottom of the groove is disconnected with the luminous layer at the rest part.
2. The display panel of claim 1, wherein the recess extends completely through the insulating layer in a direction of the substrate toward the encapsulation layer.
3. The display panel of claim 1, wherein the sidewall of the through hole is a plane, and the sidewall of the recess is a curved surface protruding toward one side of the substrate.
4. The display panel of claim 1, wherein a sum of depths of the recess and the via is greater than in a direction along the substrate base toward the encapsulation layer
5. The display panel of claim 1, wherein the recess and the through-hole are each in the shape of a closed ring surrounding the through-hole region.
6. The display panel of claim 5, wherein the closed loop shape comprises 1-4 turns.
7. A display device comprising the display panel according to any one of claims 1-6.
8. A method of manufacturing a display panel according to any one of claims 1 to 6, comprising:
forming an insulating layer in a blocking region between the via region and the display region of the substrate;
forming a metal layer on one side of the insulating layer, which is away from the substrate;
etching the metal layer and the insulating layer by adopting a dry etching process, forming a through hole in the metal layer and forming a groove in the insulating layer; the through hole is positioned above the groove, and the orthographic projection area of the groove on the substrate is larger than that of the through hole;
evaporating a light-emitting layer on one side of the metal layer, which is away from the substrate;
and depositing an encapsulation layer on one side of the light-emitting layer, which is away from the substrate.
9. The method of claim 8, wherein the etching the metal layer and the insulating layer by a dry etching process specifically comprises:
coating photoresist covering the metal layer and the insulating layer on the metal layer, and exposing and developing the photoresist;
performing dry etching treatment on the metal layer by adopting mixed gas of chlorine and boron trichloride, and forming the through hole in the metal layer of the photoresist removing area;
carrying out dry etching treatment on the insulating layer by adopting mixed gas of carbon tetrafluoride and oxygen, and forming the groove in the insulating layer below the through hole;
and stripping the rest photoresist.
10. The method of claim 9, wherein the volume ratio of the chlorine gas to the boron trichloride is 3:1 and the volume ratio of the carbon tetrafluoride to the oxygen gas is 2:1.
11. The method of claim 8, wherein the metal layer of the blocking region and the source drain metal layer of the display region are formed by a single patterning process.
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| CN111862817B (en) * | 2020-07-30 | 2022-03-18 | 昆山国显光电有限公司 | Display device |
| CN112271267B (en) * | 2020-10-28 | 2023-01-13 | 京东方科技集团股份有限公司 | Display back plate, manufacturing method thereof and display device |
| CN112531003B (en) | 2020-12-01 | 2023-04-25 | 武汉天马微电子有限公司 | Display panel, preparation method of display panel and display device |
| CN112968136B (en) * | 2021-02-04 | 2023-09-26 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
| CN113346028B (en) * | 2021-05-31 | 2024-04-19 | 京东方科技集团股份有限公司 | Light-emitting device, preparation method and display device |
| CN114594625B (en) * | 2022-02-23 | 2023-11-21 | 厦门天马微电子有限公司 | Display panel and manufacturing method thereof |
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