CN111458051A - Three-dimensional temperature field measuring system and method based on pixel-level spectral photodetector - Google Patents
Three-dimensional temperature field measuring system and method based on pixel-level spectral photodetector Download PDFInfo
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Abstract
The invention discloses a three-dimensional temperature field measuring system and method based on a pixel-level spectral light splitting detector, wherein the system comprises a light field camera and a data processing module, the light field camera is used for obtaining light field image data of all object points on a target three-dimensional object in different directions, the data processing module is used for obtaining the real temperature of a three-dimensional temperature field of the target three-dimensional object according to the light field image data, the light field camera comprises a diaphragm, a main lens, a micro lens array and the pixel-level spectral light splitting detector which are sequentially arranged, the pixel-level spectral light splitting detector comprises a filter plate array and a detector pixel array which are closely attached to each other, the filter plate array is positioned between the micro lens array and the detector pixel array, and the filter plate array comprises a plurality of spectral filter plates with different wavelengths. The three-dimensional temperature field measurement system and the method can obtain the multispectral information of the target three-dimensional object by one-time shooting, and have simple system structure and convenient data sampling.
Description
Technical Field
The invention belongs to the technical field of temperature measurement, and particularly relates to a three-dimensional temperature field measurement system and method based on a pixel-level spectral photodetector.
Background
The three-dimensional temperature field measurement is widely applied to various fields, such as weapon development, internal combustion engines of automobiles, power station boilers, engines of space rockets and aviation airplanes, and particularly, the high-temperature fireball three-dimensional temperature field generated by the explosion of weapons such as artillery cannons, missile warheads and the like is an important index for evaluating lethality and the proportion of explosive raw materials, and has important significance for updating and accelerating weapon development and national defense construction.
The current temperature measuring methods are generally divided into contact temperature measuring methods and non-contact temperature measuring methods. The contact temperature measuring device often has many restrictions and potential safety hazards, only single-point temperature values of certain specific positions of a measured object can be obtained, the response speed is slow, and the error is large. In the non-contact measurement method, the laser diagnosis method has higher measurement accuracy, but the system is complex and puts high requirements on the environment and the instrument accuracy; the infrared radiation imaging temperature measurement method of the single camera can only realize one-dimensional or two-dimensional measurement of points, lines and surfaces, and the three-dimensional temperature field measurement based on the camera array has the problems of complex system, large volume, complex debugging and the like.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a three-dimensional temperature field measurement system and method based on a pixel-level spectral photodetector. The technical problem to be solved by the invention is realized by the following technical scheme:
one aspect of the present invention provides a three-dimensional temperature field measurement system based on a pixel-level spectral photodetector, comprising a light field camera for obtaining multi-spectrum light field image data of all object points on a target three-dimensional object in different directions, and a data processing module for obtaining a three-dimensional temperature field true temperature of the target three-dimensional object according to the multi-spectrum light field image data, wherein,
the light field camera is including the diaphragm, main lens, microlens array and the pixel level spectrum light splitting detector that set gradually, pixel level spectrum light splitting detector is including hugging closely the filter array and the detector pixel array that set up each other, wherein, the filter array is located the microlens array with between the detector pixel array, the filter array is including a plurality of spectral filter that have different wavelength.
In an embodiment of the present invention, the microlens array includes a plurality of microlenses, and the detector pixel array includes a plurality of detector pixel units arranged in an array, wherein each of the microlenses has the same size.
In one embodiment of the invention, the size of each microlens is the same as that of each spectral filter, each spectral filter covers k × k detector pixel units, and k is larger than or equal to 1.
In one embodiment of the invention, the total wavelength range of the filter array is (λ)1,λN) Wherein N represents the number of wavelengths of the filter array,
λ1＝b/T1,λN＝b/TN,b＝2.898×10-3m·K，(T1,TN) And the maximum temperature measurement range of the three-dimensional temperature field measurement system is obtained.
In one embodiment of the invention, each spectral filter in the filter array has a wavelength λ1,λ2,…,λNWherein λ isi＝λ1+(i-1)(λN-λ1)/(N-1)，i＝1,2,…,N。
Another aspect of the present invention provides a three-dimensional temperature field measurement method based on a pixel-level spectral photodetector, the method being performed by the three-dimensional temperature field measurement system according to any one of the above embodiments, the method including:
determining a wavelength of each spectral filter in the light field camera;
calibrating parameters of the three-dimensional temperature field measurement system;
acquiring light field image data of all object points of the target three-dimensional object in different directions by using the three-dimensional temperature field measurement system;
and calculating the real temperature of the three-dimensional temperature field of the target three-dimensional object according to the multi-spectrum light field image data.
In an embodiment of the present invention, the calibrating the parameters of the three-dimensional temperature field measuring system includes:
carrying out geometric parameter calibration on the three-dimensional temperature field measurement system by using a checkerboard calibration plate;
and calibrating the radiation intensity of the three-dimensional temperature field measurement system by using a standard blackbody radiation source.
In one embodiment of the present invention, obtaining multi-spectrum light field image data of all object points of the target three-dimensional object in different directions by using the three-dimensional temperature field measurement system comprises:
converging light information of each spectral band emitted by the target three-dimensional object by using a diaphragm and a main lens to obtain light field information of all object points of the target three-dimensional object in different directions;
carrying out secondary imaging on the light field information by utilizing a micro-lens array and a filter array to form multi-spectrum light field image data of all object points on the target three-dimensional object in different directions;
acquiring the multispectral light field image data with the image detector.
In one embodiment of the present invention, calculating the three-dimensional temperature field true temperature of the target three-dimensional object from the multispectral light field image data comprises:
obtaining the wavelength lambda of the target three-dimensional objectiLower output signal strength value Si(x,y,z)；
Calculating the real temperature T (x, y, z) of the three-dimensional target object at the object point (x, y, z) according to a multispectral radiation thermometry formula:
wherein (lambda)iT (x, y, z)) is the target spectral emissivity corresponding to the temperature T (x, y, z), λiIs the wavelength of the ith spectral filter, c2Is the second radiation constant, T' is the reference temperature, Si' is the wavelength lambda at a reference temperature TiA lower output signal strength value;
and traversing all object points of the three-dimensional target object to complete the reconstruction of the three-dimensional temperature field of the three-dimensional target object.
In one embodiment of the invention, the target three-dimensional object is obtained at a wavelength λiLower output signal strength value Si(x, y, z) comprising:
decomposing the target three-dimensional object into a plurality of microcubes, each microcube being imaged by the three-dimensional temperature field measurement system onto a corresponding detector pixel unit cell of the detector pixel array;
obtaining the corresponding wavelength lambda of each microcube in the pixel unit of the detector by using a ray tracing method and system geometric calibration parametersiPixel value P of all homonymous pixelsi(x, y, z), (x, y, z) is the center coordinate of the microcube;
according to the pixel value P of the image point with the same namei(x, y, z) obtaining the target three-dimensional object at a wavelength λiLower output signal strength value Si(x,y,z)。
Compared with the prior art, the invention has the beneficial effects that:
1. the three-dimensional temperature field measurement system based on the pixel-level spectral light-splitting detector utilizes the characteristic that light field imaging has a plurality of image points with the same name, adds the pixel-level optical filter array in front of the detector pixel array, obtains three-dimensional position information of a three-dimensional target object by one-time shooting, can also obtain multispectral information, overcomes the defect that the same target needs to be measured for multiple times to obtain different visual angle position information and different spectral information in the prior art, has the advantages of three-dimensional imaging and multispectral detection, and has simple structure and convenient data sampling.
2. Compared with the traditional infrared radiation temperature measurement and dual-waveband radiation temperature measurement technologies, the three-dimensional temperature field measurement system and method provided by the invention can select the measurement wavelength and the waveband number of the used filter array according to the required measurement temperature range and precision by adopting the multispectral imaging temperature measurement technology, and have the characteristics of high measurement precision, large temperature range and wide application environment.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic structural diagram of a three-dimensional temperature field measurement system based on a pixel-level spectral photodetector according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a placement position of a filter array according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating the distribution of different wavelength filters on a pixel array of a detector according to an embodiment of the present invention;
fig. 4 is a schematic distribution diagram of filters with different wavelengths in the same image point region on a detector pixel array according to an embodiment of the present invention;
fig. 5 is a flowchart of a three-dimensional temperature field measurement method based on a pixel-level spectral photodetector according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, a three-dimensional temperature field measurement system and method based on a pixel-level spectrum spectrometer according to the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element.
Example one
Referring to fig. 1, fig. 1 is a schematic structural diagram of a three-dimensional temperature field measurement system based on a pixel-level spectral photodetector according to an embodiment of the present invention. The three-dimensional temperature field measuring system of the embodiment comprises a light field camera 1 and a data processing module 2, wherein the light field camera 1 is used for obtaining multi-spectral light field image data of all object points on a target three-dimensional object 3 in different directions, and the data processing module 2 is used for obtaining the real temperature of the three-dimensional temperature field of the target three-dimensional object according to the multi-spectral light field image data.
Specifically, the light field camera 1 includes a diaphragm 11, a main lens 12, a microlens array 13 and a pixel-level spectral splitting detector 14 which are sequentially arranged, the pixel-level spectral splitting detector 14 includes a filter array 141 and a detector pixel array 142 which are closely arranged, wherein the filter array 141 is located between the microlens array 13 and the detector pixel array 142, and the filter array 141 includes a plurality of spectral filters with different wavelengths. The main image plane 4 of the target three-dimensional object 3 formed by the diaphragm 11 and the main lens 12 is located between the main lens 12 and the microlens array 13. The object plane where the target three-dimensional object 3 is located and the main image plane 4 are conjugated with respect to the main lens 12, and the distance from the micro lens array 13 to the main image plane 4 and the distance from the micro lens array 13 to the pixel-level spectral photodetector 14 satisfy the Gaussian imaging formula.
Generally, a microlens array is an array composed of lenses with micron-sized clear aperture and relief depth, and has the basic functions of focusing, imaging and the like of a traditional lens, and has the characteristics of small unit size and high integration level.
In the embodiment, the microlens array 13 includes a plurality of microlenses 131, and the detector pixel array 142 includes a plurality of detector pixel units 1421 arranged in an array, wherein each microlens in the microlens array 13 has the same size, further, each microlens has the same size as each spectral filter, each spectral filter covers k × k of the detector pixel units 1421, and k is greater than or equal to 1.
In the actual usage process, it is first necessary to determine the wavelength of each spectral filter in the light field camera 1, specifically, please refer to fig. 2 to 4, fig. 2 is a schematic diagram of the placement position of a filter array provided by the embodiment of the present invention, fig. 3 is a schematic diagram of the distribution of filters with different wavelengths on a detector pixel array provided by the embodiment of the present invention, fig. 4 is a schematic diagram of the distribution of filters with different wavelengths in the same name image point region on a detector pixel array provided by the embodiment of the present invention, in fact, fig. 3 can also be expressed as a schematic diagram of the distribution of spectral filters with different wavelengths on an image detector, in which different grays represent filters with different wavelengths, the smallest square block represents a detector pixel unit 1421, the combination of the small squares of 3 6326 represents a pixel array region corresponding to a microlens, that each microlens 131 corresponds to 3 detector pixel units 1421, that each microlens 131 has the same wavelength, that the combination of the small squares of 9 represents a filter pixel array region corresponding to 3 microlenses, that each microlens 131 corresponds to 3 microlens arrays 1421, that each microlens 131 has the same microlens 6, that the same microlens 13 is a filter with the same wavelength, that the same microlens 3 is a light field image, that the same microlens 3, that the same microlens is formed by the same microlens, and that the three-dimensional image information of the same microlens 13 is formed by the same image, that the same image point of the same image, the same image is formed by the same microlens, and the same microlens, the same microlens 13, the same microlens, the three-dimensional image information of the same image sensor, the same image point of the same image formed by the same microlens 13, the same microlens array of the same microlens, the same microlens 3 image sensor, the same microlens array of the same microlens 3 image sensor, the same microlens 3 image point of the same microlens 3 image sensor, the same microlens 3 image point of the same microlens, the same microlens 3 image sensor, the same microlens 3-dimensional image point of the same microlens, the[-w，w]The set of detector pixel units corresponding to all the microlenses participating in the imaging of the same object point is called the homonymous image point region 6, as shown in fig. 3. Further, each of the same-name image point regions 6 includes a plurality of pixel regions 7 corresponding to each of the microlenses. For each object point, the light field camera has n 2w +1 image points 5 of the same name, where the distance between the main image plane 12 and the microlens array 13 is l, and the distance between the microlens array 13 and the pixel-level spectral photodetector 14 is g, then
Where f denotes the focal length of the microlens array.
In two-dimensional direction, the number N of wavelengths of a spectral filter in a light field camera can be determined by using the number N of homonymous image points in one-dimensional direction of the light field camera, wherein the number N of wavelengths is equal to the square of the number N of homonymous image points in one-dimensional direction, namely the number N of wavelengths is equal to N2＝(2w+1)2. In general, the larger the number N of wavelengths is, the higher the temperature measurement accuracy of the system is, so that the embodiment of the invention can effectively improve the measurement accuracy of the system compared with a dual-wavelength radiation temperature measurement method.
Further, according to the Wien's displacement law, the total wavelength range in which the plurality of spectral filters are obtained is (λ)1,λN) Where N represents the number of wavelengths of the filter array 141,
λ1＝b/T1,λN＝b/TN,b＝2.898×10-3m·K，(T1,TN) And the maximum temperature measurement range of the three-dimensional temperature field measurement system is obtained.
In this embodiment, a spectral filter is closely disposed in front of the pixel region 7 corresponding to each microlens 131, the pixel region 7 includes k × k detector pixel units 1421. in the actual use process, in two-dimensional direction, in front of the pixel region 7 corresponding to each microlens in the image point region 6 with the same name, micro filter plates with different wavelengths are sequentially disposed in rows or columns, and there are N micro filter plates with different wavelengths, the number N of wavelengths included in the plurality of spectral filters is determined by the number of image points with the same name of the light field camera 1, and each spectral filter plate includesThe wavelengths of the spectral filters are respectively lambda1,λ2,…,λNWherein λ isi＝λ1+(i-1)(λN-λ1) And l (N-1), i is 1,2, …, N, so that light information of different directions of the same object point can be recorded by the image detector through the optical filters with different wavelengths.
It should be noted that, in this embodiment, the filter array 141 is disposed in close proximity to the front of the pixel unit 1421 of the detector, and the size of the micro-filter with the same wavelength is the same as the size of the pixel region 7 corresponding to each microlens.
And then, calibrating the parameters of the three-dimensional temperature field measurement system.
Specifically, firstly, completing the geometric parameter calibration of the three-dimensional temperature field measurement system: the checkerboard calibration plate and the light field camera are fixed on the same horizontal line, the distance between the checkerboard calibration plate and the light field camera is adjusted, checkerboard calibration plate images at different distances are shot, the angle of the checkerboard calibration plate relative to the light field camera is adjusted, and a plurality of checkerboard calibration plate original light field images at different angles are shot. Solving a light field camera calibration model according to the image point coordinates and the corner point coordinates of the shot original light field image of the checkerboard calibration board to obtain the geometric parameters of the three-dimensional temperature field measurement system; then, calibrating the radiation intensity of the three-dimensional temperature field measurement system: controlling the temperature of the black body standard radiation source to be (T)1,TN) The three-dimensional temperature field measuring system of the embodiment is used for shooting the light field image of the black body furnace at different temperatures, according to the Planck's law, the radiation intensity value received by each pixel in the image and the temperature value of the black body satisfy the following formula, the gray value of the image and the radiation intensity value at the temperature are fitted, and the calibration of the radiation intensity of the black body of the image detector can be realized:
wherein, IλThe spectral radiant intensity value at the wavelength lambda is the emissivity of the blackbody standard radiation source, and T is the temperature of the blackbody standard radiation sourceValue of, c1Is a first radiation constant, c2Is the second radiation constant.
After the parameter setting is completed, the three-dimensional temperature field measurement system of the embodiment is utilized to obtain multispectral light field image data of the target three-dimensional object from different viewing angles. Specifically, light information of each spectral band emitted by a target three-dimensional object is converged sequentially through a diaphragm and a main lens group, and then light field information of the target three-dimensional object at different visual angles is subjected to secondary imaging through a micro lens array to form multispectral light field image data; acquiring the multispectral light field image data with the image detector. The image detector can collect multi-spectrum light field image data of the same object point, different wavelengths and different directions, and transmits the collected data to the data processing system.
Subsequently, the data processing system calculates a three-dimensional temperature field true temperature of the target three-dimensional object from the multispectral light field image data: specifically, the target three-dimensional object is obtained at the wavelength λiLower output signal strength value Si(x,y,z)；
Calculating the real temperature T (x, y, z) of the three-dimensional target object at the coordinate point (x, y, z) according to a multispectral radiation thermometry formula:
wherein (lambda)iT (x, y, z)) is the target spectral emissivity corresponding to the temperature T (x, y, z), λiIs the wavelength of the ith spectral filter, c2Is the second radiation constant, T' is the reference temperature, Si' is the wavelength lambda at a reference temperature TiA lower output signal strength value;
and traversing all coordinate points of the three-dimensional target object to complete the reconstruction of the three-dimensional temperature field of the three-dimensional target object.
The three-dimensional temperature field measurement system based on the pixel-level spectral detector utilizes the characteristic that light field imaging has a plurality of image points with the same name, the pixel-level optical filter array is added in front of the detector pixel array, and multispectral information can be obtained while three-dimensional position information of a three-dimensional target object is obtained through one-time shooting, so that the defect that the same target needs to be obtained through multiple times of measurement to obtain different visual angle position information and different spectral information in the prior art is overcome, and the three-dimensional temperature field measurement system has the advantages of three-dimensional imaging and multispectral detection, and is simple in structure and convenient in data sampling.
Example two
On the basis of the above embodiments, the present embodiment provides a three-dimensional temperature field measurement method based on a pixel-level spectral photodetector, which is performed by the three-dimensional temperature field measurement system according to the first embodiment. Referring to fig. 5, fig. 5 is a flowchart of a three-dimensional temperature field measurement method based on a pixel-level spectral photodetector according to an embodiment of the present invention. The three-dimensional temperature field measuring method comprises the following steps:
s1: determining a wavelength of each spectral filter in the light field camera;
in this embodiment, the total wavelength range of the plurality of spectral filters is (λ)1,λN) Wherein N represents the number of wavelengths of the filter array, λ1＝b/T1,λN＝b/TN,b＝2.898×10-3m·K，(T1,TN) And the maximum temperature measurement range of the three-dimensional temperature field measurement system is obtained. The wavelength of each spectral filter in the filter array 141 is λ1,λ2,…,λNWherein λ isi＝λ1+(i-1)(λN（λ1)/(N-1)，i＝1,2,…,N。
In particular, the measurement wavelength and the number of bands of the filter array used can be selected according to the desired measurement temperature range and accuracy.
S2: calibrating parameters of the three-dimensional temperature field measurement system;
specifically, a checkerboard calibration plate is used for calibrating geometric parameters of the three-dimensional temperature field measurement system; and calibrating the radiation intensity of the three-dimensional temperature field measurement system by using a standard blackbody radiation source. For a specific calibration process, please refer to embodiment one, which is not described herein again.
S3: acquiring light field image data of all object points of the target three-dimensional object in different directions by using the three-dimensional temperature field measurement system;
specifically, the S3 includes:
s31: converging light information of each spectral band emitted by the target three-dimensional object by using a diaphragm and a main lens to obtain light field information of all object points of the target three-dimensional object in different directions;
s32: carrying out secondary imaging on the light field information by utilizing a micro-lens array and a filter array to form multi-spectrum light field image data of all object points on the target three-dimensional object in different directions;
s33: acquiring the multispectral light field image data with the image detector.
The image detector can collect multi-spectrum light field image data of the same object point, different wavelengths and different directions, and transmits the collected data to the data processing system.
S4: and calculating the real temperature of the three-dimensional temperature field of the target three-dimensional object according to the multi-spectrum light field image data.
Specifically, the target three-dimensional object is decomposed into a plurality of microcubes, the center position coordinate of each microcube is (x, y, z), the temperature of each microcube is represented as T (x, y, z), and then, in the present embodiment, the size of each microcube imaged by the three-dimensional temperature field measurement system is just equal to the size of one pixel unit on the detector pixel array.
Calculating and extracting the corresponding wavelength lambda of each microcube in the pixel unit of the detector by using a ray tracing method and system geometric calibration parametersiPixel value P of all homonymous pixelsi(x, y, z) from the pixel values P of all image points of the same namei(x, y, z) obtaining the wavelength λ of the target objectiLower output signal strength value Si(x,y,z)。
And then, taking the wavelength values of different multispectral filters and system radiation calibration parameters as prior knowledge, and calculating the real temperature T (x, y, z) of different coordinate points of the inversion target object according to a multispectral radiation temperature measurement formula:
wherein (lambda)iT (x, y, z)) is the target spectral emissivity corresponding to the temperature T (x, y, z), λiIs the wavelength of the ith spectral filter, c2Is the second radiation constant, T' is the reference temperature, Si' is the wavelength lambda at a reference temperature TiThe output signal strength value of.
It should be noted that, when solving the above equation, (λ)iT (x, y, z)) may be replaced by a function using wavelength as a parameter, and according to different forms of the function, the equation solving method may adopt a linear fitting method and a nonlinear fitting method to solve the equation, and the specific solving process is not described herein again.
And finally, traversing all object points of the three-dimensional target object to complete the reconstruction of the three-dimensional temperature field of the three-dimensional target object.
Specifically, according to the above steps, the temperatures of all object points on the three-dimensional target object are obtained, thereby completing the reconstruction of the three-dimensional temperature field of the three-dimensional target object.
The three-dimensional temperature field measuring method of the embodiment adopts a multispectral imaging temperature measuring technology, can select the measuring wavelength and the number of wave bands of the used filter array according to the required measuring temperature range and precision compared with the traditional infrared radiation temperature measuring and two-wave-band radiation temperature measuring technologies, and has the characteristics of high measuring precision, large temperature range and wide application environment.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A three-dimensional temperature field measurement system based on a pixel-level spectral light splitting detector is characterized by comprising a light field camera (1) and a data processing module (2), wherein the light field camera (1) is used for obtaining multispectral light field image data of all object points on a target three-dimensional object (3) in different directions, the data processing module (2) is used for obtaining the real temperature of a three-dimensional temperature field of the target three-dimensional object according to the multispectral light field image data, wherein,
light field camera (1) is including diaphragm (11), main lens (12), microlens array (13) and the pixel level spectrum light splitting detector (14) that set gradually, pixel level spectrum light splitting detector (14) are including hugging closely filter plate array (141) and the detector pixel array (142) that set up each other, wherein, filter plate array (141) are located microlens array (13) with between detector pixel array (142), filter plate array (141) are including a plurality of spectral filter plates that have different wavelengths.
2. The three-dimensional temperature field measurement system based on the pixel-level spectrum light splitting detector as claimed in claim 1, wherein the micro-lens array (13) comprises a plurality of micro-lenses (131), the detector pixel array (142) comprises a plurality of detector pixel units (1421) arranged in an array, and the size of each micro-lens (131) is the same.
3. The three-dimensional temperature field measurement system based on pixel-level spectral photodetector as claimed in claim 2, characterized in that the size of each said microlens (131) is the same as the size of each said spectral filter, each said spectral filter covers k × k said detector pixel cells (1421), k ≧ 1.
4. The three-dimensional temperature field measurement system based on pixel-level spectral photodetector according to claim 1, characterized in that the total wavelength range of said filter array (141) is (λ &)1,λN) Wherein N represents the number of wavelengths of the filter array (141),
λ1＝b/T1,λN＝b/TN,b＝2.898×10-3m·K，(T1,TN) And the maximum temperature measurement range of the three-dimensional temperature field measurement system is obtained.
5. The three-dimensional temperature field measurement system based on pixel-level spectral photodetector as claimed in claim 1, wherein each spectral filter in said filter array (141) has a wavelength λ1,λ2,…,λNWherein λ isi＝λ1+(i-1)(λN-λ1)/(N-1)，i＝1,2,…,N。
6. A three-dimensional temperature field measurement method based on a pixel-level spectral photodetector, characterized in that the method is performed by the three-dimensional temperature field measurement system of any one of claims 1 to 5, the method comprising:
determining a wavelength of each spectral filter in the light field camera;
calibrating parameters of the three-dimensional temperature field measurement system;
acquiring light field image data of all object points of the target three-dimensional object in different directions by using the three-dimensional temperature field measurement system;
and calculating the real temperature of the three-dimensional temperature field of the target three-dimensional object according to the multi-spectrum light field image data.
7. The method according to claim 6, wherein the calibrating the parameters of the three-dimensional temperature field measurement system comprises:
carrying out geometric parameter calibration on the three-dimensional temperature field measurement system by using a checkerboard calibration plate;
and calibrating the radiation intensity of the three-dimensional temperature field measurement system by using a standard blackbody radiation source.
8. The method according to claim 6, wherein obtaining multispectral light field image data of all object points of the target three-dimensional object from different directions by using the three-dimensional temperature field measurement system comprises:
converging light information of each spectral band emitted by the target three-dimensional object by using a diaphragm and a main lens to obtain light field information of all object points of the target three-dimensional object in different directions;
carrying out secondary imaging on the light field information by utilizing a micro-lens array and a filter array to form multi-spectrum light field image data of all object points on the target three-dimensional object in different directions;
acquiring the multispectral light field image data with the image detector.
9. The method according to claim 6, wherein calculating the true temperature of the three-dimensional temperature field of the target three-dimensional object from the multi-spectral light field image data comprises:
obtaining the wavelength lambda of the target three-dimensional objectiLower output signal strength value Si(x,y,z)；
Calculating the real temperature T (x, y, z) of the three-dimensional target object at the object point (x, y, z) according to a multispectral radiation thermometry formula:
wherein (lambda)iT (x, y, z)) is the target spectral emissivity corresponding to the temperature T (x, y, z), λiIs the wavelength of the ith spectral filter, c2Is the second radiation constant, T' is the reference temperature, Si' is the wavelength lambda at a reference temperature TiA lower output signal strength value;
and traversing all object points of the three-dimensional target object to complete the reconstruction of the three-dimensional temperature field of the three-dimensional target object.
10. The method according to claim 9, wherein said objective is achieved by a method of multispectral light field imaging thermometry based on a pixel-level spectral photodetectorMarking three-dimensional objects at wavelength λiLower output signal strength value Si(x, y, z) comprising:
decomposing the target three-dimensional object into a plurality of microcubes, each microcube being imaged by the three-dimensional temperature field measurement system onto a corresponding detector pixel unit cell of the detector pixel array;
obtaining the corresponding wavelength lambda of each microcube in the pixel unit of the detector by using a ray tracing method and system geometric calibration parametersiPixel value P of all homonymous pixelsi(x, y, z), (x, y, z) is the center coordinate of the microcube;
according to the pixel value P of the image point with the same namei(x, y, z) obtaining the target three-dimensional object at a wavelength λiLower output signal strength value Si(x,y,z)。
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112532832A (en) * | 2020-11-23 | 2021-03-19 | Oppo（重庆）智能科技有限公司 | Imaging device and electronic equipment |
| CN113237559A (en) * | 2021-04-25 | 2021-08-10 | 哈尔滨工业大学 | Multispectral radiation temperature measuring device and using method |
| CN113418613A (en) * | 2021-06-22 | 2021-09-21 | 中北大学 | High-temperature transient measurement system and method based on multispectral colorimetry |
| CN113777605A (en) * | 2021-09-10 | 2021-12-10 | 哈尔滨工业大学 | Passive millimeter wave three-dimensional imaging system and imaging method thereof |
| CN114688990A (en) * | 2020-12-28 | 2022-07-01 | 北京振兴计量测试研究所 | Multi-parameter three-dimensional measuring device, system and method based on light field camera |
| CN115493705A (en) * | 2021-06-17 | 2022-12-20 | 北京振兴计量测试研究所 | Device and method for measuring surface temperature of high-temperature object under dispersion condition |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004027459A2 (en) * | 2002-09-20 | 2004-04-01 | Bae Systems Information And Electronic Systems Integration Inc | Front lens shutter mount for uniformity correction |
| CN101454650A (en) * | 2006-05-30 | 2009-06-10 | 皇家飞利浦电子股份有限公司 | Lens system |
| EP2296031A1 (en) * | 2009-09-11 | 2011-03-16 | Astrium Limited | Detecting electromagnetic radiation |
| SE1130099A1 (en) * | 2011-10-14 | 2013-01-15 | Flir Systems Ab | Procedure for Gain Folder Generation in an IR Camera, and IR Camera for Performing Gain Folder Generation |
| CN103926200A (en) * | 2014-04-25 | 2014-07-16 | 西北核技术研究所 | CARS (coherent anti-stokes Raman scattering) and TDLAS (tunable diode laser absorption spectroscopy) collinear temperature measurement device |
| CN103954357A (en) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | Obtaining method of measurement matrixes of compression spectral imaging system |
| CN104350732A (en) * | 2012-05-28 | 2015-02-11 | 株式会社尼康 | Imaging device |
| CN105606222A (en) * | 2015-09-06 | 2016-05-25 | 东南大学 | Flame three-dimensional temperature field measurement imaging device, measuring device and measuring method |
| US20170026588A1 (en) * | 2014-05-01 | 2017-01-26 | Rebellion Photonics, Inc. | Dual-band divided-aperture infra-red spectral imaging system |
| CN107084794A (en) * | 2017-04-10 | 2017-08-22 | 东南大学 | Flame three-dimensional temperature field measuring system and method based on light field Stratified Imaging technology |
| CN108072459A (en) * | 2017-12-12 | 2018-05-25 | 中国舰船研究设计中心 | A kind of method for measuring steel billet temperature field and calculating its radiation intensity |
| CN109813450A (en) * | 2019-03-27 | 2019-05-28 | 中国航空工业集团公司北京长城计量测试技术研究所 | A kind of transient state imaging type infrared multispectral temperature field measuring apparatus |
| CN110160660A (en) * | 2019-05-30 | 2019-08-23 | 上海交通大学 | High-temperature component Multi spectral thermometry method and system based on light-field camera |
-
2020
- 2020-03-09 CN CN202010159009.2A patent/CN111458051B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004027459A2 (en) * | 2002-09-20 | 2004-04-01 | Bae Systems Information And Electronic Systems Integration Inc | Front lens shutter mount for uniformity correction |
| US20050231627A1 (en) * | 2002-09-20 | 2005-10-20 | Bae Systems Information And Electronic Systems Integration Inc | Front lens shutter mount for uniformity correction |
| CN101454650A (en) * | 2006-05-30 | 2009-06-10 | 皇家飞利浦电子股份有限公司 | Lens system |
| EP2296031A1 (en) * | 2009-09-11 | 2011-03-16 | Astrium Limited | Detecting electromagnetic radiation |
| SE1130099A1 (en) * | 2011-10-14 | 2013-01-15 | Flir Systems Ab | Procedure for Gain Folder Generation in an IR Camera, and IR Camera for Performing Gain Folder Generation |
| CN104350732A (en) * | 2012-05-28 | 2015-02-11 | 株式会社尼康 | Imaging device |
| CN103954357A (en) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | Obtaining method of measurement matrixes of compression spectral imaging system |
| CN103926200A (en) * | 2014-04-25 | 2014-07-16 | 西北核技术研究所 | CARS (coherent anti-stokes Raman scattering) and TDLAS (tunable diode laser absorption spectroscopy) collinear temperature measurement device |
| US20170026588A1 (en) * | 2014-05-01 | 2017-01-26 | Rebellion Photonics, Inc. | Dual-band divided-aperture infra-red spectral imaging system |
| CN105606222A (en) * | 2015-09-06 | 2016-05-25 | 东南大学 | Flame three-dimensional temperature field measurement imaging device, measuring device and measuring method |
| CN107084794A (en) * | 2017-04-10 | 2017-08-22 | 东南大学 | Flame three-dimensional temperature field measuring system and method based on light field Stratified Imaging technology |
| CN108072459A (en) * | 2017-12-12 | 2018-05-25 | 中国舰船研究设计中心 | A kind of method for measuring steel billet temperature field and calculating its radiation intensity |
| CN109813450A (en) * | 2019-03-27 | 2019-05-28 | 中国航空工业集团公司北京长城计量测试技术研究所 | A kind of transient state imaging type infrared multispectral temperature field measuring apparatus |
| CN110160660A (en) * | 2019-05-30 | 2019-08-23 | 上海交通大学 | High-temperature component Multi spectral thermometry method and system based on light-field camera |
Non-Patent Citations (2)
| Title |
|---|
| JEFFREY S. 等: "Simultaneous, ensemble-averaged measurement of near-wall temperature and velocity in steady micro-flows using single quantum dot tracking", 《EXP FLUIDS》 * |
| 陈树强: "数字光场成像系统的信号处理", 《万方数据库》 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112532832A (en) * | 2020-11-23 | 2021-03-19 | Oppo（重庆）智能科技有限公司 | Imaging device and electronic equipment |
| CN112532832B (en) * | 2020-11-23 | 2022-04-12 | Oppo（重庆）智能科技有限公司 | Imaging device and electronic equipment |
| CN114688990A (en) * | 2020-12-28 | 2022-07-01 | 北京振兴计量测试研究所 | Multi-parameter three-dimensional measuring device, system and method based on light field camera |
| CN114688990B (en) * | 2020-12-28 | 2023-11-03 | 北京振兴计量测试研究所 | Multi-parameter three-dimensional measurement device, system and method based on light field camera |
| CN113237559A (en) * | 2021-04-25 | 2021-08-10 | 哈尔滨工业大学 | Multispectral radiation temperature measuring device and using method |
| CN115493705A (en) * | 2021-06-17 | 2022-12-20 | 北京振兴计量测试研究所 | Device and method for measuring surface temperature of high-temperature object under dispersion condition |
| CN115493705B (en) * | 2021-06-17 | 2024-08-06 | 北京振兴计量测试研究所 | Device and method for measuring surface temperature of high-temperature object under dispersion condition |
| CN113418613A (en) * | 2021-06-22 | 2021-09-21 | 中北大学 | High-temperature transient measurement system and method based on multispectral colorimetry |
| CN113777605A (en) * | 2021-09-10 | 2021-12-10 | 哈尔滨工业大学 | Passive millimeter wave three-dimensional imaging system and imaging method thereof |
| WO2024098447A1 (en) * | 2022-11-15 | 2024-05-16 | 中国矿业大学 | Boiler hearth sectional temperature field and radiation characteristic visual monitoring method combining radiation images and spectrums |
| CN116105862A (en) * | 2023-04-13 | 2023-05-12 | 中国科学院长春光学精密机械与物理研究所 | Spectrum detection system based on target surface segmentation and pixel level light splitting and preparation method thereof |
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