CN111454689B - Heat-conducting adhesive with high glass transition temperature and preparation method thereof - Google Patents
Heat-conducting adhesive with high glass transition temperature and preparation method thereof Download PDFInfo
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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Abstract
The invention relates to the technical field of heat-conducting glue, and discloses heat-conducting glue with high glass transition temperature and a preparation method thereof, wherein the heat-conducting glue is prepared from the following raw materials in percentage by mass: 5-80% of organic silicon epoxy prepolymer, 1-50% of alicyclic epoxy resin, 1-20% of oxetane monomer, 0-20% of macromolecular polyol, 0.2-25% of curing agent, 0.1-2% of antioxidant, 0.1-0.5% of light stability, 0.0-0.5% of defoaming agent, 5-90% of heat-conducting filler, 0.0-5% of dispersing agent and 0.2-2% of coupling agent, wherein the sum of the components meets 100%. The heat-conducting glue provided by the invention has high glass transition temperature (higher than 100 ℃), high elastic modulus (higher than 1000MPa), good toughness (elongation rate is higher than 5%) and strong bonding force, is suitable for bonding of an optical fiber ring in an optical fiber gyroscope, can effectively improve the overall heat conductivity coefficient of the optical fiber ring, reduce the temperature gradient of the optical fiber ring, reduce the temperature error of the ring at full temperature and improve the precision of the gyroscope.
Description
Technical Field
The invention relates to the technical field of heat-conducting glue, in particular to high-glass-transition-temperature heat-conducting glue for an optical fiber ring and a preparation method thereof.
Background
The optical fiber gyroscope is one of the important gyroscopes which are applied internationally, the main sensitive device of the optical fiber gyroscope is an optical fiber ring, in order to meet the vibration performance requirement of the optical fiber gyroscope and improve the overall precision of the optical fiber gyroscope, the wound optical fiber ring needs to be fixed by glue application and solidification, but the working error of the optical fiber gyroscope is greatly influenced by external vibration and temperature change.
The influence of temperature on the optical fiber ring mainly comes from two aspects, namely heat dissipation of an internal heat source of the optical fiber gyroscope on one hand and influence of change of ambient temperature on the optical fiber gyroscope on the other hand. The internal heat sources and the ambient temperature generate gradient temperature difference effect on the optical fiber ring, so that the zero-offset stability of the optical fiber gyroscope is directly influenced. At present, the heat conductivity coefficients of ring winding glue used for winding the optical fiber ring and ring bonding glue used for bonding the ring are only 0.15-0.25W/(m.K), so the temperature gradient effect of the optical fiber gyroscope ring is very obvious, and the precision of the optical fiber gyroscope is seriously influenced to be further improved.
Disclosure of Invention
In view of the above, the invention provides a high-vitrification-temperature heat-conducting glue for an optical fiber ring and a preparation method thereof, and the heat-conducting glue has high vitrification temperature (higher than 100 ℃), high elastic modulus (higher than 1000MPa), good toughness (elongation rate is higher than 5%) and strong binding power, can effectively improve the overall heat conductivity coefficient of the optical fiber ring, reduce the temperature gradient of the optical fiber ring, reduce the temperature error of the ring at full temperature, and improve the precision of a gyroscope.
The technical scheme of the invention is as follows:
the high-glass-transition-temperature heat-conducting glue for the optical fiber ring is prepared from the following raw materials in percentage by mass: 5-80% of organic silicon epoxy prepolymer, 1-50% of alicyclic epoxy resin, 1-20% of oxetane monomer, 0-20% of macromolecular polyol, 0.2-25% of curing agent, 0.1-2% of antioxidant, 0.1-0.5% of light stability, 0.0-0.5% of defoaming agent, 5-90% of heat-conducting filler, 0.0-5% of dispersing agent and 0.2-2% of coupling agent, wherein the sum of the components is 100%;
the organic silicon epoxy prepolymer is composed of an organic silicon epoxy prepolymer A and an organic silicon epoxy prepolymer B according to any proportion, and the structural formulas of the organic silicon epoxy prepolymer A and the organic silicon epoxy prepolymer B are as follows:
wherein the content of the first and second substances,
R1or methyl, R2Phenyl or methyl, m-0-8, n-0-8;
the glass transition temperature of the alicyclic epoxy resin is more than 100 ℃, and the viscosity of the alicyclic epoxy resin is less than 2000 mpa.s; the antioxidant is a phenol antioxidant, and the light stabilizer is a non-hindered amine antioxidant.
In the above technical scheme, the alicyclic epoxy resin includes, but is not limited to 2021P, UVR-6128.
In the above technical scheme, the oxetane monomer refers to a low viscosity reactive diluent containing oxetane, including but not limited to one or more of 3-oxetanpropanol, 3-oxetane butanol, 3-oxetanemethanol, 3-phenyl-3-hydroxy-1-oxolane, 3-ethyl-3-oxooxetanemethanol, 3-methyl-3-hydroxymethyloxetane, 3-phenyl-1-oxolane, 3-phenyl-3-methoxyoxetane, 3-methyl-3-phenyloxetane, 3' - (oxybis-methylene) bis (3-ethyl) oxetane, and mixtures thereof in any proportion. The oxetane monomer can effectively improve the curing speed, increase the toughness and reduce the viscosity.
In the above technical solution, the said macropolyol can be polyether polyol synthesized by ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and methyl tetrahydrofuran alone or in any proportion, polycaprolactone polyol synthesized by using the above polyether polyol as initiator, polycaprolactone polyol, hydroxyl-terminated polybutadiene, alkylol-terminated polydimethylsiloxane, one or more of neopentyl glycol and tetrahydrofuran copolyol, polytrimethylene ether glycol and UNIPOL-B series liquid polyester polyol in any proportion. The number average molecular weight is between 200 and 3000, preferably between 300 and 2000. The macromolecular polyol can participate in cation curing, reduce shrinkage and play a toughening role.
In the technical scheme, the curing agent is a thermal initiation latent curing agent, and comprises but is not limited to one or a mixture of more of ADEKA EH-4360S, ADEKA EH-3842 and Anyhard 1010P, ICAM-8409 in any proportion.
In the technical scheme, the antioxidant comprises but is not limited to one or a mixture of more of Irganox 1135, Irganox 1035, Irganox 1010 and Irganox 1726 which are produced by BASF corporation according to any proportion.
In the technical scheme, the light stabilizer can be benzotriazole, benzophenone or o-hydroxyphenyltriazine light stabilizer, including but not limited to one or a mixture of more of UV-9, UV-234, UV-360, UV-531 and UV-400 produced by a new material of linaloon in any proportion.
In the technical scheme, the heat-conducting filler is formed by mixing a needle-shaped, tubular or flaky filler and a spherical filler in any proportion, when the heat-conducting glue is used for winding an optical fiber ring, the particle size of the heat-conducting filler meets D100 less than 2.5 mu m, and the needle-shaped, tubular and flaky fillers include but are not limited to needle-shaped alumina, flaky boron nitride, graphene, carbon nano tubes and the like; suitable spherical fillers include, but are not limited to, aluminum nitride, spherical boron nitride, silicon carbide, diamond, and the like.
In the above technical solution, the dispersant is preferably a neutral dispersant, including but not limited to luobu 32000, TiloJet 3000, TiloJet 3003, and the like. Acidic and basic dispersants may react with epoxy resins, affecting storage stability. The dispersing agent is an auxiliary agent which has high-efficiency dispersing effect on the heat-conducting filler, can play a role in a small adding amount and can reduce the viscosity.
In the above technical solution, the coupling agent may be a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, including but not limited to KH560, KH570, KH580, KH590, AL-M (aluminate), triisostearoyl isopropyl titanate, isopropyltrioleate acyloxy titanate, isopropyldioleate acyloxy (dioctylphosphonoxy) titanate, bis (ethylacetoacetate) diisopropyl titanate, bis-triethanolamine diisopropyl titanate, etc. Preferably, the coupling agent is KH560 having an epoxy reactive group. The proper coupling agent can react with the heat-conducting filler, improve the interface connection between the heat-conducting filler and the colloid, reduce the interface thermal resistance and improve the heat conductivity coefficient.
In the above technical scheme, the defoaming agent can be organic silicon type, organic fluorine silicon type and non-silicon type defoaming agent. The compatibility of the defoamer with the mixing components other than the thermally conductive filler was tested before use, and the coupling agents include, but are not limited to, BYK-065, BYK-066N, EFKA-2022, EFKA-2035, Dow Corning DC-163 in any proportion.
The invention also provides a preparation method of the heat-conducting glue for the optical fiber ring with the high glass transition temperature, which comprises the following steps:
step 1: adding hydrogen-terminated silicone oil and allyl bisphenol A in a molar ratio of 0.95: 1-1: 1 into a flask, adding 10-300ppm of platinum catalyst KP36 relative to the total mass, reacting at 100-140 ℃ for 2-8h, and then adding allyl glycidyl ether in an equal molar amount to the hydrogen-terminated silicone oil to continue reacting for 2-8 h. To obtain an organic silicon epoxy prepolymer A, or adding 4-vinyl-1-cyclohexene-1, 2-epoxy with the same mol as hydrogen-containing silicone oil to continue reacting for 2-8h to obtain an organic silicon epoxy prepolymer B; the specific reaction structural formula is as follows:
wherein:
R1(ii) phenyl or methyl; r2(ii) phenyl or methyl; m is 0-8, n is 0-8;
preferably, X in the silicone epoxy prepolymer a and the silicone epoxy prepolymer B are different;
step 2: weighing the components in proportion, adding all the materials except the curing agent and the heat-conducting filler into a mixing tank, adding the heat-conducting filler while stirring, treating for 5-30min by using an ultrasonic processor after the heat-conducting filler is completely added, then adding the curing agent when the materials are cooled to below 40 ℃, and stirring for 2-8h at the temperature of 30-40 ℃ to obtain the heat-conducting adhesive.
Specifically, the curing conditions of the heat-conducting glue prepared by the invention are 60-85 ℃ and the curing time is 2-48 h.
The invention has the beneficial effects that:
1) the organic silicon epoxy prepolymer provided by the invention is a combination of organic silicon and bisphenol A, the organic silicon chain segment can enable the epoxy prepolymer to have the advantages of low viscosity, good wetting and leveling property, good flexibility, good aging resistance and heat resistance and the like, and the bisphenol A modification can improve the glass transition temperature of the epoxy prepolymer and obtain good compatibility.
2) The heat conduction material is formed by compounding needle-shaped, tubular and flaky fillers (in two-dimensional directions) and spherical fillers, so that the construction of a transverse and longitudinal three-dimensional heat conduction channel is realized, and the heat conduction coefficient of the heat conduction adhesive is effectively improved; the granularity of the heat-conducting filler is less than 2.5 mu m, so that the filler can be uniformly distributed in the optical fiber ring in an extremely fine state, no large particles extrude the optical fiber, and the gyro precision is not adversely affected; the curing shrinkage rate of the heat-conducting filler can be effectively reduced by improving the volume filling rate of the heat-conducting filler, and the influence of stress generated by volume shrinkage on the framework and the optical fiber bonding force in the curing process is effectively prevented;
3) the heat-conducting adhesive provided by the invention is single-component, is convenient to use, does not need to be defoamed before use, avoids a large amount of bubbles generated by the fact that A, B is needed to prepare the conventional two-component epoxy adhesive during use, and can prevent the influence of difficulty in removing the bubbles on the ring winding process;
4) when the heat-conducting adhesive is used for adhering rings, the heat transfer efficiency of the optical fiber ring and the gyroscope framework or the shell can be improved, the temperature difference between the optical fiber ring and the gyroscope framework or the shell in a variable temperature environment is reduced, the thermal expansion stress generated by the optical fiber ring, the shell and the adhesive ring adhesive under the condition of large temperature difference is reduced, the reliability of an adhering surface can be effectively improved, and the optical fiber ring adhering interface is prevented from cracking and falling off.
Detailed Description
In order that the invention may be better understood, it is further illustrated by the following detailed description, but is not to be construed as being limited thereto.
Example 1
(1) Preparation of Silicone epoxy prepolymer A
344g of end hydrogen-containing phenyl silicone oil
308.42g of allyl bisphenol A were charged into the flask, 100ppm of platinum catalyst KP36 relative to the total mass were added and the reaction was carried out at 120 ℃ for 3 hours, then 114.14g of allyl glycidyl ether was added and the reaction was continued for 4 hours to give the product having a viscosity of 25 ℃ and 265 mpa.s.
(2) Preparation of Silicone epoxy prepolymer B
208g of hydrogen-containing silicone oil
308.42g of allyl bisphenol A were added to the flask, 150ppm of platinum catalyst KP36 relative to the total mass was added, the reaction was carried out at 130 ℃ for 2 hours, then 124.18g of 4-vinyl-1-cyclohexene-1, 2-epoxy was added and the reaction was continued for 3 hours to give the product having a viscosity of 25 ℃ and 176 mpa.s.
(3) Preparation of heat-conducting glue
The heat-conducting glue comprises the following raw materials in percentage by mass: 10% of organic silicon epoxy prepolymer A, 10% of organic silicon epoxy prepolymer B, 2021P 10% of alicyclic epoxy resin, 3-phenyl-3-methoxy oxetane, 3.6% of macromolecular polyol PPG 10000.2%, ADEKA EH-384210% of curing agent, 11350.2% of antioxidant, UV-2340.2% of light stability, EFKA-20220.1% of antifoaming agent, 5% of heat-conducting filler graphene, 50% of heat-conducting filler aluminum nitride, 320000.2% of dispersing agent Lumbou, and KH 5600.5% of coupling agent, wherein the sum of the components is 100%.
Weighing the raw materials in proportion, adding all the materials except the curing agent and the heat-conducting filler into a mixing tank, then adding the heat-conducting filler while stirring, treating the mixture for 20 minutes by using an ultrasonic processor after the heat-conducting filler is completely added, then adding the curing agent when the materials are cooled to below 40 ℃, and stirring for 5 hours at the temperature of 40 ℃ to obtain the heat-conducting adhesive.
Example 2
Steps (1) and (2) were the same as in example 1.
(3) Preparation of heat-conducting glue
The heat-conducting glue comprises the following raw materials in percentage by mass: 4% of organic silicon epoxy prepolymer A, 6% of organic silicon epoxy prepolymer B, 6% of alicyclic epoxy resin UVR-61282%, 2% of 3-ethyl-3-oxetanemethanol, 6502% of macromolecular polyol PTMG, 3.52% of curing agent Anyhard 1010P, 17260.1% of antioxidant, 90.1% of photostability UV, 10% of heat-conducting filler acicular alumina, 70% of heat-conducting filler spherical alumina, Tilojet 30000.08%, and 0.2% of coupling agent AL-M (aluminate), wherein the sum of the components meets 100%.
Weighing the raw materials in proportion, adding all the materials except the curing agent and the heat-conducting filler into a mixing tank, then adding the heat-conducting filler while stirring, treating the mixture for 25 minutes by using an ultrasonic processor after the heat-conducting filler is completely added, then adding the curing agent when the materials are cooled to below 40 ℃, and stirring for 4 hours at the temperature of 35 ℃ to obtain the heat-conducting adhesive.
Example 3
Steps (1) and (2) were the same as in example 1.
(3) Preparation of heat-conducting glue
The heat-conducting glue comprises the following raw materials in percentage by mass: 30% of organic silicon epoxy prepolymer A, 5% of organic silicon epoxy prepolymer B, 12% of alicyclic epoxy resin UVR-612812%, 12% of 3-oxetanyl butanol, 30511% of macromolecular polyol PCL, 20% of curing agent ICAM-84090.5%, 0.5% of defoamer DC-1630.1%, 10100.16% of antioxidant, 25% of photostability UV-5310.15%, 8% of heat-conducting filler graphene, 20% of heat-conducting filler spherical boron nitride, 30030.59% of Tilojet, 0.5% of coupling agent triisostearoyl isopropyl titanate, and the sum of the components is 100%.
Weighing the raw materials in proportion, adding all the materials except the curing agent and the heat-conducting filler into a mixing tank, then adding the heat-conducting filler while stirring, treating the mixture for 10 minutes by using an ultrasonic processor after the heat-conducting filler is completely added, then adding the curing agent when the materials are cooled to below 40 ℃, and stirring for 8 hours at 40 ℃ to obtain the heat-conducting adhesive.
Performance characterization
The three embodiments and the products of the conventional epoxy ring-winding adhesive are tested by adopting an industry standard detection method, D1 optical fibers produced by Wuhan Chang Yingtong optical fiber Co Ltd are used for winding optical fiber rings, the tensile shear strength of the embodiments to the embodiments (simulating the ring surface of the bonded optical fiber) and the tensile shear strength of stainless steel to the stainless steel (simulating the surface of a bonded framework or a shell) are tested, and the zero bias stability of main indexes influencing the precision of the optical fiber gyroscope is tested to obtain the following table:
the embodiments show that the heat-conducting adhesive has proper viscosity, high glass transition temperature (higher than 100 ℃), high elastic modulus (higher than 1000MPa), good toughness (elongation rate is higher than 5%), low curing shrinkage rate, high heat conductivity, small granularity and adjustable operation time and curing time, is particularly suitable for winding an optical fiber ring with high requirements on heat conduction and shock resistance and bonding the optical fiber ring to a framework or a shell, can effectively reduce the temperature gradient of the optical fiber ring, improve the heat transfer efficiency of the shell and the framework to the optical fiber ring, reduce the start-up time of the gyroscope, improve the tolerance of the optical fiber gyroscope to high-frequency vibration (more than 100 Hz), and improve the reliability of the optical fiber gyroscope.
The high glass transition temperature (more than 100 ℃) can ensure that the heat-conducting adhesive keeps higher elastic modulus within the range of minus 45 ℃ to 85 ℃ in the working interval of the optical fiber ring, and the performance of the gyroscope cannot be influenced because the modulus is sharply reduced; the high elastic modulus (more than 1000MPa) can make the optical fiber ring endure the high-frequency vibration of more than 100Hz when the terminal is used, and the functions of fixing and size keeping are achieved; the high-modulus heat-conducting adhesive has better toughness (the elongation rate is more than 5 percent), can have certain bending performance under the condition that the high modulus is kept, and effectively prevents the optical fiber ring body from cracking; the granularity is less than 2.5 mu m, so that the filler can be uniformly distributed in the optical fiber ring in an extremely fine state, no large particles extrude the optical fiber, and the gyro precision is not adversely affected; the adhesive force to the optical fiber ring and metal (such as aluminum alloy, stainless steel, magnetic shielding 1J85 and other materials) is strong, and the adhesive can be used for adhering the optical fiber ring to a metal framework or a shell; the high heat conductivity coefficient can effectively reduce the temperature gradient of the optical fiber ring and improve the precision of the gyroscope. The heat transfer efficiency of the optical fiber ring and the gyroscope framework or the shell can be improved, the temperature difference between the optical fiber ring and the gyroscope framework or the shell in a temperature-changing environment is reduced, the thermal expansion stress generated by the optical fiber ring, the shell and the ring adhesive under the condition of large temperature difference is reduced, the reliability of a bonding surface can be effectively improved, and the cracking and falling of a bonding interface of the optical fiber ring are prevented.
The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by using equivalent substitutions or equivalent transformations fall within the scope of the present invention.
Claims (9)
1. The heat-conducting adhesive with the high glass transition temperature is characterized by being prepared from the following raw materials in percentage by mass: 5-80% of organic silicon epoxy prepolymer, 1-50% of alicyclic epoxy resin, 1-20% of oxetane monomer, 0-20% of macromolecular polyol, 0.2-25% of curing agent, 0.1-2% of antioxidant, 0.1-0.5% of light stabilizer, 0.0-0.5% of defoaming agent, 5-90% of heat-conducting filler, 0.0-5% of dispersing agent and 0.2-2% of coupling agent, wherein the sum of the components meets 100%;
the organic silicon epoxy prepolymer consists of an organic silicon epoxy prepolymer A and an organic silicon epoxy prepolymer B, and the structural formulas of the organic silicon epoxy prepolymer A and the organic silicon epoxy prepolymer B are as follows:
wherein the content of the first and second substances,
R1or methyl, R2Phenyl or methyl, m-0-8, n-0-8;
the glass transition temperature of the alicyclic epoxy resin is more than 100 ℃, and the viscosity of the alicyclic epoxy resin is less than 2000 mpa.s; the antioxidant is a phenol antioxidant, and the light stabilizer is a non-hindered amine antioxidant.
2. The high glass transition temperature thermally conductive adhesive of claim 1, wherein the value of m of X in the silicone epoxy prepolymer A is different from the value of m of X in the silicone epoxy prepolymer B, or the value of n of X in the silicone epoxy prepolymer A is different from the value of n of X in the silicone epoxy prepolymer B.
3. The thermally conductive paste as claimed in claim 1, wherein the oxetane monomer is one or more selected from the group consisting of 3-oxetanpropanol, 3-oxetanol, 3-oxetanemethanol, 3-phenyl-3-hydroxy-1-oxolane, 3-ethyl-3-oxetanemethanol, 3-methyl-3-hydroxymethyloxetane, 3-phenyl-1-oxetane, 3-phenyl-3-methoxyoxetane, 3-methyl-3-phenyloxetane, and 3,3' - (oxybismethylene) bis (3-ethyl) oxetane.
4. The heat-conducting adhesive with high glass transition temperature according to claim 1, wherein the said polyol is polyether polyol prepared from ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and methyltetrahydrofuran, or polycaprolactone polyol prepared from the above polyether polyol as initiator, hydroxyl-terminated polybutadiene, alkyl hydroxyl-terminated polydimethylsiloxane, one or more of neopentyl glycol and tetrahydrofuran copolymer glycol, polytrimethylene ether glycol and liquid polyester polyol of UNIPOL-B series.
5. The high glass transition temperature thermally conductive adhesive of claim 4, wherein the number average molecular weight of the macromolecular polyol is 200 to 3000.
6. The heat conductive adhesive of claim 1, wherein the curing agent is a thermally initiated latent curing agent selected from the group consisting of ADEKA EH-4360S, ADEKA EH-3842, and Anyhard 1010P, ICAM-8409.
7. The high glass transition temperature thermally conductive adhesive of claim 1, wherein the thermally conductive filler has a particle size of less than 2.5 μm, and the particle morphology of the thermally conductive filler includes needle-like or/and flake-like and spherical shapes.
8. The method for preparing a high glass transition temperature thermally conductive paste as claimed in any one of claims 1 to 7, comprising the steps of:
the method comprises the following steps: adding hydrogen-terminated silicone oil and allyl bisphenol A in a molar ratio of 0.95: 1-1: 1 into a flask, adding 10-300ppm of platinum catalyst KP36 relative to the total mass, reacting at 100-140 ℃ for 2-8 hours, then adding allyl glycidyl ether in an equal mole with the hydrogen-terminated silicone oil, and reacting for 2-8 hours to obtain an organic silicon epoxy prepolymer A, or adding 4-vinyl-1-cyclohexene-1, 2-epoxy in an equal mole with the hydrogen-terminated silicone oil, and continuing to react for 2-8 hours to obtain an organic silicon epoxy prepolymer B;
step two: weighing the components, adding all the materials except the curing agent and the heat-conducting filler into a mixing tank, adding the heat-conducting filler while stirring, treating for 5-30 minutes by using an ultrasonic processor after the heat-conducting filler is completely added, then adding the curing agent when the materials are cooled to below 40 ℃, keeping the temperature of 30-40 ℃ and stirring for 2-8 hours to obtain the heat-conducting adhesive.
9. Use of the high glass transition temperature thermally conductive paste of any one of claims 1 to 7 in a fiber optic gyroscope.
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