CN111452288A - Preparation method of notebook computer composite board - Google Patents
Preparation method of notebook computer composite board Download PDFInfo
- Publication number
- CN111452288A CN111452288A CN202010212969.0A CN202010212969A CN111452288A CN 111452288 A CN111452288 A CN 111452288A CN 202010212969 A CN202010212969 A CN 202010212969A CN 111452288 A CN111452288 A CN 111452288A
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- China
- Prior art keywords
- hot
- melting
- composite board
- notebook computer
- injection molding
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a preparation method of a notebook computer composite board, which comprises the following steps: (a) forming a plurality of hot melting columns by adopting PC material injection molding; (b) welding a plurality of hot-melting columns on the cut carbon fiber plate; (c) placing the carbon fiber plate welded with the hot-melting columns into a forming mold of an injection molding machine table, and inserting the hot-melting columns into jacks of the forming mold for positioning; (d) starting the injection molding machine to perform buried injection molding; (e) performing CNC machining on the product obtained in the step (d) to remove the hot-melting columns to obtain the embedded part. Through welding a plurality of hot melt posts on the carbon fiber plate in order to fix a position in can inserting the jack of forming die with the hot melt post, avoided the carbon fiber plate to produce position change in injection moulding process to composite board's product quality has been guaranteed effectively.
Description
Technical Field
The invention belongs to the field of injection molding, relates to a preparation method of a composite board, and particularly relates to a preparation method of a notebook computer composite board.
Background
A large number of composite boards are used in notebook computers, and carbon fiber boards containing PC or ABS and other materials are mainly compounded with common plastics (the specific manufacturing process is to fix the carbon fiber boards in a mold for injection molding). The keyboard panel shown in fig. 1 includes a key area 1 ' and a touch area 2 ', where the key area 1 ' includes a frame body 11 ', key holes 12 ' with different shapes that are formed in the frame body 11 ', a speaker hole area 13 ' (heat dissipation hole) that is formed in the frame body 11 ' and is located at two sides of the key hole 12 ', and an extension frame that extends from the frame body 11 ' to the edge of the touch area 2 '; the touch area 2 'is provided with a avoiding hole 21' for placing a touch plate, and the touch area is usually made of a carbon fiber plate with a surface coated with PC. In order to obtain the composite board for the notebook computer, the carbon fiber board needs to be accurately positioned in the manufacturing process so as to prevent the carbon fiber board from being displaced in a mold; therefore, a new preparation method of the notebook computer composite board is adopted or developed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a preparation method of a composite board for a notebook computer.
In order to achieve the purpose, the invention adopts the following technical scheme: a preparation method of a notebook computer composite board comprises the following steps:
(a) forming a plurality of hot melting columns by adopting PC material injection molding;
(b) welding a plurality of hot-melting columns on the cut carbon fiber plate;
(c) placing the carbon fiber plate welded with the hot-melting columns into a forming mold of an injection molding machine table, and inserting the hot-melting columns into jacks of the forming mold for positioning;
(d) starting the injection molding machine to perform buried injection molding;
(e) performing CNC machining on the product obtained in the step (d) to remove the hot-melting columns to obtain the embedded part.
Optimally, it also comprises the following steps:
(f) and drilling the embedded part by using a high-speed drilling machine, and spraying paint to obtain a finished product.
Further, in the step (b), a plurality of hot melting columns are welded on the carbon fiber plate by using an ultrasonic hot melting machine.
Further, in the step (b), the ultrasonic fuse machine includes:
a support assembly including a support base plate;
the material loading assembly comprises a sliding plate movably arranged on the upper surface of the supporting base plate and a hot melting column placing seat fixed on the upper surface of the sliding plate;
the hot melt subassembly, the hot melt subassembly is including supporting the supporting baseplate upper surface just is located install with carrying support piece, the liftable ground of material subassembly one side install mounting bracket on the support piece, fixing supersonic generator in the mounting bracket, install the vibrator of supersonic generator bottom and installing vibrator bottom and with seat matched with ultrasonic bonding tool is placed to the hot melt post.
Further, in the step (f), when the embedded part is drilled, the embedded part is clamped by two epoxy resin sheets.
Furthermore, in the step (f), the thickness of the epoxy resin sheet is 0.8-1 mm.
Due to the adoption of the technical scheme, the invention has the following beneficial effects: according to the preparation method of the notebook computer composite board, the plurality of hot-melting columns are welded on the carbon fiber plate so that the hot-melting columns can be inserted into the insertion holes of the forming die for positioning, so that the carbon fiber plate is prevented from generating position change in the injection molding process, and the product quality of the composite board is effectively guaranteed.
Drawings
FIG. 1 is a schematic structural diagram of a keyboard panel;
FIG. 2 is a view of the internal flow channels of the hot melt column of the present invention being injection molded;
FIG. 3 is a schematic structural view of an ultrasonic hot melt machine according to the present invention;
fig. 4 is a partially enlarged view of fig. 3.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and accurately defined.
The invention relates to a preparation method of a notebook computer composite board, which comprises the following steps:
(a) a plurality of hot melting columns 9 are formed by injecting PC material; in this embodiment, the hot melt column 9 is injection molded by using the schematic diagram of the flow channel structure 80 shown in fig. 2, where the flow channel structure 80 includes two main flow channels 802 surrounded by the upper mold and the lower mold that are matched with each other and located on the same straight line, a glue hole 801 located in the upper mold and the lower mold and having a lower end communicated with the end portions of the two main flow channels 802, and a plurality of branch flow channels 803 communicated with each main flow channel 802; the free end of each branch flow channel 803 is provided with a hot-melting column forming hole communicated with the branch flow channel (the hot-melting column forming holes are positioned in the upper die and the lower die and used for forming the hot-melting columns 9), so that the small hot-melting columns 9 can be manufactured quickly and in batches.
(b) Welding a plurality of hot-melting columns on the cut carbon fiber plate; in this embodiment, adopt ultrasonic wave hot melt machine with a plurality ofly (2 ~ 3 usually can) hot melt post welding on the carbon fiber board, be favorable to improving welded efficiency and quality.
The specific structure of the ultrasonic hot melting machine is shown in fig. 3 and 4, and mainly comprises a support assembly 1, a material loading assembly 2, a hot melting assembly 3 and the like.
The supporting assembly 1 includes a supporting frame 11, a supporting base plate 12, a mounting seat 13, supporting legs 14, universal wheels 15, and the like. The supporting bottom plate 12 is arranged on the top of the supporting frame body 11; a plurality of supporting feet 14 are arranged at the bottom of the supporting frame body 11 (in this embodiment, four supporting feet 14 are arranged at four corners of the supporting frame body 11); there are also a plurality of universal wheels 15, which are mounted on the bottom of the support frame 11 and are disposed adjacent to the support feet 14 (in this embodiment, there are two universal wheels 15, which are located on the bottom of the support frame 11 and close to the side of the user). The support assembly 1 further comprises a mounting seat 13 fixed on the side surface of the support frame body 11 and positioned below the support base plate 12, two start buttons 17 arranged in the mounting seat 13 for starting the ultrasonic generator 39, and an emergency stop button 16 arranged in the mounting seat 13 for closing the ultrasonic generator 39; it should be noted that the ultrasonic generator 39 is activated only when both activation buttons 17 are pressed simultaneously, because the two activation buttons 17, the emergency stop button 16 and the ultrasonic generator 39 (which are part of the fuse assembly 3) are connected in series, so that a circuit is formed after the power is turned on. In this embodiment, the scram button 16 is located between two start buttons 17 to facilitate inertial operation of the employee.
The material loading assembly 2 comprises a sliding plate 24 movably mounted on the upper surface of the supporting base plate 12 and a hot melting column placing seat 28 fixed on the upper surface of the sliding plate 24, and a plurality of material placing holes arranged at intervals are formed in the hot melting column placing seat 28 and used for placing small hot melting columns. The material loading assembly 2 further comprises a base plate 21 (the mounting mode is that fasteners such as conventional bolts are adopted, and the fasteners can be written up and down), two cushion blocks 22 which are arranged on the upper surface of the base plate 12 at intervals, a slide rail 23 (the fixing mode is that fasteners such as conventional bolts are adopted) fixed on the upper surface of each cushion block 22, and a cylinder 26 which is arranged on the upper surface of the base plate 12 and located on one side of the base plate 21, wherein a sliding plate 24 is slidably arranged on the slide rail 23 through a sliding block arranged on the bottom surface of the sliding plate 24, and a connecting block 25 connected with a cylinder shaft of the cylinder 26 is arranged on the bottom surface of the sliding plate 24, so that the sliding plate 24 can be driven to move back and forth on the slide rail 23 by. The loading assembly 2 further comprises a plurality of sets of clamps 27 mounted on the support base 12 for pressing the substrate 21 to further ensure the stability of the substrate 21.
The hot melting assembly 3 comprises a supporting member 32 (usually adopting a supporting column) which is supported on the upper surface of the supporting base plate 12 and is positioned on one side of the loading assembly 2, a mounting frame 33 which is arranged on the supporting member 32 in a lifting way, an ultrasonic generator 39 which is fixed in the mounting frame 33, a vibrator 37 which is arranged at the bottom of the ultrasonic generator 39, and an ultrasonic welding head 38 which is arranged at the bottom of the vibrator 37 and is matched with the hot melting column placing seat 28; when using, put into the hot melt post and place putting the material hole of seat 28 with the hot melt post, will treat that the carbon fiber board of fixed hot melt post is manual to be placed and place seat 28 on the surface at the hot melt post, utilize cylinder 26 to pull slide 24 to hot melt subassembly 3 for hot melt post is placed seat 28 and is located ultrasonic bonding tool 38 under, and the manual regulation ultrasonic bonding tool 38 is in order to push down the carbon fiber board, can utilize the ultrasonic wave to weld the hot melt post on the surface of carbon fiber board.
In this embodiment, the heat fusible component 3 further includes a base 31 installed on the upper surface of the support base 12, and the lower end of the supporting member 32 is inserted into the base 31. The mounting block 33 is movably mounted on the support member 32 by means of a plurality of ferrule units 35 mounted on the side thereof, each ferrule unit 35 comprising two collet halves 351 mounted on the side of the mounting block 33 and clamped on the support member 32 and a handle bolt 352 adjustably mounted on the free ends of the two collet halves 351 (the tightness of the collet halves 351 and the support member 32 can be adjusted by means of the handle bolt 352; it is necessary that the mounting block 33 cannot be over-tightened or the mounting block 33 cannot slide on the support member 32). The hot melting assembly 3 further comprises a rack 34 fixed on the side of the supporting member 32 and a manual adjusting mechanism 36, wherein the manual adjusting mechanism 36 comprises a supporting vertical block 361 connected with any jacket half block 351 and parallel to the rack 34, a connecting shaft 364 with one end inserted into the supporting vertical block 361 and perpendicular to the supporting vertical block, a bevel gear mounted at one end of the connecting shaft 364 and meshed with the rack 34 and a manual wheel 362 mounted at the other end of the connecting shaft 364, so that the relative position of the mounting frame 33 and the supporting member 32 can be adjusted by manually rotating the manual wheel 362; of course, the vibrator 37 may be driven to move up and down by using a conventional structure such as a hydraulic cylinder, an air cylinder, etc. (in this case, the vibrator 37 is mounted on the bottom of the ultrasonic generator 39 by using a conventional structure such as a hydraulic cylinder, an air cylinder, etc.; the aforementioned manual adjustment mechanism 36 may be reserved for fine adjustment of the position of the support member 32). The ultrasonic hot melting machine can also comprise an illuminating lamp 4 arranged above the hot melting assembly 3, and the illuminating lamp plays a role in illumination, so that the operation of a user is facilitated (such as placing a small hot melting column into a material placing hole of the hot melting column placing seat 28, and the like).
(c) Placing the carbon fiber plate welded with the hot-melting columns into a forming mold of an injection molding machine table, and correspondingly inserting a plurality of hot-melting columns (usually 2-3) into jacks (namely limiting holes) of the forming mold for positioning;
(d) starting an injection molding machine to perform the buried injection molding, wherein the injection molding process parameters and the mold can be conventional (but the mold needs to be correspondingly provided with a jack for accommodating a hot-melting column), and the method can be disclosed in the Chinese invention with the application number of 201110022909.3;
(e) performing CNC machining on the product obtained in the step (d) to remove the hot-melting column to obtain an embedded part;
(f) drilling the embedded part by using a high-speed drilling machine to form a horn hole or a heat dissipation hole, and spraying paint to obtain a finished product; when the embedded part is drilled, the embedded part is clamped by the two epoxy resin sheets, so that the phenomenon that burrs are formed on the embedded part by material scraps generated when the embedded part rotates the hole to influence the quality of a product can be avoided; the thickness of the epoxy resin thin plate is preferably 0.8-1 mm, and if the thickness is too thick, the hole rotating efficiency is influenced; if too thin, this will not have the effect of preventing the formation of burrs.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
Claims (6)
1. The preparation method of the notebook computer composite board is characterized by comprising the following steps:
(a) forming a plurality of hot melting columns by adopting PC material injection molding;
(b) welding a plurality of hot-melting columns on the cut carbon fiber plate;
(c) placing the carbon fiber plate welded with the hot-melting columns into a forming mold of an injection molding machine table, and inserting the hot-melting columns into jacks of the forming mold for positioning;
(d) starting the injection molding machine to perform buried injection molding;
(e) performing CNC machining on the product obtained in the step (d) to remove the hot-melting columns to obtain the embedded part.
2. The method for preparing the composite board for the notebook computer according to claim 1, further comprising the steps of:
(f) and drilling the embedded part by using a high-speed drilling machine to form a horn hole or a heat dissipation hole, and spraying paint to obtain a finished product.
3. The method for preparing the notebook computer composite board according to claim 1 or 2, wherein: and (b) welding a plurality of hot melting columns on the carbon fiber plate by using an ultrasonic hot melting machine.
4. The method for preparing a composite board for a notebook computer according to claim 3, wherein in the step (b), the ultrasonic wave heat-melting machine comprises:
a support assembly (1), the support assembly (1) comprising a support floor (12);
the material loading assembly (2) comprises a sliding plate (24) movably mounted on the upper surface of the supporting base plate (12) and a hot melting column placing seat (28) fixed on the upper surface of the sliding plate (24);
hot melt assembly (3), hot melt assembly (3) are including supporting bottom plate (12) upper surface just is located support piece (32), liftable ground of carrying material subassembly (2) one side are installed mounting bracket (33) on support piece (32), fix supersonic generator (39) in mounting bracket (33), install vibrator (37) of supersonic generator (39) bottom and install vibrator (37) bottom and with seat (28) matched with ultrasonic horn (38) are placed to the hot melt post.
5. The preparation method of the notebook computer composite board as claimed in claim 2, wherein the preparation method comprises the following steps: in the step (f), when the embedded part is drilled, the embedded part is clamped by two epoxy resin sheets.
6. The preparation method of the notebook computer composite board as claimed in claim 5, wherein the preparation method comprises the following steps: in the step (f), the thickness of the epoxy resin sheet is 0.8-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010212969.0A CN111452288A (en) | 2020-03-24 | 2020-03-24 | Preparation method of notebook computer composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010212969.0A CN111452288A (en) | 2020-03-24 | 2020-03-24 | Preparation method of notebook computer composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111452288A true CN111452288A (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010212969.0A Pending CN111452288A (en) | 2020-03-24 | 2020-03-24 | Preparation method of notebook computer composite board |
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| CN (1) | CN111452288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112338358A (en) * | 2020-10-29 | 2021-02-09 | 昶宝电子科技(重庆)有限公司 | Laser carving process for magnesium-aluminum panel for notebook computer |
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