CN111447725B - Heat dissipation structure applied to high-precision blind hole circuit board and process thereof - Google Patents
Heat dissipation structure applied to high-precision blind hole circuit board and process thereof Download PDFInfo
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- CN111447725B CN111447725B CN202010219184.6A CN202010219184A CN111447725B CN 111447725 B CN111447725 B CN 111447725B CN 202010219184 A CN202010219184 A CN 202010219184A CN 111447725 B CN111447725 B CN 111447725B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a heat dissipation structure applied to a high-precision blind hole circuit board and a process thereof. The invention has the effects of increasing the heat dissipation capacity of the circuit board and reducing the influence on the position arrangement of the electric elements on the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a heat dissipation structure applied to a high-precision blind hole circuit board and a process thereof.
Background
Along with the development of scientific technology, the electronic process technology is mature day by day, makes the volume of electronic equipment reduce gradually, realizes that the electronic component that electronic equipment needs integrates and installs on the circuit board, in order to reach the purpose that reduces the volume of electronic equipment, the interval between the electronic electrical component of installing on the circuit board is all smaller usually, and electronic electrical component is at the in-process of work, can generate heat usually, if the heat can not in time distribute away, can lead to the circuit board to damage.
Chinese patent publication No. CN209659703U is named as a circuit board with heat abstractor, which comprises a base plate, a heat abstractor, an electrical component, a vertical plate and a spacer, wherein the vertical plate is arranged on the base plate, the electrical component is arranged on the vertical plate, the heat abstractor comprises a main body and a heat sink, the heat sink is arranged at the top of the main body, a plurality of heat sinks are arranged at intervals, the main body is provided with a plurality of accommodating cavities, each accommodating cavity is provided with two vertical plates, the electrical component on the two vertical plates is arranged relatively, the spacer is arranged between the two vertical plates, and the electrical component and the spacer are abutted against each.
The above prior art solutions have the following drawbacks: the riser is adopted to separate the electrical elements on the circuit board in the setting, so that the ventilation effect between the electrical elements is poor, the heat dissipation effect is poor, the riser is arranged on the circuit board, the utilization rate of the side face of the circuit board on which components are placed is reduced, and the circuit board is not beneficial to the setting of an integrated circuit board.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a heat dissipation structure applied to a high-precision blind hole circuit board and a process thereof, which have the effects of increasing the heat dissipation capacity of the circuit board and reducing the influence on the position arrangement of an electric element on the circuit board.
One of the above objects of the present invention is achieved by the following technical solutions:
a heat radiation structure applied to a high-precision blind hole circuit board comprises: the circuit board comprises a circuit board body, a heat dissipation plate arranged on one side of the circuit board body, a heat dissipation extension plate arranged on one side of the heat dissipation plate and located on the outer side of the circuit board body, and heat conduction columns arranged on the circuit board body and corresponding to the positions of high-heating elements, wherein the heat conduction columns are connected with the heat dissipation plate, an angle is formed between the heat dissipation extension plate and the heat dissipation plate, and the heat dissipation extension plate inclines towards one side far away from the circuit board body.
Through adopting above-mentioned technical scheme, the heat conduction post sets up in high-power electrical component's below, is close to the source that generates heat, and the heat conduction post leads the heat to the heating panel for the heat dissipation of circuit board, when the heat dissipation extension board played increase heat radiating area, still played and erect the circuit board, increased circuit board ventilation all around, thereby had the heat-sinking capability that increases the circuit board, reduced the effect to the influence that the electrical component position was put on the circuit board.
The present invention in a preferred example may be further configured to: the circuit board body comprises a first copper foil layer and a second copper foil layer, a first bonding layer is arranged between the first copper foil layer and the second copper foil layer, a second bonding layer is arranged between the second copper foil layer and the heat dissipation plate, and first through holes for the heat conduction columns to penetrate through are formed in corresponding positions of the first copper foil layer and the second copper foil layer.
Through adopting above-mentioned technical scheme, the circuit board body is provided with first copper foil layer, second copper foil layer, has increased the effective wiring area on the circuit board body, and the heat conduction post passes first copper foil layer and second copper foil layer, then can all play radiating effect to first copper foil layer and second copper foil layer.
The present invention in a preferred example may be further configured to: and a heat conduction metal wire is arranged between the first bonding layers, and two ends of the heat conduction metal wire are positioned at the outer sides of the first bonding layers.
Through adopting above-mentioned technical scheme, heat conduction wire plays and reaches the heat of passing to, still plays the effect of conducting partial heat to the air.
The present invention in a preferred example may be further configured to: the side of the heat dissipation extension plate, which is far away from the heat dissipation plate, is provided with supporting legs, the supporting legs are parallel to the heat dissipation plate, and the supporting legs are rotatably provided with connecting bolts.
By adopting the technical scheme, the supporting legs increase the contact area between the radiating extension plate and the supporting surface, and the supporting legs can be connected with a supporting object through the connecting bolts, so that the effect of fixing the circuit board is achieved.
The present invention in a preferred example may be further configured to: the heating panel is provided with a plurality of ventilation holes which penetrate through the heating panel and penetrate through the second bonding layer.
Through adopting above-mentioned technical scheme, set up the ventilation hole on the heating panel, the heat diffusion to the air on the heating panel of being convenient for on the one hand, the heat effluvium on the second copper foil layer of being convenient for on the other hand has the effect that increases the heat-sinking capability of circuit board.
The present invention in a preferred example may be further configured to: the side of first tie coat is provided with the heat conduction crown plate that the ring was located its outside and was the metal material, the side that the heat dissipation extended plate was kept away from to the heat conduction crown plate flushes with first copper foil layer.
By adopting the technical scheme, the high-power electric element is arranged at the position, close to the heat conducting annular plate, on the circuit board, so that the heat on the electric element is conducted to the heat conducting annular plate, and the heat dissipation of the circuit board is accelerated.
The present invention in a preferred example may be further configured to: the heat-conducting annular plate is uniformly provided with a first connecting groove penetrating through the heat-conducting annular plate along the annular side wall of the heat-conducting annular plate, a second connecting groove is formed in the position, corresponding to the first connecting groove, of the heat dissipation extension plate, and a connecting column penetrating through the first connecting groove and the second connecting groove and fixed with the heat-conducting annular plate is arranged on the heat-conducting annular plate.
Through adopting above-mentioned technical scheme, the spliced pole plays and carries out heat-conducting effect on heat conduction ring board and heat dissipation extension piece, and the spliced pole still plays the effect of supporting heat conduction ring board.
The present invention in a preferred example may be further configured to: the two ends of the heat conducting metal wire respectively correspond to the heat dissipation extension plates on the two sides, and the connecting columns and the heat conducting metal wire are arranged in a staggered mode.
By adopting the technical scheme, the heat conducting metal wires and the heat dissipation extension plates are staggered in a # -shaped manner, the effect of improving the structural strength of the circuit board is achieved, and the heat dissipation of the heat conducting metal wires is facilitated by staggering the connecting columns and the heat conducting metal wires.
The present invention in a preferred example may be further configured to: the side of the heat dissipation plate far away from the second bonding layer is provided with a plurality of grooves parallel to the heat dissipation extension plate, the grooves are communicated with the ventilation holes, and supporting plates used for supporting the circuit board are matched in the grooves in an inserted mode.
Through adopting above-mentioned technical scheme, the recess has increased the heat radiating area of heating panel, and the backup pad plays when increasing the heat radiating area of heating panel, and with the cooperation of heat dissipation extension board, plays the effect of supporting circuit board.
The second purpose of the invention is realized by the following technical scheme.
A process for a heat dissipation structure applied to a high-precision blind hole circuit board comprises the following steps:
the method comprises the following steps: manufacturing a first bonding layer between the first copper foil layer and the second copper foil layer for bonding connection, embedding a heat conduction metal wire in the first bonding layer before the first bonding layer is formed, and then connecting the second copper foil layer and the heat dissipation plate through the second bonding layer;
step two: forming first through holes in the first and second copper foil layers at positions corresponding to the first and second adhesive layers, arranging dry films on the side surface of the first copper foil layer and the side surface of the heat dissipation layer, and forming heat conduction columns connected with the heat dissipation plate in the first through holes by using an electroplating method;
step three: after the heat dissipation extension plate is adjusted to a required angle, the heat dissipation extension plate is welded on the side face of the heat dissipation plate, then the heat conduction annular plate is bonded on the side face of the second bonding layer, and the connecting column is connected between the heat conduction annular plate and the heat dissipation extension plate;
step four: the supporting legs are arranged on the heat dissipation extension plate, and then the connecting bolts penetrate through the supporting legs.
Through adopting above-mentioned technical scheme, be convenient for the machine-shaping of circuit board in this application, and make this circuit board have good radiating effect.
In summary, the invention includes at least one of the following beneficial technical effects:
the heat-conducting columns are arranged below the high-power electrical element and are close to the heating source, the heat-conducting columns guide heat to the heat-radiating plate, heat radiation of the circuit board is accelerated, the heat-radiating extension plate plays a role in increasing the heat-radiating area, meanwhile, the heat-radiating extension plate also plays a role in erecting the circuit board and increasing ventilation around the circuit board, and therefore the heat-radiating effect of the circuit board is improved, and the effect of reducing the influence on the position arrangement of the electrical element on the circuit board is achieved;
the outer side of the second bonding layer is annularly provided with the heat conducting ring plate, so that a high-power electric element is arranged at a position, close to the heat conducting ring plate, on the circuit board, heat on the electric element is conducted to the heat conducting ring plate, and heat dissipation of the circuit board is accelerated.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation structure applied to a high-precision blind-hole circuit board according to an embodiment;
fig. 2 is a schematic cross-sectional structure diagram of the present embodiment.
In the figure, 1, a circuit board body; 11. a heat dissipation plate; 12. a heat dissipating extension plate; 13. a heat-conducting column; 14. a first copper foil layer; 15. a second copper foil layer; 16. a first adhesive layer; 17. a second adhesive layer; 18. a first through hole; 19. a heat conductive wire; 2. supporting legs; 21. a connecting bolt; 22. a vent hole; 23. a heat conductive ring plate; 24. connecting columns; 25. a groove; 26. a support plate; 27. a first connecting groove; 28. a second connecting groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, a heat dissipation structure applied to a high-precision blind via circuit board disclosed in this embodiment includes a circuit board body 1, a heat dissipation plate 11, a heat dissipation extension plate 12, and a heat conduction column 13, wherein the heat dissipation plate 11 is disposed on a side surface of the circuit board body 1, and the heat conduction column 13 penetrates through the circuit board body 1 and is connected to the heat dissipation plate 11.
The circuit board body 1 comprises a first copper foil layer 14 and a second copper foil layer 15, the first copper foil layer 14 is bonded with the second copper foil layer 15 through a first bonding layer 16, the second copper foil layer 15 is connected with the heat dissipation plate 11 through a second bonding layer 17, in the actual circuit design, the circuit board body 1 can be provided with a plurality of layers in the combination form of one copper foil layer and one bonding layer, in the embodiment, the first bonding layer 16 and the second bonding layer 17 are both placed between the first copper foil layer 14 and the second copper foil layer 15 by adopting a prepreg, the second copper foil layer 15 is placed between the heat dissipation plate 11, and the circuit board body is formed by pressing.
The heat conducting metal wire 19 is inserted into the first adhesive layer 16, the heat conducting metal wire 19 is arranged along the width direction of the first adhesive layer 16, two ends of the heat conducting metal wire 19 respectively extend out of the outer side of the first adhesive layer 16 and contact with air, and in actual use, a layer of insulating paint is coated on the side wall of the heat conducting metal wire 19, so that the heat conducting metal wire 19 is prevented from influencing the conducting effect of the first copper foil layer 14 and the second copper foil layer 15.
The first through hole 18 is arranged in the corresponding position among the first copper foil layer 14, the second copper foil layer 15, the first bonding layer 16 and the second bonding layer 17 in a penetrating mode, the position of the first through hole 18 corresponds to the position below the position of a high-power heating electric element to be preset on a circuit board, the size of the first through hole 18 is determined according to the size of the electric element, the heat conduction column 13 extends towards the direction of the first copper foil layer 14 at the position, corresponding to the first through hole 18, of the heat dissipation plate 11, the heat conduction column 13 protrudes out of the surface of the first copper foil layer 14, the heat conduction column 13 conducts heat to the heat dissipation plate 11, and then the heat dissipation plate 11 timely radiates the heat.
The heat sink 11 is a rectangular copper plate, and the shape and size of the heat sink 11 are the same as those of the first copper foil layer 14 and the second copper foil layer 15.
Evenly seted up ventilation hole 22 on the heating panel 11, ventilation hole 22 staggers with the position of heat conduction post 13, evenly seted up recess 25 on the face of keeping away from second tie coat 17 at heating panel 11, recess 25 communicates with the ventilation hole 22 that is located above that, increase heating panel 11's heat radiating area, it has backup pad 26 to peg graft in recess 25, backup pad 26 is the metal material, and backup pad 26 perpendicular to heating panel 11, backup pad 26 erects heating panel 11, separate the interval with other parts in the equipment of circuit board installation, in order to ensure heating panel 11's radiating effect.
The two opposite sides of the heat dissipation plate 11 are welded with heat dissipation extension plates 12, the heat dissipation extension plates 12 are arranged on the two sides of the length direction of the heat dissipation plate 11, an included angle smaller than 90 degrees is formed between the heat dissipation extension plates 12 and the side face, far away from the second bonding layer 17, of the heat dissipation plate 11, and when the heat dissipation plate is actually needed, the included angle between the heat dissipation plate 11 and the heat dissipation extension plates 12 can be adjusted according to needs.
In this embodiment, in order to facilitate heating panel 11 and the connection of heat dissipation extension board 12 fixed, heat dissipation extension board 12 has preset the connection steel wire on being close to heating panel 11's the side, the connection steel wire flexible, the constant head tank has been seted up on heating panel 11 keeps away from the side of second tie coat 17, the constant head tank communicates with the side that heating panel 11 is close to heat dissipation extension board 12, make the connection steel wire can insert in the constant head tank, when connecting fixed heating panel 11 and heat dissipation extension board 12, to connect the steel wire and inject in the constant head tank, welded fastening connects steel wire and heating panel 11, then adjust the position of heat dissipation extension board 12, again with the heat dissipation extension board 12 and the heating panel 11 welded fastening who adjusts.
Supporting legs 2 are welded on one side, away from the heat dissipation plate 11, of the heat dissipation extension plate 12, the supporting legs 2 are rectangular plates, after the heat dissipation plate 11 is connected with the heat dissipation extension plate 12, the positions of the supporting legs 2 are adjusted to be parallel to the heat dissipation plate 11, and then the supporting legs 2 are fixed through welding.
Set up the screw hole on supporting legs 2, threaded hole wears to be equipped with connecting bolt 21, in the in-service use, be connected with the casing that sets up the equipment of this circuit board through connecting bolt 21 on the supporting legs 2, make the circuit board keep unsettled state, the space of increase circuit board circulation of air, and for further very high radiating effect, still can correspond the position installation fan between heat dissipation extension plate 12 in the casing of installation this circuit board, the flow of air between heat dissipation extension plate 12 with higher speed, thereby rapid cooling.
There is heat conduction ring board 23 in the side of first tie coat 16 through the bonding of binder, and heat conduction ring board 23 encloses the outside of establishing at first tie coat 16, and heat conduction ring board 23 keeps away from the side of heat dissipation extension board 12 and the side of keeping away from first tie coat 16 with first copper foil layer 14 and flushes, and heat conduction ring board 23 adopts the metal material, in the in-service use, installs high-power electric elements in the position that is close to heat conduction ring board 23 on the circuit board for heat conduction.
Be provided with spliced pole 24 between heat conduction ring board 23 and heat dissipation extension board 12, spliced pole 24 is the metal material, in actual installation, first connecting groove 27 has been seted up to the position that has corresponded on heat conduction ring board 23 and has set up spliced pole 24, first connecting groove 27 runs through heat conduction ring board 23, spliced pole 24 is worn into by first connecting groove 27, second connecting groove 28 has been seted up to the position that is close to spliced pole 24 at heat dissipation extension board 12, spliced pole 24 injects in second connecting groove 28, then weld spliced pole 24 on heat conduction ring board 23, spliced pole 24 plays the connection, support and the effect of heat conduction.
Two ends of the heat conducting metal wire 19 respectively correspond to the heat dissipation extension plates 12 at two sides, so that the heat conducting metal wire 19 and the heat dissipation extension plates 12 have good supporting effect on the circuit board in the transverse direction and the longitudinal direction.
Referring to fig. 1 and 2, the following is a manufacturing process of the above-described circuit board:
the method comprises the following steps: a prepreg is placed between the second copper foil layer 15 and the heat dissipation plate 11 and is compacted so that the prepreg is filled between the second copper foil layer 15 and the heat dissipation plate 11, forming a second adhesive layer 17, then, a dry film is coated on the side of the second copper foil layer 15 away from the heat dissipation plate 11, and a desired circuit wiring is formed by exposure, development, and etching, the remaining dry film is removed, then, a prepreg is placed on one side of the second copper foil layer 15 far away from the heat dissipation plate 11, and the prepreg is uniformly connected with heat conducting metal wires 19 through resin, both ends of the heat conducting metal wires 19 extend out of the outer side of the second copper foil layer 15, then, the first copper foil layer 14 and the second copper foil layer 15 are compacted, so that the prepreg is filled between the first copper foil layer 14 and the second copper foil layer 15 to form a first adhesive layer 16, and the heat conductive wire 19 extending out of the second copper foil layer 15 is cut off.
Step two: the first copper foil layer 14 is covered with a dry film, then the required circuit diagram and the position of a first through hole 18 are printed on the first copper foil layer 14 through film exposure, then the circuit diagram on the first copper foil layer 14 is formed through development and etching, then the first through hole 18 is drilled by a high-frequency machine, the side surface of the heat dissipation plate 11, which is positioned on the outer side of the circuit board, and the first copper foil layer 14 are covered with the dry film, a hole is formed in the position, corresponding to the first through hole 18, of the dry film on the side surface of the first copper foil layer 14, then an insulating glue layer is coated on the side wall of the first through hole 18, and then the heat conduction column 13 is formed through electroplating and hole.
Step three: firstly, drilling a first connecting groove 27 on the heat conducting annular plate 23 through a high-frequency machine, drilling a second connecting groove 28 on the heat radiating extension plate 12, then uniformly forming a groove 25 and a positioning groove on the side surface of the heat radiating plate 11 along the length of the heat radiating plate, welding a connecting steel wire on the heat radiating extension plate 12, then inserting the connecting steel wire into the positioning groove and welding the connecting steel wire on the heat radiating plate 11, adjusting the angle between the heat radiating extension plate 12 and the heat radiating plate 11 so as TO enable the heat radiating extension plate 12 TO form a proper angle, then welding the heat radiating extension plate 12 on the heat radiating plate 11, then bonding the heat conducting annular plate 23 on the side surface of the second bonding layer 17 by using TO-JQ2000 high-temperature resistant blue gel, enabling the side surface of the heat conducting annular plate 23 far away from the heat radiating extension plate 12 TO be flush with the first copper foil layer 14, then inserting the connecting column 24 into the second connecting groove 28 from the first connecting groove 27 so, the connecting posts 24 and the heat conducting ring plate 23 are welded.
Step four: threaded holes are drilled in the supporting legs 2, the supporting legs 2 are welded on the side faces, close to each other, of the heat dissipation extension plates 12, and then connecting bolts 21 are arranged on the threaded holes in a penetrating mode.
The implementation principle of the embodiment is as follows: when the electric element generates a large amount of heat, the heat-conducting columns 13 transfer part of the heat to the heat-radiating plate 11, the heat-conducting annular plate 23 absorbs part of the heat and radiates the heat to the air, and the heat-radiating extension plate 12 supports the circuit board in the air to ventilate the periphery of the circuit board, thereby accelerating the heat radiation of the circuit board.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (6)
1. The utility model provides a be applied to heat radiation structure of high accuracy blind hole circuit board which characterized in that includes: the circuit board comprises a circuit board body (1), a heat dissipation plate (11) arranged on one side of the circuit board body (1), a heat dissipation extension plate (12) arranged on one side of the heat dissipation plate (11) and positioned on the outer side of the circuit board body (1), and a heat conduction column (13) arranged on the circuit board body (1) and corresponding to the position of a high-heat-generation component, wherein the heat conduction column (13) is connected with the heat dissipation plate (11), an angle is formed between the heat dissipation extension plate (12) and the heat dissipation plate (11), the heat dissipation extension plate (12) inclines towards one side far away from the circuit board body (1), the circuit board body (1) comprises a first copper foil layer (14) and a second copper foil layer (15), a first bonding layer (16) is arranged between the first copper foil layer (14) and the second copper foil layer (15), and a second bonding layer (17) is arranged between the second copper foil layer (15), the heat-conducting copper foil is characterized in that corresponding positions on the first copper foil layer (14) and the second copper foil layer (15) are provided with first through holes (18) for the heat-conducting columns (13) to penetrate through, heat-conducting metal wires (19) are arranged between the first bonding layers (16), two ends of each heat-conducting metal wire (19) are located on the outer sides of the first bonding layers (16), heat-conducting annular plates (23) which are made of metal materials and are arranged on the outer sides of the first bonding layers (16) in a surrounding mode are arranged on the side edges of the first bonding layers (16), and the side faces, away from the heat-radiating extension plates (12), of the heat-conducting annular plates (23) are flush with the.
2. The heat dissipation structure applied to the high-precision blind hole circuit board as claimed in claim 1, wherein: one side of the heat dissipation extension plate (12) far away from the heat dissipation plate (11) is provided with supporting legs (2), the supporting legs (2) are parallel to the heat dissipation plate (11), and the supporting legs (2) are rotatably provided with connecting bolts (21).
3. The heat dissipation structure applied to the high-precision blind hole circuit board as claimed in claim 1, wherein: the heat dissipation plate (11) is provided with a plurality of ventilation holes (22) which penetrate through the heat dissipation plate (11) and penetrate through the second bonding layer (17).
4. The heat dissipation structure applied to the high-precision blind hole circuit board as claimed in claim 1, wherein: heat conduction crown plate (23) evenly is provided with first connecting groove (27) that run through it along its annular side wall, the position that heat dissipation extension plate (12) corresponds first connecting groove (27) is provided with second connecting groove (28), be provided with on heat conduction crown plate (23) wear to establish in first connecting groove (27) and second connecting groove (28) and with the spliced pole (24) that heat conduction crown plate (23) are fixed.
5. The heat dissipation structure applied to the high-precision blind hole circuit board as claimed in claim 3, wherein: the side of the heat dissipation plate (11) far away from the second bonding layer (17) is provided with a plurality of grooves (25) parallel to the heat dissipation extension plate (12), the grooves (25) are communicated with the ventilation holes (22), and supporting plates (26) used for supporting a circuit board are inserted and matched in the grooves (25).
6. The process for the heat dissipation structure of the high-precision blind hole circuit board according to any one of claims 1 to 5, comprising the steps of:
the method comprises the following steps: a first bonding layer (16) is manufactured between the first copper foil layer (14) and the second copper foil layer (15) for bonding connection, before the first bonding layer (16) is formed, a heat conducting metal wire (19) is buried in the first bonding layer (16), and then the second copper foil layer (15) and the heat dissipation plate (11) are connected through a second bonding layer (17);
step two: arranging a first through hole (18) in the positions of the first copper foil layer and the second copper foil layer (15) corresponding to the first bonding layer and the second bonding layer (17), arranging dry films on the side surface of the first copper foil layer (14) and the side surface of the heat dissipation layer, and forming a heat conduction column (13) connected with the heat dissipation plate (11) in the first through hole (18) by using an electroplating method;
step three: after the heat dissipation extension plate (12) is adjusted to a required angle, the heat dissipation extension plate is welded on the side face of the heat dissipation plate (11), then the heat conduction ring plate (23) is bonded on the side face of the second bonding layer (17), and the connecting column (24) is connected between the heat conduction ring plate (23) and the heat dissipation extension plate (12);
step four: the supporting legs (2) are arranged on the heat dissipation extension plate (12), and then the connecting bolts (21) are arranged on the supporting legs (2) in a penetrating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010219184.6A CN111447725B (en) | 2020-03-25 | 2020-03-25 | Heat dissipation structure applied to high-precision blind hole circuit board and process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010219184.6A CN111447725B (en) | 2020-03-25 | 2020-03-25 | Heat dissipation structure applied to high-precision blind hole circuit board and process thereof |
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| Publication Number | Publication Date |
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| CN111447725A CN111447725A (en) | 2020-07-24 |
| CN111447725B true CN111447725B (en) | 2021-03-16 |
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| CN112004311B (en) * | 2020-08-26 | 2021-11-02 | 深圳市腾鑫精密电子芯材科技有限公司 | Reliable reinforcing mechanism device for flexible circuit board |
| CN114585212B (en) * | 2020-11-30 | 2024-05-17 | 华为技术有限公司 | Heat dissipating device and electronic equipment |
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| CN111447725A (en) | 2020-07-24 |
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