CN111446305A - Airtight packaging assembly structure of integrated lens - Google Patents
Airtight packaging assembly structure of integrated lens Download PDFInfo
- Publication number
- CN111446305A CN111446305A CN202010324629.7A CN202010324629A CN111446305A CN 111446305 A CN111446305 A CN 111446305A CN 202010324629 A CN202010324629 A CN 202010324629A CN 111446305 A CN111446305 A CN 111446305A
- Authority
- CN
- China
- Prior art keywords
- lens
- diaphragm
- assembly
- chip module
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 238000003466 welding Methods 0.000 claims abstract description 14
- 229920006335 epoxy glue Polymers 0.000 claims abstract description 13
- 239000011261 inert gas Substances 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
Abstract
The invention discloses an air-tight packaging assembly structure of an integrated lens, which comprises an assembly shell, a cover plate, a lens, a primary diaphragm, a secondary diaphragm, an optical filter, a chip module and an electrode plate. Two stages of diaphragms are arranged in the assembly, wherein the two stages of diaphragms are close to the surface of the chip and used for fixing the optical filter. The lens also serves as a component window, is fixed on the cover plate through welding or epoxy glue, and is centered with the chip module by using optical centering equipment. And filling inert gas for protection in the assembly after all the parts are assembled, and completing the gas-tight welding. The component can be applied at room temperature or low temperature, and the lens is used as a component window, so that the requirement of air-tight packaging can be met, and the requirement of high-precision optical registration can also be ensured. Meanwhile, the multistage diaphragm is integrated in the assembly, so that the influence of background radiation and stray light in a chip field of view can be effectively reduced.
Description
Technical Field
The invention relates to a packaging structure of a photoelectric detector, in particular to a component structure for the air-tight packaging of a detector of an integrated optical lens, which is suitable for the packaging of detectors working at low temperature and near room temperature.
Background
The infrared detector is packaged, and the purpose is to realize optical, mechanical, electrical and thermal interfaces of the detector and provide protection for the detector, thereby improving the reliability of the detector. In order to obtain high signal-to-noise ratio, the infrared detector generally works at low temperature, and is respectively packaged in vacuum and protected by inert gas according to the packaging atmosphere, so that the infrared detector can be prevented from being influenced by water vapor condensation when working at low temperature. The two packaging modes have higher requirements on the leakage rate of the assembly, but in comparison, the inert gas protection packaging assembly does not need to integrate a getter, can save the exhaust process time, has low packaging cost, and is very suitable for the application occasions of providing cold energy through a thermoelectric refrigerator or space radiation cooling. In addition, the photoelectric detection system based on aerospace application has strict requirements on the volume, weight and reliability of the infrared detector assembly. The integration of the lens on the near surface of the infrared detector can simplify the optical system, and can greatly reduce the system volume especially when the F # number of the optical system is small. Zeng Zhijiang et al reported a multi-lens deep low temperature infrared detector tube shell structure packaged in a Dewar, application number: 201210431030.9 the package is used as the support member of the lens in the Dewar, the precise mechanical registration of the chip and the lens group is realized by the structural design and the positioning assembly, and the sealing is not needed when the chip and the lens are registered.
Disclosure of Invention
The invention aims to provide an assembly structure and a packaging method for the airtight packaging of an integrated lens, which can realize the function of the lens as a sealed packaging window while ensuring the registration of a chip and the lens. The device is suitable for packaging detectors working at room temperature and is also suitable for application occasions for providing cold energy through thermoelectric refrigerators or space radiation cooling.
An air-tight packaging assembly structure of an integrated lens comprises an assembly shell 1, a cover plate 2, a lens 3, a primary diaphragm 4, a secondary diaphragm 8, an optical filter 7, a chip module 6, an electrode plate 5 and a diaphragm support 9; the method is characterized in that: the chip module 6 and the electrode plate 5 are fixed on the bottom surface of the component shell 1 through epoxy glue, the electrode plate 5 is positioned on two sides of the chip module 6, and an electric signal of the chip module 6 is led out to the electrode plate 5 through gold wire or aluminum wire bonding and is led out to pins of the component shell 1 through gold wire or aluminum wire bonding; the diaphragm support 9 is fixed on the upper surface of the chip module 6 through epoxy glue, the optical filter 7 is integrally fixed on the upper surface of the diaphragm support 9 after being attached to the secondary diaphragm 8, and the primary diaphragm 4 is fixed on the step of the component shell 1 through epoxy glue; the lens 3 is fixed on the cover plate 2 through welding or epoxy glue, before sealing welding, the cover plate 2 of the integrated lens 3 and the chip module 6 are optically registered with high precision, the registration deviation between the center of the lens and the center of the chip is less than 0.05mm, and the registered rear cover plate 2 and the component shell 1 are fixed through spot welding or a clamp; before sealing, the whole assembly is vacuumized and exhausted, then inert gas is refilled, and finally sealing is achieved through laser welding or parallel seam welding.
The component shell 1, the cover plate 2, the primary diaphragm 4 and the secondary diaphragm 8 are made of low-expansion coefficient alloy materials.
And the outer surfaces of the primary diaphragm 4 and the secondary diaphragm 8 are subjected to low-reflectivity blackening treatment.
The airtight packaging assembly structure of the integrated lens has the following three characteristics: firstly, a tube shell packaging form is adopted, optical elements such as an optical filter, a diaphragm and a lens are integrated in the assembly, the integration level is high, and the structure is simple; the structure saves the traditional flat optical window as a sealing window and replaces the traditional flat optical window with a lens, so that the lens can be closer to the surface of the chip, the design flexibility of an optical system is higher, and the transmittance of the system is also favorably improved; thirdly, the assembly can realize air inflation sealing, and can be nitrogen or other inert gases to ensure the low-moisture atmosphere of the chip.
Drawings
FIG. 1 is a schematic cross-sectional view of the assembly.
Fig. 2 is a top view of the completed package.
1 shell, 2 cover plates, 3 lenses, 4 primary diaphragms, 5 electrode plates, 6 chip modules, 7 optical filters, 8 secondary diaphragms and 9 diaphragm supports
The specific implementation mode is as follows:
the invention provides an airtight packaging assembly structure of an integrated lens, as shown in fig. 1, comprising an assembly shell 1, a cover plate 2, a lens 3, a primary diaphragm 4, a secondary diaphragm 8, an optical filter 7, a chip module 6, an electrode plate 5 and a diaphragm support 9. Kovar materials are selected for the component shell 1, the cover plate 2, the primary diaphragm 4 and the secondary diaphragm 8, the bottom surface of the component shell 1 is provided with sintered glass bead lead pins, and the outer surfaces of the primary diaphragm 4 and the secondary diaphragm 8 are blackened by black nickel. The chip module 6 and the electrode plate 5 are fixed on the bottom surface of the assembly shell 1 through epoxy glue, and the electrode plate 5 is positioned on two sides of the chip module 6; the electric signal of the chip module 6 is led out to the electrode plate 5 through gold wire ball bonding and is led out to pins of the component shell 1 through gold wire ball bonding; the diaphragm support 9 is fixed on the upper surface of the chip module 6 through epoxy glue, the optical filter 7 and the secondary diaphragm 8 are adhered through the epoxy glue and then integrally fixed on the upper surface of the diaphragm support 9, and the centering deviation between the optical filter and the chip module 1 is better than 0.05 mm; the primary diaphragm 4 is fixed on the step of the component shell 1 through epoxy glue; the lens 3 is fixed on the cover plate 2 through eutectic welding, the centering of the chip module 1 and the lens 3 is realized on a center deviation instrument, and the middle deviation is better than 0.02 mm; the registration back cover plate 2 and the module case 1 are fixed by spot welding. And (3) repeatedly vacuumizing and filling nitrogen into the assembly in parallel sealing and welding equipment, wherein the repetition times are 3 times, and finally, the cover plate 2 and the assembly shell 1 are fixed by parallel sealing and welding. The top view after the encapsulation is as shown in fig. 2.
Claims (3)
1. An airtight packaging assembly structure of an integrated lens comprises an assembly shell (1), a cover plate (2), a lens (3), a primary diaphragm (4), a secondary diaphragm (8), an optical filter (7), a chip module (6), an electrode plate (5) and a diaphragm support (9); the method is characterized in that:
the chip module (6) and the electrode plate (5) are fixed on the bottom surface of the component shell (1) through epoxy glue, the electrode plate (5) is positioned on two sides of the chip module (6), an electric signal of the chip module (6) is led out to the electrode plate (5) through gold wire or aluminum wire bonding, and then is led out to a pin of the component shell (1) through the gold wire or aluminum wire bonding; the diaphragm support (9) is fixed on the upper surface of the chip module (6) through epoxy glue, the optical filter (7) is attached to the secondary diaphragm (8) and then integrally fixed on the upper surface of the diaphragm support (9), and the primary diaphragm (4) is fixed on a step of the assembly shell (1) through epoxy glue; the lens (3) is fixed on the cover plate (2) through welding or epoxy glue, the registration deviation between the center of the lens (3) and the center of the chip is less than 0.05mm, the cover plate (2) and the assembly shell (1) are sealed through laser welding or parallel seam welding, and inert gas is filled in the whole assembly.
2. The lens-integrated, hermetic package assembly structure of claim 1, wherein: the component shell (1), the cover plate (2), the primary diaphragm (4) and the secondary diaphragm (8) are all made of low-expansion-coefficient alloy materials.
3. The lens-integrated, hermetic package assembly structure of claim 1, wherein: and the outer surfaces of the primary diaphragm (4) and the secondary diaphragm (8) are subjected to low-reflectivity blackening treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324629.7A CN111446305A (en) | 2020-04-23 | 2020-04-23 | Airtight packaging assembly structure of integrated lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324629.7A CN111446305A (en) | 2020-04-23 | 2020-04-23 | Airtight packaging assembly structure of integrated lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111446305A true CN111446305A (en) | 2020-07-24 |
Family
ID=71653535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010324629.7A Pending CN111446305A (en) | 2020-04-23 | 2020-04-23 | Airtight packaging assembly structure of integrated lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111446305A (en) |
-
2020
- 2020-04-23 CN CN202010324629.7A patent/CN111446305A/en active Pending
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