CN111439466A - Dustproof computer integrated chip storage device - Google Patents

Dustproof computer integrated chip storage device Download PDF

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Publication number
CN111439466A
CN111439466A CN202010233220.4A CN202010233220A CN111439466A CN 111439466 A CN111439466 A CN 111439466A CN 202010233220 A CN202010233220 A CN 202010233220A CN 111439466 A CN111439466 A CN 111439466A
Authority
CN
China
Prior art keywords
mounting
integrated chip
supporting
storage device
computer integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202010233220.4A
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Chinese (zh)
Inventor
李利萍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Economic And Trade Vocational College
Original Assignee
Shandong Economic And Trade Vocational College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Economic And Trade Vocational College filed Critical Shandong Economic And Trade Vocational College
Priority to CN202010233220.4A priority Critical patent/CN111439466A/en
Publication of CN111439466A publication Critical patent/CN111439466A/en
Withdrawn legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • B65D25/10Devices to locate articles in containers
    • B65D25/101Springs, elastic lips, or other resilient elements to locate the articles by pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20External fittings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the field of computer equipment, in particular to a dustproof computer integrated chip storage device which comprises a horizontally arranged supporting and mounting plate, wherein a supporting and mounting cylinder is vertically arranged at the upper end of the supporting and mounting plate, a flow guide mounting cylinder is vertically arranged at the middle position of the supporting and mounting cylinder, a plurality of L-type fixed mounting plates are arranged at the edge of the upper end of the supporting and mounting cylinder at equal angles, two fixed mounting holes are respectively arranged on the L-type fixed mounting plate, a plurality of U-type mounting cylinders are arranged at the lower end of the supporting and mounting plate at equal intervals, snake-shaped flow guide heat exchange tubes are embedded in the two sides of each U-type mounting cylinder, and a working area is completely sealed, so that no air communication exists in the operation space of a computer integrated chip, the possibility of internal ash entering is avoided, in order to ensure the stable operation of the device, the heat dissipation efficiency and the quality of the device are obviously improved through circulating liquid cooling and uniform flow guide heat.

Description

Dustproof computer integrated chip storage device
Technical Field
The invention relates to the field of computer equipment, in particular to a dustproof computer integrated chip storage device.
Background
Computer chip is the important component of computer, there are different chips on mainboard, hard disk, display card, etc., these chips cooperate each other, make the computer function normal operating, the computer chip has included resistance, electric capacity and other small components of millions, the chip storage device on the market is placed in a comparatively sealed device in use, use the internal clearance that probably appears in long-time use, aqueous vapor enters from the clearance, corrode the computer integrated chip, accelerate the aging of computer integrated chip, the fine thermal-insulated protect function of storage device underwear simultaneously, cause the computer integrated chip to appear damaging, for this reason, we propose a dustproof computer integrated chip storage device.
Chinese patent publication No. CN208007541U discloses a dustproof storage device for a computer ic, which can solve the above problems to some extent, but has drawbacks in terms of design of a dustproof structure, stable operation on the premise of dust prevention, and maintainability.
Disclosure of Invention
The present invention is directed to a dustproof computer integrated chip storage device to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a can dirt-proof computer integrated chip storage device, the support mounting panel that sets up including the level, the vertical support installation section of thick bamboo that is provided with in upper end of support mounting panel, the vertical water conservancy diversion installation section of thick bamboo that is provided with in intermediate position of support installation section of thick bamboo, the upper end edge of support installation section of thick bamboo is provided with a plurality of L type fixed mounting boards with angle such as, all be provided with two fixed mounting holes on the L type fixed mounting panel, the lower extreme of support mounting panel is equidistant to be provided with a plurality of U type installation section of thick bamboo, the inside embedding in both sides of U type installation section of thick bamboo is provided with snakelike water conservancy diversion heat exchanger tube, the bottom of U type installation section of thick bamboo is provided with the connecting pipe, the connecting pipe both ends respectively with the snakelike water conservancy diversion heat exchanger tube intercommunication of water conservancy diversion of both sides, two snakelike water conservancy diversion heat exchanger tube upper ends that are close to on two adjacent U type installation sections of thick bamboo are through the draft chamber intercommunication, the draft chamber all stretches into the support mounting panel, two snakelike water conservancy diversion heat exchanger tubes of water conservancy diversion that left and right side all upwards are provided with annular liquid storage section of thick bamboo, the lower half outside of water conservancy diversion installation section of flow cylinder is provided with annular liquid storage section of flow storage section of thick bamboo that the cooperation support that the cooperation of flow pump delivery pump is provided with the installation section of thick bamboo, the installation section of flow cylinder that the installation.
As a further scheme of the invention: the upper end of the U-shaped installation barrel is provided with a guide installation sleeve, telescopic current-conducting plates are symmetrically arranged in the guide installation sleeve, and the telescopic current-conducting plates are fixed on the inner side of the guide installation sleeve through telescopic springs.
As a further scheme of the invention: the lower extreme army level of U type installation section of thick bamboo is provided with the lift mounting panel, and the upper end of lift mounting panel also is provided with the direction installation cover, and the equal vertical reset spring that is provided with of lower extreme of lift mounting panel, reset spring's lower extreme is all fixed in the bottom of U type installation section of thick bamboo.
As a further scheme of the invention: the inside intermediate position of pump sending draft tube is provided with the pump sending motor, and the pump sending motor is fixed in the pump sending draft tube through the water conservancy diversion mounting bracket that the outside set up, and the both ends of pump sending motor all are provided with the pump sending impeller through the pivot.
As a further scheme of the invention: the outer side of the driving motor is provided with a plurality of flow guide mounting columns at equal angles, and the outer ends of the flow guide mounting columns are fixed on the inner side of the flow guide mounting cylinder.
As a further scheme of the invention: the upper end of the driving motor is provided with a plurality of air draft impellers through a rotating shaft, and the upper end of the flow guide mounting cylinder is provided with a spherical filter screen.
As a still further scheme of the invention: the upper end of the dustproof mounting cover is provided with a plurality of fixing studs at equal angles, the edges of the supporting mounting plate are matched with the fixing studs and are provided with fixing screw holes, and the outer ends of the fixing studs are provided with inner hexagonal turntables.
Compared with the prior art, the invention has the beneficial effects that: the working area is completely closed, no air is communicated in the running space of the computer integrated chip, the possibility of internal dust entering is avoided, the heat dissipation efficiency and the quality of the device are remarkably improved through circulating liquid cooling and uniform flow guide heat dissipation in order to guarantee the stable running of the device, and the computer integrated chip is convenient to install and disassemble and good in maintainability.
Drawings
Fig. 1 is a schematic structural diagram of a dustproof computer ic storage device.
Fig. 2 is an enlarged schematic view of a portion a of fig. 1.
Fig. 3 is a perspective view of a guide mounting sleeve in a dustproof computer ic storage device.
The device comprises a 1-dustproof mounting cover, a 2-U-shaped mounting barrel, a 3-reset spring, a 4-guide mounting sleeve, a 5-connecting pipe, a 6-lifting mounting plate, a 7-support mounting plate, an 8-ventilation guide pipe, a 9-annular liquid storage barrel, a 10-guide mounting barrel, a 11-driving motor, a 12-air draft impeller, a 13-spherical filter screen, a 14-support mounting barrel, a 15-L-type fixed mounting plate, a 16-fixed mounting hole, a 17-guide mounting column, an 18-fixed screw hole, a 19-S-shaped guide hole, a 20-conical filter screen, a 21-guide mounting frame, a 22-pumping motor, a 23-pumping impeller, a 24-return pipe, a 25-pumping guide barrel, a 26-guide cavity, a 27-serpentine guide heat exchange pipe, a 28-telescopic conductive plate, a 29-telescopic spring, a 30-inner hexagonal rotary table and a 31-fixed stud.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Example one
Referring to fig. 1 to 3, in the embodiment of the present invention, a dustproof computer integrated chip storage device includes a horizontally disposed support mounting plate 7, a support mounting cylinder 14 is vertically disposed at an upper end of the support mounting plate 7, a guide mounting cylinder 10 is vertically disposed at a middle position of the support mounting cylinder 14, a plurality of L-type fixed mounting plates 15 are disposed at an upper end edge of the support mounting cylinder 14 at an equal angle, two fixed mounting holes 16 are disposed on a L-type fixed mounting plate 15, a plurality of U-type mounting cylinders 2 are disposed at an equal interval at a lower end of the support mounting plate 7, a guide mounting sleeve 4 is disposed at an upper end of the U-type mounting cylinder 2, telescopic current-conducting plates 28 are symmetrically disposed inside the guide mounting sleeve 4, the telescopic current-conducting plates 28 are fixed inside the guide mounting sleeve 4 through telescopic springs 29, a lifting mounting plate 6 is horizontally disposed at a lower end of the U-type mounting cylinder 2, a guide mounting sleeve 4 is also disposed at an upper end of the lifting mounting plate 6, a lower end of the lifting mounting plate 6 is vertically disposed at a lower end of the lifting mounting plate 6, a return spring 3 is disposed at a lower end of the lifting mounting plate 6, a return spring 3 is fixed at a lower end of the lifting mounting plate 3, a return pipe 2 is fixed at a lower end of the return pipe 2, a horizontal mounting plate 2, a lower end of a horizontal mounting plate 2, a horizontal mounting plate 7 is disposed at a horizontal mounting plate 7, a horizontal mounting plate 20, a horizontal mounting plate 7 is disposed at a horizontal mounting plate 7, a horizontal mounting plate 20 is disposed at a horizontal mounting plate.
The computer integrated chip is fixed in the U-shaped mounting barrel 2 and is matched with the guide mounting sleeve 4 and the reset spring 3, so that the computer integrated chip can be stably mounted, the computer integrated chip can always keep power supply through the telescopic spring 29 and the telescopic current conducting plate 28 and is convenient for data transmission, after the computer integrated chip is mounted, the dustproof mounting cover 1 is matched with the supporting mounting plate 7 to be fixed, at the moment, the pumping motor 22 is started to enable the pumping impeller 23 to rotate at a high speed, the snakelike flow guide heat exchange pipe 27 and the circulating flow guide in each U-shaped mounting barrel 2 are enabled to lead out the heat inside efficiently, at the same time, the driving motor 11 realizes the high-speed rotation of the air draft impeller 12, so that the air is guided outwards, at the moment, the external air enters the supporting mounting barrel 14 through the S-shaped flow guide holes 19 and then enters the flow guide mounting barrel 10 through the ventilation flow guide pipe 8 to realize the heat, and then the ventilation guide pipe 8 is discharged along with the highly guided air, so that efficient heat dissipation is completed, the inside of the equipment does not need to be perforated for heat dissipation, dust is prevented from entering the equipment by self-heating, and the stable operation of computer integrated chip storage is ensured.
Example two
On the basis of the first embodiment, the fixing stud 31 is installed quickly by rotating the inner hexagonal turntable 30, and the conical filter screen 20 and the spherical filter screen 13 are combined to reduce dust in the internal heat dissipation part of the device, so that the device has the capability of long-time stable operation.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (7)

1. The utility model provides a can dirt-proof computer integrated chip storage device, support mounting panel (7) including the level setting, the upper end of support mounting panel (7) is vertical to be provided with supports installation section of thick bamboo (14), the intermediate position of supporting installation section of thick bamboo (14) is vertical to be provided with water conservancy diversion installation section of thick bamboo (10), the upper end edge of supporting installation section of thick bamboo (14) is equiangularly provided with a plurality of L type fixed mounting panel (15), all be provided with two fixed mounting hole (16) on L type fixed mounting panel (15), a serial communication port, the lower extreme of supporting mounting panel (7) is equidistant to be provided with a plurality of U type installation section of thick bamboo (2), the inside embedding in both sides of U type installation section of thick bamboo (2) is provided with snakelike water conservancy diversion heat exchanger tube (27), the bottom of U type installation section of thick bamboo (2) is provided with connecting pipe (5), connecting pipe (5) both ends communicate with snakelike water conservancy diversion heat exchanger tube (27) of snakelike water conservancy diversion respectively with the snakelike water conservancy diversion heat exchanger tube (27) of both sides, two snakelike water conservancy diversion heat exchanger tube (27) upper ends of snakelike water conservancy diversion heat exchanger tube (27) near two adjacent U type installation section of water conservancy diversion installation section of flow guide, the equal heat exchanger tube (27) of water conservancy diversion are provided with the equal embedding of water storage section of thick bamboo (9) of flow guide tube (9) of vertical to pass through flow guide tube (9) and all be provided with the equal angle of water storage tube (9) of the equal supporting installation of the equal angle of the equal of water storage section of water storage tube (10) of the equal angle of the equal of water storage tube (10) of the equal angle of the equal of the lower.
2. The dustproof computer integrated chip storage device according to claim 1, wherein the upper ends of the U-shaped mounting cylinders (2) are respectively provided with a guide mounting sleeve (4), the interior of each guide mounting sleeve (4) is symmetrically provided with telescopic conductive plates (28), and the telescopic conductive plates (28) are fixed on the inner side of each guide mounting sleeve (4) through telescopic springs (29).
3. The dustproof computer integrated chip storage device according to claim 1 or 2, wherein the lower end of the U-shaped mounting cylinder (2) is horizontally provided with a lifting mounting plate (6), the upper end of the lifting mounting plate (6) is also provided with a guide mounting sleeve (4), the lower ends of the lifting mounting plate (6) are vertically provided with return springs (3), and the lower ends of the return springs (3) are fixed at the bottom of the U-shaped mounting cylinder (2).
4. The dustproof computer integrated chip storage device according to claim 1, wherein a pumping motor (22) is arranged in the middle of the inside of the pumping guide cylinder (25), the pumping motor (22) is fixed in the pumping guide cylinder (25) through a guide mounting frame (21) arranged on the outer side, and two ends of the pumping motor (22) are provided with pumping impellers (23) through rotating shafts.
5. The dustproof computer integrated chip storage device according to claim 1, wherein a plurality of flow guide mounting columns (17) are arranged on the outer side of the driving motor (11) at equal angles, and the outer ends of the flow guide mounting columns (17) are fixed on the inner side of the flow guide mounting cylinder (10).
6. The dustproof computer integrated chip storage device according to claim 5, wherein the upper end of the driving motor (11) is provided with a plurality of air draft impellers (12) through a rotating shaft, and the upper end of the guide flow installation cylinder (10) is provided with a spherical filter screen (13).
7. The dustproof computer integrated chip storage device according to claim 1, wherein the upper end of the dustproof mounting cover (1) is provided with a plurality of fixing studs (31) at equal angles, the edge of the supporting mounting plate (7) is provided with fixing screw holes (18) in cooperation with the fixing studs (31), and the outer ends of the fixing studs (31) are provided with inner hexagonal turntables (30).
CN202010233220.4A 2020-03-29 2020-03-29 Dustproof computer integrated chip storage device Withdrawn CN111439466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010233220.4A CN111439466A (en) 2020-03-29 2020-03-29 Dustproof computer integrated chip storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010233220.4A CN111439466A (en) 2020-03-29 2020-03-29 Dustproof computer integrated chip storage device

Publications (1)

Publication Number Publication Date
CN111439466A true CN111439466A (en) 2020-07-24

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Application Number Title Priority Date Filing Date
CN202010233220.4A Withdrawn CN111439466A (en) 2020-03-29 2020-03-29 Dustproof computer integrated chip storage device

Country Status (1)

Country Link
CN (1) CN111439466A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111949079A (en) * 2020-08-07 2020-11-17 河南工业贸易职业学院 Case dust removal collection device for computer
CN112306170A (en) * 2020-10-12 2021-02-02 企策(宁波)科技服务有限公司 Auxiliary device for exciting continuous high-speed operation of computer hardware
CN115158832A (en) * 2022-07-22 2022-10-11 广州祈阳科技有限公司 Heat dissipation storage device for semiconductor chip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111949079A (en) * 2020-08-07 2020-11-17 河南工业贸易职业学院 Case dust removal collection device for computer
CN112306170A (en) * 2020-10-12 2021-02-02 企策(宁波)科技服务有限公司 Auxiliary device for exciting continuous high-speed operation of computer hardware
CN115158832A (en) * 2022-07-22 2022-10-11 广州祈阳科技有限公司 Heat dissipation storage device for semiconductor chip
CN115158832B (en) * 2022-07-22 2023-10-10 深圳市飞龙兆富科技有限公司 Heat dissipation storage device for semiconductor chip

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Application publication date: 20200724