CN111438937A - 3D printing forming method of PEEK material - Google Patents

3D printing forming method of PEEK material Download PDF

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Publication number
CN111438937A
CN111438937A CN202010345419.6A CN202010345419A CN111438937A CN 111438937 A CN111438937 A CN 111438937A CN 202010345419 A CN202010345419 A CN 202010345419A CN 111438937 A CN111438937 A CN 111438937A
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China
Prior art keywords
peek
slurry
forming
printing
feeding
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Pending
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CN202010345419.6A
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Chinese (zh)
Inventor
周利锋
李喜露
李娜娜
周江保
李昕
李春新
张思伟
韦佳成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Chengyi Technology Co ltd
Shenzhen Collaborative Innovation High Tech Development Co ltd
Shenzhen Guangyunda Additive Manufacturing Research Institute
Original Assignee
Shenzhen Chengyi Technology Co ltd
Shenzhen Collaborative Innovation High Tech Development Co ltd
Shenzhen Guangyunda Additive Manufacturing Research Institute
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Application filed by Shenzhen Chengyi Technology Co ltd, Shenzhen Collaborative Innovation High Tech Development Co ltd, Shenzhen Guangyunda Additive Manufacturing Research Institute filed Critical Shenzhen Chengyi Technology Co ltd
Priority to CN202010345419.6A priority Critical patent/CN111438937A/en
Publication of CN111438937A publication Critical patent/CN111438937A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/379Handling of additively manufactured objects, e.g. using robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/02Moulding by agglomerating
    • B29C67/04Sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Robotics (AREA)

Abstract

The invention relates to the technical field of 3D printing, and particularly discloses a 3D printing forming method of a PEEK material, which comprises the following steps: s1, grinding the PEEK material into powder, sieving the powder, and mixing the powder with photosensitive resin to prepare PEEK slurry; s2, loading the PEEK slurry into a feeding mechanism, and filling, paving and feeding the PEEK slurry into the feeding mechanism; s3, enabling the PEEK slurry in the feeding mechanism to rise by a unit height, enabling the molding surface of the molding mechanism to fall by a unit height, and enabling the PEEK slurry on the feeding mechanism to be scraped and paved on the molding mechanism by the scraper mechanism; s4, the optical-mechanical mechanism receives the vector slice picture command and solidifies the PEEK slurry on the forming mechanism; s5, repeating the operation steps S3 and S4 until the model printing is completed; the invention adopts the exposure mode of the photocuring surface for forming, has short single-layer forming time and improves the forming speed by 10 to 100 times; can use general medical grade PEEK powder, very big reduction the processing cost.

Description

3D printing forming method of PEEK material
Technical Field
The invention relates to the technical field of 3D printing, in particular to a 3D printing forming method of a PEEK material.
Background
At present, the 3D printing technology related to PEEK materials mostly adopts the principle of extrusion Fused Deposition (FDM), the PEEK wire materials are extruded layer by a spray head and stacked to form after being fused with the assistance of a computer, or the PEEK wire materials are formed in a laser selection sintering (S L S) mode, PEEK powder materials are used for powder paving, and then laser sintering forming is carried out under the specific atmosphere and temperature environment.
In practical application, the existing 3D printing technology of the PEEK material is found to have the problems that the efficiency is low, an extrusion head needs to reciprocate along a single-layer molding surface to completely coat the outline of the whole layer of molding surface, and the manufacturing of a sample piece by an extrusion printer needs tens of hours to complete, the precision is low, the extrusion head is limited by the precision of the extrusion printer and cannot normally work if the extrusion head is too small, the PEEK material sample molded by adopting the FDM technology has poor consistency, the bonding process is stacked again after solidification exists among different layers, the heat of a melting layer is not enough to melt the previous layer, the bonding force among different layers is smaller, the bonding force is smaller than that among the same layer of material, the properties of the sample in all directions are not uniform, the raw material preparation requirement is high, the molding mode of the S L S technology needs to select specially-made PEEK powder, and otherwise, the normal powder laying and sintering processes cannot be completed.
Disclosure of Invention
Aiming at the technical problem, the invention provides a 3D printing forming method of PEEK material, which adopts a photocuring surface exposure mode for forming, has short single-layer forming time and improves the forming speed by 10-100 times; can use general medical grade PEEK powder, very big reduction the processing cost.
In order to solve the technical problems, the invention provides the following specific scheme:
A3D printing forming method of a PEEK material is applied to 3D printing equipment, wherein the 3D printing equipment comprises a feeding mechanism, a scraper mechanism, a forming mechanism and an optical mechanical mechanism;
the scraper mechanism and the forming mechanism are respectively arranged at two opposite sides of the feeding mechanism, and the optical-mechanical mechanism is arranged at the upper end of the forming mechanism;
the 3D printing forming method comprises the following steps:
s1, grinding the PEEK material into powder, sieving the powder, and mixing the powder with photosensitive resin to prepare PEEK slurry;
s2, loading the PEEK slurry into a feeding mechanism, and filling, paving and feeding the PEEK slurry into the feeding mechanism;
s3, enabling the PEEK slurry in the feeding mechanism to rise by a unit height, enabling the molding surface of the molding mechanism to fall by a unit height, and enabling the PEEK slurry on the feeding mechanism to be scraped and paved on the molding mechanism by the scraper mechanism;
s4, the optical-mechanical mechanism receives the vector slice picture command and solidifies the PEEK slurry on the forming mechanism;
s5, repeating the operation steps S3 and S4 until the model printing is completed.
Optionally, the 3D printing and forming method further includes the following steps:
s6, taking the printed model out of the 3D printing equipment, and cleaning the model by using alcohol;
s7, putting the cleaned model into a firing furnace for firing;
and S8, after the firing is finished, naturally cooling the model.
The mould is placed in a firing furnace for twice firing, the temperature gradient of twice firing is controlled, the glue discharging amount of the mould and the strength of the mould are ensured, compared with the prior art that the PEEK material fused deposition technology is adopted, the mould post-processing link is added, and the strength of the mould is improved; meanwhile, the operating method of binder removal and sintering at the same time is adopted, the condition that the interlayer binding force is inconsistent due to layered bonding of the FDM technology is avoided, and the product reliability is improved.
Optionally, the step S7 specifically includes the following steps:
s71, the initial firing temperature is 150-200 ℃, and the firing time is 15-45 minutes;
s72, adjusting the firing temperature to 300-400 ℃ and the firing time to 10-15 minutes.
According to the difference of the solid content of the PEEK slurry in the initial proportion, the initial firing time is controlled to be 15-45 minutes, so that the purpose is to discharge glue; after the binder removal, the firing temperature is adjusted upward in order to improve the strength of the mold.
Optionally, the ratio of the PEEK material to the photosensitive resin is 1: 1-1:3.
Optionally, the feeding mechanism includes a feeding cavity and a first driving module disposed at the bottom of the feeding cavity;
the forming mechanism comprises a forming cavity, a forming plate is arranged in the forming cavity, and the forming plate is connected with a second driving module.
The first driving module rises by a unit height to enable PEEK slurry in the feeding cavity to protrude out of the cavity opening of the feeding cavity, and the second driving module drives the forming plate to descend by a unit height to realize that the scraper mechanism scrapes the PEEK slurry on the feeding mechanism and paves the PEEK slurry on the forming plate.
Optionally, the step S3 specifically includes:
the first driving module rises by a unit height to enable PEEK slurry in the feeding cavity to protrude out of the cavity opening of the feeding cavity, the second driving module drives the forming plate to descend by a unit height, and the scraper mechanism scrapes the PEEK slurry on the feeding mechanism and paves the PEEK slurry on the forming plate.
Optionally, the step S4 specifically includes:
and the optical mechanical mechanism receives the vector slice picture command, and projects the vector slice picture on the molding surface of the molding plate to solidify the PEEK slurry in the projection area.
Optionally, the optical mechanical device includes a digital micromirror DMD chip.
The digital micromirror DMD chip is used as an imaging chip, the forming precision is determined by the digital micromirror DMD, the DMD micromirror is 10um in size, and the precision is improved by 10-30 times.
Compared with the prior art, the invention has the beneficial effects that the invention adopts the photocuring surface exposure mode for molding, has short single-layer molding time, improves the molding speed by 10-100 times compared with the traditional extrusion molding mode, can use the universal medical grade PEEK powder, has the cost far lower than that of the powder specially customized for S L S, and greatly reduces the processing cost.
Drawings
Fig. 1 is a schematic overall structure diagram of a 3D printing apparatus in an initial printing state provided in an embodiment of the present invention.
Fig. 2 is a schematic diagram of an overall structure of a 3D printing apparatus in a printing completed state according to an embodiment of the present invention.
Fig. 3 is a flowchart of a 3D printing and molding method for PEEK materials according to an embodiment of the present invention.
Wherein 1 is 3D printing equipment; 2 is a feeding mechanism; 3 is a scraper mechanism; 4, a forming mechanism; 5 is an optical-mechanical mechanism; 6 is PEEK slurry.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiment of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
For example, a 3D printing forming method for PEEK materials is applied to 3D printing equipment, where the 3D printing equipment includes a feeding mechanism, a scraper mechanism, a forming mechanism, and an optical mechanical mechanism; the scraper mechanism and the forming mechanism are respectively arranged at two opposite sides of the feeding mechanism, and the optical-mechanical mechanism is arranged at the upper end of the forming mechanism; the 3D printing forming method comprises the following steps: s1, grinding the PEEK material into powder, sieving the powder, and mixing the powder with photosensitive resin to prepare PEEK slurry; s2, loading the PEEK slurry into a feeding mechanism, and filling, paving and feeding the PEEK slurry into the feeding mechanism; s3, enabling the PEEK slurry in the feeding mechanism to rise by a unit height, enabling the molding surface of the molding mechanism to fall by a unit height, and enabling the PEEK slurry on the feeding mechanism to be scraped and paved on the molding mechanism by the scraper mechanism; s4, the optical-mechanical mechanism receives the vector slice picture command and solidifies the PEEK slurry on the forming mechanism; s5, repeating the operation steps S3 and S4 until the model printing is completed.
According to the 3D printing forming method of the PEEK material, the light-cured surface exposure mode is adopted for forming, the single-layer forming time is short, compared with the traditional extrusion forming mode, the forming speed is improved by 10-100 times, the universal medical PEEK powder can be used, the cost is far lower than that of powder specially customized for S L S, and the processing cost is greatly reduced.
Referring to fig. 1 to 3, fig. 1 and 2 are schematic diagrams illustrating an overall structure of a 3D printing apparatus; fig. 3 shows a flow chart of a 3D printing molding method of PEEK material.
As shown in fig. 1 and 2, a 3D printing apparatus includes a feeding mechanism, a scraper mechanism, a forming mechanism, and an optical mechanical mechanism.
Wherein, feed mechanism is used for splendid attire and provides the PEEK thick liquids, and in initial work, is full of the PEEK thick liquids in the feed mechanism to the PEEK thick liquids can not spill or spill over, and at the printing in-process, feed mechanism receives preset program control, provides quantitative PEEK thick liquids in proper order.
This scraper mechanism for on scraping the PEEK thick liquids on the feeding mechanism and paving the forming mechanism, realize single face exposure and print, print the time and shorten to several hours by original tens of hours, improve printing efficiency by a wide margin.
This forming mechanism for the paving of PEEK thick liquids, the ray apparatus mechanism of being convenient for solidifies the PEEK thick liquids, accomplishes the printing of model.
In this example, the relative both sides of feed mechanism are located respectively to scraper mechanism and forming mechanism, and forming mechanism's upper end is located to ray apparatus mechanism, and can understand, scraper mechanism is located feed mechanism's left side, and forming mechanism is located feed mechanism's right side, and when printing, scraper mechanism moves from left to right, realizes scraping the PEEK thick liquids on the feed mechanism and paves to forming mechanism on, and ray apparatus mechanism locates the forming mechanism upper end, solidifies the PEEK thick liquids on the forming mechanism.
As shown in fig. 3, a 3D printing and molding method of PEEK material includes the following steps:
and S1, grinding the PEEK material into powder, sieving the powder, and mixing the powder with photosensitive resin to prepare the PEEK slurry.
According to actual printing requirements, PEEK powder and light-curable photosensitive resin in a certain proportion are fully stirred and mixed to obtain PEEK slurry with different viscosity degrees.
And S2, loading the PEEK slurry into a feeding mechanism, and filling and paving the feeding mechanism.
At the initial stage of printing, ensure that the PEEK thick liquids pave feeding mechanism to there is not to spill or overflow the phenomenon, avoid causing the influence or causing the waste to the PEEK thick liquids to the printing process.
S3, enabling the PEEK slurry in the feeding mechanism to rise by a unit height, enabling the molding surface of the molding mechanism to fall by a unit height, and enabling the scraper mechanism to scrape the PEEK slurry on the feeding mechanism and lay the PEEK slurry flat on the molding mechanism.
The lifting height of the feeding mechanism is the same as the descending height of the forming mechanism, so that the PEEK slurry supplied by the feeding mechanism in each lifting can be ensured to be more than the forming surface of the forming mechanism.
And S4, the optical-mechanical mechanism receives the vector slice picture command and solidifies the PEEK slurry on the forming mechanism.
By adopting a surface exposure form and the control of a computer, the optical-mechanical mechanism can sequentially project the obtained pictures on the molding surface of the molding mechanism to complete the printing of the model.
S5, repeating the operation steps S3 and S4 until the model printing is completed.
It is understood that different embodiments among the components in the above embodiments can be combined and implemented, and the embodiments are only for illustrating the implementation of specific structures and are not limited to the implementation of the embodiments.
In some embodiments, the 3D printing forming method further includes the steps of:
and S6, taking the printed model out of the 3D printing equipment, and cleaning the model by using alcohol.
And S7, putting the cleaned model into a firing furnace for firing.
And S8, after the firing is finished, naturally cooling the model.
The mould is placed in a firing furnace for twice firing, the temperature gradient of twice firing is controlled, the glue discharging amount of the mould and the strength of the mould are ensured, compared with the prior art that the PEEK material fused deposition technology is adopted, the mould post-processing link is added, and the strength of the mould is improved; meanwhile, the operating method of binder removal and sintering at the same time is adopted, the condition that the interlayer binding force is inconsistent due to layered bonding of the FDM technology is avoided, and the product reliability is improved.
Wherein, step S7 specifically includes the following processes:
s71, the initial firing temperature is 150-200 ℃, and the firing time is 15-45 minutes.
According to the difference of the solid content of the PEEK slurry in the initial proportion, the initial firing time is controlled to be 15-45 minutes, so that the purpose is to discharge glue.
S72, adjusting the firing temperature to 300-400 ℃ and the firing time to 10-15 minutes.
After the binder removal, the firing temperature is adjusted upward in order to improve the strength of the mold. The baking time after the temperature is adjusted up is not suitable to be too long so as to avoid the influence of mold carbonization on the appearance and ensure that the model is not paralyzed, softened and warped in the baking process.
In this example, the ratio of PEEK material to photosensitive resin is 1:2, the initial firing temperature is 180 ℃ and the firing time is 30 minutes, and then the firing temperature is adjusted up to 350 ℃ and the firing time is 12 minutes.
In some embodiments, the feeding mechanism comprises a feeding cavity and a first driving module arranged at the bottom of the feeding cavity; the forming mechanism comprises a forming cavity, a forming plate is arranged in the forming cavity, and the forming plate is connected with a second driving module.
The cavity of this feed chamber and shaping chamber can be many different forms in time, for example be the cavity of forms such as rectangle, cylindrical, its outer wall material that forms the cavity can adopt metal, plastics etc. can select for use according to actual need, and this application does not limit to this.
The first driving module and the second driving module can adopt mechanical modules with linear pushing action, such as a driving cylinder, a driving motor and the like, and the specific driving module form is not limited.
Specifically, first drive module rises a unit height, makes the supply intracavity PEEK thick liquids outstanding the accent in supply chamber, and second drive module drives the profiled sheeting and descends a unit height, realizes that scraper mechanism scrapes the PEEK thick liquids on the feed mechanism and paves on the profiled sheeting.
In some embodiments, step S3 specifically includes:
the first driving module rises by a unit height to enable PEEK slurry in the feeding cavity to protrude out of the cavity opening of the feeding cavity, the second driving module drives the forming plate to descend by a unit height, and the scraper mechanism scrapes the PEEK slurry on the feeding mechanism and paves the PEEK slurry on the forming plate.
Step S4 specifically includes:
and the optical mechanical mechanism receives the vector slice picture command, and projects the vector slice picture on the molding surface of the molding plate to solidify the PEEK slurry in the projection area.
In some embodiments, the opto-mechanical mechanism comprises a digital micromirror DMD chip.
The digital micromirror DMD chip is used as an imaging chip, the forming precision is determined by the digital micromirror DMD, the DMD micromirror is 10um in size, and the precision is improved by 10-30 times.
According to the 3D printing forming method of the PEEK material, the PEEK powder is mixed with the photosensitive material and uniformly stirred to form the PEEK slurry, and through photocuring forming, compared with the prior art that the PEEK material is subjected to fused deposition, the forming mode of the material is changed; after printing the model, placing the model in a firing furnace for firing twice, controlling the temperature gradient of the firing twice, and ensuring the glue discharging amount and the model strength of the model; the products are uniformly sintered, all the materials are molded simultaneously, and the consistency of the products can be ensured.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (8)

1. The 3D printing forming method of the PEEK material is characterized by being applied to 3D printing equipment (1), wherein the 3D printing equipment (1) comprises a feeding mechanism (2), a scraper mechanism (3), a forming mechanism (4) and an optical mechanical mechanism (5);
the scraper mechanism (3) and the forming mechanism (4) are respectively arranged at two opposite sides of the feeding mechanism (2), and the optical-mechanical mechanism (5) is arranged at the upper end of the forming mechanism (4);
the 3D printing forming method comprises the following steps:
s1, grinding the PEEK material into powder, sieving the powder, and mixing the powder with photosensitive resin to prepare PEEK slurry;
s2, loading the PEEK slurry into a feeding mechanism, and filling, paving and feeding the PEEK slurry into the feeding mechanism;
s3, enabling the PEEK slurry in the feeding mechanism to rise by a unit height, enabling the molding surface of the molding mechanism to fall by a unit height, and enabling the PEEK slurry on the feeding mechanism to be scraped and paved on the molding mechanism by the scraper mechanism;
s4, the optical-mechanical mechanism receives the vector slice picture command and solidifies the PEEK slurry on the forming mechanism;
s5, repeating the operation steps S3 and S4 until the model printing is completed.
2. The 3D printing and molding method for PEEK material according to claim 1, further comprising the following steps:
s6, taking the printed model out of the 3D printing equipment, and cleaning the model by using alcohol;
s7, putting the cleaned model into a firing furnace for firing;
and S8, after the firing is finished, naturally cooling the model.
3. The 3D printing and molding method for PEEK materials according to claim 2, wherein the step S7 specifically includes the following steps:
s71, the initial firing temperature is 150-200 ℃, and the firing time is 15-45 minutes;
s72, adjusting the firing temperature to 300-400 ℃ and the firing time to 10-15 minutes.
4. The 3D printing forming method of the PEEK material of claim 1, wherein the proportion of the PEEK material to the photosensitive resin is 1: 1-1:3.
5. The 3D printing forming method for the PEEK material according to claim 1, wherein the feeding mechanism comprises a feeding cavity and a first driving module arranged at the bottom of the feeding cavity;
the forming mechanism comprises a forming cavity, a forming plate is arranged in the forming cavity, and the forming plate is connected with a second driving module.
6. The 3D printing and molding method for PEEK material of claim 5, wherein the step S3 specifically comprises:
the first driving module rises by a unit height to enable PEEK slurry in the feeding cavity to protrude out of the cavity opening of the feeding cavity, the second driving module drives the forming plate to descend by a unit height, and the scraper mechanism scrapes the PEEK slurry on the feeding mechanism and paves the PEEK slurry on the forming plate.
7. The 3D printing and molding method for PEEK material of claim 6, wherein the step S4 specifically comprises:
and the optical mechanical mechanism receives the vector slice picture command, and projects the vector slice picture on the molding surface of the molding plate to solidify the PEEK slurry in the projection area.
8. The 3D printing molding method for PEEK material of claim 1, wherein the optical mechanical mechanism comprises a digital micromirror DMD chip.
CN202010345419.6A 2020-04-27 2020-04-27 3D printing forming method of PEEK material Pending CN111438937A (en)

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CN202010345419.6A CN111438937A (en) 2020-04-27 2020-04-27 3D printing forming method of PEEK material

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112808688A (en) * 2021-01-05 2021-05-18 上海理工大学 Method for cleaning small-size pore powder of PEEK material 3D printing product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110385854A (en) * 2019-05-31 2019-10-29 西安铂力特增材技术股份有限公司 For the SLA equipment of highly viscous slurry forming and the control method of slurry forming
CN110869421A (en) * 2017-07-21 2020-03-06 美国圣戈班性能塑料公司 Method of forming a three-dimensional body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110869421A (en) * 2017-07-21 2020-03-06 美国圣戈班性能塑料公司 Method of forming a three-dimensional body
CN110385854A (en) * 2019-05-31 2019-10-29 西安铂力特增材技术股份有限公司 For the SLA equipment of highly viscous slurry forming and the control method of slurry forming

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112808688A (en) * 2021-01-05 2021-05-18 上海理工大学 Method for cleaning small-size pore powder of PEEK material 3D printing product
CN112808688B (en) * 2021-01-05 2023-04-11 上海理工大学 Method for cleaning small-size pore powder of PEEK material 3D printing product

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