CN111435059A - Chip heat exchanger and variable frequency air conditioner - Google Patents
Chip heat exchanger and variable frequency air conditioner Download PDFInfo
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- CN111435059A CN111435059A CN201910027092.5A CN201910027092A CN111435059A CN 111435059 A CN111435059 A CN 111435059A CN 201910027092 A CN201910027092 A CN 201910027092A CN 111435059 A CN111435059 A CN 111435059A
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- 230000005494 condensation Effects 0.000 claims abstract description 27
- 238000009833 condensation Methods 0.000 claims abstract description 27
- 238000001704 evaporation Methods 0.000 claims abstract description 23
- 230000008020 evaporation Effects 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims description 26
- 230000000694 effects Effects 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 238000005057 refrigeration Methods 0.000 abstract description 14
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000003570 air Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/37—Capillary tubes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention discloses a chip heat exchanger and a variable frequency air conditioner, belonging to the field of chip heat dissipation, wherein the chip heat exchanger comprises a heat sink; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor; the evaporation section of the heat pipe is arranged below a chip of the computer board of the air conditioner, the branch pipe of the capillary pipe is wound on the condensation section of the heat pipe, the first end of the main pipe of the capillary pipe is connected with the indoor heat exchanger, the second end of the main pipe of the capillary pipe is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor. In this scheme, the capillary branch absorbs the heat pipe heat dissipation, reduces the chip temperature, because the crotch form branch, not parallel passage, so the cooperation debugging of system's operating mode is easier, solves the chip heat dissipation of the down conversion air conditioner computer board of high temperature environment in summer, leads to that the refrigeration is raised frequently slowly, difficultly, and control logic easily reports wrong, and the refrigerating output is not enough, and the operation power consumption is big, causes the problem that the user complains about.
Description
Technical Field
The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and a frequency converter air conditioner.
Background
At present, in a high-temperature environment in summer, the chip of the computer board of the variable-frequency air conditioner has poor heat dissipation, so that the frequency rise of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is large, and the complaint of users is caused. The environment temperature is T3 under the working condition (53 ℃) or higher, the ambient air temperature of the frequency conversion chip is plus 10 ℃ (63 ℃), the difference value between the heat source temperature (68-120 ℃) of the computer board and the environment temperature (5-57 ℃) is reduced, the heat dissipation power is reduced, even the computer board is burnt, the system is down, and hardware faults are caused.
Disclosure of Invention
The embodiment of the invention provides a chip heat exchanger and a frequency converter air conditioner, which at least solve one of the technical problems in the prior art. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;
in some alternative embodiments, the chip heat exchanger comprises; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor;
the evaporation section of the heat pipe is arranged below a chip of the computer board of the air conditioner, the branch pipe of the capillary pipe is wound on the condensation section of the heat pipe, the first end of the main pipe of the capillary pipe is connected with the indoor heat exchanger, the second end of the main pipe of the capillary pipe is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor.
In some optional embodiments, further, the branch pipe is spirally wound around the condensing section.
In some optional embodiments, further, the condensation section is a straight pipe section.
In some alternative embodiments, further, the condensation section is a U-shaped section.
In some optional embodiments, further, the evaporation section is disposed along a length direction of the chip.
In some optional embodiments, further, the area of the evaporation section is 3/4 of the area of the chip.
In some optional embodiments, further, the diameter of the capillary tube can be thickened to a preset value, so that the capillary tube can achieve a refrigerant throttling effect.
In some optional embodiments, further, the first end and the second end of the capillary tube are spirally disposed therebetween.
In some optional embodiments, further, the chip heat exchanger further comprises a four-way valve; the first port of the four-way valve is connected with one port of the compressor, the second port of the four-way valve is communicated with the indoor heat exchanger, the third port of the four-way valve is communicated with the other port of the compressor, and the fourth port of the four-way valve is communicated with the outdoor heat exchanger.
According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;
in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
the evaporation zone of heat pipe absorbs the heat, arranges the below of chip in the computer board in, and the condensation zone releases the heat, through connecting the capillary, lets the heat pipe refrigerant fully release heat condensation, and the intraductal system refrigerant heat absorption inflation of capillary simultaneously realizes the throttle effect, and in addition, because the radiating thermal current density of heat pipe is great, the pipe diameter of capillary can be thickened, has both reached refrigerant throttle effect, can reduce the production degree of difficulty of capillary again, and then reduction in production cost. In the refrigeration and heating circulation, the capillary tube plays a throttling role, can be combined with absorbed heat through increasing the tube diameter, equivalently realizes the throttling expansion effect of a system refrigerant, so that a one-way valve is not needed to control the heat dissipation of the refrigeration and heating working condition on a condensation section of the heat pipe, the production cost is reduced, the capillary tube branch pipe absorbs the heat dissipation of the heat pipe, and the cooperative debugging of the working condition of the system is easier because of the branch of the fork shape instead of a parallel passage, meanwhile, the heat pipe does not need to be driven by electric power, and the self-circulation of the density difference of the refrigerant can be realized.
1. The temperature of a chip is reduced, the capillary branch pipes absorb heat radiation of the heat pipes, and due to the fact that the capillary branch pipes are branch-shaped branches and not parallel paths, the cooperative debugging of the working condition of the system is easier, and the problems that the heat radiation of the chip of the down-conversion air conditioner computer board in the high-temperature environment in summer is poor, the refrigeration frequency rising is slow and difficult, the control logic is easy to report errors, the refrigeration quantity is insufficient, the running power consumption is high, and the complaint of users is caused are solved;
2. because the heat-dissipating heat flow density of the heat pipe is larger, the pipe diameter of the capillary can be thickened, thereby not only achieving the throttling effect of the refrigerant, but also reducing the production difficulty of the capillary, further reducing the production cost and shortening the length of the capillary;
3. in refrigeration and heating circulation, the capillary tube plays a throttling role, and can equivalently realize the throttling expansion effect of a system refrigerant by increasing the pipe diameter and combining and absorbing heat, so that a check valve is not needed to control the heat dissipation of refrigeration and heating conditions on a condensation section of the heat pipe, and the production cost is reduced;
4. the capillary branch pipe absorbs the heat pipe to dissipate heat, and is a fork-shaped branch instead of a parallel passage, so that the cooperative debugging of the system working condition is easier, the single-path heat absorption of the fork-shaped branch has smaller influence on the system circulation, and the flow of a refrigerant for cooling the chip is smaller; the influence of the parallel passage is larger, and because the flow of the refrigerant for cooling the chip is larger, the cooperative debugging of the system working condition is more complicated.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic diagram illustrating a chip heat exchanger according to an exemplary embodiment.
Reference numerals:
1-computer board; 2-a heat pipe; 21-an evaporation section; 22-a condensation section; 3-indoor heat exchanger; 4-a capillary tube; 41-branch pipe; 5-outdoor heat exchanger; 6-a compressor; 7-four-way valve.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. As for the methods, products and the like disclosed by the embodiments, the description is simple because the methods correspond to the method parts disclosed by the embodiments, and the related parts can be referred to the method parts for description.
According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;
as shown in fig. 1, in some alternative embodiments, the chip heat exchanger includes; the heat pipe 2, the capillary tube 4, the outdoor heat exchanger 5, the indoor heat exchanger 3 and the compressor 6;
the evaporation section 21 of the heat pipe 2 is arranged below a chip of the air conditioner computer board 1, the branch pipe 41 of the capillary tube 4 is wound on the condensation section 22 of the heat pipe 2, the first end of the main pipe of the capillary tube 4 is connected with the indoor heat exchanger 3, the second end of the main pipe of the capillary tube 4 is connected with the outdoor heat exchanger 5, and the indoor heat exchanger 3 and the outdoor heat exchanger 5 are respectively connected with the compressor 6.
In this embodiment, the evaporation section 21 of the heat pipe 2 absorbs heat and is disposed below the chip in the computer board 1, the condensation section 22 releases heat, the refrigerant in the heat pipe 2 fully releases heat and condenses by connecting the capillary tube 4, the branch tube 41 of the capillary tube 4 absorbs the heat of the heat pipe, because of the branch and not the parallel path, the cooperative debugging of the system working condition is easier, the single path heat absorption of the branch has less influence on the system cycle, because the refrigerant flow for cooling the chip is smaller; in the prior art, the influence of the parallel connection channel is large, and because the flow of a refrigerant for cooling the chip is large, the cooperative debugging of the system working condition is more complicated; meanwhile, the refrigerant in the capillary 4 absorbs heat and expands, so that the throttling effect is realized, the temperature of the chip is reduced, and the problems that the frequency rising of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigeration quantity is insufficient, the running power consumption is large, and the complaint of users is caused due to the poor heat dissipation of the chip of the computer board of the variable frequency air conditioner in the high-temperature environment in summer are solved.
In some alternative embodiments, further, as shown in fig. 1, the branch pipe 41 is spirally wound around the condensation section 22.
In this embodiment, the condensation section 22 of the heat pipe 2 releases heat to the branch pipe 41 of the capillary 4 wound around the condensation section 22 of the heat pipe 2, so that the refrigerant in the heat pipe 2 is fully cooled and condensed, and the condensation section 22 releases heat better, thereby improving the heat dissipation efficiency.
In some alternative embodiments, further, as shown in fig. 1, the condenser section 22 is a straight pipe section.
In this embodiment, the condensation section 22 may be a straight pipe section, but alternatively, the condensation section 22 may also be a U-shaped pipe section.
In some optional embodiments, further, the evaporation section 21 is disposed along the length direction of the chip.
In this embodiment, the evaporation section 21 is arranged along the length direction of the chip, so that the contact area between the evaporation section 21 and the chip is larger, and the effect of evaporation heat absorption of the evaporation section 21 is improved.
In some optional embodiments, further, the area of the evaporation section 21 is 3/4 of the area of the chip.
In this embodiment, the area of the evaporation section 21 is close to the area of the chip, so that the contact area between the evaporation section 21 and the chip is larger, and the effect of evaporation heat absorption of the evaporation section 21 is improved.
In some optional embodiments, further, the diameter of the capillary tube 4 can be thickened to a preset value, so that the capillary tube 4 can achieve a refrigerant throttling effect.
In this embodiment, since the heat dissipation of the heat pipe 2 has a large heat flux density, the diameter of the capillary tube 4 can be increased, which not only achieves the refrigerant throttling effect, but also reduces the production difficulty of the capillary tube 4, thereby reducing the production cost and shortening the length of the capillary tube 4.
In some alternative embodiments, further, as shown in fig. 1, the capillary 4 is spirally disposed between the first end and the second end.
In the embodiment, in the refrigeration and heating cycle, the capillary tube 4 plays a throttling role, and can equivalently realize the throttling expansion effect of the system refrigerant by increasing the tube diameter and combining with absorbed heat, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating condition on the condensation section 22 of the heat pipe 2, and the production cost is reduced.
In some optional embodiments, further, the chip heat exchanger further comprises a four-way valve 7; the first port of the four-way valve 7 is connected with one port of the compressor 6, the second port of the four-way valve 7 is communicated with the indoor heat exchanger 3, the third port of the four-way valve 7 is communicated with the other port of the compressor 6, and the fourth port of the four-way valve 7 is communicated with the outdoor heat exchanger 5, so that the flowing trend of cold flow is better realized.
In a specific embodiment, as shown in fig. 1, the evaporation section 21 of the heat pipe 2 is disposed below the chip of the computer board 1 of the air conditioner, the branch pipe 41 of the capillary tube 4 is wound on the condensation section 22 of the heat pipe 2, the first end of the main pipe of the capillary tube 4 is connected to the indoor heat exchanger 3, the second end of the main pipe of the capillary tube 4 is connected to the outdoor heat exchanger 5, the indoor heat exchanger 3 and the outdoor heat exchanger 5 are respectively connected to the compressor 6, the first port of the four-way valve 7 is connected to one port of the compressor 6, the second port of the four-way valve 7 is communicated to the indoor heat exchanger 3, the third port of the four-way valve 7 is communicated to the other port of the compressor 6, the fourth port of the four-way valve 7 is communicated to the outdoor heat exchanger 5, and the condensation section 22 is a straight pipe section, the branch pipe 41 is spirally wound on the condensation section 22, the pipe diameter of the capillary tube 4 can be thickened to a preset value, so that the capillary tube 4 can achieve a refrigerant throttling effect, the first end and the second end of the capillary tube 4 are spirally arranged, the evaporation section 21 of the heat pipe 2 absorbs heat and is arranged below a chip in the computer board 1, the condensation section 22 releases heat, the refrigerant of the heat pipe 2 is fully released and condensed by connecting the capillary tube 4, the branch pipe 41 of the capillary tube 4 absorbs heat of the heat pipe for heat dissipation, and because of tree-branch-shaped branches and not parallel paths, the cooperative debugging of the system working condition is easier, the influence of the single path heat absorption of the tree-branch-shaped branches on the system circulation is smaller, because the refrigerant flow for cooling the chip is smaller, and meanwhile, the refrigerant in the capillary tube 4 absorbs heat and expands, so that the throttling effect is realized, and in addition, because the heat flow density, the pipe diameter of the capillary tube 4 can be increased to be thick, so that the refrigerant throttling effect is achieved, the production difficulty of the capillary tube 4 can be reduced, and the production cost is reduced. In the refrigeration and heating circulation, the capillary tube 4 plays a throttling role, can be combined with absorbed heat through increasing the tube diameter, equivalently realizes the throttling expansion effect of the system refrigerant, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating conditions on the condensation section 22 of the heat pipe 2, the production cost is reduced, and meanwhile, the heat pipe 2 is not needed to be driven by electric power, and the self-circulation of the refrigerant density difference can be realized.
According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;
in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.
The inverter air conditioner that the second aspect provided has the chip heat exchanger that the first aspect provided, consequently has the whole beneficial effect of the chip heat exchanger that the first aspect provided, and it is not repeated here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. A chip heat exchanger, comprising; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor;
the evaporation section of the heat pipe is arranged below a chip of the computer board of the air conditioner, the branch pipe of the capillary pipe is wound on the condensation section of the heat pipe, the first end of the main pipe of the capillary pipe is connected with the indoor heat exchanger, the second end of the main pipe of the capillary pipe is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor.
2. The chip heat exchanger according to claim 1,
the branch pipe is spirally wound on the condensation section.
3. The chip heat exchanger according to claim 2,
the condensation section is a straight pipe section.
4. The chip heat exchanger according to claim 2,
the condensation section is a U-shaped pipe section.
5. The chip heat exchanger according to claim 1,
the evaporation section is arranged along the length direction of the chip.
6. The chip heat exchanger according to claim 5,
the area of the evaporation section is 3/4 of the area of the chip.
7. The chip heat exchanger according to claim 1,
the pipe diameter of the capillary pipe can be thickened to a preset value, so that the capillary pipe can achieve a refrigerant throttling effect.
8. The chip heat exchanger according to any one of claims 1 to 7,
the first end and the second end of the capillary tube are arranged in a spiral shape.
9. The chip heat exchanger according to claim 8,
the device also comprises a four-way valve; the first port of the four-way valve is connected with one port of the compressor, the second port of the four-way valve is communicated with the indoor heat exchanger, the third port of the four-way valve is communicated with the other port of the compressor, and the fourth port of the four-way valve is communicated with the outdoor heat exchanger.
10. An inverter air conditioner, characterized in that it comprises a chip heat exchanger according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910027092.5A CN111435059A (en) | 2019-01-11 | 2019-01-11 | Chip heat exchanger and variable frequency air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910027092.5A CN111435059A (en) | 2019-01-11 | 2019-01-11 | Chip heat exchanger and variable frequency air conditioner |
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| Publication Number | Publication Date |
|---|---|
| CN111435059A true CN111435059A (en) | 2020-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910027092.5A Pending CN111435059A (en) | 2019-01-11 | 2019-01-11 | Chip heat exchanger and variable frequency air conditioner |
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| CN (1) | CN111435059A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112856588A (en) * | 2021-01-22 | 2021-05-28 | 青岛海尔空调器有限总公司 | Air conditioner indoor unit and air conditioner |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09318163A (en) * | 1996-06-03 | 1997-12-12 | Saginomiya Seisakusho Inc | Controller of superheat degree of capillary tube |
| CN202813668U (en) * | 2012-09-07 | 2013-03-20 | 新昌县华亿机械有限公司 | Variable frequency air conditioner with novel chip cooling device |
| CN105333674A (en) * | 2014-08-08 | 2016-02-17 | 青岛海尔特种电冰柜有限公司 | Refrigerating device capable of adapting to multiple placement angles |
| CN206459546U (en) * | 2016-12-29 | 2017-09-01 | 无锡市普尔换热器制造有限公司 | A kind of high-efficient energy-saving radiator of coolant recoverable |
-
2019
- 2019-01-11 CN CN201910027092.5A patent/CN111435059A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09318163A (en) * | 1996-06-03 | 1997-12-12 | Saginomiya Seisakusho Inc | Controller of superheat degree of capillary tube |
| CN202813668U (en) * | 2012-09-07 | 2013-03-20 | 新昌县华亿机械有限公司 | Variable frequency air conditioner with novel chip cooling device |
| CN105333674A (en) * | 2014-08-08 | 2016-02-17 | 青岛海尔特种电冰柜有限公司 | Refrigerating device capable of adapting to multiple placement angles |
| CN206459546U (en) * | 2016-12-29 | 2017-09-01 | 无锡市普尔换热器制造有限公司 | A kind of high-efficient energy-saving radiator of coolant recoverable |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112856588A (en) * | 2021-01-22 | 2021-05-28 | 青岛海尔空调器有限总公司 | Air conditioner indoor unit and air conditioner |
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Application publication date: 20200721 |
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| RJ01 | Rejection of invention patent application after publication |