CN111433931A - Flexible substrate, preparation method thereof and flexible device - Google Patents
Flexible substrate, preparation method thereof and flexible device Download PDFInfo
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- CN111433931A CN111433931A CN201780097411.9A CN201780097411A CN111433931A CN 111433931 A CN111433931 A CN 111433931A CN 201780097411 A CN201780097411 A CN 201780097411A CN 111433931 A CN111433931 A CN 111433931A
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- 239000000758 substrate Substances 0.000 title claims abstract description 159
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- -1 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 7
- 239000004695 Polyether sulfone Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 7
- 229920003050 poly-cycloolefin Polymers 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920006393 polyether sulfone Polymers 0.000 claims description 7
- 229920002530 polyetherether ketone Polymers 0.000 claims description 7
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000001704 evaporation Methods 0.000 abstract description 2
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- 239000011248 coating agent Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
A flexible substrate (10) comprises a base (110), a first flexible base layer (120), an alignment mark (140) and a second flexible base layer (150), wherein the first flexible base layer (120) is arranged on the surface of the base (110), the alignment mark (140) is arranged on one side, away from the base (110), of the first flexible base layer (120), and the second flexible base layer (150) is arranged on one side, away from the base (110), of the first flexible base layer (120) and exposes the alignment mark (140). The flexible substrate (10) is accurate in alignment in the preparation process of the flexible display panel, the evaporation coating process or the film pasting process of the backboard protective film, and the yield is improved. A method of manufacturing a flexible substrate (10) and a flexible device (20) are also provided.
Description
The invention relates to the field of display panels, in particular to a flexible substrate, a preparation method thereof and a flexible device.
In the prior art, the positions of a glass substrate and a mask plate are determined by an optical coupling element (CCD) camera, and the CCD camera has certain requirements on the transparency of a flexible substrate material, so that the transparency of a single-layer 10 mu m flexible substrate can meet the requirements on the contraposition of a machine and the CCD camera, but the contraposition is inaccurate due to the fact that the film thickness is increased and the transparency is reduced when the double-layer flexible substrate is prepared, or the double-layer flexible substrate material is required to have higher transparency, which causes certain difficulty on material selection.
Disclosure of Invention
In view of this, the present invention provides a flexible substrate capable of implementing accurate alignment of a dual-layer flexible display panel and a manufacturing method thereof, and the specific technical scheme is as follows:
a flexible substrate comprises a substrate, a first flexible base layer, an alignment mark and a second flexible base layer, wherein the first flexible base layer is arranged on the surface of the substrate, the alignment mark is arranged on one side, away from the substrate, of the first flexible base layer, and the second flexible base layer is arranged on one side, away from the substrate, of the first flexible base layer and exposes the alignment mark.
Preferably, the alignment marks are symmetrically distributed on the surface of the first flexible base layer away from the substrate.
Preferably, the area of the second flexible base layer is smaller than the area of the first flexible base layer.
Preferably, the transparency of the flexible substrate is less than a preset transparency.
Preferably, the transparency of the two layers of the substrate and the first flexible base layer in the flexible substrate is greater than the preset transparency.
Preferably, the flexible substrate further includes an inorganic layer, the inorganic layer is disposed on the surface of the substrate away from the first flexible base layer, the alignment mark is disposed on the surface of the inorganic layer away from the first flexible base layer, and the second flexible base layer is disposed on the surface of the inorganic layer away from the first flexible base layer.
Preferably, the alignment mark is disposed on a surface of the first flexible base layer away from the substrate, the flexible substrate further includes an inorganic layer, the inorganic layer is disposed on a surface of the first flexible base layer away from the substrate and exposes the alignment mark, and the second flexible base layer is disposed on a surface of the inorganic layer away from the first flexible base layer.
Preferably, the material of the first flexible base layer is one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polycycloolefin and polyetheretherketone; the second flexible base layer is made of one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polycycloolefin and polyether ether ketone.
Preferably, the para-position mark is a metal film, and the metal film is a silver film or an aluminum film.
Preferably, the material of the inorganic layer is one or a combination of two of silicon oxide and silicon nitride.
The invention also provides a preparation method of the flexible substrate, which comprises the following steps:
providing a substrate;
forming a first flexible base layer on a surface of the substrate;
forming a contraposition mark on one side of the first flexible base layer far away from the substrate;
and forming a second flexible base layer on one side of the first flexible base layer, which is far away from the substrate, and exposing the alignment mark by using the second flexible base layer.
Preferably, the alignment mark is formed symmetrically on the surface of the first flexible base layer away from the substrate.
Preferably, the alignment mark is formed on the side of the first flexible base layer away from the substrate by vacuum evaporation or magnetron sputtering.
Preferably, the method for manufacturing a flexible substrate further includes the steps of:
forming an inorganic layer on a surface of the first flexible base layer remote from the substrate;
the step of forming the alignment mark on the side of the first flexible base layer away from the substrate comprises the following steps:
forming the alignment mark on the surface of the inorganic layer far away from the first flexible base layer;
the step of forming a second flexible base layer on the side of the first flexible base layer away from the substrate, and exposing the alignment mark by the second flexible base layer includes:
forming the second flexible base layer on a surface of the inorganic layer distal from the first flexible base layer.
Preferably, the method for manufacturing a flexible substrate further includes the steps of:
the step of forming the alignment mark on the side of the first flexible base layer away from the substrate comprises the following steps:
forming the alignment mark on the surface of the first flexible base layer far away from the substrate;
an inorganic layer is formed on the surface of the first flexible base layer far away from the substrate, and the alignment mark is exposed by the inorganic layer;
the step of forming a second flexible base layer on the side of the first flexible base layer away from the substrate, and exposing the alignment mark by the second flexible base layer includes:
forming the second flexible base layer on a surface of the inorganic layer distal from the first flexible base layer.
Preferably, the area of the second flexible base layer is smaller than the area of the first flexible base layer.
The invention also provides a flexible device which comprises the flexible substrate.
The invention has the beneficial effects that: the flexible substrate provided by the invention is accurate in alignment in the preparation process of the flexible display panel, the evaporation coating process or the film pasting process of the backboard protective film, and the yield is improved.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic cross-sectional view of a flexible substrate according to a first embodiment of the invention.
Fig. 2 is a schematic diagram of the alignment process of the flexible substrate provided by the present invention.
Fig. 3 is a schematic cross-sectional view of a flexible substrate according to a second embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a flexible substrate according to a third embodiment of the invention.
Fig. 5 is a flowchart of a method for manufacturing a flexible substrate according to a first embodiment of the invention.
Fig. 6 is a schematic view of coating a film layer by using a coater according to the present invention.
Fig. 7 is a flowchart of a method for manufacturing a flexible substrate according to a second embodiment of the invention.
Fig. 8 is a flowchart of a method for manufacturing a flexible substrate according to a third embodiment of the invention.
Fig. 9 is a schematic view of a flexible device provided by the present invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a flexible substrate 10 according to a first embodiment of the present invention includes a substrate 110, a first flexible base layer 120, an alignment mark 140, and a second flexible base layer 150. The first flexible base layer 120 is disposed on the surface of the substrate 110, the alignment mark 140 is disposed on a side of the first flexible base layer 120 away from the substrate 110, and the second flexible base layer 150 is disposed on a side of the first flexible base layer 120 away from the substrate 110 and exposes the alignment mark 140.
It is understood that, in this embodiment, the alignment mark 140 is not overlapped with the second flexible base layer 120 when viewed from directly above the flexible substrate 10. Alternatively, it is understood that the flexible substrate 10 includes an alignment mark setting area 170 and a film coating area 160, the alignment mark setting area 170 is used for setting the alignment mark 140, and the film coating area 160 is used for coating the second flexible base layer 120 or coating other film layers. The alignment mark setting area 170 is disposed around the film coating area 160, or the alignment mark setting area 170 is disposed on two opposite sides of the film coating area 160. In this embodiment, the alignment mark 140 is disposed in the alignment mark disposition region 170, and the second flexible base layer 120 is disposed in the coating region 160.
Referring to fig. 2, the embodiment of the present invention is a flexible substrate using a double-layer flexible base layer, and the alignment mark 140 and the second flexible base layer 150 are arranged in a non-overlapping manner, so that when the CCD camera 180 captures and obtains the alignment mark 140, only two layers, i.e., the substrate 110 and the first flexible base layer 120, are needed to obtain image information of the alignment mark 140, and two layers, i.e., the first flexible base layer 120 and the second flexible base layer 150, are not needed to be passed through. It is easier to obtain the image information of the alignment mark 140 through one flexible base layer than through two flexible base layers, and the image is clearer, so that the alignment is more accurate.
It is understood that the substrate 110 may be, but is not limited to, a glass substrate, a transparent substrate.
In a further embodiment, the alignment marks 140 are symmetrically distributed on the surface of the first flexible base layer 120 away from the substrate 110. The symmetrical distribution of the alignment marks 140 enables the CCD camera 180 to acquire more uniform position information, so that the alignment is more accurate. It is understood that in other embodiments, the alignment marks 140 may have other arrangements, and the positions thereof may be flexibly set according to actual needs.
In a further embodiment, the area of the second flexible base layer 150 is smaller than the area of the first flexible base layer 120. The present invention can increase the transparency of the substrate 110 to the alignment mark 140 by using the difference between the areas of the second flexible base layer 150 and the second flexible base layer 120.
In a further embodiment, the transparency of the flexible substrate 10 is less than a predetermined transparency. The transparency of the flexible substrate 10 refers to the transparency from the substrate 110 to the second flexible base layer 150. The preset transparency refers to a minimum transparency at which the CCD camera 180 can acquire image information of the alignment mark 140. When the transparency of the flexible substrate 10 is greater than the preset transparency, the CCD camera 180 can acquire image information of the alignment mark 140. When the transparency of the flexible substrate 10 is less than the preset transparency, the CCD camera 180 cannot acquire the image information of the alignment mark 140. In the embodiment of the present invention, the transparency of the flexible substrate 10 is smaller than the preset transparency, that is, the CCD camera 180 cannot acquire the image information of the alignment mark 140 through the flexible substrate.
In a further embodiment, the preset transparency is 70%. It is understood that in embodiments of the present invention, the transparency of the flexible substrate 10 is less than 70%.
In a further embodiment, the transparency of the two layers of the substrate 110 and the first flexible base layer 120 in the flexible substrate 10 is greater than a predetermined transparency. It is understood that the preset transparency refers to a minimum transparency at which the CCD camera 180 can acquire image information of the alignment mark 140. In the embodiment of the present invention, the transparency of the two layers of the base 110 and the first flexible base layer 120 in the flexible substrate 10 is greater than the preset transparency, which means that the CCD camera 180 can obtain the image information of the alignment mark 140 through the two layers of the base 110 and the first flexible base layer 120.
As illustrated below, it is assumed that the transparency of the two layers of the base 110 and the first flexible base layer 120 in the flexible substrate 10 is 75%. The transparency of the flexible substrate 10 was 65%. In this case, when the CCD camera 180 is used to capture the alignment mark 140, the CCD camera 180 can only obtain the image information of the alignment mark 140 through two layers of the substrate 110 and the first flexible base layer 120, but cannot obtain the image information of the alignment mark 140 through three layers (flexible substrates) of the substrate 110, the first flexible base layer 120, and the second flexible base layer 150.
Referring to fig. 3, in a second embodiment of the present invention, the flexible substrate 10 further includes an inorganic layer 130, the inorganic layer 130 is disposed on a surface of the first flexible base layer 120 away from the substrate 110, the alignment mark 140 is disposed on a surface of the inorganic layer 130 away from the first flexible base layer 120, and the second flexible base layer 150 is disposed on a surface of the inorganic layer 130 away from the first flexible base layer 120. In this embodiment, the alignment mark 140 and the second flexible base layer 120 are simultaneously disposed on the surface of the inorganic layer 130 away from the first flexible base layer 120, but the second flexible base layer 120 is not coincident with the alignment mark 140. In this embodiment, the inorganic layer 130 in the dual-layer flexible substrate structure can be used for water and oxygen barrier.
For such a flexible substrate having the inorganic layer 130, in a further embodiment, the transparency of the three layers of the substrate 110, the first flexible base layer 120 and the inorganic layer 130 in the flexible substrate 10 is required to be greater than a preset transparency. In this case, the CCD camera 180 can acquire image information of the alignment mark 140 through three layers of the substrate 110, the first flexible base layer 120, and the inorganic layer 130.
Referring to fig. 4, in the third embodiment of the present invention, the alignment mark 140 is disposed on a surface of the first flexible base layer 120 away from the substrate 110. The flexible substrate 10 further includes an inorganic layer 130. The inorganic layer 130 is disposed on a surface of the first flexible base layer 120 away from the substrate 110 and exposes the alignment mark 140, and the second flexible base layer 150 is disposed on a surface of the inorganic layer 130 away from the first flexible base layer 120. For the flexible substrate having the inorganic layer 130, the structural configuration of the third embodiment of the present invention is adopted, and the inorganic layer 130 and the alignment mark 140 are arranged in a non-overlapping manner, so that when the CCD camera 180 is aligned, the image information of the alignment mark 140 does not need to be acquired through three layers, namely, the substrate 110, the first flexible base layer 120 and the inorganic layer 130, and only two layers, namely, the substrate 110 and the first flexible base layer 120, need to be acquired. The transparency of the two layers of the substrate 110 and the first flexible base layer 120 is greater than the transparency of the three layers of the substrate 110, the first flexible base layer 120 and the inorganic layer 130, so that the CCD camera 180 can more easily and clearly obtain the image information of the alignment mark 140, and the alignment operation is more accurate. The inorganic layer 130 can serve as a water barrier and an oxygen barrier. Therefore, the third embodiment can achieve the effects of water and oxygen isolation and achieve the purpose of accurate alignment.
In a further embodiment, the material of the first flexible substrate 120 is one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polycycloolefin, and polyetheretherketone. The material of the second flexible base layer 150 is one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polycycloolefin and polyether ether ketone. The alignment mark 140 in the embodiment of the present invention is structurally configured, so that when a dual-layer flexible substrate is manufactured, the requirement of selecting the materials of the first flexible base layer 120 and the second flexible base layer 150 for transparency is reduced, and further, the process cost is reduced.
In a further embodiment, the alignment mark 140 is a metal film, and the metal film is a silver film or an aluminum film. The thickness of the metal film is 100nm-1000 nm.
In further embodiments, the shape of the alignment mark 140 may be, but is not limited to, circular, triangular, square, cross. Preferably in the shape of a cross, and the use of a cross pattern makes it easier to obtain target information when photographed by the CCD camera 180. More preferably, the area of the alignment mark 140 occupies 50 to 90% of the area of the visible range of the CCD camera 180 for capturing an image of the flexible substrate. It is understood that the smaller the ratio of the area of the alignment mark 140 to the area of the visible range, the lower the accuracy in the alignment process. If the ratio of the area of the alignment mark 140 to the area of the visible range is larger, the CCD camera 180 needs to continuously adjust the position during alignment so that the alignment mark is located within the visible range, which is time-consuming and labor-consuming. Therefore, the proper proportion range is adopted, so that the alignment precision is ensured, and the process cost is saved.
In a further embodiment, the material of the inorganic layer 130 is one or a combination of silicon oxide and silicon nitride. The silicon oxide or silicon nitride is used for water and oxygen resistance.
Referring to fig. 5, the present invention also provides a method for manufacturing a flexible substrate according to a first embodiment, which includes steps S100-i, S200-i, S300-i and S400-i. The details of each step are as follows.
In step S100-I, a substrate 110 is provided. The substrate may be a glass substrate, or a flexible substrate with high transparency.
In step S200-i, a first flexible base layer 120 is formed on a surface of the substrate 110. The first flexible base layer 120 is formed by coating the material of the first flexible base layer 120 on the surface of the substrate 110 by a coating method, and then drying by baking or vacuum-pumping to obtain the first flexible base layer 120. The first flexible base layer 120 is made of one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polycycloolefin and polyetheretherketone.
In step S300-i, an alignment mark 140 is formed on a side of the first flexible base layer 120 away from the substrate 110. The alignment mark 140 is formed by vacuum evaporation or magnetron sputtering on the side of the first flexible base layer away from the substrate. The alignment mark 140 is a metal film, and the metal film is a silver film or an aluminum film. The thickness of the metal film is 100nm-1000 nm. The shape of the alignment mark 140 may be, but is not limited to, circular, triangular, square, and cross. The alignment mark 140 is symmetrically formed on the surface of the first flexible base layer 120 away from the substrate 110. Preferably, the alignment marks 140 are formed at four corners or opposite sides corresponding to the first flexible base layer 120. The symmetrical distribution of the alignment marks 140 enables the CCD camera 180 to acquire more uniform position information, so that the alignment is more accurate.
In step S400-i, a second flexible base layer 150 is formed on a side of the first flexible base layer 120 away from the substrate 110, and the alignment mark 140 is exposed by the second flexible base layer 150. The second flexible base layer 150 is formed by coating. Referring to fig. 6, the second flexible base layer 150 is formed by coating and printing through a coating machine 190.
Referring to fig. 7, the present invention further provides a method for manufacturing a flexible substrate according to a second embodiment, where the method for manufacturing a flexible substrate according to the second embodiment includes steps S100-ii, S200-ii, S300-ii, S400-ii, and S500-ii. The details of each step are as follows.
In step S100-II, a substrate 110 is provided.
In step S200-ii, a first flexible base layer 120 is formed on the surface of the substrate 110.
In step S300-ii, an inorganic layer 130 is formed on a surface of the first flexible base layer 120 away from the substrate 110. The inorganic layer 130 is formed by coating. The material of the inorganic layer 130 may be, but is not limited to, one or a combination of silicon oxide and silicon nitride. The inorganic layer 130 is added to achieve the purpose of water and oxygen isolation.
In step S400-ii, the alignment mark 140 is formed on the surface of the inorganic layer 130 away from the first flexible base layer 120.
Step S500-ii, forming the second flexible base layer 150 on the surface of the inorganic layer 130 away from the first flexible base layer 120.
Wherein, the alignment mark 140 formed in step S400-ii and the second flexible base layer 150 formed in step S500-ii are not overlapped with each other, and the second flexible base layer 150 exposes the alignment mark 140. The flexible substrate formed by the preparation method of this embodiment can be referred to fig. 3.
Referring to fig. 8, the present disclosure further provides a method for manufacturing a flexible substrate according to a third embodiment, where the method for manufacturing a flexible substrate according to the third embodiment includes steps S100-iii, S200-iii, S300-iii, S400-iii, and S500-iii. The details of each step are as follows.
Step S100-III, a substrate 110 is provided.
Step S200-iii, a first flexible base layer 120 is formed on the surface of the substrate 110.
In step S300-iii, the alignment mark 140 is formed on the surface of the first flexible base layer 120 away from the substrate 110.
Step S400-iii, forming an inorganic layer 130 on a surface of the first flexible base layer 120 away from the substrate 110. Wherein the alignment mark 140 formed in the step S300-iii and the inorganic layer 130 formed in the step S400-iii do not overlap with each other, and the inorganic layer 130 exposes the alignment mark 140.
Step S500-iii, forming the second flexible base layer 150 on the surface of the inorganic layer 130 away from the first flexible base layer 120. Wherein the second flexible base layer 150 exposes the alignment marks 140. The flexible substrate formed by the preparation method of this embodiment can be referred to fig. 4.
In a further embodiment, the area of the second flexible base layer 150 is smaller than the area of the first flexible base layer 120.
Referring to fig. 9, the present invention further provides an embodiment of a flexible device 20, where the flexible device 20 is a flexible device for oled display, and the flexible device 20 includes the flexible substrate 10 in the above embodiment. The flexible substrate 10 may be, but not limited to, an electronic book, a smart Phone (e.g., an Android Phone, an iOS Phone, a Windows Phone, etc.), a tablet computer, a flexible palm computer, a flexible notebook computer, a Mobile Internet device (MID, Mobile Internet Devices), or a wearable device.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (17)
- The flexible substrate is characterized by comprising a base, a first flexible base layer, an alignment mark and a second flexible base layer, wherein the first flexible base layer is arranged on the surface of the base, the alignment mark is arranged on one side, away from the base, of the first flexible base layer, and the second flexible base layer is arranged on one side, away from the base, of the first flexible base layer and exposes the alignment mark.
- The flexible substrate of claim 1, wherein the alignment marks are symmetrically distributed on a surface of the first flexible base layer away from the substrate.
- The flexible substrate of claim 1, wherein the second flexible base layer has an area smaller than an area of the first flexible base layer.
- The flexible substrate of claim 1, wherein the flexible substrate has a transparency less than a predetermined transparency.
- The flexible substrate of claim 4, wherein the transparency of both the substrate and the first flexible base layer in the flexible substrate is greater than a predetermined transparency.
- The flexible substrate of claim 1, further comprising an inorganic layer disposed on a surface of the first flexible base layer remote from the base, wherein the alignment mark is disposed on a surface of the inorganic layer remote from the first flexible base layer, and wherein the second flexible base layer is disposed on a surface of the inorganic layer remote from the first flexible base layer.
- The flexible substrate of claim 1, wherein the alignment mark is disposed on a surface of the first flexible base layer away from the base, the flexible substrate further comprising an inorganic layer disposed on a surface of the first flexible base layer away from the base and exposing the alignment mark, the second flexible base layer disposed on a surface of the inorganic layer away from the first flexible base layer.
- The flexible substrate of claim 1, wherein the material of the first flexible base layer is one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polycycloolefin, polyetheretherketone; the second flexible base layer is made of one or more of polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polycycloolefin and polyether ether ketone.
- The flexible substrate according to claim 1, wherein the alignment mark is a metal film, and the metal film is a silver film or an aluminum film.
- The flexible substrate of claim 6, wherein the material of the inorganic layer is one or a combination of silicon oxide and silicon nitride.
- A method for preparing a flexible substrate is characterized by comprising the following steps:providing a substrate;forming a first flexible base layer on a surface of the substrate;forming a contraposition mark on one side of the first flexible base layer far away from the substrate;and forming a second flexible base layer on one side of the first flexible base layer, which is far away from the substrate, and exposing the alignment mark by using the second flexible base layer.
- The method for manufacturing a flexible substrate according to claim 11, wherein the alignment marks are symmetrically formed on a surface of the first flexible base layer away from the base.
- The method for manufacturing the flexible substrate according to claim 11, wherein the alignment mark is formed by vacuum evaporation or magnetron sputtering on a side of the first flexible base layer away from the substrate.
- The method for manufacturing a flexible substrate according to claim 11, further comprising the steps of:forming an inorganic layer on a surface of the first flexible base layer remote from the substrate;the step of forming the alignment mark on the side of the first flexible base layer away from the substrate comprises the following steps:forming the alignment mark on the surface of the inorganic layer far away from the first flexible base layer;the step of forming a second flexible base layer on a side of the first flexible base layer away from the substrate, and exposing the alignment mark by the second flexible base layer includes:forming the second flexible base layer on a surface of the inorganic layer distal from the first flexible base layer.
- The method for manufacturing a flexible substrate according to claim 11, further comprising the steps of:the step of forming the alignment mark on the side of the first flexible base layer away from the substrate comprises the following steps:forming the alignment mark on the surface of the first flexible base layer far away from the substrate;an inorganic layer is formed on the surface of the first flexible base layer far away from the substrate, and the alignment mark is exposed by the inorganic layer;the step of forming a second flexible base layer on a side of the first flexible base layer away from the substrate, and exposing the alignment mark by the second flexible base layer includes:forming the second flexible base layer on a surface of the inorganic layer distal from the first flexible base layer.
- The method of manufacturing a flexible substrate according to claim 11, wherein an area of the second flexible base layer is smaller than an area of the first flexible base layer.
- A flexible device comprising a flexible substrate according to any one of claims 1 to 10.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/115505 WO2019113759A1 (en) | 2017-12-11 | 2017-12-11 | Flexible substrate and preparation method therefor, and flexible device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111433931A true CN111433931A (en) | 2020-07-17 |
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| CN201780097411.9A Pending CN111433931A (en) | 2017-12-11 | 2017-12-11 | Flexible substrate, preparation method thereof and flexible device |
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| CN (1) | CN111433931A (en) |
| WO (1) | WO2019113759A1 (en) |
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| CN114627762B (en) * | 2022-03-09 | 2024-04-09 | 武汉华星光电半导体显示技术有限公司 | Display module, attaching method thereof and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073847A1 (en) * | 2009-09-29 | 2011-03-31 | Dai Nippon Printing Co., Ltd. | Laminate, preparatory support, method for producing laminate, and method for producing device |
| CN105552247A (en) * | 2015-12-08 | 2016-05-04 | 上海天马微电子有限公司 | Composite substrate, flexible display device and preparation method thereof |
| CN106601771A (en) * | 2016-12-09 | 2017-04-26 | 武汉华星光电技术有限公司 | Flexible substrate and manufacturing method thereof |
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| CN104600220B (en) * | 2014-12-30 | 2017-08-25 | 上海天马微电子有限公司 | A kind of manufacture method of flexible display, composite base plate and flexible display |
| CN106783872A (en) * | 2016-11-28 | 2017-05-31 | 友达光电（昆山）有限公司 | A kind of flexible display panels |
| CN107359285B (en) * | 2017-08-18 | 2019-03-15 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073847A1 (en) * | 2009-09-29 | 2011-03-31 | Dai Nippon Printing Co., Ltd. | Laminate, preparatory support, method for producing laminate, and method for producing device |
| CN105552247A (en) * | 2015-12-08 | 2016-05-04 | 上海天马微电子有限公司 | Composite substrate, flexible display device and preparation method thereof |
| CN106601771A (en) * | 2016-12-09 | 2017-04-26 | 武汉华星光电技术有限公司 | Flexible substrate and manufacturing method thereof |
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