CN111432548B - Multilayer printed wiring board that can buckle - Google Patents
Multilayer printed wiring board that can buckle Download PDFInfo
- Publication number
- CN111432548B CN111432548B CN202010200605.0A CN202010200605A CN111432548B CN 111432548 B CN111432548 B CN 111432548B CN 202010200605 A CN202010200605 A CN 202010200605A CN 111432548 B CN111432548 B CN 111432548B
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- circuit board
- layer
- shaped
- holes
- circular mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
Abstract
The invention discloses a bendable multilayer printed circuit board, and relates to the technical field of electronic manufacturing. The circuit board comprises a circular mounting column, connecting sleeves and circuit board bodies, wherein the circuit board bodies are symmetrically arranged on two sides of the circular mounting column, and the connecting sleeves are fixedly sleeved on one end, close to the circular mounting column, of the circuit board bodies; the outer side wall of the circular mounting column is uniformly provided with limiting sleeves along the extending direction of the circular mounting column; the circuit board body includes circuit board layer, hot melt layer and insulation board layer, and insulation board layer's upper and lower side from inside to outside symmetry in proper order has hot melt layer and circuit board layer. According to the invention, the communication cavity formed between the first heat dissipation hole and the first vertical through hole, the contact between the circuit board and the air can be improved, the heat dissipation effect is improved, and the circuit board can be bent in a large-scale two-way manner through the relative rotation between the circular mounting column and the circuit board body.
Description
Technical Field
The invention belongs to the technical field of electronic manufacturing, and particularly relates to a bendable multilayer printed circuit board which is mainly used for integrated connection between electrical elements.
Background
Along with the development of society, in order to satisfy more electronic component's integration, the multilayer circuit board replaces the circuit board of individual layer gradually, but the setting of multilayer circuit board, and the thermal diffusivity that leads to the circuit board is relatively poor, and electrical components damages because of high temperature very easily, and in addition, the setting of multilayer circuit board leads to whole plate body flexibility relatively poor, can't accomplish wide-angle the buckling, and the practicality is lower.
The CN207766663U, a novel bendable multilayer circuit board, includes a first heat conducting layer and a second heat conducting layer, a flexible layer is sandwiched between the first heat conducting layer and the second heat conducting layer, the first heat conducting layer is provided with a first opening for exposing a portion of the flexible layer, the second heat conducting layer is provided with a second opening for exposing a portion of the flexible layer, and the first opening and the second opening are symmetrically arranged; the first opening and the second opening which expose part of the flexible layer are symmetrically arranged on the first heat conduction layer and the second heat conduction layer, so that the circuit board can be bent through the part of the flexible layer exposed by the openings, and meanwhile, the heat dissipation performance of the circuit board is improved through the first heat conduction layer and the second heat conduction layer, so that the circuit board has better heat dissipation performance and is better suitable for electronic equipment with bending requirements.
Disclosure of Invention
The invention aims to provide a bendable multilayer printed circuit board, which can improve the contact between the circuit board and the air and the heat dissipation effect through a communication cavity formed between a first heat dissipation hole and a first vertical through hole and a second heat dissipation hole, can realize the large-amplitude bidirectional bending of the circuit board through the relative rotation between a circular mounting column and a circuit board body, and solves the problems of poor heat dissipation effect of the existing multilayer circuit board and small bending angle and unidirectional bending of the existing multilayer circuit board.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a bendable multilayer printed circuit board, which comprises a circular mounting column, connecting sleeves and a circuit board body, wherein the circuit board body is symmetrically arranged on two sides of the circular mounting column, and the connecting sleeves are fixedly sleeved on one end, close to the circular mounting column, of the circuit board body;
the outer side wall of the circular mounting column is uniformly provided with limiting sleeves along the extending direction of the circular mounting column;
the circuit board body comprises a circuit board layer, a hot melting layer and an insulating board layer, wherein the hot melting layer and the circuit board layer are symmetrically arranged on the upper side and the lower side of the insulating board layer from inside to outside in sequence;
the insulation board layer is uniformly provided with first vertical through holes, the hot melting layer is uniformly provided with second vertical through holes, and the first vertical through holes and the second vertical through holes are vertically aligned;
inserting strips are uniformly welded on one end, close to the connecting sleeve, of the circuit board layer, and the inserting strips above and below the insulating board layer are arranged in a staggered mode;
an inserting cavity is formed in one end of the connecting sleeve, first L-shaped clamping grooves are uniformly distributed in the upper end of the inner wall of the connecting sleeve on one side of the inserting cavity along the horizontal direction, and second L-shaped clamping grooves are formed in the lower end of the inner wall of the connecting sleeve and the first L-shaped clamping grooves in a vertically one-to-one aligned mode;
horizontal slots are uniformly distributed in the side surface center position of the connecting sleeve, which is close to the circular mounting column, along the horizontal direction, the first L-shaped clamping groove and the second L-shaped clamping groove are vertically and symmetrically arranged, and the communication end of the first L-shaped clamping groove and the second L-shaped clamping groove is communicated with one end of each horizontal slot;
z-shaped connecting strips are fixedly sleeved in the connecting groove formed by the first L-shaped clamping groove and the transverse slot and the connecting groove formed by the second L-shaped clamping groove and the transverse slot, and two adjacent Z-shaped connecting strips are arranged in an up-down symmetrical mode;
one end of the Z-shaped connecting strip is provided with a positioning cavity, one side of the other end face of the Z-shaped connecting strip is provided with a connecting block, and the outer surface center position of one side of the connecting block is provided with a contact.
Furthermore, the connecting sleeves are provided with connecting plates on two sides of the end face close to the circular mounting column, one end of each connecting plate is provided with a first mounting hole, and the first mounting holes are used for being matched with the connecting columns.
Furthermore, two end faces of the connecting column are provided with second mounting holes, and first screws are spirally matched in the second mounting holes.
Furthermore, one end of the circuit board body is sleeved in the plug cavity, and an insulating sleeve is sleeved between the plug cavity and the circuit board body.
Furthermore, a third mounting hole is formed in the two side faces of the connecting sleeve in an aligned mode, a second screw is spirally matched in the third mounting hole, and one end of the second screw is in contact with the outer wall of the insulating sleeve.
Furthermore, first heat dissipation holes are uniformly distributed in the insulating board layer along the vertical direction, second heat dissipation holes are uniformly distributed in the insulating board layer along the horizontal direction, and the first vertical through holes are distributed at the intersection points of the first heat dissipation holes and the second heat dissipation holes.
Furthermore, one end of the cutting is slidably inserted into the positioning cavity, contact plates are symmetrically arranged on the upper inner wall and the lower inner wall of the positioning cavity, the upper end face and the lower end face of one end of the cutting are obliquely arranged, and the two inclined faces are respectively contacted with the contact plates.
Furthermore, a U-shaped mounting groove is formed in one side face of the limiting sleeve along the circumferential direction, and a circular conductive wire is welded in the U-shaped mounting groove.
Furthermore, the outside of U-shaped mounting groove is provided with the connecting block, contact on the connecting block extends to the inside and the circular conductor wire contact of U-shaped mounting groove.
The invention has the following beneficial effects:
1. according to the invention, a good heat dissipation effect can be achieved through the arrangement of the first vertical through hole and the second vertical through hole, and the arrangement of the first heat dissipation hole and the second heat dissipation hole which are communicated with the first vertical through hole facilitates the contact of air and a circuit board layer, so that the quick contact of heat and air is realized.
2. According to the invention, the contact and the contact sheet at the two ends of the Z-shaped connecting strip are respectively in contact with the round conductive wire and the inserting strip, so that the two circuit board layers can be electrified, the relative rotation of the two circuit board layers can be realized through the matching arrangement between the connecting plate and the connecting column, the bending angle is greatly increased, the circuit board can be bent towards two sides simultaneously, and the practicability is wider.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an assembly view of FIG. 1;
FIG. 3 is a schematic view of the overall structure of the connecting sleeve and the circuit board body in the invention;
FIG. 4 is an exploded view of FIG. 3;
FIG. 5 is a schematic view of the internal structure of the socket of the present invention;
FIG. 6 is an exploded view of the Z-shaped connecting bar and connecting sleeve of the present invention;
FIG. 7 is a sectional view of the connecting sleeve of the present invention;
FIG. 8 is a schematic view showing the overall structure of the Z-shaped connecting strip of the present invention;
FIG. 9 is a cross-sectional view of FIG. 8;
FIG. 10 is a cross-sectional view of an insulation wythe of the present invention;
FIG. 11 is a schematic view of the overall structure of the cutting of the present invention;
FIG. 12 is a schematic view of the overall structure of the circular mounting post of the present invention;
FIG. 13 is a schematic view of the overall configuration of the contact and round conductive wire of the present invention in mating relationship;
in the drawings, the components represented by the respective reference numerals are listed below:
1. a circular mounting post; 2. connecting sleeves; 3. a circuit board body; 4. a second screw; 5. a first screw; 6. a Z-shaped connecting strip; 7. an insulating sleeve; 8. cutting; 9. a circular conductive wire; 12. connecting columns; 21. a connecting plate; 31. a circuit board layer; 32. an insulating board layer; 33. a hot melt layer; 101. a limiting sleeve; 102. a U-shaped mounting groove; 201. a first L-shaped slot; 202. a second L-shaped slot; 203. inserting a cavity; 204. a third mounting hole; 205. a horizontal slot; 601. connecting blocks; 602. a contact; 603. a positioning cavity; 604. a contact piece; 1201. a second mounting hole; 2101. a first mounting hole; 3201. a second heat dissipation hole; 3202. a first vertical through hole; 3203. a first heat dissipation hole; 3301. a second vertical through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "two sides", "extending direction", "up and down", "from inside to outside", "horizontal direction", "concentric arrangement", "alternate connection", "inner", "vertical direction", "outer", and the like indicate orientation or positional relationship and are only for convenience of description and simplicity of description, but do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention.
Example one
Referring to fig. 1-4, the invention relates to a bendable multi-layer printed circuit board, which comprises a circular mounting post 1, a connecting sleeve 2 and a circuit board body 3, wherein the circular mounting post 1 and the connecting sleeve 2 are made of insulating materials,
circuit board bodies 3 are symmetrically arranged on two sides of the circular mounting column 1, and a connecting sleeve 2 is fixedly sleeved on one end, close to the circular mounting column 1, of each circuit board body 3;
the round mounting column 1 is concentrically and fixedly sleeved with a connecting column 12, the outer side wall of the round mounting column 1 is uniformly provided with limiting sleeves 101 along the extending direction of the round mounting column 1, and the limiting sleeves 101 are made of insulating materials;
the circuit board body 3 comprises a circuit board layer 31, a hot melt layer 33 and an insulation board layer 32, wherein the hot melt layer 33 is made of hot melt adhesive, the circuit board layer 31 and the insulation board layer 32 can be pressed together under the condition of high temperature, and the hot melt layer 33 and the circuit board layer 31 are sequentially and symmetrically arranged from inside to outside above and below the insulation board layer 32;
first vertical through holes 3202 are uniformly distributed on the insulation board layer 32, second vertical through holes 3301 are uniformly distributed on the hot melt layer 33, the first vertical through holes 3202 and the second vertical through holes 3301 are vertically aligned, and the arrangement of the first vertical through holes 3202 and the second vertical through holes 3301 can dissipate heat of the circuit board layer 31;
the end, close to the connecting sleeve 2, of the circuit board layer 31 is uniformly welded with the inserting strips 8, the inserting strips 8 can be electrically connected with the circuits on the circuit board layer 31, and the inserting strips 8 above and below the insulating board layer 32 are arranged in a staggered mode;
as shown in fig. 5-9, one end of the connecting sleeve 2 is provided with an insertion cavity 203, the insertion cavity 203 is used for connecting the connecting sleeve 2 and the circuit board body 3, first L-shaped slots 201 are uniformly distributed on the upper end of the inner wall of the connecting sleeve 2 on one side of the insertion cavity 203 along the horizontal direction, and second L-shaped slots 202 are vertically and one by one aligned with the first L-shaped slots 201 on the lower end of the inner wall of the connecting sleeve 2;
z-shaped connecting strips 6 are fixedly sleeved in connecting grooves formed by the first L-shaped clamping groove 201 and the transverse slot 205 and connecting grooves formed by the second L-shaped clamping groove 202 and the transverse slot 205, two adjacent Z-shaped connecting strips 6 are arranged in an up-down symmetrical mode, the Z-shaped connecting strips 6 are used for conducting electricity, and the adjacent Z-shaped connecting strips 6 are arranged in an up-down symmetrical mode, so that the simultaneous electrification of the multilayer circuit board layer 31 can be realized;
wherein, one of Z shape connecting strip 6 is served and is provided with location chamber 603, and the setting of location chamber 603 can be used for the electric connection between cutting 8 and the Z shape connecting strip 6, is provided with connecting block 601 on another terminal surface one side of Z shape connecting strip 6 simultaneously, and connecting block 601 one side surface central point puts and is provided with contact 602, and the setting of contact 602 is used for with circular conductor line 9 connection on the circular erection column 1.
Referring to fig. 1-2, the connecting plates 21 are disposed on both sides of the end surface of the connecting sleeve 2 close to the circular mounting post 1, a first mounting hole 2101 is disposed on one end of the connecting plate 21, and the first mounting hole 2101 is used for matching with the connecting post 12, which facilitates the rotation of the circuit board body 3 around the center of the circular mounting post 1.
All be provided with second mounting hole 1201 on two terminal surfaces of spliced pole 12, the screw fit has first screw 5 in the second mounting hole 1201, and the setting of first screw 5 can play spacing effect to connecting plate 21 on spliced pole 12.
Referring to fig. 3-4, one end of the circuit board body 3 is sleeved in the plug cavity 203, and an insulating sleeve 7 is sleeved between the plug cavity 203 and the circuit board body 3, and the insulating sleeve 7 can be arranged before the circuit board body 3 and the connecting sleeve 2.
Third mounting holes 204 are formed in the two side faces of the connecting sleeve 2 in an aligned mode, second screws 4 are spirally matched in the third mounting holes 204, one ends of the second screws 4 are in contact with the outer wall of the insulating sleeve 7, and the second screws 4 can fix the connecting sleeve 2 on the circuit board body 3.
Referring to fig. 10, first heat dissipation holes 3203 are uniformly distributed in the insulating board layer 32 along the vertical direction, second heat dissipation holes 3201 are uniformly distributed in the insulating board layer 32 along the horizontal direction, first vertical through holes 3202 are distributed at intersections of the first heat dissipation holes 3203 and the second heat dissipation holes 3201, and the first heat dissipation holes 3203 and the second heat dissipation holes 3201 are communicated with the first vertical through holes 3202 for contacting the air circuit board layer 31, thereby improving heat dissipation efficiency.
Referring to fig. 9 and 11, one end of the inserting bar 8 is slidably inserted into the positioning cavity 603, the upper and lower inner walls of the positioning cavity 603 are symmetrically provided with contact pieces 604, the upper and lower end surfaces of one end of the inserting bar 8 are both inclined, the two inclined surfaces are respectively contacted with the contact pieces 604, the contact pieces 604 are elastic metal pieces, and the stability of the connection between the inserting bar 8 and the Z-shaped connecting bar 6 is improved by elasticity.
Referring to fig. 12-13, a U-shaped mounting groove 102 is formed on one side surface of the position limiting sleeve 101 along the circumferential direction, the circular conductive wires 9 are welded in the U-shaped mounting groove 102, and the U-shaped mounting groove 102 can protect the circular conductive wires 9 and prevent the adjacent circular conductive wires 9 from being short-circuited.
The outer side of the U-shaped mounting groove 102 is provided with a connecting block 601, the contacts 602 on the connecting block 601 extend to the inside of the U-shaped mounting groove 102 to be contacted with the circular conductive wires 9, and the contacts 602 on two sides of the circular mounting column 1 are respectively contacted with the circular conductive wires 9, so that the two circuit board bodies 3 can be electrified.
Example two
Based on the multilayer printed circuit board described in the first embodiment, in actual use, the two circuit board bodies 3 can be rotated by taking the circular mounting column 1 as a circle center, so that the mounting of bending at different angles can be realized.
In addition, N circular mounting posts 1 are arranged between the circuit board bodies 3, and N is more than or equal to 1.
For the multi-layer printed circuit board of the first embodiment, the insulating material is a high temperature resistant material, such as polyimide.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. The utility model provides a multilayer printed wiring board that can buckle, includes circular erection column (1), adapter sleeve (2) and circuit board body (3), its characterized in that:
circuit board bodies (3) are symmetrically arranged on two sides of the circular mounting column (1), and a connecting sleeve (2) is fixedly sleeved on one end, close to the circular mounting column (1), of each circuit board body (3);
the mounting structure comprises a circular mounting column (1), a connecting column (12) and limiting sleeves (101), wherein the connecting column (12) is concentrically and fixedly sleeved on the circular mounting column (1), and the limiting sleeves (101) are uniformly distributed on the outer side wall of the circular mounting column (1) along the extending direction of the circular mounting column (1);
the circuit board body (3) comprises a circuit board layer (31), a hot melting layer (33) and an insulation board layer (32), wherein the hot melting layer (33) and the circuit board layer (31) are sequentially and symmetrically arranged from inside to outside above and below the insulation board layer (32);
first vertical through holes (3202) are uniformly distributed on the insulating plate layer (32), second vertical through holes (3301) are uniformly distributed on the hot melting layer (33), and the first vertical through holes (3202) and the second vertical through holes (3301) are vertically aligned;
the plug strips (8) are uniformly welded on one end, close to the connecting sleeve (2), of the circuit board layer (31), and the plug strips (8) on the upper side and the lower side of the insulating board layer (32) are arranged in a staggered mode;
an inserting cavity (203) is formed in one end of the connecting sleeve (2), first L-shaped clamping grooves (201) are uniformly distributed in the upper end of the inner wall of the connecting sleeve (2) on one side of the inserting cavity (203) along the horizontal direction, and second L-shaped clamping grooves (202) are formed in the lower end of the inner wall of the connecting sleeve (2) and the first L-shaped clamping grooves (201) in an up-and-down one-to-one alignment mode;
horizontal slots (205) are uniformly distributed in the side center position of the connecting sleeve (2) close to the circular mounting column (1) along the horizontal direction, the first L-shaped clamping groove (201) and the second L-shaped clamping groove (202) are symmetrically arranged up and down, and the communication end of the first L-shaped clamping groove (201) and the second L-shaped clamping groove (202) is communicated with one end of each horizontal slot (205);
z-shaped connecting strips (6) are fixedly sleeved in connecting grooves formed by the first L-shaped clamping groove (201) and the transverse slot (205) and connecting grooves formed by the second L-shaped clamping groove (202) and the transverse slot (205), and two adjacent Z-shaped connecting strips (6) are arranged in an up-and-down symmetrical mode;
one end of the Z-shaped connecting strip (6) is provided with a positioning cavity (603), the other end face side of the Z-shaped connecting strip (6) is provided with a connecting block (601), and the center of the outer surface of one side of the connecting block (601) is provided with a contact (602).
2. A bendable multi-layer printed wiring board according to claim 1, wherein the connecting sleeve (2) has connecting plates (21) on both sides of the end surface near the circular mounting post (1), and a first mounting hole (2101) is provided on one end of the connecting plates (21), and the first mounting hole (2101) is used to cooperate with the connecting post (12).
3. A bendable multilayer printed wiring board according to claim 1, wherein the connecting post (12) is provided with second mounting holes (1201) on both end faces, and the second mounting holes (1201) are screw-fitted with first screws (5).
4. A flexible multilayer printed wiring board according to claim 1, wherein one end of the board body (3) is fitted in the cavity (203), and an insulating sleeve (7) is fitted between the cavity (203) and the board body (3).
5. A bendable multilayer printed wiring board according to claim 4, wherein the connecting sleeve (2) is provided with third mounting holes (204) on two sides in alignment, the third mounting holes (204) are spirally fitted with the second screws (4), and one end of the second screws (4) is in contact with the outer wall of the insulating sleeve (7).
6. The foldable multi-layer printed circuit board of claim 1, wherein the inside of the insulation board layer (32) is uniformly provided with first heat dissipation holes (3203) along a vertical direction, and the inside of the insulation board layer (32) is uniformly provided with second heat dissipation holes (3201) along a horizontal direction, and the first vertical through holes (3202) are distributed at the intersection points of the first heat dissipation holes (3203) and the second heat dissipation holes (3201).
7. A bendable multilayer printed wiring board according to claim 1, wherein one end of the strip (8) is slidably inserted into the positioning cavity (603), the upper and lower inner walls of the positioning cavity (603) are symmetrically provided with contact pieces (604), the upper and lower end surfaces of one end of the strip (8) are both inclined, and the two inclined surfaces are respectively in contact with the contact pieces (604).
8. A bendable multilayer printed wiring board according to claim 1, wherein a U-shaped mounting groove (102) is provided on one side surface of the position-limiting sleeve (101) along the circumferential direction, and the circular conductive wire (9) is soldered in the U-shaped mounting groove (102).
9. A bendable multilayer printed wiring board according to claim 8, wherein the outside of the U-shaped mounting groove (102) is provided with a connecting block (601), and the contact (602) on the connecting block (601) extends to the inside of the U-shaped mounting groove (102) to be contacted with the round conductive wire (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010200605.0A CN111432548B (en) | 2020-03-20 | 2020-03-20 | Multilayer printed wiring board that can buckle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010200605.0A CN111432548B (en) | 2020-03-20 | 2020-03-20 | Multilayer printed wiring board that can buckle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111432548A CN111432548A (en) | 2020-07-17 |
| CN111432548B true CN111432548B (en) | 2021-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010200605.0A Active CN111432548B (en) | 2020-03-20 | 2020-03-20 | Multilayer printed wiring board that can buckle |
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| Country | Link |
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| CN (1) | CN111432548B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584613B (en) * | 2021-01-08 | 2022-11-18 | 深圳市欣润实业有限公司 | Multilayer high strength circuit board that can buckle according to in service behavior |
| CN113473705B (en) * | 2021-07-16 | 2022-02-15 | 定颖电子（昆山）有限公司 | Circuit board capable of being folded at will |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231403A (en) * | 2001-02-02 | 2002-08-16 | Oki Electric Ind Co Ltd | Connector device |
| CN1537408A (en) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | Portable apparatus |
| CN209218447U (en) * | 2018-08-24 | 2019-08-06 | 深圳市昶东鑫线路板有限公司 | It is a kind of can high efficiency and heat radiation pcb board |
-
2020
- 2020-03-20 CN CN202010200605.0A patent/CN111432548B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231403A (en) * | 2001-02-02 | 2002-08-16 | Oki Electric Ind Co Ltd | Connector device |
| CN1537408A (en) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | Portable apparatus |
| CN209218447U (en) * | 2018-08-24 | 2019-08-06 | 深圳市昶东鑫线路板有限公司 | It is a kind of can high efficiency and heat radiation pcb board |
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| Publication number | Publication date |
|---|---|
| CN111432548A (en) | 2020-07-17 |
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