CN111417281A - Electronic device - Google Patents
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- Publication number
- CN111417281A CN111417281A CN201910008101.6A CN201910008101A CN111417281A CN 111417281 A CN111417281 A CN 111417281A CN 201910008101 A CN201910008101 A CN 201910008101A CN 111417281 A CN111417281 A CN 111417281A
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- Prior art keywords
- heat dissipation
- circuit board
- processing unit
- electronic device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides an electronic device which comprises a circuit board, a processing unit, a heat dissipation module and a fixing module. The circuit board comprises a first surface and a second surface. The processing unit is arranged on the first surface and electrically connected to the circuit board. The heat dissipation module comprises a heat conduction plate covering the processing unit and a plurality of heat dissipation fins arranged on the heat conduction plate at intervals. The fixing module comprises a base and an elastic fixing ring. The base is arranged on the second surface of the circuit board and is provided with a frame body abutting against the second surface and two support arms extending from two opposite sides of the frame body. The elastic fixing ring is provided with two extension sections which are arranged at intervals, pass through the gaps among the radiating fins, abut against the heat conducting plate and extend to the second surface of the circuit board, and two sleeving sections which are connected with the extension sections and are respectively sleeved on the support arms of the base in a detachable mode.
Description
Technical Field
The present invention relates to an electronic device, and more particularly, to an electronic device having heat dissipation fins that can achieve an active enlargement of a heat dissipation module and ensure a wiring space on a circuit board.
Background
In addition to more and more functions, the performance of the present electronic products is more and more powerful, and the overall appearance of the electronic products is also evolving towards the concept of being light, thin, short and small. Under the condition of limited internal space of the electronic product, the circuit board in the electronic product is correspondingly designed to be minimized, and the specification and the size of the processing chip on the circuit board are correspondingly designed to be maximized in order to achieve higher efficiency, so that the size of the heat dissipation plate on the processing chip and the circuit wiring space are restricted. For example, as the size of the processing chip increases, the performance increases, and the power and heat generation amount also increase, the heat dissipation plate disposed on the processing chip can also preferably cover the processing chip as completely as possible to achieve the best heat dissipation effect. Most of the conventional heat sinks require a specific fixing mechanism to fix the heat sink to the processing chip. The conventional fixing mechanism includes, for example, forming a through hole on the circuit board, and inserting a plastic stud into the heat dissipation plate and the through hole to fix the heat dissipation plate and the circuit board relatively, or, for example, installing two anchor hooks on the circuit board, and binding the heat dissipation plate with a spring wire having two ends respectively connected to the anchor hooks. However, in either case, a space where wiring cannot be performed is formed on the circuit board, and the size and shape of the processing chip are limited. To maximize the performance of the processing chip on the circuit board with limited area, it is a subject to be achieved by the circuit designer to increase the heat dissipation plate coverage area and to ensure the wiring space of the circuit board.
Disclosure of Invention
The present invention is directed to an electronic device having heat dissipation fins, which can achieve an increase in the size of a heat dissipation module and ensure a wiring space on a circuit board.
In order to solve the above technical problem, an electronic device includes a circuit board, a processing unit, a heat dissipation module and a fixing module. The circuit board comprises a first surface and a second surface which are positioned on the opposite sides, and two side edges which are positioned on the opposite sides and connected with the first surface and the second surface. The processing unit is arranged on the first surface and electrically connected to the circuit board. The heat dissipation module comprises a heat conduction plate covering the processing unit and a plurality of heat dissipation fins arranged on the heat conduction plate at intervals, and the heat dissipation fins define a plurality of gaps. The fixing module is sleeved on the circuit board and the heat dissipation module so as to enable the heat dissipation module to be tightly pressed on the processing unit, and comprises a base and an elastic fixing ring. The base is arranged on the second surface of the circuit board and is provided with a frame body which is abutted against the second surface and two support arms which extend from two opposite sides of the frame body. The elastic fixing ring is provided with two extension sections which are arranged at intervals, pass through the gaps, abut against the heat conducting plate and extend to the second surface of the circuit board, and two sleeving sections which are connected with the extension sections and are separately sleeved on the support arms of the base respectively.
Preferably, the processing unit includes a first processor and a plurality of second processors having a thickness smaller than that of the first processor, the heat-conducting plate is attached to the first processor, and the frame body is annular and is disposed at a position corresponding to the first processor.
Preferably, the frame body has at least one connecting rod portion surrounding in a ring shape, and a shoulder pad portion disposed on the connecting rod portion and abutting against the second surface to make the connecting rod portion and the second surface form a raised space.
Preferably, the frame body further has a plurality of connecting rod portions connected with each other to surround in a ring shape, and the shoulder pad portions are respectively disposed at the connection positions of two connecting rod portions.
Preferably, each support arm has two side lever portions spaced from each other and each connected to the frame body at one end thereof, and a cross-bar portion connected to the other end of the side lever portions, and each engaging section is engaged with and fixed to a joint between the side lever portions and the cross-bar portion.
Preferably, each side bar part has a side surface facing the second surface, and the side surface extends obliquely away from the second surface to a connection with the cross bar part.
Preferably, the elastic fixing ring further has two tension adjusting sections connected to the extending sections at intervals, and the tension adjusting sections can adjust the pressure applied to the heat dissipation module by the elastic fixing ring through different ones sleeved on the heat dissipation fins.
The invention also provides an electronic device which can not reduce the wiring space on the circuit board and comprises the circuit board, a processing unit, a heat dissipation module and an elastic fixing ring. The circuit board comprises a first surface and a second surface which are positioned on the opposite sides, and two side edges which are positioned on the opposite sides and connected with the first surface and the second surface. The processing unit is arranged on the first surface and electrically connected to the circuit board. The heat dissipation module comprises a heat conduction plate covering the processing unit and a plurality of heat dissipation fins arranged on the heat conduction plate at intervals, and the heat dissipation fins define a plurality of gaps. The elastic fixing ring is sleeved on the circuit board and the heat dissipation module and comprises two extension sections which are abutted against the second surface of the circuit board at intervals and extend to the heat conduction plate, and two sleeving sections which are connected with the extension sections and are respectively sleeved on the heat dissipation fins in a separable mode.
Preferably, the elastic fixing ring is made of silica gel.
Compared with the prior art, the electronic device of the invention needs to make holes on the circuit board or arrange the anchor hook seat on the circuit board to occupy the space capable of wiring, the fixing module of the electronic device of the invention is bent and sleeved on the heat dissipation module along the second surface of the circuit board and the side edge of the circuit board, thus not occupying the wiring space on the circuit board, and the heat dissipation module can also achieve full board design to optimize the heat dissipation effect.
[ description of the drawings ]
Fig. 1 is a perspective view of an electronic device according to a first embodiment of the invention.
Fig. 2 is a partially enlarged view of the first embodiment.
Fig. 3 is a bottom view of fig. 2.
Fig. 4 is an exploded perspective view illustrating a circuit board, a processing unit, a heat dissipation module and a fixing module according to the first embodiment.
Fig. 5 is a side view illustrating a plurality of link portions of a frame of the base spaced apart from the circuit board to form a raised space.
Fig. 6 is a top view illustrating the elastic fixing ring sleeved on the heat dissipation module.
Fig. 7 is a top view illustrating the two tension adjusting sections of the elastic fixing ring oppositely sleeved on the heat dissipating fins of the heat dissipating module.
Fig. 8 is a top view illustrating the two tension adjusting sections of the elastic fixing ring being reversely sleeved on the heat dissipating fins of the heat dissipating module.
Fig. 9 is a perspective view of an electronic device according to a second embodiment of the invention.
Fig. 10 is a perspective view of another angle of the second embodiment.
Fig. 11 is a top view illustrating a heat dissipation module of the second embodiment with an elastic fixing ring of the second embodiment sleeved thereon.
[ detailed description ] embodiments
Referring to fig. 1, a first embodiment of the electronic device 1 of the present invention may be embodied as an interface card, such as a display card, a network interface card, a memory, or a sound card, which is suitable for being electrically connected to a slot of a motherboard (not shown) through a PCIE bus system, for example, but not limited to the embodiment. Referring to fig. 2 to 4, the electronic device 1 of the first embodiment includes a circuit board 2, a processing unit 3, a heat dissipation module 4, and a fixing module 5.
The circuit board 2 is in a long plate shape and includes a first surface 21 and a second surface 22 on opposite sides, two first side edges 23 on opposite sides and connected to the first surface 21 and the second surface 22, and a second side edge 24 connected to the first side edges 23, and in this embodiment, the length of each first side edge 23 is greater than the length of the second side edge 24. In addition, the first surface 21 and the second surface 22 of the circuit board 2 may be actually provided with a plurality of other electronic components and circuits, but are not illustrated for simplifying the illustration.
The processing unit 3 is disposed on the first surface 21 and electrically connected to the circuit board 2, and includes a first processor 31 and four second processors 32 adjacent to the first processor 31. In the embodiment, the first processor 31 and the second processors 32 may be a microprocessor (Micro Control Unit), a Central processing Unit (Central processing Unit), a System on a Chip (System on a Chip), a substrate management controller (base management controller), a Graphics processing Unit (Graphics processing Unit), an Expander (Expander, for example, SAS Expander), and the like, and the processing performance, the heat productivity, the thickness, and the area of the first processor 31 are all greater than those of each of the second processors 32. However, the number and arrangement of the second processors 32 are not limited to the embodiment, and the embodiment may also be configured with only a single processor, and is not limited to the embodiment with a plurality of processors 31 and 32.
The heat dissipation module 4 is made of aluminum alloy and manufactured by CNC machining, and is used for heat dissipation of the processing unit 3. The heat dissipation module 4 is disposed on the processing unit 3 and includes a heat conducting plate 41 and a plurality of heat dissipation fins 42. The heat conducting plate 41 covers the processing unit 3, and in this embodiment, the heat conducting plate 41 is tightly attached to the thicker first processor 31 of the processing unit 3, and the second processors 32 are accommodated in the space between the heat conducting plate 41 and the circuit board 2 separated by the first processor 31. Since the second processors 32 generate a lower amount of heat, the second processors 32 do not need to be in direct contact with the heat conductive plate 41. In other embodiments, the space may further contain other electronic components, so as to improve the utilization rate of the space.
The heat dissipation fins 42 are disposed on the heat conduction plate 41 at intervals and define a plurality of gaps. In addition, referring to fig. 7, in detail, in the embodiment, the heat dissipation fins 42 are disposed on the heat conduction plate 41 in an array arrangement, and the gaps are divided into a plurality of first gaps 43 arranged at intervals along a first direction D1 and a plurality of second gaps 44 arranged at intervals along a second direction D2 perpendicular to the first direction D1, however, the arrangement of the heat dissipation fins 42 may be adjusted as required, and is not limited to the disclosure herein.
The fixing module 5 includes a base 51 and a resilient fixing ring 52. The base 51 is made of plastic and is integrally formed by injection molding, for example. The base 51 abuts against the second surface 22 of the circuit board 2 and includes a frame 511 and two arms 512 extending from two opposite sides of the frame 511. In the embodiment, the frame body 511 has four connecting rod portions 511a vertically connected to and surrounding the square shape, and four shoulder pad portions 511b respectively disposed at the connecting positions of the connecting rod portions 511a and facing the second surface 22. In other embodiments, the frame body 511 may have only one link portion 511a, and the shape surrounded by the link portion 511a may also be a circle or other polygonal shapes, and is not limited to a square shape. In addition, referring to fig. 5, the shoulder portions 511b abut against the second surface 22, so that the connecting rod portions 511a and the second surface 22 form a raised space 511 c. By the design of the shoulder pad portions 511b, the link portions 511a do not directly contact the second surface 22. That is, in the embodiment, the contact area of the base 51 occupying the second surface 22 is only the sum of the areas of the four shoulder portions 511b, so as to greatly increase the space (for example, routing circuits or disposing electronic components such as capacitors and resistors) used by the second surface 22, wherein the positions of the shoulder portions 511b correspond to the positions of the four end points of the first processor 31, and the shape of the connecting rod portion 511a is not limited to a square shape, as long as the shoulder portions 511b can be disposed so that the positions thereof correspond to the positions of the end points of the electronic components (for example, the first processor 31) that mainly dissipate heat, and the height-up space 511c is suitable for accommodating the electronic components (not shown) on the second surface 22 of the circuit board 2, so that the electronic components can be hidden between the connecting rod portions 511a and the second surface 22.
Each arm 512 of the base 51 has two side bars 512a spaced apart from each other and each connected to the frame 511 at one end thereof, and a cross bar 512b connected to the other ends of the side bars 512 a. In the present embodiment, the side rods 512a are vertically connected to the connecting rods 511a, and the cross rods 512b are vertically connected to the side rods 512a, but the disclosure of the present embodiment is not limited thereto. Each side rod portion 512a has a side surface 512c facing the second surface 22, and a connection portion of the side surface 512c and the frame body 511 extends a short distance and then extends obliquely to a connection portion with the cross rod portion 512b in a direction away from the second surface 22, so that a shortest distance between the cross rod portion 512b and the second surface 22 is greater than a shortest distance between the connecting rod portions 511a and the second surface 22.
The elastic fixing ring 52 is generally oval and has two extending sections 521, two sleeving sections 522, and two tension adjusting sections 523. Referring to fig. 5 and fig. 6, the extending sections 521 extend and stretch toward the first side edges 23 respectively, pass through two rows of the first gaps 43 in parallel, abut against the heat conducting plate 41, and extend to the second surface 22 of the circuit board 2 to be close to the first side edges 23. The socket sections 522 are respectively connected to two ends of the extending sections 521, and respectively detachably socket the support arms 512 of the base 51. In the present embodiment, each engaging section 522 is engaged with the connecting portion between the side rod portions 512a and the cross rod portion 512b fixed on one side of the frame body 511, and the portion of each engaging section 522 above the side surfaces 512c is accommodated in the elevated space 511 c. By sleeving the sleeving sections 522 on the bases 51, the stretched extension sections 521 generate elastic contraction force to drive the sleeving sections 522 to pull the base 51 to press and fix the base in the direction of the second surface 22, and the extension sections 521 simultaneously press the heat conducting plate 41 of the heat dissipation module 4 in the direction of the first surface 21, so that the heat conducting plate 41 is more tightly pressed on the first processor 31, thereby achieving better heat conduction effect. Because the fixing module 5 only occupies a part of the area contacting the second surface 22 on the circuit board 2, that is, the contact area occupied by the shoulder pad 551b contacting the second surface 22, and the fixing module 5 fixes the heat dissipation module 4 along the first side edges 23, the fixing module does not occupy the space on the first surface 21 of the circuit board 2, the area proportion of the processing unit 3 occupying the circuit board can be maximized, and the wiring space is larger than that of the conventional interface card in which the heat dissipation module 4 is installed in other manners. In addition, the heat dissipation module 4 can also be designed to be full, so that the side of the heat conduction plate 41 is almost aligned with the first side edges 23 and the second side edges 24 of the circuit board 2, and the heat dissipation fins 42 are divided into the area proportion of the heat dissipation plate 41, and can also be maximized without planning the area on the heat dissipation plate 41 where no heat dissipation fins 42 are required to be arranged in order to reserve the space of the fixing member, thereby obtaining a better heat dissipation effect. Furthermore, the material of the elastic fixing ring 52 is silicon in the present embodiment, and the material characteristic thereof is not only an electrical insulator, but also can resist a high temperature of 220 ℃, and will not expand or contract due to a large change in temperature. The temperature of the heat dissipation module 4 in the operating ic is about 50 to 70 degrees celsius, so that the elastic fixing ring 52 made of silicon rubber is not prone to elastic fatigue or high temperature embrittlement due to temperature effects after long-term use.
The tension adjusting segments 523 are connected to the extending segments 521 in parallel and pass through two rows of the second gaps 44 and abut against the heat conducting plate 41. Under normal conditions, the tension adjusting segments 523 will not generate interaction force with the heat dissipating fins 42. Referring to fig. 7 and 8, since the electronic device 1 needs to undergo various reliability tests before leaving the factory, including a heat dissipation capability test and a vibration test, the pressure of the heat dissipation module 4 against the processing unit 3 needs to reach a predetermined value. When the fixing module 5 is applied to the electronic device 1 of different embodiments, the elastic fixing ring 52 may be stretched to different degrees due to different widths (the length of the second side edge 24 of the circuit board 2), so that the pressure of the heat dissipation module 4 pressing against the processing unit 3 may deviate and may not reach the predetermined value. Therefore, the tension adjusting sections 523 can elastically adjust the pressure applied by the elastic fixing ring 52 to the heat dissipation module 4 through different ones of the heat dissipation fins 42. For clarity, a first extension 521a is defined as a portion of each extension 521 between the tensioning sections 523, and a second extension 521b is defined as a portion of each extension 521 between the tensioning section 523 and the sleeve section 522. When the pressure of the heat dissipation module 4 pressing against the processing unit 3 is detected to be lower than the predetermined value, the tension adjusting segments 523 can be moved toward each other to positions closer to the center of the heat conducting plate 41 and closer to each other as shown in fig. 7 to be sleeved on the heat dissipation fins 42, so that the distance between the tension adjusting segments 523 is smaller, the first extending segments 521a become looser, the second extending segments 521b become tighter, the sleeve segments 522 respectively connected to the second extending segments 521b become tighter due to the linkage effect, and the base 51 pulled and lifted corresponding to the sleeve segments 522 is pressed against the second surface 22, thereby increasing the pressure of the heat dissipation module 4 pressing against the processing unit 3. On the contrary, when the pressure of the heat dissipation module 4 pressing against the processing unit 3 is detected to be higher than the predetermined value, the tension adjusting sections 523 can be moved in opposite directions to the positions farther from the center of the heat conducting plate 41 and farther from each other as shown in fig. 8 to be sleeved on the heat dissipation fins 42, so that the distance between the tension adjusting sections 523 is larger, the first extending sections 521a become tighter, the second extending sections 521b become looser, the linking effect respectively causes the sleeving sections 522 connected with the corresponding second extending sections 521b to become looser, thereby reducing the pressing force of the heat dissipation module 4 pressing against the processing unit 3, and the base 51 looser the second surface 22. In addition, compared with the conventional fixing mechanism which is mostly disassembled or installed by means of a screwdriver or other tools, the fixing module 5 of the electronic device 1 can be directly disassembled and installed by hands, so that the convenience of assembly is improved.
Referring to fig. 9 to 11, an electronic device 1 according to a second embodiment of the present invention includes a circuit board 2, a processing unit 3, a heat dissipation module 4, and a fixing module 5. The circuit board 2, the processing unit 3 and the heat sink module 4 of the second embodiment are the same as those of the first embodiment, except that the fixing module 5 of the second embodiment only includes an elastic fixing ring 52 similar to that of the first embodiment. The elastic fixing ring 52 is sleeved on the circuit board 2 and the heat dissipation module 4, and includes two extending sections 521 abutting against the second surface 22 of the circuit board 2 at intervals and extending to the heat conduction plate 41 of the heat dissipation module 4 in the direction of the two first side edges 23 of the circuit board 2, and two sleeving sections 522 connected to the extending sections 521 and detachably sleeved on the heat dissipation fins 42 of the heat dissipation module 4 respectively. That is, the elastic fixing ring 52 of the second embodiment fixes the heat dissipation module 4 from the second surface 22 of the circuit board 2 to the upper side, so that the heat dissipation module 4 is tightly pressed against the processing unit 3. When the pressure of the heat dissipation module 4 against the processing unit 3 is detected to be lower than a predetermined value, the sleeving sections 522 are moved toward the heat dissipation fins 42 located at the center of the heat conduction plate 41 in opposite directions to a distance where the sleeving sections 522 are closer to each other and then sleeved on the corresponding positions of the heat dissipation fins 42, so as to increase the pressure of the heat dissipation module 4 against the processing unit 3. On the contrary, when the pressure of the heat dissipation module 4 pressing against the processing unit 3 is detected to be higher than the preset value, the sleeving sections 522 are moved reversely to the heat dissipation fins 42 away from the center of the heat conduction plate 41 to the distance between the sleeving sections 522 and then sleeved on the corresponding positions of the heat dissipation fins 42, so as to reduce the pressure of the heat dissipation module 4 pressing against the processing unit 3.
In summary, the fixing module 5 of the electronic device 1 of the present invention is bent along the second surface 22 of the circuit board 2 and the second side edge 24 of the circuit board 2 and is disposed on the heat dissipation module 4, so that the fixing module does not occupy the wiring space on the circuit board 2, and the processing unit 3 and the heat dissipation module 4 can also be designed to be full, thereby optimizing the performance and heat dissipation effect, and thus the objective of the present invention can be achieved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An electronic device, comprising:
a circuit board including a first surface and a second surface on opposite sides;
a processing unit disposed on the first surface and electrically connected to the circuit board;
the heat dissipation module comprises a heat conduction plate covering the processing unit and a plurality of heat dissipation fins which are arranged on the heat conduction plate at intervals, and a plurality of gaps are defined by the heat dissipation fins; and
a fixing module, which is sleeved on the circuit board and the heat dissipation module to make the heat dissipation module tightly pressed on the processing unit, the fixing module includes:
a base arranged on the second surface of the circuit board and having a frame body abutting against the second surface, two support arms extending from two opposite sides of the frame body, and
the elastic fixing ring is provided with two extension sections which pass through the gaps among the radiating fins at intervals and can separately press the heat conducting plate and extend to the second surface of the circuit board, and two sleeving sections which are connected with the extension sections and can separately and respectively sleeved on the support arms of the base.
2. The electronic device of claim 1, wherein the processing unit comprises a first processor and at least one second processor having a thickness smaller than that of the first processor, the heat-conducting plate covers the first processor and the second processor and is attached to the first processor, and the frame body is disposed at a position corresponding to the first processor.
3. The electronic device of claim 1, wherein the frame body has at least one link portion and at least one shoulder pad portion disposed on the link portion and abutting against the second surface to separate the link portion and the second surface into a raised space.
4. The electronic device as claimed in claim 3, wherein the frame has a plurality of link portions connected to each other around a ring shape, and the shoulder pad portions are respectively disposed at the connection positions of two link portions.
5. The electronic device of claim 1, wherein each supporting arm has two side lever portions spaced apart from each other and each connected to the frame body at one end thereof, and a cross bar portion connected to the other end of the side lever portions, and each engaging portion is engaged with and fixed to a connecting portion between the side lever portions and the cross bar portion.
6. The electronic device as claimed in claim 5, wherein each side bar portion has a side surface facing the second surface, and the side surface extends obliquely away from the second surface to a connection with the cross bar portion.
7. The electronic device of claim 1, wherein the resilient fastening ring further comprises two tension adjusting sections connected to the extending sections at intervals, and the tension adjusting sections can adjust the pressure applied to the heat sink module by the resilient fastening ring through different ones of the heat sink fins.
8. The electronic device of claim 1, wherein the elastic fixing ring is made of silicone.
9. An electronic device, comprising:
a circuit board including a first surface and a second surface on opposite sides;
a processing unit disposed on the first surface and electrically connected to the circuit board;
the heat dissipation module comprises a heat conduction plate covering the processing unit and a plurality of heat dissipation fins which are arranged on the heat conduction plate at intervals; and
the elastic fixing ring is sleeved on the circuit board and the heat dissipation module and comprises two extension sections which are abutted against the second surface of the circuit board at intervals and extend to the heat conduction plate, and two sleeving sections which are connected with the extension sections and are separably sleeved on the heat dissipation fins respectively so that the heat dissipation module is tightly pressed on the processing unit, and the sleeving sections can adjust the pressure applied to the heat dissipation module by the elastic fixing ring through different ones sleeved on the heat dissipation fins.
10. The electronic device of claim 9, wherein the elastic fixing ring is made of silicone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008101.6A CN111417281A (en) | 2019-01-04 | 2019-01-04 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008101.6A CN111417281A (en) | 2019-01-04 | 2019-01-04 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111417281A true CN111417281A (en) | 2020-07-14 |
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ID=71494086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910008101.6A Pending CN111417281A (en) | 2019-01-04 | 2019-01-04 | Electronic device |
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| CN (1) | CN111417281A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2333143Y (en) * | 1998-06-16 | 1999-08-11 | 皇品工业有限公司 | Buckle of integrated circuit cooling fin |
| CN101267723A (en) * | 2007-03-16 | 2008-09-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN101742833A (en) * | 2008-11-20 | 2010-06-16 | 英业达股份有限公司 | Electronic device |
| CN103687403A (en) * | 2012-09-24 | 2014-03-26 | 特拉博斯股份有限公司 | Circuit board system comprising spring fastened element |
| CN103988591A (en) * | 2011-11-21 | 2014-08-13 | 汤姆逊许可公司 | Hold down for retaining a heat sink |
-
2019
- 2019-01-04 CN CN201910008101.6A patent/CN111417281A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2333143Y (en) * | 1998-06-16 | 1999-08-11 | 皇品工业有限公司 | Buckle of integrated circuit cooling fin |
| CN101267723A (en) * | 2007-03-16 | 2008-09-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN101742833A (en) * | 2008-11-20 | 2010-06-16 | 英业达股份有限公司 | Electronic device |
| CN103988591A (en) * | 2011-11-21 | 2014-08-13 | 汤姆逊许可公司 | Hold down for retaining a heat sink |
| CN103687403A (en) * | 2012-09-24 | 2014-03-26 | 特拉博斯股份有限公司 | Circuit board system comprising spring fastened element |
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