CN111417043A - Can test and join in marriage earphone - Google Patents
Can test and join in marriage earphone Download PDFInfo
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- CN111417043A CN111417043A CN202010209003.1A CN202010209003A CN111417043A CN 111417043 A CN111417043 A CN 111417043A CN 202010209003 A CN202010209003 A CN 202010209003A CN 111417043 A CN111417043 A CN 111417043A
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- 238000012360 testing method Methods 0.000 title claims description 13
- 238000012545 processing Methods 0.000 claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- 238000012795 verification Methods 0.000 abstract 1
- 206010011878 Deafness Diseases 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 208000016354 hearing loss disease Diseases 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 231100000888 hearing loss Toxicity 0.000 description 2
- 230000010370 hearing loss Effects 0.000 description 2
- 238000012074 hearing test Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 102000006822 Agouti Signaling Protein Human genes 0.000 description 1
- 108010072151 Agouti Signaling Protein Proteins 0.000 description 1
- 238000012076 audiometry Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 231100000895 deafness Toxicity 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1041—Mechanical or electronic switches, or control elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Telephone Function (AREA)
Abstract
The invention relates to a fitting earphone, and belongs to the field of sound adjustment. The fitting earphone comprises a sound processing module and one or more than one sound generating unit connected to the sound processing module, wherein when the number of the sound processing module is one, the sound processing module is connected with two replaceable sound generating units through a frequency dividing circuit; when the number of the sound processing modules is more than one, each sound processing module is connected with a replaceable sound production unit. The invention has the advantages that the voice unit which can be replaced can realize the verification and configuration aiming at the personal characteristics of the user, and the requirement of the user on personalized use is met.
Description
Technical Field
The invention relates to a fitting earphone, and belongs to the field of sound adjustment.
Background
The earphone is characterized in that two small loudspeakers are hung on two sides of the head, and the sound field heard by ears has spatial sense, reality sense and telepresence sense which are different. In order to improve the condition that the auditory sense of the earphone is more consistent with the physiological and psychological characteristics of people, the existing earphone is required to be subjected to sound adjustment, each frequency band is adjusted in advance according to the expected playing sound characteristics so as to improve the tone and tone quality of sound playing, and a user selects different adjustment scheme products according to the requirements. The user cannot perform personalized adjustment according to the hearing condition of the user, cannot adapt to the use of people with hearing deficiency, and cannot meet the personalized requirements of the user.
Disclosure of Invention
The invention aims to provide a fitting earphone capable of matching personalized use requirements of different users by replacing a sound production unit.
In order to achieve the purpose, the invention provides the following technical scheme: an earphone capable of being matched in an experience mode comprises a sound processing module and sound generating units connected to the sound processing module, wherein the number of the sound processing module is one or more than one, and when the number of the sound processing module is one, the sound processing module is connected with two replaceable sound generating units through a frequency dividing circuit; when the number of the sound processing modules is more than one, each sound processing module is connected with a replaceable sound production unit.
Furthermore, the sound processing module comprises a driving power supply, a switching button, an audio interface, a data communication interface and an audiology chip, wherein the driving power supply, the switching button, the audio interface and the sound generating unit are electrically connected with the audiology chip.
Further, the frequency dividing circuit comprises a first frequency modulation circuit and a second frequency modulation circuit which are connected to different sound production units.
Further, the first frequency modulation circuit comprises an adjustable resistor R1 and a capacitor C1 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C1 and the negative pole of the capacitor C1.
Further, the second frequency modulation circuit comprises an adjustable resistor R2 and a capacitor C2 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C2 and the negative pole of the capacitor C2.
Furthermore, a plurality of sound modes are preset in the audiology chip, and the sound modes are switched through the switching button.
Furthermore, the number of the sound processing modules is 2, and each sound processing module is connected with a sound production unit.
Further, the sound production unit is replaced according to the test result of the hearing condition of the user.
Further, the audiological chip is a HAP150 chip.
Further, the audiological chip reads or writes the content after modification through communication software conforming to the I2C protocol.
The invention has the beneficial effects that: the testable earphone comprises a sound processing module and a sound generating unit connected to the sound processing module, and the testable earphone can be tested and configured aiming at the personal characteristics of a user through the sound generating unit which can be arranged in a replaceable manner, so that the requirement of the user on personalized use is met.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic view of the overall structure of the fittable headset according to the present invention.
Fig. 2 is a schematic diagram of a pin structure of the audiological chip HAP150 in fig. 1.
Fig. 3 is a pin definition diagram of the audiological chip HAP150 in fig. 1.
Fig. 4 is a schematic structural diagram of the first embodiment of the fittable headset.
Fig. 5 is a schematic structural diagram of a fittable headset in the second embodiment.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1, in a preferred embodiment of the present invention, a fittable headset includes a sound processing module 30 and one or more sound units 40 connected to the sound processing module 30, wherein when the number of the sound processing module 30 is one, the sound processing module 30 is connected to two replaceable sound units 40 through a frequency dividing circuit (not shown); when the number of the sound processing modules 30 is more than one, a replaceable sound emitting unit 40 is connected to each sound processing module 30. And the sound production unit is replaced according to the test result of the hearing condition of the user.
Hearing tests are typically pure tone tests of the user's air conduction threshold condition. The test method is an audiometer test. The audiometer is a medical electroacoustic instrument for testing the hearing function in detail, pure sound is used as a stimulating sound signal, the hearing threshold test is carried out through an air conduction earphone and a bone conduction earphone, and the degree and the nature of hearing loss of a tested person are diagnosed according to a drawn hearing curve. The test method using speech as the stimulation sound signal is called speech audiometry, which can understand the actual communication ability of the deaf patient and provide valuable information for hearing aid matching and central deafness diagnosis.
The gain adjustment method comprises the following steps: the input signal frequency is divided into 64 frequency dividing points, and is divided into at most 16 frequency bands equally or unequally in a combination mode, and the gain value of each frequency band can be adjusted respectively. The hearing test result is considered during adjustment, and for the frequency band with serious hearing loss of the user, the corresponding gain value can be modified, the output intensity of the frequency band is increased, and customized hearing output is realized.
Referring to fig. 3 and 4, the adjustment and driving is achieved by the HAP150 audiology chip 35 pre-storing an algorithm. The contents of the chip can be read or written modified using communication software conforming to the I2C protocol.
Referring to fig. 1, 4 and 5, in the above embodiment, the sound processing module includes a driving power supply 31, a switch button 32, an audio interface 33, a data communication interface 34 and an audiology chip 35, and the driving power supply 31, the switch button 32, the audio interface 33, the data communication interface 34 and the sound emitting unit 40 are all electrically connected to the audiology chip 35.
Referring to fig. 4, in the above embodiment, the frequency dividing circuit includes a first frequency modulation circuit and a second frequency modulation circuit connected to different sound emitting units. The first frequency modulation circuit comprises an adjustable resistor R1 and a capacitor C1 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C1 and the negative pole of the capacitor C1. The second frequency modulation circuit comprises an adjustable resistor R2 and a capacitor C2 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C2 and the negative pole of the capacitor C2. However, in other embodiments, more frequency modulation circuits may be provided to achieve further fine tuning of the sound.
In the above embodiment, a plurality of sound modes are preset in the audiology chip 35, and the sound modes are switched by the switch button 32. According to the habit or hobby of the user to listen to music daily, the sound output of each frequency band is adjusted, so that the expressive force of the sound is better restored or enhanced, and the final sound heard by the user is richer in layering and expressive force.
In the above embodiment, the audiological chip 35 reads or writes the content after modification through communication software conforming to the I2C protocol.
Referring to fig. 5, in other embodiments, the number of the sound processing modules 30 is 2, and each sound processing module is connected with a sound emitting unit 40. The sound processing module comprises a driving power supply 31, a switching button 32, an audio interface 33, a data communication interface 34 and an audiology chip 35, wherein the driving power supply 31, the switching button 32, the audio interface 33, the data communication interface 34 and the sound generating unit 40 are electrically connected with the audiology chip 35.
The HAP150 audiological chip comprises a power supply, a clock and an SOC, wherein the clock adopts an RC clock module to provide working clocks for various parts of the system. The problem with RC is that the frequency is not accurate, which can cause the true bandwidth of the speech to deviate. The RC generates a stable clock source, then frequency division is carried out to obtain three blocks of working clocks, a plurality of register bits can be set, and the frequency division proportion is adjusted. The significance of adjusting the working frequency of the ADC and the DA is to change the bandwidth of a voice signal, and the significance of adjusting the working frequency of the processor is to use a lower working frequency as far as possible on the premise of meeting the real-time property. To enhance the design reliability, an external test clock and a clock select port are added. When the RC module fails, at least the function test of other modules can be completed.
The SoC comprises a digital part and an analog part, wherein the digital part is divided into three blocks: a filter, a voice signal processing module and a modulator. The filter is used for processing a 3Bit code stream output by the ADC, converting the 3Bit code stream into 16Bit input data and then sending the 16Bit input data to the DSP; the voice signal processing module adopts an ASIP + rASIC framework and is responsible for real-time processing of voice signals, and the voice signal processing module further comprises functions of WDRC, noise elimination, feedback elimination, frequency shift compression and the like. The modulator is used for processing the voice signal to be sent out, and converting the voice signal into a 1bit signal to drive the analog circuit to send out an audio signal.
The analog part is divided into the following blocks:
ADC: 1V working voltage, 16bit effective bit, working frequency 4MHz under typical conditions, 3bit code stream output, signal bandwidth 8KHz, and sampling rate 16 KHz.
The DAC comprises a modulator and a C L ASS-D power amplifier.
The RC clock module: and generating a system source clock, then dividing the system source clock to provide a working clock for each module, wherein the target frequency is 8MHz, and the simulation output frequency of the RC output frequency under each process foot is shown in an FJ document. In addition, an external test clock and a clock selection port are added. When the RC module fails, at least the function test of other modules can be completed.
Bandgap: direct current reference of the analog circuit.
L DO 2L DO, 1.4V battery voltage is converted into stable 1V chip working voltage to respectively supply power for the digital module and the analog module L DO can be powered down and then supplied from the outside, and the digital L DO is single-step and adjustable by 50mV and is adjusted through an off-chip control port.
PGA: the working voltage is 1V, the gain range is-6-30 dB, the single step is 3dB, and the control is realized through a register. A charge pump: 1V voltage is raised to 3.3V, power is supplied to an EEPROM and an IO, the EEPROM is only effective during booting, and after boot is completed, the EEPROM can be turned off by the voltage, so that static power consumption is saved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A fittable headset, comprising: the voice processing device comprises a voice processing module and one or more than one voice generating unit connected to the voice processing module, wherein when the number of the voice processing module is one, the voice processing module is connected with two replaceable voice generating units through a frequency dividing circuit; when the number of the sound processing modules is more than one, each sound processing module is connected with a replaceable sound production unit.
2. A fittable headset according to claim 1, wherein: the sound processing module comprises a driving power supply, a switching button, an audio interface, a data communication interface and an audiology chip, wherein the driving power supply, the switching button, the audio interface and the sound production unit are electrically connected with the audiology chip.
3. A fittable headset according to claim 2, wherein: the frequency dividing circuit comprises a first frequency modulation circuit and a second frequency modulation circuit which are connected to different sound production units.
4. A fittable headset according to claim 3, wherein: the first frequency modulation circuit comprises an adjustable resistor R1 and a capacitor C1 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C1 and the negative pole of the capacitor C1.
5. A fittable headset according to claim 3, wherein: the second frequency modulation circuit comprises an adjustable resistor R2 and a capacitor C2 which are sequentially connected in series, and two poles of the sounding unit are respectively connected to the positive pole of the capacitor C2 and the negative pole of the capacitor C2.
6. A fittable headset according to claim 2, wherein: a plurality of sound modes are preset in the audiology chip, and the sound modes are switched through the switching button.
7. A fittable headset according to claim 1, wherein: the quantity of sound processing module is 2, every sound processing module all is connected with a sound production unit.
8. A fittable headset according to claim 1, wherein: and the sound production unit is replaced according to the test result of the hearing condition of the user.
9. A fittable headset according to claim 2, wherein: the audiological chip is a HAP150 chip.
10. A fittable headset according to claim 6, wherein: the audiological chip reads or writes the content after modification through communication software conforming to the I2C protocol.
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CN202010209003.1A CN111417043A (en) | 2020-03-23 | 2020-03-23 | Can test and join in marriage earphone |
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CN202010209003.1A CN111417043A (en) | 2020-03-23 | 2020-03-23 | Can test and join in marriage earphone |
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CN202010209003.1A Pending CN111417043A (en) | 2020-03-23 | 2020-03-23 | Can test and join in marriage earphone |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108650578A (en) * | 2018-07-26 | 2018-10-12 | 深圳市丸子科技有限公司 | Modular earphone |
CN209105403U (en) * | 2018-12-31 | 2019-07-12 | 林辉 | Multiple-unit earphone power governor |
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- 2020-03-23 CN CN202010209003.1A patent/CN111417043A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108650578A (en) * | 2018-07-26 | 2018-10-12 | 深圳市丸子科技有限公司 | Modular earphone |
CN209105403U (en) * | 2018-12-31 | 2019-07-12 | 林辉 | Multiple-unit earphone power governor |
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