CN111416068A - Electronic device and manufacturing method thereof - Google Patents

Electronic device and manufacturing method thereof Download PDF

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Publication number
CN111416068A
CN111416068A CN202010346317.6A CN202010346317A CN111416068A CN 111416068 A CN111416068 A CN 111416068A CN 202010346317 A CN202010346317 A CN 202010346317A CN 111416068 A CN111416068 A CN 111416068A
Authority
CN
China
Prior art keywords
electronic device
hole
electrode guide
liquid injection
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010346317.6A
Other languages
Chinese (zh)
Inventor
刘亮亮
祝媛
袁中直
刘建华
刘金成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eve Energy Co Ltd
Original Assignee
Huizhou Yiwei Energy Battery Co ltd
Eve Energy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Yiwei Energy Battery Co ltd, Eve Energy Co Ltd filed Critical Huizhou Yiwei Energy Battery Co ltd
Priority to CN202010346317.6A priority Critical patent/CN111416068A/en
Publication of CN111416068A publication Critical patent/CN111416068A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0431Cells with wound or folded electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/147Lids or covers
    • H01M50/166Lids or covers characterised by the methods of assembling casings with lids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/60Arrangements or processes for filling or topping-up with liquids; Arrangements or processes for draining liquids from casings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Abstract

The invention discloses an electronic device and a manufacturing method thereof, wherein the electronic device comprises a shell, a cell and a sealing plate assembly, the shell comprises a base plate and a surrounding wall, a containing cavity for containing the cell is formed between the surrounding wall and the base plate, an opening communicated with the containing cavity is formed at one end of the surrounding wall far away from the base plate, the opening is sealed by the sealing plate assembly, the sealing plate assembly comprises a body, the body is welded with the shell and seals the opening, the body is provided with a first side surface close to the containing cavity and a second side surface opposite to the first side surface, the first side surface is connected with an electrode guide plate in an insulated manner, the electrode guide plate is connected with a pole lug of the cell, one side of the electrode guide plate close to the first side surface is convexly provided with a first convex part, a liquid injection hole is arranged on the body in a penetrating manner, a first through hole for the, the second convex part is inserted with the liquid injection hole to plug the liquid injection hole. The electronic device has simple structure and reliable sealing.

Description

Electronic device and manufacturing method thereof
Technical Field
The invention relates to the technical field of electronic equipment, in particular to an electronic device and a manufacturing method thereof.
Background
At present, the battery of crust structure adopts the extrusion mode to seal usually, and this battery includes drain pan, block and electric core, and drain pan and block are one end and seal one end open-ended shell structure, and the drain pan includes that bottom plate and ring establish the first leg in bottom plate one side, and the block includes that roof and ring establish the second leg in roof one side, and during drain pan and cap equipment, outside first leg was located to the second leg cover, was provided with the sealing washer between two legs. During the equipment, put electric core in the drain pan, sheathe the sealing washer on the first leg of drain pan, annotate the back and assemble block and drain pan again to by outer to interior extrusion second leg and first leg, make two legs support tight sealing washer and realize sealedly. The prior art has the following defects: 1. the length of the second surrounding wall of the cap needs to be controlled, if the size is too short, the sealing is poor when the sealing is carried out, and if the size is too long, the weight of the battery is increased; 2. for batteries with larger sizes, the extrusion sealing mode is unreliable, and the leakage is easy to occur; 3. the extrusion sealing mode enables the inner space of the battery to be occupied by the extruded and deformed structure, and the battery capacity is reduced.
Disclosure of Invention
One object of an embodiment of the present invention is to: the electronic device is simple in structure, light in weight, high in sealing reliability, low in processing difficulty and large in capacity.
Another object of an embodiment of the present invention is to: the manufacturing method of the electronic device is simple to operate, and the manufactured and molded electronic device is good in sealing performance.
To achieve the purpose, the embodiment of the invention adopts the following technical scheme:
in a first aspect, an electronic device is provided, which includes a casing, an electrical core, and a sealing plate assembly, wherein the casing includes a substrate and an enclosure wall enclosed on one side of the substrate, an accommodating cavity for accommodating the electrical core is formed between the enclosure wall and the substrate, an opening communicated with the accommodating cavity is formed at one end of the enclosure wall away from the substrate, the sealing plate assembly seals the opening, the sealing plate assembly includes a body, the body is welded to the casing and seals the opening, the body has a first side surface close to the accommodating cavity and a second side surface opposite to the first side surface, the first side surface is connected with an electrode guide plate in an insulating manner, the electrode guide plate is connected to a tab of the electrical core, a first convex portion is protruded from one side of the electrode guide plate close to the first side surface, a liquid injection hole is formed through the first convex portion, and a first through hole for the first convex portion to pass through is formed on, the second side surface is connected with a conductive sealing cover in an insulating mode, a second convex part is arranged on the sealing cover in a protruding mode, and the second convex part is connected with the liquid injection hole in an inserting mode to block the liquid injection hole.
As a preferable aspect of the electronic device, a size of the first through hole is larger than a size of the first convex portion, and an inner wall of the first through hole is spaced from an outer wall of the first convex portion.
As a preferable aspect of the electronic device, a first insulating layer is provided between the first side surface and the electrode lead, and a second insulating layer is provided between the second side surface and the sealing cover.
As a preferable mode of the electronic device, one end of the first insulating layer close to the first convex portion abuts against an outer wall of the first convex portion; and/or the second insulating layer covers the second side face, and the second insulating layer partially extends into the first through hole towards the center of the first through hole.
As a preferable mode of the electronic device, the first insulating layer is an insulating adhesive layer.
As a preferable mode of the electronic device, the sealing cover includes a cover plate, and the second protrusion is provided to protrude from a center of the cover plate.
As a preferable scheme of the electronic device, the electrode guide plate comprises a guide plate main body, the first convex part is formed on the guide plate main body by punching, a containing groove is formed correspondingly on one side of the guide plate main body, which is far away from the first convex part, and the liquid injection hole is formed at the bottom of the containing groove; or the like, or, alternatively,
the electrode guide plate comprises two first plates arranged at intervals, the first plates are in insulation connection with the body, one ends of the first plates are connected with second plates in an included angle mode, one ends of the second plates, far away from the first plates, are connected through a third plate, and the liquid injection hole is formed in the third plate.
As an optimal scheme of the electronic device, the electric core is a winding type electric core, a second through hole penetrates through the middle of the winding type electric core along the axis direction of the winding type electric core, a support column is arranged in the second through hole, the support column is provided with a liquid guide cavity, one end of the support column is abutted to the electrode guide plate, the other end of the support column is abutted to the substrate, the liquid injection hole is communicated with the liquid guide cavity, a third through hole is formed in the peripheral wall of the support column, and the third through hole is communicated with the liquid guide cavity.
As a preferable scheme of the electronic device, the first convex part is formed on the electrode guide plate by stamping, an accommodating groove is formed in a side surface of the electrode guide plate away from the first convex part, and the supporting column is inserted into the accommodating groove.
As an optimized scheme of the electronic device, the liquid injection hole is formed in the bottom of the accommodating tank, the end face, abutting against one end of the accommodating tank, of the supporting column is provided with a fourth through hole communicated with the liquid guide cavity, and the size of the fourth through hole is not smaller than that of the liquid injection hole.
As a preferable scheme of the electronic device, the battery further includes a support frame, the support frame includes a first support member and a second support member that are arranged at an interval, the first support member and the second support member are connected through a connecting member, the first support member is connected with the body, the second support member is connected with the substrate, and the connecting member is arranged between the battery cell and the inner wall of the casing wall.
As a preferable scheme of the electronic device, the support frame is a metal piece, a third insulating layer is arranged between the first support piece and the battery cell, the first support piece is welded to the body, and one side of the second support piece, which is far away from the battery cell, is welded to one tab of the battery cell.
As a preferred scheme of the electronic device, the first supporting member is provided with an avoiding hole, and the electrode guide plate is arranged in the avoiding hole and spaced from the hole wall of the avoiding hole.
As an optimal scheme of the electronic device, the battery cell is a winding battery cell, a support column is arranged in a central hole of the winding battery cell, the support column is made of metal, one end of the support column is connected with one side, close to the accommodating cavity, of the body, the other end of the support column is connected with the inner side wall of the substrate, and the support column and the electrode guide plate are arranged at intervals.
In a second aspect, a method for manufacturing an electronic device is provided, in which a casing, a battery cell, and a sealing plate assembly are provided, the battery cell is placed in the casing, two tabs of the battery cell are respectively connected to an electrode guide plate of the sealing plate assembly and the casing, the sealing plate assembly is welded to the casing, and after liquid injection formation, a sealing cover of the sealing plate assembly is installed to seal a liquid injection hole on the electrode guide plate.
The embodiment of the invention has the beneficial effects that: the sealing structure is simple, the sealing effect is good, liquid leakage can not occur completely, the welding mode is sealed, the shell does not need to be extruded, and the space in the shell can not be occupied, so that the capacity of an electronic device is large; the liquid injection hole is formed in the electrode guide plate, and the sealing cover is conductive to block, so that the structure of the sealing plate assembly can be simplified, the sealing cover not only has the function of blocking the liquid injection hole, but also can be used as a terminal exposed outside an electronic device to realize electric conduction, and the occupied space of the structure on the sealing plate assembly is greatly reduced.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a housing according to a first embodiment of the invention.
Fig. 3 is a schematic diagram of a state after the casing and the battery cell are assembled according to the first embodiment of the invention.
Fig. 4 is a schematic view of the assembled sealing plate assembly and the housing according to the first embodiment of the present invention (the sealing cover is not assembled).
Fig. 5 is a schematic diagram illustrating a state after the second insulating layer is mounted according to the first embodiment of the invention.
Fig. 6 is a schematic view of a state in which the sealing cover according to the first embodiment of the present invention is mounted.
Fig. 7 is a schematic cross-sectional view of an electronic device according to a second embodiment of the present invention.
Fig. 8 is a schematic structural view of an electrode guide according to an embodiment of the present invention.
Fig. 9 is a schematic cross-sectional view of an electronic device according to a third embodiment of the present invention.
Fig. 10 is an assembly view of the sealing plate assembly and the support frame according to the third embodiment of the present invention.
Fig. 11 is an assembly diagram of the sealing plate assembly, the support frame and the battery cell according to the third embodiment of the present invention.
Fig. 12 is a schematic view of an assembly of the sealing plate assembly, the support frame, and the battery cell according to the third embodiment of the present invention after being assembled with the housing.
Fig. 13 is a schematic view showing a state in which the seal cover according to the third embodiment of the present invention is mounted.
In the figure:
1. a housing; 11. a substrate; 12. a surrounding wall; 13. an accommodating chamber; 14. a support portion; 2. an electric core; 21. a positive tab; 22. a negative tab; 23. a second through hole; 3. a seal plate assembly; 31. a body; 311. a first through hole; 32. an electrode guide plate; 321. a first convex portion; 322. a liquid injection hole; 323. a first plate; 324. a second plate; 325. a third plate; 326. accommodating grooves; 33. a sealing cover; 331. a second convex portion; 332. a cover plate; 4. a first insulating layer; 5. a second insulating layer; 6. a support pillar; 61. a drainage cavity; 62. a third through hole; 7. a support frame; 71. a first support member; 72. a second support member; 73. a connecting member; 8. and a third insulating layer.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 6, an electronic device according to an embodiment of the present invention includes a housing 1, a battery cell 2, and a sealing plate assembly 3, where the housing 1 includes a base plate 11 and a surrounding wall 12 surrounding one side of the base plate 11, a receiving cavity 13 for receiving the battery cell 2 is formed between the surrounding wall 12 and the base plate 11, an end of the surrounding wall 12 away from the base plate 11 forms an opening communicating with the receiving cavity 13, the sealing plate assembly 3 seals the opening, the sealing plate assembly 3 includes a body 31, the body 31 is welded to the housing 1 and seals the opening, the body 31 has a first side surface close to the receiving cavity 13 and a second side surface opposite to the first side surface, the first side surface is connected with an electrode guide plate 32 in an insulated manner, the electrode guide plate 32 is connected with a tab of the battery cell 2, a first protrusion 321 is protruded from one side of the electrode guide plate 32 close to the first side surface, the first protruding portion 321 is provided with a liquid injection hole 322 in a penetrating manner, the body 31 is provided with a first through hole 311 through which the first protruding portion 321 passes, the second side surface is connected with a conductive sealing cover 33 in an insulating manner, the sealing cover 33 is provided with a second protruding portion 331 in a protruding manner, and the second protruding portion 331 is inserted into the liquid injection hole 322 to seal the liquid injection hole 322. The sealing structure is simple, the sealing effect is good, liquid leakage can not occur completely, the welding mode is sealed, the shell 1 does not need to be extruded, and the space in the shell 1 can not be occupied, so that the capacity of an electronic device is large; by arranging the liquid injection hole 322 on the electrode guide plate 32 and plugging the liquid injection hole with the conductive sealing cover 33, the structure of the sealing plate assembly 3 can be simplified, and the sealing cover 33 not only has the function of plugging the liquid injection hole 322, but also can be used as a terminal exposed outside an electronic device to realize electric conduction, thereby greatly reducing the occupied space of the structure on the sealing plate assembly 3.
The manufacturing process of the electronic device comprises the following steps: will electric core 2 place in casing 1, respectively will two utmost point ears of electric core 2 with shrouding assembly 3's electrode guide 32 with casing 1 is connected, will shrouding assembly 3 weld in on casing 1, annotate the liquid and become the back, install shrouding assembly 3's sealed lid 33 is in order to the shutoff annotate liquid hole 322 on the electrode guide 32.
The electronic device may be a rechargeable battery (e.g., a lithium ion battery), a non-rechargeable battery (e.g., a lithium battery), or a capacitor.
Further, a support portion 14 extends from one end of the surrounding wall 12 away from the substrate 11 toward the outside of the surrounding wall 12, and the body 31 is laminated on and welded to the support portion 14. Through setting up supporting part 14, can guarantee that body 31 and casing 1 are executed the position of welding enough, promote sealed effect, and need not to make the wall thickness of casing 1 thick and also can satisfy the sealed requirement of welding back.
In the present embodiment, the battery cell 2 includes a positive tab 21 and a negative tab 22, the positive tab 21 is connected to the electrode guide 32, and the negative tab 22 is connected to the inner side surface of the substrate 11 of the casing 1. In other embodiments, the connection positions of the positive tab 21 and the negative tab 22 can be interchanged, that is, the negative tab 22 is connected to the electrode guide 32, and the positive tab 21 is connected to the inner side surface of the substrate 11 of the housing 1.
Alternatively, both the positive tab 21 and the negative tab 22 are led out from the same side of the casing 1, and one of the positive tab 21 and the negative tab 22 is connected to the electrode guide plate 32, while the other is connected to the body 31 of the sealing plate assembly 3.
In addition, instead of providing one sealing plate assembly 3, the casing 1 may be provided with a tube structure having openings at both ends, one sealing plate assembly 3 may be provided at each end of the casing 1, and the positive electrode tab 21 and the negative electrode tab 22 may be connected to the electrode guides 32 of the two sealing plate assemblies 3.
In one embodiment, the size of the first through hole 311 is larger than the size of the first protrusion 321, and an inner wall of the first through hole 311 is spaced apart from an outer wall of the first protrusion 321. The design can avoid the contact between the electrode guide 32 and the body 31, thereby preventing the electrode guide 32 from being electrically conducted with the body 31.
Specifically, a first insulating layer 4 is disposed between the first side surface of the body 31 and the electrode lead 32, and a second insulating layer 5 is disposed between the second side surface and the sealing cover 33. The first and second insulating layers 4 and 5 may insulate the electrode lead 32, the sealing cover 33, and the body 31.
The first insulating layer 4 is any one or two combinations of a PE layer and modified PP, the first insulating layer 4 further comprises a first adhesive layer and a second adhesive layer, an intermediate layer is arranged between the first adhesive layer and the second adhesive layer, the first adhesive layer and/or the second adhesive layer is any one of a PE layer or modified PP, and the intermediate layer is a PFA layer.
Polyethylene (PE) is a thermoplastic resin prepared by polymerizing ethylene, and industrially also comprises a copolymer of ethylene and a small amount of α -olefin, and the polyethylene is odorless, nontoxic, has a wax-like hand feeling, has excellent low-temperature resistance, good chemical stability, can resist corrosion of most of acid and alkali, is insoluble in common solvents at normal temperature, and has small water absorption and excellent electrical insulation.
Polypropylene (PP) is a polymer formed by propylene addition polymerization, is a white waxy material, is transparent and light in appearance and flammable, has a melting point of 165 ℃, is softened at about 155 ℃, and has a use temperature range of-30-140 ℃. The modified PP is modified based on PP, for example, the modified PP used in this embodiment is a Metal-philic modified Polypropylene resin (hereinafter, referred to as Metal-philic modified PP), which can be chemically modified based on PP by copolymerization, grafting or crosslinking to make the surface have Metal-philic characteristics, so that the modified PP can be fused with the Metal surface by heating to form a good bonding seal.
PFA is known as tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (also known as perfluoroalkoxy, soluble polytetrafluoroethylene), which is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene. The melt cohesiveness is enhanced, the melt viscosity is reduced, and the performance is unchanged compared with the polytetrafluoroethylene. The resin can be directly processed into products by adopting a common thermoplastic molding method. PFA has excellent chemical corrosion resistance at a long-term use temperature of-200 ℃ to 260 ℃, resists all chemicals, has the lowest friction coefficient in plastics, has good electrical property, has no temperature influence on electrical insulation, and is called as 'plastics king'. The PFA has chemical resistance similar to that of polytetrafluoroethylene, better than vinylidene fluoride, better creep resistance and compression strength than that of polytetrafluoroethylene, high tensile strength and elongation of up to 100-; the dielectric property is good, and the radiation resistance is excellent; the flame retardance is high; has no toxicity or harm, has physiological inertia, and can be implanted into human body.
In this embodiment, the first insulating layer 4 comprises two spaced layers of modified PP with a PFA layer disposed therebetween.
The second insulating layer 5 is an insulating film. By providing the second insulating layer 5 as an insulating film, the thickness of the insulating film can be made thin, so that the thickness of the entire sealing plate assembly 3 can be reduced, and the specific capacity in the housing 1 can be increased. Specifically, the second insulating layer 5 is a PI film.
Polyimide film (polyimide film) is prepared by polycondensation and film-casting of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent, and imidization. The PI film is yellow and transparent, the relative density is 1.39-1.45, the PI film has excellent high and low temperature resistance, electrical insulation, cohesiveness, radiation resistance and medium resistance, can be used for a long time within the temperature range of-269-280 ℃, and can reach the high temperature of 400 ℃ in a short time. The glass transition temperatures were 280 ℃ (Uplix R), 385 ℃ (Kapton) and 500 ℃ or higher (Uplix S), respectively. The tensile strength is 200MPa at 20 ℃ and is more than 100MPa at 200 ℃.
In order to further improve the insulation effect, one end of the first insulation layer 4 close to the first protrusion 321 abuts against the outer wall of the first protrusion 321, the second insulation layer 5 covers the second side surface, and a part of the second insulation layer 5 extends into the first through hole 311 toward the center of the first through hole 311.
In one embodiment, the sealing cover 33 includes a cover plate 332, and the second protrusion 331 protrudes from the center of the cover plate 332. The second convex part 331 is protruded from the center of the cover plate 332, so that the cover plate 332 is disposed on the outer periphery of the second convex part 331, and after the cover plate 332 abuts against the second side surface of the body 31, a surrounding structure is formed for sealing, thereby improving the sealing effect of the liquid injection hole 322.
In addition, the center of the cover 332 is stamped to form the second protrusion 331. The second protrusion 331 is formed by stamping, so that the manufacturing cost of the cover plate 332 can be reduced, the cover plate 332 and the second protrusion 331 do not need to be formed by machining with a thick plate, the second protrusion 331 does not need to be separately arranged and then welded with the cover plate 332, the manufacturing cost is low, assembly is not needed, the second protrusion 331 is integrally formed by stamping, the strength is high, and deformation is not easy to occur.
In one embodiment, as shown in fig. 1 and 8, the electrode guide 32 includes two first plates 323 arranged at intervals, the two first plates 323 are connected to the body 31 in an insulating manner, one end of the first plate 323 is connected to a second plate 324 at an included angle, one ends of the two second plates 324 far away from the first plate 323 are connected to each other through a third plate 325, and the liquid injection hole 322 is opened in the third plate 325. This design has increased the structural stability after the electrode baffle 32 equipment, guarantees that sealed lid 33 pegs graft firmly, and difficult appearance is not hard up, and in addition, manufacturing cost has still been practiced thrift on the basis that this structure is high in stability.
In the present embodiment, the electrode guide 32 is formed by integrally bending a metal plate. The design simplifies the number of parts of the electrode guide plate 32, has no assembly process, and simultaneously, the bent electrode guide plate 32 is of an integral structure, has high strength and is not easy to deform.
The two second plates 324 and the third plate 325 form between them a receiving groove 326 opening towards the inside of the housing 1. The accommodating groove 326 not only can reduce the weight of the electronic device, but also can accommodate more electrolyte by utilizing the accommodating groove 326, thereby improving the specific capacity in the shell 1.
In another embodiment, the electrode guide 32 includes a guide body, the first protrusion 321 is formed by stamping on the guide body, a receiving groove 326 is formed on a side of the guide body away from the first protrusion 321, and the liquid injection hole 322 is formed at a bottom of the receiving groove 326.
In order to further enhance the sealing effect, the electrode lead 32 and the sealing cover 33 may be welded.
In an embodiment, as shown in fig. 7, the battery cell 2 is a winding battery cell 2, a second through hole 23 penetrates through the middle of the winding battery cell 2 along the axis direction of the winding battery cell, a support column 6 is disposed in the second through hole 23, the support column 6 has a liquid guide cavity 61, one end of the support column 6 abuts against the electrode guide plate 32, the other end of the support column abuts against the substrate 11, the liquid injection hole 322 is communicated with the liquid guide cavity 61, a third through hole 62 is disposed on the outer peripheral wall of the support column 6, and the third through hole 62 is communicated with the accommodating cavity 13 and the liquid guide cavity 61. By providing the supporting posts 6, the centers of the substrate 11 and the sealing plate assembly 3 can be effectively prevented from being recessed, particularly in an electronic device with a large size and a small thickness (for example, the diameter-to-thickness ratio of the electronic device is greater than or equal to 2:1, preferably, the diameter-to-thickness ratio of the electronic device is greater than or equal to 4:1, for example, 5: 1,6:1, 7: 1, 8:1, 9: 1, 10: 1, etc., more preferably, the diameter-to-thickness ratio of the electronic device is 8:1, specifically, the thickness of the electronic device is less than 10mm, more preferably, 4-10mm), because the size of the electronic device is large, the size of the body 31 and the size of the substrate 11 are large, and the thickness of the material of the electronic device housing 1 is small (for example, the thickness of the material of the electronic device housing 1 is less than 0.2mm, more preferably, less than or equal to 0.1mm, the concave structure occupies the space in the housing 1 of the electronic device, reduces the specific capacity of the electronic device, or is easily damaged by being squeezed by an external object when in use.
In this embodiment, the support posts 6 are inserted into the receiving slots 326 of the electrode guide 32. The receiving groove 326 can define the position of the supporting post 6, and can reduce the occupied space of the supporting post 6.
Further, annotate liquid hole 322 and offer the tank bottom of holding tank 326, support column 6 butt is in the terminal surface of the one end of holding tank 326 seted up with the fourth through-hole of drain chamber 61 intercommunication, the size of fourth through-hole is not less than annotate the size of liquid hole 322. This design can avoid fourth through-hole to hinder the insertion of second convex part 331, also can guarantee to annotate liquid effect and speed simultaneously.
Preferably, the fourth through hole and the liquid injection hole 322 are concentrically arranged.
If the liquid injection hole 322 is arranged in the central hole of the winding type electric core 2, the advantages of this are: the second protrusion 331 of the sealing cover 33 is disposed in the central hole of the winding type battery cell 2 having the central hole, which is beneficial to improving the space utilization rate of the electronic device.
Secondly, in the design shown in fig. 7, the support posts 6 are made of an insulating material, so that the closing plate assembly 3 is not electrically connected to the housing 1, which may cause short circuit, for example: which may be plastic or metal coated with an insulating material. In addition, the tab connected to the bottom of the housing 1 may be attached to the housing 1 by the support column 6 through force without welding.
In addition, in order to reduce the alignment difficulty between the fourth through hole and the liquid injection hole 322, a positioning convex part may be convexly disposed on one of the end surface of the support column 6 and the bottom of the accommodating groove 326, and a positioning groove is concavely disposed on the other of the end surface of the support column 6 and the bottom of the accommodating groove 326, and the positioning convex part is inserted into the positioning groove.
In other embodiments, the supporting pillars 6 may also be made of a metal material, one end of each supporting pillar 6 is connected to one side of the body 31 close to the accommodating cavity 13, the other end of each supporting pillar 6 is connected to an inner side wall of the substrate 11, and the supporting pillars 6 and the electrode guide 32 are arranged at intervals. The support column 6 of the metal structure has high strength and cannot deform, and the support column 6 and the electrode guide plate 32 are arranged at intervals to avoid short circuit caused by conduction of the anode and the cathode of the electronic device.
Support column 6 can be bonded or welded with being connected of casing 1, and after the preferred electronic device equipment when metal support column 6 is the metal material, carry out resistance weld to support column 6 from the casing 1 outside, so can reduce the equipment degree of difficulty, also can improve the welding reliability simultaneously, preferably, place one of them utmost point ear of electric core 2 between metal support column 6 and casing 1, through the casing 1 outside with support column 6, utmost point ear and casing 1 carry out resistance weld.
The specific manufacturing steps of the electronic device are as follows:
step S100, as shown in fig. 3, placing the battery cell 2 in the accommodating cavity 13 of the casing 1, and then welding the negative electrode tab 22 of the battery cell 2 to the inner side surface of the substrate 11 of the casing 1;
step S200, as shown in fig. 4, combining the body 31, the first insulating layer 4 and the electrode guide 32 into a component, and then welding (preferably, laser welding stitch welding) the component on the support portion 14 of the housing 1, wherein a margin is reserved for manufacturing the housing 1 and the body 31 for welding;
step S300, as shown in FIG. 4, injecting liquid and forming;
step S400, as shown in fig. 5, adhering the second insulating layer 5 to the second side surface of the body 31;
step S500, as shown in fig. 6, the sealing lid 33 is assembled to the main body 31, the second convex portion 331 of the sealing lid 33 is inserted into the liquid inlet 322 of the first convex portion 321 of the electrode guide 32, and then the main body 31 and the support portion 14 are welded to achieve sealing.
Step S600, drawing a margin line on the body 31 or the support part 14, and then cutting the excess structure along the margin line to form the electronic device shown in fig. 4.
The step of adhering the second insulating layer 5 to the second side of the body 31 is not limited to the step of adhering to the second side of the body 31 after the formation of the electronic device, and may be adhered to the second side of the body 31 when the assembly of the body 31, the first insulating layer 4 and the electrode lead 32 is manufactured.
In other embodiments, the support posts 6 of fig. 7 can be replaced by other structures to achieve the same support function. As shown in fig. 9 to 13, a support frame 7 is disposed in the casing 1, the support frame 7 includes a first support member 71 and a second support member 72 that are disposed at an interval, the first support member 71 and the second support member 72 are connected by a connection member 73, the first support member 71 is connected with the body 31, the second support member 72 is connected with the substrate 11, and the connection member 73 is disposed between the battery cell 2 and the inner wall of the surrounding wall 12. The support frame 7 is arranged to support the housing 1 and the body 31 of the sealing plate assembly 3, which is beneficial to prevent the swelling deformation and the dent of large-diameter ultrathin electronic devices (for example, the diameter-to-thickness ratio of the electronic device is greater than or equal to 2:1, preferably, the diameter-to-thickness ratio of the electronic device is greater than or equal to 4:1, such as: 5: 1,6:1, 7: 1, 8:1, 9: 1, 10: 1, and the like, more preferably, the diameter-to-thickness ratio of the electronic device is 8: 1. specifically, the thickness of the material of the electronic device housing 1 is less than 0.2mm, more preferably less than or equal to 0.1mm, specifically, the thickness of the electronic device is less than 10mm, and more preferably, 4-10mm), and in addition, the structure of the support frame 7 can be applied not only to the winding type battery core 2, but also to the laminated type battery core 2, and the.
In this embodiment, the support frame 7 is a metal member, a third insulating layer 8 is disposed between the first support member 71 and the battery cell 2, the first support member 71 is welded to the body 31, and one side of the second support member 72, which is far away from the battery cell 2, is welded to one tab of the battery cell 2. Specifically, second support 72 is welded to negative tab 22. Through setting up support frame 7 as the metalwork, can be with support frame 7 and body 31 welded fastening as an organic whole to positive pole ear 21 and negative pole ear 22 of electric core 2 all can weld in advance with shrouding subassembly 3 in casing 1's outside, reduce the operation degree of difficulty, are convenient for realize automatic equipment. Of course, the support frame 7 may also be made of a high-strength and corrosion-resistant non-metallic material, and the support frame 7 is connected with the body 31 and the housing 1 by means of dispensing.
The first supporting member 71 and the second supporting member 72 are perpendicular to the connecting member 73, and the first supporting member 71 and the second supporting member 72 are located on the same side of the connecting member 73 to form the U-shaped supporting frame 7.
Further, an avoiding hole (not shown in the figure) is formed in the first support member 71, and the electrode guide plate 32 is arranged in the avoiding hole and spaced from the hole wall of the avoiding hole. Preferably, the first support 71 is an annular plate, the inner hole of which is a relief hole, and the periphery of which is connected with the connector 73.
The specific manufacturing steps of the electronic device are as follows:
step S100, as shown in fig. 10, combining the body 31, the first insulating layer 4 and the electrode guide 32 into an assembly, and then welding the support frame 7 to the body 31;
step S200, as shown in fig. 11, placing the battery cell 2 between the electrode guide plate 32 and the second support member 72 of the support frame 7, and welding the positive tab 21 of the battery cell 2 to the electrode guide plate 32, and welding the negative tab 22 to the second support member 72;
step 300, as shown in fig. 12, placing the battery cell 2, the support frame 7 and the closing plate assembly 3 in the accommodating cavity 13 of the casing 1, and then welding the body 31 to the support portion 14 of the casing 1, wherein allowance is reserved for welding when the casing 1 and the body 31 are manufactured;
s400, injecting liquid and forming;
step S500, as shown in fig. 13, adhering the second insulating layer 5 to the second side surface of the body 31;
step S500, as shown in fig. 13, is to assemble the sealing lid 33 to the main body 31, insert the second convex portion 331 of the sealing lid 33 into the liquid inlet 322 of the first convex portion 321 of the electrode guide 32, and weld the main body 31 and the support portion 14 to achieve sealing.
Step S600, drawing a margin line on the body 31 or the support part 14, and then cutting the excess structure along the margin line to form the electronic device shown in fig. 9.
Of course, the core 2, the sealing plate assembly 3, and the case 1 may be assembled and then welded to the positive and negative electrodes from the outside of the electronic device, preferably by resistance welding.
In the description herein, it is to be understood that the terms "upper" and the like are based on the orientation or positional relationship shown in the drawings, which are for convenience of description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
In the description herein, references to the term "an embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims (15)

1. An electronic device comprises a shell, an electric core and a sealing plate assembly, wherein the shell comprises a base plate and an enclosing wall arranged on one side of the base plate in a surrounding manner, a containing cavity for containing the electric core is formed between the enclosing wall and the base plate, an opening communicated with the containing cavity is formed at one end, far away from the base plate, of the enclosing wall, the sealing plate assembly seals the opening, the sealing plate assembly is characterized by comprising a body, the body is welded with the shell and seals the opening, the body is provided with a first side face close to the containing cavity and a second side face opposite to the first side face, the first side face is connected with an electrode guide plate in an insulating manner, the electrode guide plate is connected with a lug of the electric core, a first convex part is arranged on one side, close to the first side face, of the electrode guide plate in a protruding manner, a liquid injection hole is formed in the first convex part in a penetrating manner, the second side surface is connected with a conductive sealing cover in an insulating mode, a second convex part is arranged on the sealing cover in a protruding mode, and the second convex part is connected with the liquid injection hole in an inserting mode to block the liquid injection hole.
2. The electronic device of claim 1, wherein a size of the first through hole is larger than a size of the first convex portion, and an inner wall of the first through hole is spaced apart from an outer wall of the first convex portion.
3. The electronic device according to claim 1, wherein a first insulating layer is provided between the first side face and the electrode lead, and a second insulating layer is provided between the second side face and the sealing cover.
4. The electronic device according to claim 3, wherein one end of the first insulating layer near the first convex portion abuts against an outer wall of the first convex portion; and/or the second insulating layer covers the second side face, and the second insulating layer partially extends into the first through hole towards the center of the first through hole.
5. The electronic device according to claim 3, wherein the first insulating layer is an insulating adhesive layer.
6. The electronic device as claimed in claim 1, wherein the sealing cover includes a cover plate, and the second protrusion is protrusively provided at a center of the cover plate.
7. The electronic device according to claim 1, wherein the electrode lead comprises a lead body, the lead body is formed by stamping the first convex portion, a receiving groove is formed on the lead body corresponding to a side of the lead body away from the first convex portion, and the liquid injection hole is formed at a bottom of the receiving groove; or the like, or, alternatively,
the electrode guide plate comprises two first plates arranged at intervals, the first plates are in insulation connection with the body, one ends of the first plates are connected with second plates in an included angle mode, one ends of the second plates, far away from the first plates, are connected through a third plate, and the liquid injection hole is formed in the third plate.
8. The electronic device according to claim 1, wherein the electric core is a winding electric core, a second through hole penetrates through a middle portion of the winding electric core along an axis direction of the winding electric core, a support column made of a non-metallic material is disposed in the second through hole, the support column has a liquid guide cavity, one end of the support column abuts against the electrode guide plate, the other end of the support column abuts against the substrate, the liquid injection hole is communicated with the liquid guide cavity, a third through hole is disposed on a peripheral wall of the support column, and the third through hole is communicated with the accommodating cavity and the liquid guide cavity.
9. The electronic device as claimed in claim 8, wherein the first protrusion is formed by stamping on the electrode guide, and a receiving groove is formed on a side surface of the electrode guide away from the first protrusion, and the supporting pillar is inserted into the receiving groove.
10. The electronic device as claimed in claim 8, wherein the liquid injection hole is formed at a bottom of the receiving groove, and an end surface of the supporting pillar abutting against one end of the receiving groove is formed with a fourth through hole communicating with the liquid guide chamber, and a size of the fourth through hole is not smaller than a size of the liquid injection hole.
11. The electronic device according to claim 1, further comprising a support frame, wherein the support frame includes a first support member and a second support member that are disposed at an interval, the first support member and the second support member are connected through a connector, the first support member is connected to the body, the second support member is connected to the substrate, and the connector is disposed between the battery cell and the inner wall of the casing wall.
12. The electronic device of claim 11, wherein the support frame is a metal member, a third insulating layer is disposed between the first support member and the battery cell, the first support member is welded to the body, and a side of the second support member away from the battery cell is welded to a tab of the battery cell.
13. The electronic device according to claim 11, wherein the first support member is provided with an avoiding hole, and the electrode guide is disposed in the avoiding hole and spaced apart from a hole wall of the avoiding hole.
14. The electronic device according to claim 1, wherein the electric core is a winding electric core, a support pillar is disposed in a central hole of the winding electric core, the support pillar is made of metal, one end of the support pillar is connected to a side of the body close to the accommodating cavity, the other end of the support pillar is connected to an inner side wall of the substrate, and the support pillar and the electrode guide plate are disposed at an interval.
15. A method for manufacturing an electronic device, wherein a casing, a cell and a sealing plate assembly are provided, the cell is placed in the casing, two tabs of the cell are respectively connected with an electrode guide plate of the sealing plate assembly and the casing, the sealing plate assembly is welded on the casing, and after liquid injection is completed, a sealing cover of the sealing plate assembly is installed to seal a liquid injection hole on the electrode guide plate.
CN202010346317.6A 2020-04-27 2020-04-27 Electronic device and manufacturing method thereof Pending CN111416068A (en)

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