CN111415588A - Flexible screen assembly and electronic equipment - Google Patents
Flexible screen assembly and electronic equipment Download PDFInfo
- Publication number
- CN111415588A CN111415588A CN202010249496.1A CN202010249496A CN111415588A CN 111415588 A CN111415588 A CN 111415588A CN 202010249496 A CN202010249496 A CN 202010249496A CN 111415588 A CN111415588 A CN 111415588A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- base layer
- layer
- flexible screen
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 129
- 239000003990 capacitor Substances 0.000 claims description 26
- 150000002500 ions Chemical class 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 158
- 238000005452 bending Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- -1 boron ions Chemical class 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
Abstract
The invention discloses a flexible screen assembly and electronic equipment, wherein the flexible screen assembly comprises a flexible screen, a semiconductor device layer and a first electric connection part; the flexible screen is provided with a display area, the flexible screen comprises a flexible base layer, the flexible base layer comprises a first area and a second area, the display area comprises the first area, the second area is located on one side of the display area, the first end of the second area is connected with the first area, and the second end of the second area is bent to one side of the first area; the semiconductor device layer and the first electric connection portion are arranged in the second area, the semiconductor device layer is attached to the second area, the first electric connection portion is arranged at the second end of the second area, the first electric connection portion is electrically connected with a circuit board of the electronic equipment, the first electric connection portion is electrically connected with the semiconductor device layer, and the first electric connection portion is electrically connected with the display area. The scheme can solve the problem that the thickness of the electronic equipment is large.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible screen assembly and electronic equipment.
Background
A flexible screen refers to a display screen that can be bent or rolled. When the flexible screen is bent or curled, the flexible screen is small in size, so that the flexible screen is convenient to carry; when the flexible screen is unfolded, the effective display area of the flexible screen is increased. Since the flexible screen has excellent characteristics, it is widely used in electronic devices.
In the related art, the electronic device may include a flexible screen, a flexible circuit board, and a driving chip, an edge region of the flexible screen is overlapped with the flexible circuit board, one end of the flexible circuit board is electrically connected to the flexible screen, and the other end of the flexible circuit board is electrically connected to a main board of the electronic device or a component such as a processor. The driving chip may be disposed on the flexible circuit board, and the driving chip is electrically connected with the flexible circuit board. Alternatively, the driving chip may be disposed on the flexible screen, and the driving chip is electrically connected to the flexible screen.
However, since the thickness of the stacked structure formed by the flexible screen, the flexible circuit board and the driving chip is large, the stacked structure formed by the flexible screen, the flexible circuit board and the driving chip occupies a large internal space of the electronic device, resulting in a large thickness of the electronic device, and thus the lightness and thinness of the electronic device needs to be improved.
Disclosure of Invention
The invention discloses a flexible screen assembly and electronic equipment, and aims to solve the problem that the thickness of the electronic equipment is large.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention discloses a flexible screen assembly applied to an electronic device, where the flexible screen assembly includes a flexible screen, a semiconductor device layer, and a first electrical connection portion;
the flexible screen is provided with a display area, the flexible screen comprises a flexible base layer, the flexible base layer comprises a first area and a second area, the display area comprises the first area, the second area is positioned on one side of the display area, the first end of the second area is connected with the first area, and the second end of the second area is bent to one side of the first area;
the semiconductor device layer and the first electric connection portion are arranged in the second area, the semiconductor device layer is attached to the second area, the first electric connection portion is arranged at the second end of the second area, the first electric connection portion is electrically connected with a circuit board of the electronic equipment, the first electric connection portion is electrically connected with the semiconductor device layer, and the first electric connection portion is electrically connected with the display area.
In a second aspect, an embodiment of the present invention discloses an electronic device, which includes the above flexible screen assembly.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in an embodiment of the invention, the flexible screen comprises a flexible base layer, the flexible base layer comprises a first area and a second area, and the first electric connection part is arranged at the second end of the second area and is used for being electrically connected with a circuit board of the electronic device. Above-mentioned scheme is provided with the first electricity connection portion of being connected with electronic equipment electricity in flexible basic unit's second region, and at this moment, the flexible screen is connected with electronic equipment's circuit board electricity, need not through flexible circuit board, has consequently cancelled flexible circuit board in the flexible screen subassembly to reduce the pile height of flexible screen subassembly, and then make the flexible screen subassembly occupy electronic equipment's inner space less, make electronic equipment's thickness less, and then promoted electronic equipment's frivolous development.
Meanwhile, the original electronic components in the flexible screen assembly are replaced by the semiconductor device layer, so that the electronic components which are dispersedly installed are replaced by the semiconductor device layer with higher integration level, the semiconductor device layer occupies smaller space of the second area, and therefore the flexible base layer can compress the space of the second area, increase the space of the first area, further increase the display area and promote the screen of the electronic equipment to have larger ratio.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings used in the description of the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any inventive exercise.
FIG. 1 is a schematic structural diagram of a flexible screen assembly according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of another flexible screen assembly disclosed in the embodiments of the present invention;
FIG. 3 is a cross-sectional view of a flexible screen assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a flexible panel assembly according to an embodiment of the present invention, in which the semiconductor portion is a diode;
FIG. 5 is a schematic structural diagram of a flexible panel assembly according to an embodiment of the present invention, wherein the semiconductor portion is a resistor;
fig. 6 is a schematic structural diagram of a flexible panel assembly according to an embodiment of the present invention, in which a semiconductor portion is a capacitor;
FIG. 7 is a partial cross-sectional view of a flexible screen assembly as disclosed in an embodiment of the present invention.
Description of reference numerals:
110-flexible base layer, 111-first region, 112-second region, 113-first surface, 114-second surface, 115-gap, 120-display line layer, 130-line protection layer, 140-first supporting layer, 141-third surface, 150-second supporting layer, 151-fourth surface,
200-semiconductor device layer, 210-first wiring base layer, 211-first bump, 220-second wiring base layer, 221-second bump, 230-semiconductor part, 231-first semiconductor, 232-second semiconductor, 233-third semiconductor, 234-conductive ion, 235-fourth semiconductor, 236-capacitor electrode, 237-insulating medium, and,
300-first electrical connection,
500-driving the chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 7, the embodiment of the invention discloses a flexible screen assembly applied to an electronic device, which may specifically include a flexible screen, a semiconductor device layer 200, and a first electrical connection portion 300.
The flexible screen is a main body component of the flexible screen assembly and is provided with a display area, and the display area is used for displaying information such as characters, pictures and videos of the electronic equipment. The flexible screen can be bent or curled, so that the display area of the flexible screen can be adjusted, and the use performance of the electronic equipment can be improved. The flexible screen comprises a flexible base layer 110, the flexible base layer 110 comprising a first region 111 and a second region 112, the first region 111 and the second region 112 being two different regions of the same flexible base layer 110. The display area includes a first area 111, and the first area 111 may be a part of the display area or the entire display area. The second region 112 is located on one side of the display region, a first end of the second region 112 is connected to the first region 111, and a second end of the second region 112 is bent to one side of the first region 111, so that a portion of the second region 112 is located below the first region 111. Optionally, the flexible substrate 110 may be made of a material with good flexibility, such as plastic. The flexible substrate 110 has a corresponding color filter or thin film transistor deposited thereon.
The semiconductor device layer 200 and the first electrical connection portion 300 are disposed in the second region 112, and the semiconductor device layer 200 includes at least one of a capacitor element, a resistor element, and a diode element, but may also be other electronic devices manufactured by a semiconductor process. The semiconductor device layer 200 can be used for controlling and transmitting signals, so that the flexible screen assembly is subjected to display operation. The fabrication process of the semiconductor device layer 200 is prior art and is not limited herein. The semiconductor device layer 200 is attached to the second region 112, the first electrical connection portion 300 is disposed at a second end of the second region 112, the second end of the second region 112 is an end close to a circuit board of an electronic device, and the first electrical connection portion 300 is electrically connected to the circuit board of the electronic device. The first electrical connection portion 300 is electrically connected to the semiconductor device layer 200, and the first electrical connection portion 300 is electrically connected to the display region. At this time, the circuit board of the electronic device emits display information, which is transferred to the display area via the first electrical connection portion 300, so that the display information is displayed in the display area. Of course, part of the display information may also be transferred to the display region via the first electrical connection 300 and the semiconductor device layer 200. Alternatively, the first electrical connection 300 may be a board-to-board connector, conductive contact, or the like that is attached to the second region 112.
In the embodiment of the present invention, the second region 112 of the flexible substrate 110 is provided with the first electrical connection portion 300 electrically connected to the circuit board of the electronic device, and at this time, the flexible screen is electrically connected to the circuit board of the electronic device without passing through the flexible circuit board, so that the flexible circuit board is eliminated from the flexible screen assembly, thereby reducing the stacking height of the flexible screen assembly, further making the flexible screen assembly occupy a smaller internal space of the electronic device, and promoting the thickness of the electronic device to be smaller, thereby promoting the development of the electronic device in a light and thin manner.
Meanwhile, the original electronic components in the flexible screen assembly are replaced by the semiconductor device layer 200, so that the electronic components which are dispersedly installed are replaced by the semiconductor device layer 200 with higher integration level, the space of the second area 112 occupied by the semiconductor device layer 200 is smaller, and therefore the space of the second area 112 can be compressed and the space of the first area 111 can be increased in the manufacturing process of the flexible base layer 110, the display area can be increased, and the screen occupation ratio of the electronic equipment is larger.
In addition, the flexible circuit board is omitted from the flexible screen assembly, so that the connection step between the flexible circuit board and the flexible screen is omitted, the assembly of the flexible screen assembly is simpler and more convenient, and the structure of the flexible screen assembly is more compact.
Furthermore, the semiconductor device layer 200 has a layered structure, and therefore has better flexibility, which facilitates better bending performance of the second region 112, and facilitates easier bending of the second region 112.
Optionally, the thickness of the flexible base layer 110 may be 0.01mm to 0.3mm, and in order to enable the flexible base layer 110 to have better performance, the thickness of the flexible base layer 110 may be 0.03mm, and at this time, the flexible base layer 110 is thinner and also has certain strength. The flexible screen assembly may further include a first flexible polarizer and a second flexible polarizer, which are located at both sides of the first region 111.
In order to further increase the integration level of the semiconductor device layer 200, in an alternative embodiment, the flexible panel assembly disclosed in the present invention may further include a driving chip 500, where the driving chip 500 is used for driving the display area to display. The driving chip 500 may be packaged in the semiconductor device layer 200, and at this time, the integration level of the semiconductor device layer 200 may be further improved, and meanwhile, the second region 112 does not need to reserve an installation space of the driving chip 500, so that the space of the second region 112 may be further compressed, and thus the first region 111 for displaying is larger, and the screen occupation ratio of the electronic device is further increased.
In an alternative embodiment, the first electrical connection 300 can be a coating that conforms to the second region 112. In the scheme, the processing technology of the coating layer is simple, the cost is low, and meanwhile, the thickness of the coating layer is thinner, so that the structure of the flexible screen assembly is more compact. Optionally, a mask is formed on the second region 112 by a vacuum sputtering coating method, and then the mask is subjected to exposure, etching, demolding and other processing to obtain a circuit pattern. Or the coating layer can be made by adopting a yellow metal process.
A specific structure of the semiconductor device layer 200 is disclosed herein, but other structures may be adopted, and the structure is not limited herein. Specifically, the semiconductor device layer 200 may include a first trace base layer 210, a second trace base layer 220 and a semiconductor portion 230, wherein one end of the semiconductor portion 230 is connected to the first trace base layer 210, and the other end of the semiconductor portion 230 is connected to the second trace base layer 220. The first trace base layer 210 and the second trace base layer 220 are electrically connected through the semiconductor portion 230, and both the first trace base layer 210 and the second trace base layer 220 are electrically connected to the first electrical connection portion 300. The electrical signal is transmitted from the first trace base layer 210 to the second trace base layer 220 through the semiconductor portion 230, and then transmitted to the first electrical connection portion 300 through the second trace base layer 220. In this scheme, the first trace base layer 210 and the second trace base layer 220 are located at two ends of the semiconductor portion 230, so as to prevent the first trace base layer 210 and the second trace base layer 220 from being electrically connected in series, and to facilitate more reliable information transmission of the semiconductor device layer 200.
Optionally, the first trace base layer 210 and the second trace base layer 220 may be made of molybdenum, silver, titanium, copper, or the like, a mask is formed on the second region 112 by a vacuum sputtering coating method, and then the mask is exposed, etched, and demolded to obtain a circuit pattern. Or the first trace base layer 210 and the second trace base layer 220 can also be manufactured by using a yellow light metal process. The semiconductor part 230 may include at least one of a diode component, a resistance component, and a capacitance component. The semiconductor portion 230 may be made of silicon, germanium, gallium arsenide, or the like.
In another scheme, the first electrical connection portion 300 can be a portion of the first trace base layer 210 or the second trace base layer 220, so that the first trace base layer 210 or the second trace base layer 220 replaces a portion of the first electrical connection portion 300, and the structure of the flexible screen assembly is more compact.
In an alternative embodiment, when the semiconductor part 230 includes a diode component, the diode component may include a first semiconductor 231 and a second semiconductor 232, the first semiconductor 231 and the second semiconductor 232 are electrically connected, the first semiconductor 231 is electrically connected to the first trace base layer 210, the second semiconductor 232 is electrically connected to the second trace base layer 220, the first semiconductor 231 may be a P-type semiconductor, and the second semiconductor 232 may be an N-type semiconductor. In this scheme, the diode subassembly can be used to the rectification, the steady voltage and the modulation of the circuit of flexible screen subassembly to guarantee that the display information of flexible screen subassembly normally transmits, therefore the diode subassembly has extremely important effect in the flexible screen subassembly. Alternatively, the first semiconductor 231 and the second semiconductor 232 may be made of silicon, germanium, gallium arsenide, or the like. When the first semiconductor 231 is a P-type semiconductor, boron ions may be doped in the first semiconductor 231; when the second semiconductor 232 is an N-type semiconductor, the second semiconductor 232 may be doped with phosphorus ions.
In order to further improve the safety and reliability of the flexible screen assembly, in an alternative embodiment, the first routing base layer 210 may be provided with a first protrusion 211, the second routing base layer 220 may be provided with a second protrusion 221, and in a direction perpendicular to the flexible base layer 110, the first protrusion 211 is in limit fit with the first semiconductor 231, and the second protrusion 221 is in limit fit with the second semiconductor 232. At this time, the first and second protrusions 211 and 221 press the first and second semiconductors 231 and 232 on the flexible base layer 110, so that the first and second semiconductors 231 and 232 are prevented from falling off from the flexible base layer 10, and the safety and reliability of the flexible screen assembly are improved.
Optionally, when the semiconductor part 230 includes a resistor component, the resistor component may include a third semiconductor 233 and conductive ions 234 doped in the third semiconductor 233, one end of the third semiconductor 233 is connected to the first trace base layer 210, the other end of the third semiconductor 233 is connected to the second trace base layer 220, and the first trace base layer 210 and the second trace base layer 220 are electrically connected through the third semiconductor 233. This scheme can adjust the concentration of the conductive ions 234 doped in the third semiconductor 233 to obtain resistive elements with different impedances, thereby facilitating the fabrication of the semiconductor device layer 200.
In another aspect, the semiconductor portion 230 can include a capacitor assembly, which can include a fourth semiconductor 235, at least one pair of oppositely disposed capacitor electrodes 236, and an insulating dielectric 237. In operation of the capacitor assembly, a voltage difference is formed between a pair of oppositely disposed capacitor electrodes 236. The fourth semiconductor 235 may have an accommodating space, the insulating medium 237 may be filled in the accommodating space, the capacitor electrode 236 may be disposed in the accommodating space, and one of the two capacitor electrodes 236 in the same pair is electrically connected to the first trace base layer 210, and the other is electrically connected to the second trace base layer 220. The capacitor assembly can be used in blocking, coupling, bypass, filtering and tuning circuits of the flexible screen assembly, so that control over partial functions of the flexible screen assembly can be realized. The capacitance has an extremely important role in the flexible screen assembly. Alternatively, the capacitor electrode 236 may be made of metal or indium tin oxide. The insulating medium 237 may be air or other substances, which is not limited herein.
In order to improve the performance of the capacitor, in another embodiment, the capacitor assembly may include a plurality of pairs of capacitor electrodes 236, and the capacitor electrodes 236 for storing charges are increased, thereby increasing the capacitance of the capacitor assembly and improving the performance of the capacitor assembly. Further, a plurality of pairs of the capacitor electrodes 236 may be stacked, and the plurality of pairs of the capacitor electrodes 236 are alternately electrically connected to the first trace base layer 210 and the second trace base layer 220. At this time, the capacitor electrode 236 may be disposed in the thickness direction of the flexible base layer 110, thereby making the structure of the capacitor assembly more compact.
In an optional embodiment, the flexible screen further includes a display circuit layer 120 and a circuit protection layer 130, the display circuit layer 120 is disposed in the first region 111, the display circuit layer 120 is used to be electrically connected to components in the first region 111, the display circuit layer 120 is electrically connected to the first electrical connection portion 300, and a circuit board of the electronic device transmits a display signal to the display circuit layer 120 through the first electrical connection portion 300, and then transmits the display signal to the components in the first region 111 through the display circuit layer 120. The line protection layer 130 covers the semiconductor device layer 200 and the display line layer 120, and extends to the edge of the flexible base layer 110. In this scheme, the line protection layer 130 covers the semiconductor device layer 200 and the display line layer 120, so as to protect the semiconductor device layer 200 and the display line layer 120, thereby improving the safety and reliability of the flexible screen assembly.
In order to make the second region 112 easier to bend, in another embodiment, the flexible base layer 110 is provided with a gap 115, and the gap 115 is located at the connection position of the first region 111 and the second region 112. This solution removes a portion of material at the joint of the first region 111 and the second region 112, so that the joint of the first region 111 and the second region 112 has a smaller size, thereby facilitating the bending of the second region 112.
In another embodiment, the semiconductor device layer 200 may be a first stripe structure, the second region 112 may be a second stripe structure, an extending direction of the first stripe structure may be the same as an extending direction of the second stripe structure, an extending direction of the second region 112 is perpendicular to a length direction of the flexible base layer 110 and perpendicular to a thickness direction of the flexible base layer 110, and an extending direction of the second region 112 is a width direction of the flexible base layer 110. At this time, the semiconductor device layer 200 may be disposed along the width direction of the flexible base layer 110, and the size of the second region 112 may be set to be smaller in the length direction of the flexible base layer 110, so that the entire second region 112 is smaller, and further the size of the first region 111 may be increased, so that the screen occupation ratio of the electronic device is larger.
In the above embodiment, the flexible base layer 110 has the first surface 113 and the second surface 114 disposed oppositely, in this case, a part of the semiconductor device layer 200 may be disposed on the first surface 113, another part of the semiconductor device layer 200 may be disposed on the second surface 114, and the semiconductor device layer 200 is disposed on both surfaces of the flexible base layer 110, so that the stacking thickness of the flexible base layer 110 and the semiconductor device layer 200 is larger, resulting in a larger thickness of the flexible screen assembly. Meanwhile, the first electrical connection portion 300 needs to extend from the first surface 113 to the second surface 114, so that the arrangement area of the first electrical connection portion is increased, and the difficulty of the manufacturing process of the flexible screen assembly is increased.
In order to solve the above problem, in an alternative embodiment, the semiconductor device layer 200 and the first electrical connection portion 300 may be disposed on the first surface 113, and at this time, the semiconductor device layer 200 and the first electrical connection portion 300 are disposed on the same surface of the flexible base layer 110, so that the stacking height of the semiconductor device layer 200 and the flexible base layer 110 is smaller, and further the stacking height of the flexible screen assembly is reduced, and the thickness of the electronic device is reduced, thereby improving the user experience. In addition, the semiconductor device layer 200 and the first electrical connection portion 300 are arranged on the same plane, so that the arrangement area of the first electrical connection portion 300 is smaller, and the difficulty of the manufacturing process of the flexible screen assembly is reduced.
The flexible base layer 110 is weak, so the flexible base layer 110 is easily broken during bending or curling, resulting in low safety and reliability of the flexible screen assembly. In addition, other components for displaying need to be deposited on the first region 111, and when the strength of the first region 111 is small, the components are easily recessed in the first region 111 after being mounted in the first region 111, thereby affecting the display effect of the first region 111. In an alternative embodiment, the flexible screen may further include a first support layer 140, the first support layer 140 is disposed on the second side 114, and the first support layer 140 is located in the first region 111 and extends to an edge of the first region 111. In this scheme, first supporting layer 140 can increase the intensity of first region 111 to make first region 111 be difficult to the fracture at crooked or curled in-process, make first region 111 be difficult to appear the crackle, simultaneously, also make first region 111 be difficult to take place sunken, and then do not influence the demonstration of first region 111, consequently improved the security and the reliability of flexible screen assembly. It should be noted that the thickness of the added first support layer 140 does not affect the bending or curling of the flexible screen. Alternatively, the first support layer 140 may be made of PET or the like.
In another embodiment, the flexible screen may further include a second support layer 150, the second support layer 150 being disposed on the second side 114, the second support layer 150 being located at the second area 112 and extending to an edge of the second area 112. At this time, the second support layer 150 can increase the strength of the second region 112, thereby preventing the second region 112 from being broken, and further improving the safety and reliability of the electronic device. Alternatively, the second support layer 150 may be made of PET (Polyethylene terephthalate), metal foil, or the like. Since the second region 112 is provided with the semiconductor device layer 200, the semiconductor device layer 200 is easy to generate heat when in operation, so that the temperature of the second region 112 is high, and therefore, the second supporting layer 150 can be made of a heat dissipation material, so that the heat of the second region 112 can be dissipated, and the operation of the flexible screen assembly is not affected. The thickness of the first support layer 140 may be the same as or different from the thickness of the second support layer 150.
In the above embodiment, when the first support layer 140 and the second support layer 150 are stacked at the joint of the first region 111 and the second region 112, the stacking thickness at the joint of the first region 111 and the second region 112 is large, so that the bending difficulty of the second region 112 is large, and the second region 112 is easily broken during the bending process. In an alternative embodiment, the first support layer 140 may have a third face 141, the second support layer 150 may have a fourth face 151, the third face 141 and the fourth face 151 may be disposed opposite to each other, and a gap may be formed between the third face 141 and the fourth face 151. In this scheme, the first support layer 140 and the second support layer 150 are disposed at an interval, and a gap is formed between the first support layer 140 and the second support layer 150, so that the bending position of the second region 112 has a small thickness, and the bending is facilitated.
Optionally, the gap between the third surface 141 and the fourth surface 151 may be flexibly set according to the bending radius of the second region 112, and when the bending radius of the second region 112 is larger, the gap between the third surface 141 and the fourth surface 151 may be set to be larger, so as to facilitate bending of the second region 112; when the bending radius of the second region 112 is small, the gap between the third face 141 and the fourth face 151 may be set small, thereby making the structure of the flexible display screen compact.
In an alternative embodiment, the thickness of the first support layer 140 may be less than the thickness of the second support layer 150. At this time, the thickness of the second support layer 150 is smaller, so that the second region 112 is more easily bent. Meanwhile, after the second region 112 is bent, the second support layer 150 is bent to one side of the first region 111, and at this time, the first region 111, the first support layer 140, a part of the second support layer 150 and a part of the second region 112 are sequentially stacked, so that the thickness of the second support layer 150 is smaller, and the thickness of the flexible screen can be reduced. Alternatively, the thickness of the first support layer 140 may be 0.08mm, and the thickness of the second support layer 150 may be 0.02 mm.
Based on the flexible screen assembly of any one of the embodiments of the invention, the embodiment of the invention also discloses electronic equipment, and the disclosed electronic equipment is provided with the flexible screen assembly of any one of the embodiments.
The electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, or the like, and the specific type of the electronic device is not limited in the embodiment of the present invention.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A flexible screen assembly for application to an electronic device, the flexible screen assembly comprising a flexible screen, a semiconductor device layer (200) and a first electrical connection (300);
the flexible screen is provided with a display area, the flexible screen comprises a flexible base layer (110), the flexible base layer (110) comprises a first area (111) and a second area (112), the display area comprises the first area (111), the second area (112) is located on one side of the display area, a first end of the second area (112) is connected with the first area (111), and a second end of the second area (112) is bent to one side of the first area (111);
the semiconductor device layer (200) and the first electric connection portion (300) are arranged in the second area (112), the semiconductor device layer (200) is attached to the second area (112), the first electric connection portion (300) is arranged at the second end of the second area (112), the first electric connection portion (300) is electrically connected with a circuit board of the electronic equipment, the first electric connection portion (300) is electrically connected with the semiconductor device layer, and the first electric connection portion is electrically connected with the display area.
2. The flexible screen assembly of claim 1, further comprising a driver chip (500), the driver chip (500) being encapsulated within the semiconductor device layer (200).
3. The flexible screen assembly of claim 1, wherein the semiconductor device layer (200) comprises a first trace base layer (210), a second trace base layer (220), and a semiconductor portion (230), wherein one end of the semiconductor portion (230) is connected to the first trace base layer (210), the other end of the semiconductor portion (230) is connected to the second trace base layer (220), the first trace base layer (210) and the second trace base layer (220) are electrically connected through the semiconductor portion (230), and the first trace base layer (210) and the second trace base layer (220) are both electrically connected to the first electrical connection portion (300).
4. The flexible screen assembly of claim 3, wherein the semiconductor portion (230) comprises a diode assembly, the diode assembly comprising a first semiconductor (231) and a second semiconductor (232), the first semiconductor (231) and the second semiconductor (232) being electrically connected, the first semiconductor (232) being electrically connected to the first trace base layer (210), the second semiconductor (232) being electrically connected to the second trace base layer (220), the first semiconductor (231) being a P-type semiconductor, and the second semiconductor (232) being an N-type semiconductor.
5. The flexible screen assembly of claim 4, wherein the first trace base layer (210) is provided with a first protrusion (211), the second trace base layer (220) is provided with a second protrusion (221), and the first protrusion (211) is in limit fit with the first semiconductor (210) and the second protrusion (221) is in limit fit with the second semiconductor (232) in a direction perpendicular to the flexible base layer (110).
6. The flexible screen assembly of claim 3, wherein the semiconductor portion (230) comprises a resistive assembly, the resistive assembly comprising a third semiconductor (233) and conductive ions (234) doped in the third semiconductor (233), one end of the third semiconductor (233) being connected to the first trace base layer (210), the other end of the third semiconductor (233) being connected to the second trace base layer (220), the first trace base layer (210) and the second trace base layer (220) being electrically connected through the third semiconductor (233).
7. The flexible screen assembly of claim 3, wherein the semiconductor portion (230) comprises a capacitor assembly, the capacitor assembly comprises a fourth semiconductor (235), at least one pair of capacitor electrodes (236) disposed opposite to each other, and an insulating medium (237), the fourth semiconductor (235) has a receiving space, the insulating medium (237) is filled in the receiving space, the capacitor electrodes (236) are disposed in the receiving space, one of the two capacitor electrodes (236) in the same pair is electrically connected to the first trace base layer (210), and the other is electrically connected to the second trace base layer (220).
8. The flexible screen assembly of claim 7, wherein the capacitive assembly includes a plurality of pairs of the capacitive electrodes (236), wherein the plurality of pairs of the capacitive electrodes (236) are stacked, and wherein all of the capacitive electrodes (236) are alternately electrically connected to the first trace base layer (210) and the second trace base layer (220).
9. The flexible screen assembly of claim 1, further comprising a display circuitry layer (120) and a circuitry protection layer (130), the display circuitry layer (120) being disposed in the first region (111), the display circuitry layer (120) being electrically connected to the first electrical connection (300), the circuitry protection layer (130) covering the semiconductor device layer (200) and the display circuitry layer (120) and extending to an edge of the flexible base layer (110).
10. An electronic device comprising the flexible screen assembly of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010249496.1A CN111415588A (en) | 2020-03-31 | 2020-03-31 | Flexible screen assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010249496.1A CN111415588A (en) | 2020-03-31 | 2020-03-31 | Flexible screen assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111415588A true CN111415588A (en) | 2020-07-14 |
Family
ID=71494762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010249496.1A Pending CN111415588A (en) | 2020-03-31 | 2020-03-31 | Flexible screen assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111415588A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201520A (en) * | 2007-12-27 | 2008-06-18 | 昆山龙腾光电有限公司 | LCD device array substrate with electrostatic protection function |
| CN105911787A (en) * | 2016-07-05 | 2016-08-31 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN106449664A (en) * | 2016-11-30 | 2017-02-22 | 厦门天马微电子有限公司 | Display panel and electronic equipment |
| CN206421362U (en) * | 2017-01-10 | 2017-08-18 | 上海中航光电子有限公司 | A kind of touch-control display panel and touch control display apparatus |
| CN107505747A (en) * | 2017-07-25 | 2017-12-22 | 武汉华星光电技术有限公司 | A kind of preparation method of array base palte, display panel and substrate |
| CN107610593A (en) * | 2016-07-11 | 2018-01-19 | 三星显示有限公司 | Display panel |
| CN108663863A (en) * | 2018-06-25 | 2018-10-16 | 深圳市华星光电技术有限公司 | Array substrate |
| CN108831306A (en) * | 2018-06-22 | 2018-11-16 | 武汉华星光电半导体显示技术有限公司 | Display panel and electronic equipment |
| CN108899316A (en) * | 2018-06-29 | 2018-11-27 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN109285460A (en) * | 2018-11-29 | 2019-01-29 | 上海天马微电子有限公司 | Array substrate, display panel and display device |
| CN110600503A (en) * | 2019-08-12 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Flexible integrated display screen module, preparation method thereof and display device |
-
2020
- 2020-03-31 CN CN202010249496.1A patent/CN111415588A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201520A (en) * | 2007-12-27 | 2008-06-18 | 昆山龙腾光电有限公司 | LCD device array substrate with electrostatic protection function |
| CN105911787A (en) * | 2016-07-05 | 2016-08-31 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN107610593A (en) * | 2016-07-11 | 2018-01-19 | 三星显示有限公司 | Display panel |
| CN106449664A (en) * | 2016-11-30 | 2017-02-22 | 厦门天马微电子有限公司 | Display panel and electronic equipment |
| CN206421362U (en) * | 2017-01-10 | 2017-08-18 | 上海中航光电子有限公司 | A kind of touch-control display panel and touch control display apparatus |
| CN107505747A (en) * | 2017-07-25 | 2017-12-22 | 武汉华星光电技术有限公司 | A kind of preparation method of array base palte, display panel and substrate |
| CN108831306A (en) * | 2018-06-22 | 2018-11-16 | 武汉华星光电半导体显示技术有限公司 | Display panel and electronic equipment |
| CN108663863A (en) * | 2018-06-25 | 2018-10-16 | 深圳市华星光电技术有限公司 | Array substrate |
| CN108899316A (en) * | 2018-06-29 | 2018-11-27 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN109285460A (en) * | 2018-11-29 | 2019-01-29 | 上海天马微电子有限公司 | Array substrate, display panel and display device |
| CN110600503A (en) * | 2019-08-12 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Flexible integrated display screen module, preparation method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10985194B2 (en) | Display panel and display device | |
| CN110568963B (en) | Display panel, display substrate and display device | |
| TW201145669A (en) | Input device with antenna and electronic device having the same | |
| CN110768731A (en) | Functional panel, manufacturing method thereof and terminal | |
| CN110596922B (en) | Display panel and display device | |
| CN111596481B (en) | Display panel, display device and manufacturing method | |
| CN112817482A (en) | Electronic equipment and display module | |
| KR100474168B1 (en) | Flat support with at least one semiconductor chip | |
| CN112787691A (en) | Electronic equipment and display module | |
| KR20220009207A (en) | Radio frequency module and electronic device including the same | |
| US11086460B2 (en) | Touch substrate, method for manufacturing same, and touch device | |
| US7629614B2 (en) | Electrostatic discharge protection circuit and diode thereof | |
| CN108762580A (en) | Show equipment, touch sensing and preparation method thereof | |
| CN108762593B (en) | Touch panel and touch device | |
| CN111258448B (en) | touch panel | |
| CN111176383B (en) | Flexible display panel and display device | |
| CN106371667B (en) | Panel board | |
| CN111415588A (en) | Flexible screen assembly and electronic equipment | |
| CN111210730A (en) | Display panel and display device | |
| CN111462628A (en) | Flexible screen assembly and electronic equipment | |
| WO2017198146A1 (en) | Display device and manufacturing method therefor | |
| TW200427385A (en) | Electronic circuit unit with mounting structure having high soldering reliability | |
| TWI778655B (en) | Touch panel | |
| CN114185458B (en) | Display device and display panel thereof | |
| CN113437093B (en) | Display panel, manufacturing method of display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200714 |
|
| RJ01 | Rejection of invention patent application after publication |