CN111411255B - Copper alloy for electronic component and preparation method thereof - Google Patents
Copper alloy for electronic component and preparation method thereof Download PDFInfo
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Abstract
A copper alloy for electronic parts and a method for producing the same, the copper alloy comprising: 0.2 to 0.6 wt% of Cr, 0.02 to 0.08 wt% of Zr, 0.1 to 0.2 wt% of Al, 0.05 to 0.15 wt% of Ti, 0.03 to 0.15 wt% of Si, 0.02 to 0.06 wt% of B, and the balance of Cu and inevitable impurity elements. The alloy components and the content thereof adopted by the invention can reduce the preparation difficulty under the non-vacuum condition and improve the etching performance and the surface oxidation resistance of the alloy, and the preparation method is easy to implement and has low cost. The copper alloy product obtained by the invention has the performance of tensile strength of 580-650MPa, elongation of more than 2 percent and conductivity of 80-88 percent IACS, and can be used for elements such as a lead frame of a very large scale integrated circuit, a miniaturized electronic communication connector, a terminal, a relay and the like.
Description
Technical Field
The invention relates to the technical field of nonferrous metal processing, in particular to a copper alloy for electronic parts and a preparation method thereof.
Background
With the rapid development of the high-tech fields of microelectronics, communication, transportation, aerospace, aviation and the like, electronic components are also developed towards high integration, miniaturization and thinning, the transmission quantity and the heat productivity of the electronic components are increased, which puts higher requirements on copper alloy materials, and the copper alloy materials not only have enough strength to meet the strength supporting requirement after the thickness is reduced, but also need high electric conduction and heat conduction performance, are difficult to generate joule heat during electrification and are easy to dissipate the generated heat. At the same time, it is also desirable to have a high heat resistance to ensure that softening does not occur at high temperatures. The preparation method also adopts a large amount of etching methods, and needs to have better etching performance. There is a strong market need for alloy materials having a strength of up to about 600MPa and an electrical conductivity of greater than 80% IACS. The Cu-Cr-Zr alloy is an ideal material for meeting the performances, but because Zr element is easy to oxidize and burn, the large-size square ingot is difficult to prepare under the non-vacuum condition, which limits the wide application of the Cu-Cr-Zr alloy on the increasingly miniaturized electronic components.
Under the non-vacuum condition, Zr loss in a furnace, semi-continuous casting melt transfer and Zr loss of a melt in a crystallizer in the Cu-Cr-Zr alloy casting process, and how to ensure the stability of Zr in the full-length range of an ingot and how to improve the yield of Zr element are the technical problems faced at the present stage. It is conventional practice to protect the melt with a blanketing agent or inert gas, but because the continuous casting process lasts longer, the oxygen content in the melt will still continue to increase, resulting in lower Zr yields. In the patents CN107287468B and CN108526422A, the Zr content is replaced or reduced by adding common elements such as Mg, Si and the like with low price, so that the production difficulty is reduced, but the heat resistance of the alloy is 460 ℃, and the alloy has a larger difference compared with the Cu-Cr-Zr alloy. Patent CN1042350C prepares a copper alloy with high strength and high conductivity suitable for electrical components by adding Fe, Ti, etc., but the intermetallic compound formed by Fe and Ti has a large influence on the chemical etching performance. .
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a copper alloy which is easy to be prepared under non-vacuum conditions and has high strength, high electrical and thermal conductivity, high heat resistance and excellent etching performance, and a preparation method thereof, wherein the copper alloy can be used for lead frames of very large scale integrated circuits, miniaturized electronic communication connectors, terminals, relays, large current electronic components, heat dissipation parts, etc.
The invention is realized by the following technical scheme.
A copper alloy for electronic parts, characterized in that the composition of the copper alloy comprises: 0.2 to 0.6 weight percent of Cr, 0.02 to 0.08 weight percent of Zr, 0.1 to 0.2 weight percent of Al, 0.05 to 0.15 weight percent of Ti, 0.03 to 0.15 weight percent of Si, 0.02 to 0.06 weight percent of B, and the balance of Cu and inevitable impurity elements.
Further, the copper alloy also comprises other elements, wherein the other elements are one or a mixture of more of Mg, Sn, Ag, Ni, Zn and Co, and the total content of the other elements is less than 0.5 wt%.
Furthermore, the content of the added Cr element and Zr element can be further reduced to reduce the preparation difficulty, and the optimized alloy comprises the following components: 0.2 to 0.4 weight percent of Cr, 0.03 to 0.05 weight percent of Zr, 0.1 to 0.2 weight percent of Al, 0.05 to 0.15 weight percent of Ti, 0.03 to 0.15 weight percent of Si, 0.02 to 0.06 weight percent of B, and the balance of copper and inevitable impurity elements.
Further, the performance of the product made of the copper alloy is as follows: tensile strength of 580MPa-650MPa, elongation of more than 2% and electric conductivity of 80-88% IACS.
The preparation method of the copper alloy for the electronic component is characterized by comprising the following steps of:
(1) melting: putting copper into an induction melting furnace, adding a covering agent, melting under a protective atmosphere, degassing and refining the copper melt, and reducing the oxygen content to be below 40 ppm;
(2) alloying: adding the intermediate alloy into the copper melt, wherein the alloy is added in the order of Cu-Cr, Cu-Si, Cu-B, Cu-Ti, Cu-Zr intermediate alloy and pure aluminum to obtain the copper alloy melt;
(3) casting: casting the copper alloy melt obtained in the step (2) at the casting temperature of 1180-1280 ℃ to obtain a copper alloy casting blank;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 900-960 ℃, the heat preservation time is 2-5 h, and the on-line quenching temperature is more than 700 ℃; and then carrying out combined shape heating treatment, and straightening and slitting treatment to obtain a finished product.
Further, the method adopts non-vacuum fusion casting to prepare the copper alloy ingot.
Further, the covering agent in the step (1) is crystalline flake graphite or charcoal, and the protective atmosphere is inert gas.
Further, the step (1) is degassing refining, and one or two groups of modes of Cu-P alloy degassing and inert gas degassing are adopted.
Further, when other elements are added in the step (2), namely one or more of Mg, Sn, Ag, Ni, Zn and Co, the Mg, Ni and Co elements are respectively added in the form of Cu-Mg, Cu-Ni and Cu-Co intermediate alloys, the Sn, Ag and Zn elements are added in the form of pure metals, and the total content of the other elements is less than 0.5 wt%.
Further, the combined thermomechanical treatment process in the step (4) comprises the following steps: the hot rolled blank is subjected to primary cold rolling, the cold rolling deformation is 70-95%, the strip blank subjected to primary cold rolling is subjected to primary aging treatment at the temperature of 400-550 ℃ for 2-6 h, the strip subjected to primary aging treatment is subjected to cold rolling, the deformation is 50-95%, and then secondary aging treatment is performed to remove stress, the temperature is 550 ℃ and the time is 60S.
The invention has the beneficial technical effects that:
the non-vacuum preparation difficulty is reduced: according to the invention, Cr and Zr are controlled within the range lower than the solid solubility limit, the addition amounts are respectively 0.2-0.6 wt% of Cr0.2 and 0.02-0.08 wt% of Zr, and the Cr and Zr are in a stable solid solution state at the smelting temperature, so that the excessive floating up to the surface oxidation loss of a melt can be avoided. Meanwhile, the oxygen content in the melt is reduced to be below 40ppm before the alloy elements are added, the oxidation loss of Cr and Zr elements in the melt is avoided, and the yield of the elements is improved;
strength and heat resistance improvement: in the invention, the content of Cr and Zr elements is reduced for reducing the preparation difficulty, the strength and the heat resistance are reduced, and as compensation, Al, Ti and Si elements are added in the invention to further improve the strength and the heat resistance of the alloy, but when the content of the elements exceeds 0.2 wt%, the electric and heat conductivity of the alloy can be greatly reduced, and the optimized content range is as follows: 0.1 to 0.2 weight percent of Al, 0.05 to 0.15 weight percent of Ti and 0.03 to 0.15 weight percent of Si. And one or more of Mg, Sn, Ag, Ni, Zn, Co and the like can be selected, so that the electric and heat conductivity of the alloy is not greatly reduced, and the total content is less than 0.5 wt%.
Etching performance: the prior studies have agreed that the medium coarse precipitated phases or intermetallic compounds of the alloy and their inhomogeneous distribution strongly influence the etching performance. When the content of Cr element in the Cu-Cr-Zr alloy is more than 0.6 wt%, a coarse Cr-rich phase is easy to generate, and the coarse Cr-rich phase is easy to coarsen, grow up and is unevenly distributed, so that the etching performance is influenced. The invention reduces the content of Cr element, the optimized addition range is 0.2-0.4 wt% of Cr, and the coarse phase of Cr element is avoided. Meanwhile, the trace addition of Al, Ti, Si and other elements is not easy to form coarse precipitated phases or intermetallic compounds, thereby being beneficial to improving the strength and having better etching performance.
Al and B elements: the addition of the Al element is beneficial to improving the oxidation resistance of the alloy at room temperature and high temperature; the large grain size of Cu-Cr-Zr alloy ingot casting is a great problem influencing high-quality ingot casting, the combination of B and Ti elements has excellent refining effect on Cu-Cr-Zr alloy, and meanwhile, the B element is easier to combine with oxygen, so that the oxygen content in the melt is reduced, the melt is continuously kept at low oxygen content, and the Zr loss in the Cu-Cr-Zr alloy casting process can be reduced.
Compared with the prior art, the invention has the remarkable technical effects that:
(1) in the alloy, the content of the added Cr and Zr is low, and the elements such as Al, Ti, Si, B and the like are added in trace, so that the alloy elements are uniformly and fixedly dissolved in a copper melt during casting, floating burning loss caused by excessive elements is avoided, the preparation difficulty under the non-vacuum condition is reduced, and the yield of the elements is improved.
(2) In the alloy, the content of Cr element is reduced, the generation of coarse phases of the Cr element is avoided, and the trace addition of Al, Ti, Si and other elements which are not easy to form coarse precipitated phases or intermetallic compounds is beneficial to improving the etching performance of the alloy;
(3) in the alloy, Al element is added, which is beneficial to improving the oxidation resistance of the alloy;
(4) in the alloy, the combination of B and Ti elements refines the as-cast structure of the Cu-Cr-Zr alloy, reduces the segregation of ingot casting elements, improves the quality of ingots and improves the comprehensive performance of alloy finished products;
(5) the copper alloy has high strength, high electric and heat conductivity, high heat resistance and etching performance, the preparation method is easy to implement, the cost is low, and the performance of the finished strip reaches the tensile strength of more than 580MPa and the electric conductivity of more than 80 percent IACS.
Detailed Description
The present invention will be described in detail with reference to the following embodiments.
The invention provides a copper alloy for electronic parts and a preparation method thereof, which are implemented by the following specific modes:
(1) melting: putting raw material copper into an induction melting furnace, adding a covering agent, melting under a protective atmosphere, degassing and refining the copper melt, and reducing the oxygen content to be below 40 ppm; wherein, the covering agent is crystalline flake graphite or charcoal, the covering thickness is 10 cm-15 cm, and the protective atmosphere is inert gas, such as nitrogen or argon; the degassing refining adopts one or the combination of two groups of modes of Cu-P alloy degassing and inert gas degassing, wherein the aeration time is 15 minutes when the inert gas degassing is adopted;
(2) alloying: adding the intermediate alloy into the copper melt, wherein the adding sequence of the alloy comprises Cu-Cr, Cu-Si, Cu-B, Cu-Ti, Cu-Zr intermediate alloy and pure aluminum, and obtaining the copper alloy melt; when one or more of Mg, Sn, Ag, Ni, Zn and Co is added, wherein the Mg, Ni and Co elements are respectively added in the form of Cu-Mg, Cu-Ni and Cu-Co intermediate alloys, the Sn, Ag and Zn elements can be added in pure metals, and the total content of the Sn, Ag and Zn elements is less than 0.5 wt%;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1180-1280 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 900-960 ℃, the heat preservation time is 2-5 h, the on-line quenching temperature after hot rolling is more than 700 ℃, and the thickness of the hot rolled plate blank is 16 mm; and then carrying out combined forming heat treatment: carrying out primary cold rolling on a hot rolled plate blank, wherein the cold rolling deformation is 70-95%, carrying out primary aging treatment on the strip blank subjected to the primary cold rolling at the temperature of 400-550 ℃ for 2-6 h, carrying out cold rolling on the strip subjected to the primary aging treatment at the deformation of 50-95%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S; finally, straightening, cutting and processing to obtain a finished product.
The following examples are provided to illustrate the embodiments of the present invention in detail:
example 1:
(1) melting: loading raw material copper into an induction melting furnace, adding covering agent crystalline flake graphite, melting in a protective atmosphere, degassing and refining the melt (degassing Cu-P alloy), and measuring the oxygen content to be 35 ppm;
(2) alloying: adding an intermediate alloy into a copper melt, wherein the addition sequence of the intermediate alloy comprises intermediate alloys such as Cu-10 wt% Cr, Cu-20 wt% Si, Cu-5 wt% B, Cu-15 wt% Ti, Cu-15 wt% Zr and the like and pure aluminum, and after the intermediate alloy is completely melted, determining the components of the alloy to be 0.2 wt% Cr, 0.08 wt% Zr, 0.18 wt% Al, 0.1 wt% Ti, 0.13 wt% Si, 0.05 wt% B and the balance copper;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1200 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 900 ℃, the heat preservation time is 2 hours, and the hot rolling temperature is 705 ℃ after the hot rolling, and the thickness of the plate blank is 16 mm; and then carrying out combined forming heat treatment: and (3) carrying out primary cold rolling on the hot rolled blank, wherein the cold rolling deformation is 75%, carrying out primary aging treatment on the strip blank after the primary cold rolling at the temperature of 400 ℃ for 6h, carrying out cold rolling on the strip after the primary aging treatment at the deformation of 80%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S. Finally, straightening, cutting and processing to obtain a finished product. The tensile strength of the obtained alloy is 585MPa, the elongation is 4.6%, the conductivity is 86.2% IACS, the Vickers hardness is 178, and the softening temperature is 560 ℃.
Example 2:
(1) melting: loading raw material copper into an induction melting furnace, adding covering agent crystalline flake graphite, melting in a protective atmosphere, degassing and refining the melt (inert gas), and measuring the oxygen content to be 30 ppm;
(2) alloying: adding an intermediate alloy into a copper melt, wherein the intermediate alloy comprises intermediate alloys such as Cu-10 wt% of Cr, Cu-20 wt% of Si, Cu-5 wt% of B, Cu-15 wt% of Ti, Cu-15 wt% of Zr and the like, pure silver and pure aluminum in sequence, and after the intermediate alloys are completely melted, determining that the components of the alloy comprise 0.25 wt% of Cr, 0.05 wt% of Zr, 0.15 wt% of Al, 0.08 wt% of Ti, 0.05 wt% of Si, 0.03 wt% of B, 0.05 wt% of Ag and the balance of copper;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1220 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 915 ℃, the heat preservation time is 3 hours, and the thickness of the plate blank is 16mm at the quenching temperature of 710 ℃ after hot rolling; and then carrying out combined forming heat treatment: and (3) carrying out primary cold rolling on the hot rolled blank, wherein the cold rolling deformation is 80%, carrying out primary aging treatment on the strip blank after the primary cold rolling at the temperature of 450 ℃ for 4h, carrying out cold rolling on the strip after the primary aging treatment at the deformation of 75%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S. Finally, straightening, cutting and processing to obtain a finished product. The tensile strength of the obtained alloy is 606MPa, the elongation is 4.1%, the conductivity is 85.1% IACS, the Vickers hardness is 183, and the softening temperature is 565 ℃.
Example 3:
(1) melting: loading raw material copper into an induction melting furnace, adding covering agent charcoal, melting in a protective atmosphere, degassing and refining the melt, and measuring the oxygen content to be 25 ppm;
(2) alloying: adding an intermediate alloy into a copper melt, wherein the intermediate alloy comprises intermediate alloys such as Cu-10 wt% of Cr, Cu-20 wt% of Si, Cu-5 wt% of B, Cu-15 wt% of Ti, Cu-15 wt% of Zr and the like, pure zinc and pure aluminum in sequence, and after the intermediate alloys are completely melted, determining that the components of the alloy comprise 0.3 wt% of Cr, 0.05 wt% of Zr, 0.13 wt% of Al, 0.08 wt% of Ti, 0.05 wt% of Si, 0.02 wt% of B, 0.1 wt% of Zn and the balance of copper;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1250 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 930 ℃, the heat preservation time is 4 hours, and the thickness of the plate blank is 16mm at the quenching temperature of 710 ℃ after hot rolling; and then carrying out combined forming heat treatment: and (3) carrying out primary cold rolling on the hot rolled blank, wherein the cold rolling deformation is 85%, carrying out primary aging treatment on the strip blank after the primary cold rolling at the temperature of 470 ℃ for 4h, carrying out cold rolling on the strip after the primary aging treatment at the deformation of 65%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S. Finally, straightening, cutting and processing to obtain a finished product. The obtained alloy has the tensile strength of 615MPa, the elongation of 3.8 percent, the conductivity of 84.8 percent IACS, the Vickers hardness of 189 and the softening temperature of 565 ℃.
Example 4:
(1) melting: loading raw material copper into an induction melting furnace, adding covering agent crystalline flake graphite, melting in a protective atmosphere, degassing and refining the melt, and determining the oxygen content to be 27 ppm;
(2) alloying: adding an intermediate alloy into a copper melt, wherein the intermediate alloy comprises the intermediate alloy of Cu-10 wt% of Cr, Cu-20 wt% of Si, Cu-5 wt% of B, Cu-15 wt% of Ti, Cu-15 wt% of Zr and the like, and pure tin, pure zinc and pure aluminum in sequence, and after the intermediate alloy is completely melted, determining the components of the alloy to be 0.35 wt% of Cr, 0.04 wt% of Zr, 0.1 wt% of Al, 0.05 wt% of Ti, 0.04 wt% of Si, 0.03 wt% of B, 0.05 wt% of Sn, 0.05 wt% of Zn and the balance of copper;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1250 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 945 ℃, the heat preservation time is 4 hours, and the thickness of the plate blank is 16mm at the quenching temperature of 715 ℃ after hot rolling; and then carrying out combined forming heat treatment: and (3) carrying out primary cold rolling on the hot rolled blank, wherein the cold rolling deformation is 90%, carrying out primary aging treatment on the strip blank subjected to the primary cold rolling at the temperature of 500 ℃ for 4h, carrying out cold rolling on the strip subjected to the primary aging treatment at the deformation of 60%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S. Finally, straightening, cutting and processing to obtain a finished product. The tensile strength of the obtained alloy is 625MPa, the elongation is 3.1%, the conductivity is 82.7% IACS, the Vickers hardness is 191, and the softening temperature is 575 ℃.
Example 5:
(1) melting: loading raw material copper into an induction melting furnace, adding covering agent charcoal, melting in a protective atmosphere, degassing and refining the melt, and measuring the oxygen content to be 34 ppm;
(2) alloying: adding an intermediate alloy into a copper melt, wherein the addition sequence of the intermediate alloy comprises intermediate alloys such as Cu-10 wt% Cr, Cu-20 wt% Si, Cu-10 wt% Co, Cu-5 wt% B, Cu-15 wt% Ti, Cu-15 wt% Zr and the like and pure aluminum, and after the intermediate alloy is completely melted, determining the components of the alloy to be 0.6 wt% Cr, 0.03 wt% Zr, 0.1 wt% Al, 0.06 wt% Ti, 0.03 wt% Si, 0.02 wt% B, 0.05 wt% Co and the balance copper;
(3) casting: adjusting the temperature of the copper alloy melt obtained in the step (2) to 1280 ℃, and then casting to obtain a casting blank with the specification of 200 x 600 mm;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 960 ℃, the heat preservation time is 5 hours, and the thickness of the plate blank is 16mm at the quenching temperature of 720 ℃ after hot rolling; and then carrying out combined forming heat treatment: and (2) carrying out primary cold rolling on the hot rolled blank, wherein the cold rolling deformation is 95%, carrying out primary aging treatment on the strip blank after the primary cold rolling at the temperature of 550 ℃ for 2h, carrying out cold rolling on the strip after the primary aging treatment at the deformation of 95%, and then carrying out secondary aging treatment to remove stress at the temperature of 550 ℃ for 60S. Finally, straightening, cutting and processing to obtain a finished product. The tensile strength of the obtained alloy is 636MPa, the elongation is 2.8%, the conductivity is 81.6% IACS, the Vickers hardness is 195, and the softening temperature is 580 ℃.
Table 1 shows alloy compositions of each example and comparative example, and table 2 shows properties of each example and comparative example.
TABLE 1 alloy composition Table for examples and comparative examples
TABLE 2 alloy Performance tables for examples and comparative examples
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention. It should be noted that other equivalent modifications can be made by those skilled in the art in light of the teachings of the present invention, and all such modifications can be made as are within the scope of the present invention.
Claims (7)
1. A method for producing a copper alloy for electronic parts, characterized in that the composition of the copper alloy comprises: 0.2 to 0.6 weight percent of Cr, 0.02 to 0.08 weight percent of Zr, 0.1 to 0.2 weight percent of Al, 0.05 to 0.15 weight percent of Ti, 0.03 to 0.15 weight percent of Si, 0.02 to 0.06 weight percent of B, and the balance of Cu and inevitable impurity elements; the preparation method of the copper alloy for the electronic component comprises the following steps:
(1) melting: putting copper into an induction melting furnace, adding a covering agent, melting under a protective atmosphere, degassing and refining the copper melt, and reducing the oxygen content to be below 40 ppm;
(2) alloying: adding the intermediate alloy into the copper melt, and adding the intermediate alloy sequentially comprising Cu-Cr, Cu-Si, Cu-B, Cu-Ti, Cu-Zr and pure aluminum to obtain the copper alloy melt;
(3) casting: casting the copper alloy melt obtained in the step (2) at the casting temperature of 1180-1280 ℃ to obtain a copper alloy casting blank;
(4) processing: carrying out heating hot rolling and on-line quenching on the copper alloy casting blank obtained in the step (3), wherein the hot rolling heating temperature is 900-960 ℃, the heat preservation time is 2-5 h, and the on-line quenching temperature is more than 700 ℃; then carrying out combined shape heating treatment, and straightening and slitting treatment to obtain a finished product; the combined heat treatment process comprises the following steps: the hot rolled blank is subjected to primary cold rolling, the cold rolling deformation is 70-95%, the strip blank subjected to primary cold rolling is subjected to primary aging treatment at the temperature of 400-550 ℃ for 2-6 h, the strip subjected to primary aging treatment is subjected to cold rolling, the deformation is 50-95%, and then secondary aging treatment is performed to remove stress, the temperature is 550 ℃ and the time is 60S.
2. The copper alloy of claim 1, wherein the composition of the copper alloy further comprises other elements, the other elements are one or a mixture of more of Mg, Sn, Ag, Ni, Zn, and Co, and the total content of the other elements is less than 0.5 wt%.
3. The copper alloy of claim 1, wherein the composition of the copper alloy comprises: 0.2 to 0.4 weight percent of Cr, 0.03 to 0.05 weight percent of Zr, 0.1 to 0.2 weight percent of Al, 0.05 to 0.15 weight percent of Ti, 0.03 to 0.15 weight percent of Si, 0.02 to 0.06 weight percent of B, and the balance of copper and inevitable impurity elements.
4. The method of claim 1, wherein the method comprises non-vacuum casting to produce copper alloy ingots.
5. The method according to claim 1, wherein the covering agent in step (1) is crystalline flake graphite or charcoal, and the protective atmosphere is inert gas.
6. The preparation method according to claim 1, wherein the step (1) of degassing refining adopts one or two groups of modes of Cu-P alloy degassing and inert gas degassing.
7. The preparation method according to claim 4, wherein when other elements are added in the step (2), namely one or more of Mg, Sn, Ag, Ni, Zn and Co, the Mg, Ni and Co elements are respectively added in the form of Cu-Mg, Cu-Ni and Cu-Co master alloys, the Sn, Ag and Zn elements are added in pure metals, and the total content of the other elements is less than 0.5 wt%.
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| CN113913642B (en) * | 2021-09-26 | 2022-07-05 | 宁波博威合金板带有限公司 | Copper alloy strip and preparation method thereof |
| CN114645152A (en) * | 2022-03-14 | 2022-06-21 | 红河学院 | High-strength high-conductivity copper-magnesium alloy and preparation method thereof |
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| CN116694953B (en) * | 2023-08-04 | 2023-10-31 | 中铝科学技术研究院有限公司 | Copper alloy plate strip for electromagnetic shielding and preparation method thereof |
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| JP2009191337A (en) * | 2008-02-18 | 2009-08-27 | Chuetsu Metal Works Co Ltd | Copper based alloy for mold, having excellent high temperature fatigue strength and wear resistance |
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